CN113851461A - Photoelectric sensor packaging structure comprising shading layer, manufacturing method and electronic equipment - Google Patents
Photoelectric sensor packaging structure comprising shading layer, manufacturing method and electronic equipment Download PDFInfo
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- CN113851461A CN113851461A CN202111203821.1A CN202111203821A CN113851461A CN 113851461 A CN113851461 A CN 113851461A CN 202111203821 A CN202111203821 A CN 202111203821A CN 113851461 A CN113851461 A CN 113851461A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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Abstract
The disclosure relates to the technical field of semiconductors, and provides a photoelectric sensor packaging structure comprising a shading layer, a manufacturing method and an electronic device. The packaging structure comprises: the optical signal transmission device comprises a substrate, a first optical signal transmission unit and a second optical signal reception unit, wherein the upper surface of the substrate is provided with a first mounting position and a second mounting position; the protective adhesive layer covers the optical signal transmitting unit and the optical signal receiving unit; and a light shielding layer. According to the embodiment of the disclosure, by arranging the light shielding layer and the directional light guide channel, the optical signal can only enter the photoelectric sensor through the directional light guide channel and is received by the optical signal receiving unit, and the interference of ambient light and the reflected light of the non-to-be-detected object to the detection result is reduced.
Description
Technical Field
The invention relates to the technical field of photoelectric sensors, in particular to a photoelectric sensor packaging structure comprising a shading layer, a manufacturing method and electronic equipment.
Background
Photoelectric sensors are applied more and more widely in the aspects of current intelligent medical treatment, intelligent home, industrial automation, portable equipment and the like, for example, heart rate sensors, blood oxygen sensors, proximity sensors, distance sensors and the like, so that the work and life of people are more and more intelligent and convenient. With the improvement and development of technical requirements, in order to reduce the volume of the whole device, the components are more and more miniaturized, and the functions are integrated, and in order to reduce the packaging volume of the photoelectric sensor, the optical signal transmitting part and the optical signal receiving part are always prone to be packaged in the same unit. However, due to the reflection of the external object not to be measured on the light, the accurate feedback of the optical signal receiving part on the target optical signal is greatly disturbed, and the detection result is wrong or unstable.
Disclosure of Invention
The present disclosure provides a photoelectric sensor package structure including a light shielding layer, a manufacturing method thereof, and an electronic device, so as to solve the technical problem in the prior art that a detection result of a photoelectric sensor is inaccurate due to signal interference caused by reflection of light by an external non-object to be detected.
In order to achieve the purpose, the technical scheme adopted by the disclosure is as follows:
in one aspect, the present disclosure provides a photosensor package structure including a light shielding layer, including:
the optical signal transmission device comprises a substrate, wherein a first mounting position and a second mounting position are arranged on the upper surface of the substrate, an optical signal transmission unit is fixed on the first mounting position, and an optical signal receiving unit is fixed on the second mounting position;
the protective adhesive layer is formed on the upper surface of the substrate in an adhesive injection mode;
the shading layer covers the upper surface of the protective adhesive layer through a printing process, and is provided with a directional light guide channel which covers the optical signal transmitting unit and the optical signal receiving unit respectively;
the protective adhesive layer is used for protecting the optical signal transmitting unit and the optical signal receiving unit and allowing the optical signal of the optical signal transmitting unit to pass through;
the light shielding layer covers the position which does not allow the optical signal to pass through so as to ensure that the optical signal passes through the directional light guide channel.
In some embodiments, the area of the opening on the side of the directional light guide channel, which is far away from the substrate, corresponding to the optical signal emitting unit and the optical signal receiving unit is greater than or equal to the area of the opening on the side of the directional light guide channel, which is close to the substrate.
In some embodiments, the shape of the opening on the side of the directional light guide channel away from the substrate is the same as the shape of the opening on the side of the directional light guide channel close to the substrate.
In some embodiments, the light-shielding layer has a thickness ranging from 20 to 200 μm.
In some embodiments, the area of the directional light guide channel is 0.5 to 1.5 times the surface area of the corresponding optical signal transmitting unit or optical signal receiving unit.
In some embodiments, the light-shielding layer is manufactured by screen printing, jet printing or 3D printing.
In some embodiments, the upper surface of the substrate is provided with a first conductive potential, a first conductive connection site, a second conductive site and a second conductive connection site, the first mounting site is arranged at the first conductive potential, and the second mounting site is arranged at the second conductive potential;
the optical signal transmitting unit located at the first installation position is communicated with the first conductive connection position through a first conductive wire, and the optical signal receiving unit located at the second installation position is communicated with the second conductive connection position through a second conductive wire.
In some embodiments, the lower surface of the substrate is provided with a third conducting potential, a third conducting connection site, a fourth conducting potential and a fourth conducting connection site which respectively correspond to the first conducting potential, the first conducting connection site, the second conducting potential and the second conducting connection site;
and a first through hole for connecting the first conducting potential and the third conducting potential, a second through hole for connecting the first conducting connecting position and the third conducting connecting position, a third through hole for connecting the second conducting potential and the fourth conducting connecting position and a fourth through hole for connecting the second conducting connecting position and the fourth conducting connecting position are respectively arranged on two sides of the substrate.
On the other hand, the present disclosure also provides a method for manufacturing a photoelectric sensor package structure, including:
providing a substrate, wherein a first mounting position and a second mounting position, a first conductive connecting position and a second conductive connecting position are arranged on the upper surface of the substrate;
respectively fixing the optical signal transmitting unit and the optical signal receiving unit to a first mounting position and a second mounting position of a substrate, and respectively connecting the optical signal transmitting unit and the optical signal receiving unit with a first conductive connecting position and a second conductive connecting position through a first conductive wire and a second conductive wire;
forming a protective adhesive layer covering the whole upper surface on the upper surface of the substrate by using adhesive injection equipment, wherein the protective adhesive layer covers the optical signal transmitting unit and the optical signal receiving unit, plays a role in protecting the optical signal transmitting unit and the optical signal receiving unit, and allows an optical signal of the optical signal transmitting unit to pass through;
utilize screen printing technology to form the light shield layer that covers the protection glue film on the upper surface of protection glue film, wherein, the light shield layer is provided with the directional light guide channel who covers respectively in light signal emission unit and light signal receiving unit top, and the position that the light shield layer covers does not allow the light signal to pass through to ensure that the light signal passes through by directional light guide channel.
In still another aspect, the present disclosure also provides an electronic device including the above-mentioned photosensor package structure,
or, the electronic device comprises the photoelectric sensor packaging structure manufactured by the manufacturing method.
The photoelectric sensor packaging structure comprising the light shielding layer provided by the disclosure has the beneficial effects that:
(1) according to the photoelectric sensor, the light shading layer and the directional light guide channel are arranged, so that light signals can only enter the photoelectric sensor through the directional light guide channel and are received by the light signal receiving unit, and the interference of ambient light and reflected light of a non-to-be-detected object to a detection result is reduced.
Drawings
To more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a package structure of a photosensor provided in an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a first portion of a photosensor package structure including a light-shielding layer according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a second portion of a photosensor package structure including a light-shielding layer according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a third portion of a photosensor package structure including a light-shielding layer according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a fourth portion of a photosensor package structure including a light-shielding layer according to an embodiment of the present disclosure;
fig. 6 is a structural schematic diagram of a second state of a photosensor package structure including a light-shielding layer according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a third state of a photosensor package structure including a light-shielding layer according to an embodiment of the present disclosure;
fig. 8 is a flowchart of a method for manufacturing a photosensor package structure including a light-shielding layer according to an embodiment of the present disclosure.
Wherein, in the figures, the respective reference numerals:
| 10 | |
11 | Optical |
| 12 | Optical |
13 | Protective |
| 14 | |
15 | Directional |
| 16 | First conductive site | 17 | A first |
| 18 | Second |
19 | Second |
| 20 | First |
21 | Second |
| 22 | First through |
23 | Second through |
| 24 | Third through |
25 | Fourth through hole |
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present disclosure more clearly understood, the present disclosure is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the disclosure and are not intended to limit the disclosure.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
Referring to fig. 1, an embodiment of the present disclosure provides an overall structure schematic diagram of a photoelectric sensor package structure, including a substrate 10, an optical signal emitting unit 11, an optical signal receiving unit 12, a protective adhesive layer 13, and a light shielding layer 14. An optical signal transmitting unit 11 and an optical signal receiving unit 12 are fixed on the upper surface of the substrate 10; the optical signal transmitting unit 11 and the optical signal receiving unit 12 are respectively connected with the first conductive connecting position 17 and the second conductive connecting position 19 on the upper surface of the substrate 10 through a first conductive connecting line 20 and a second conductive line 21; the optical signal transmitting unit 11 and the optical signal receiving unit 12 are provided with a protective adhesive layer 13; the upper surface of the protective adhesive layer 13 includes a light shielding layer 14, and the light shielding layer 14 is provided with a directional light guide channel 15 respectively covering the upper parts of the optical signal transmitting unit 11 and the optical signal receiving unit 12. It should be noted that the structure of the photosensor package including the light-shielding layer in this embodiment is essentially the structure of the photosensor, and for convenience of description, the structure of the photosensor package including the light-shielding layer is collectively referred to as the photosensor in this embodiment.
The photoelectric sensor including the light shielding layer 14 provided by the present embodiment has at least the following beneficial effects:
(1) by arranging the light shielding layer 14 and the directional light guide channel 15, the optical signal can only enter the photoelectric sensor from the directional light guide channel 15 and is received by the optical signal receiving unit 12, so that the interference of ambient light and the reflected light of the non-object to be detected to the detection result is reduced.
Referring to fig. 2, in an embodiment, the substrate 10 is a rectangular substrate 10 having a certain thickness, and the shape of the substrate 10 may be changed by one skilled in the art according to different situations, which is not limited herein. A first conductive potential 16, a first conductive connection site 17, a second conductive potential 18 and a second conductive connection site 19 are arranged on the upper surface of the substrate 10, a third conductive potential, a third conductive connection site, a fourth conductive potential and a fourth conductive connection site which correspond to the first conductive potential 16, the first conductive connection site 17, the second conductive potential 18 and the second conductive connection site 19 respectively are arranged on the lower surface of the substrate 10, and the shapes and the sizes of the conductive sites corresponding to the upper part and the lower part of the substrate 10 can be different without limitation; a first through hole 22 for connecting the first conductive potential 16 and the third conductive potential, a second through hole 23 for connecting the first conductive connection site 17 and the third conductive connection site, a third through hole 24 for connecting the second conductive potential 18 and the fourth conductive potential, and a fourth through hole 25 for connecting the second conductive connection site 19 and the fourth conductive connection site are respectively disposed on both sides of the substrate 10.
Referring to fig. 3, a first conductive potential 16 and a second conductive potential 18 are disposed on the upper surface of the substrate 10, the optical signal transmitting unit 11 is fixed on the first conductive potential 16, and the optical signal receiving unit 12 is fixed on the second conductive potential 18. As an example, the optical signal emitting unit 11 may be an LED or a VCSEL, the chip structure may be vertical or flip, and the chip structure may be an infrared emitting chip or a green emitting chip according to different applications, but is not limited to these types of chips, and those skilled in the art may select different bands and different types of chips according to practical applications, and this embodiment is not limited to this; the optical signal receiving unit 12 may be a photodiode or a phototriode, but is not limited to the photodiode or the phototriode, and may also be a dedicated ASIC chip, and those skilled in the art may flexibly select the optical signal receiving unit according to actual needs, and the embodiment does not limit the optical signal receiving unit. It should be noted that the optical signal transmitting unit 11 and the optical signal receiving unit 12 of the present embodiment may be fixed on the substrate 10, that is, the optical signal transmitting unit 11, the optical signal receiving unit 12 and the substrate 10 are two separate components; in addition, the optical signal transmitting unit 11 and the optical signal receiving unit 12 of the present embodiment can also be directly covered inside the substrate 10, i.e. they are integrated with the substrate 10.
The protective adhesive layer 13 is formed on the upper surface of the substrate 10 by a glue injection method, and includes a first protective adhesive layer 131 and a second protective adhesive layer 132, and the first protective adhesive layer 131 and the second protective adhesive layer 132 respectively cover the optical signal transmitting unit 11, the optical signal receiving unit 12, and the conductive connection line. As shown in fig. 7, on the premise of completely covering the optical signal transmitting unit 11 and the optical signal receiving unit 12, the shape of the protective adhesive layer 13 may be a rectangular parallelepiped, a cylinder, a hexahedral cylinder, or the like, and is set as required, which is not limited herein; as an example, the protective adhesive layer 13 of the present embodiment is generally transparent silicone or transparent epoxy, but is not limited to transparent silicone or transparent epoxy, and those skilled in the art can also select other materials with similar performance, so that the first protective adhesive layer 131 and the second protective adhesive layer 132 can not only protect the optical signal transmitting unit 11 and the optical signal receiving unit 12, thereby improving the reliability and stability of the package, but also allow the optical signal in the wavelength band transmitted by the optical signal transmitting unit 11 to pass through. Optionally, other functional materials, such as an ambient light filter material or a band-pass material, may be mixed in the protective adhesive layer 13, wherein the ambient light filter material is used to prevent ambient light signals that may cause interference from passing through, and the band-pass material allows light of a specific wavelength band to pass through. So, protection glue film 13 can prevent to pass through the colloid to the ambient light that produces the interference to the detected signal to improve photoelectric sensor testing result's accuracy, and then promote photoelectric sensor's wholeness ability. In this embodiment, the functional materials that can be mixed in the protective adhesive layer 13 are not limited to the above two materials, and those skilled in the art can flexibly select other functional materials according to the application requirements, which is not limited in this embodiment.
The light shielding layer 14 covers the entire upper surface of the protective adhesive layer 13, and in addition, the light shielding layer 14 is further provided with a directional light guide channel 15 respectively covering above the optical signal transmitting unit 11 and the optical signal receiving unit 12.
In some embodiments, the thickness of the light shielding layer 14 is generally 20 to 200 μm, which ensures that the light shielding layer 14 shields the ambient light from the covered portion of the light shielding layer 14 to enter the inside of the package body, and prevents the optical signal of the optical signal emitting unit 11 from being emitted from the covered portion of the printed layer.
In some embodiments, the size of the cross-sectional area of the directional light guide channel may be 0.5 to 1.5 times the size of the surface area of the optical signal transmitting unit 11 or the optical signal receiving unit 12, and less than 0.5 times may cause the effective emission or effective reception of the optical signal to be weakened, and more than 1.5 times may weaken the effect of resisting the ambient light interference. In addition, the cross-sectional shape of the directional light guide channel can be circular, square, oval, semi-oval, diamond or other shapes, and is specifically set as required. In some embodiments, the shape and size of the directional light guide channel 15 corresponding to the optical signal receiving unit 12 and the directional light guide channel 15 corresponding to the optical signal receiving unit 12 may be the same or different, and are specifically set according to needs, and are not limited herein.
The directional light guide channel 15 mainly functions to guide a light signal path, and the directional light guide channel 15 is structurally designed to achieve the effect of gathering or diffusing light. Referring to fig. 6, in some embodiments, the opening area of the side of the directional light guide channel 15 corresponding to the optical signal receiving unit 12 away from the substrate 1 is larger than the opening area of the side of the directional light guide channel 15 close to the substrate 10. This structure can make the directional light guide channel 15 collect more light signals and transmit the collected light signals to the light signal receiving unit 12 in a concentrated manner, thereby enhancing the light signal receiving capability of the photoelectric sensor.
In some embodiments, the directional light guide channel 15 corresponding to the optical signal receiving unit 12 is a bowl-shaped structure. The bowl-shaped structure may mean that the openings at the two sides of the directional light guide channel 15 are circular or elliptical, and the sizes of the openings at the two sides of the directional light guide channel 15 are different.
In some embodiments, the area of the opening on the side of the directional light guide channel 15 away from the substrate 10 corresponding to the optical signal emitting unit 11 is greater than or equal to the area of the opening on the side of the directional light guide channel 15 close to the substrate 10, so that the optical signal emitted by the optical signal emitting unit 11 can be emitted more intensively, and the optical signal emission intensity of the photosensor can be increased.
Referring to fig. 7, in an embodiment, the directional light guide channel 15 corresponding to the optical signal receiving unit 12 is the same as the directional light guide channel 15 corresponding to the optical signal emitting unit 11, and the opening areas of the sides far away from the substrate 10 are larger than the opening areas of the sides of the directional light guide channels 15 close to the substrate 10. The design has the advantages that the mold is easier to demould during processing, and the success rate of forming the directional light guide channel 15 is increased.
In some embodiments, the material of the light shielding layer 14 may be a light-curing material such as black UV ink, a thermosetting material such as black silica gel, black epoxy resin, or other materials with similar functions, and is not limited specifically herein.
In some embodiments, the light shielding layer 14 may be formed by a screen printing process, a spray printing process, a 3D printing process, or other flexible shape and size adjustment process. By adopting the preparation method, the shape and the size of the directional light guide channel 15 can be flexibly adjusted according to the needs, and the limitation that the traditional die cannot be adjusted due to fixation is avoided. In addition, because the accuracy requirements are different, in different application scenarios, different settings can be performed according to needs, and no limitation is made here.
As shown in fig. 2-5, in manufacturing the photoelectric sensor of the present embodiment, a substrate 10 (the substrate 10 shown in fig. 2) provided with a first conductive potential 16 and a second conductive potential 18 is provided first, then the optical signal transmitting unit 11 and the optical signal receiving unit 12 are fixed to the first conductive potential 16 and the second conductive potential 18 of the substrate 10 respectively (as shown in fig. 3), next, the substrate 10 may be placed into a dedicated Molding apparatus, a protective adhesive layer 13 is obtained by Molding with adhesive, and then a light shielding layer 14 with an oriented light guide channel 15 is formed on the protective adhesive layer 13 by a screen printing process (as shown in fig. 6).
Alternatively, in the above manufacturing process, the protective adhesive layer 13 is not limited to be molded by Molding, and those skilled in the art may form the adhesive into a rubber cake and then bond the rubber cake to the substrate 10. The specific dedicated mold is not described in this embodiment, and those skilled in the art can select a dedicated mold capable of implementing the above-described functions.
Alternatively, in the above manufacturing process, the light shielding layer 14 is not limited to be formed by screen printing, and those skilled in the art may also realize the formation by a spray printing process, a 3D printing process, or the like.
Due to the flexibility of the process, the overall packaging size of the photoelectric sensor of the embodiment can be flexibly adjusted according to the actual application requirements, so that large-size packaging and small-size packaging can be realized, such as 2.0mm multiplied by 1.0mm, 2.0mm multiplied by 1.6mm and the like, and the packaging thickness can be flexibly adjusted by adjusting the amount of injected glue; 0.7mm, 1.0mm and the like, and provides great flexibility for adapting to different application requirements.
In a more specific embodiment, the upper surface and the lower surface of the substrate 10 of the present embodiment are each provided with four conductive potentials. Specifically, referring to fig. 4, the upper surface of the substrate 10 is provided with a first conductive potential 16, a first conductive connection site 17, a second conductive potential 18 and a second conductive connection site 19, the first mounting site is provided at the first conductive potential 16, and the second mounting site is provided at the second conductive potential 18; the optical signal transmitting unit 11 at the first installation position is communicated with the first conductive connection position 17 through a first conductive wire 20, and the optical signal receiving unit 12 at the second installation position is communicated with the second conductive connection position 19 through a second conductive wire 21. The position of the first mounting position on the first conductive potential 16 and the position of the second mounting position on the second conductive potential 18 can be flexibly adjusted according to practical application, in other words, it can also be understood that the optical signal transmitting unit 11 and the optical signal receiving unit 12 are directly fixed to the first conductive potential 16 and the second conductive potential 18, respectively.
The lower surface of the substrate 10 is provided with a third conductive potential, a third connection conductive potential, a fourth conductive potential, and a fourth connection conductive potential (not shown in the figure) corresponding to the first conductive potential 16, the first conductive connection site 17, the second conductive potential 18, and the second conductive connection site 19, respectively. And, a first via hole 22 for connecting the first conductive potential 16 and the third conductive potential, a second via hole 23 for connecting the first conductive connection site 17 and the third connection conductive potential, a third via hole 24 for connecting the second conductive potential 18 and the fourth conductive potential, and a fourth via hole 25 for connecting the second conductive connection site 19 and the fourth connection conductive potential are respectively provided on both sides of the substrate 10. These vias may serve to electrically connect the upper and lower conductive sites of the substrate 10. Optionally, the shapes and sizes of the four conductive potentials disposed on the upper surface and the lower surface of the substrate 10 may be flexibly adjusted according to practical applications or heat dissipation requirements, which is not limited in this embodiment.
According to the above design, when manufacturing the photoelectric sensor, after the optical signal transmitting unit 11 and the optical signal receiving unit 12 are respectively fixed on the substrate 10, the optical signal transmitting unit 11 and the optical signal receiving unit 12 are further respectively connected with the first conductive connection position 17 and the second conductive connection position 19 of the substrate 10 through the first conductive wire 20 and the second conductive wire 21, and then the subsequent operation of the glue injection process is performed. It should be noted that the photoelectric sensor of the present embodiment is not limited to the above-mentioned design (i.e. the way of setting four conductive potentials on the upper and lower surfaces of the substrate 10 and then connecting the optical signal transmitting unit 11 and the optical signal receiving unit 12 through the conductive wires), and those skilled in the art can flexibly design the substrate 10, the optical signal transmitting unit 11 and the optical signal receiving unit 12 according to actual needs without departing from the scope of the present disclosure.
The present disclosure also provides a method of manufacturing a photosensor package structure including a light shielding layer 14, as shown in fig. 8, including:
s30: a substrate 10 is provided, wherein the upper surface of the substrate 10 is provided with a first mounting location and a second mounting location, a first conductive connection location 17 and a second conductive connection location 19.
S31: the optical signal transmitting unit 11 and the optical signal receiving unit 12 are fixed to the first mounting position and the second mounting position of the substrate 10, respectively, and are connected to the first conductive connection position 17 and the second conductive connection position 19 through the first conductive line 20 and the second conductive line 21, respectively.
S32: a protective adhesive layer 13 covering the entire upper surface is formed on the upper surface of the substrate 10 by using an adhesive injection device, wherein the protective adhesive layer 13 covers the optical signal transmitting unit 11 and the optical signal receiving unit 12, protects the optical signal transmitting unit 11 and the optical signal receiving unit 12, and allows the optical signal of the optical signal transmitting unit 11 to pass through the protective adhesive layer 13.
S33: a light shielding layer 14 covering the protective adhesive layer 13 is formed on the upper surface of the protective adhesive layer 13 by using a screen printing process, wherein the light shielding layer 14 is provided with a directional light guide channel 15 respectively covering the optical signal transmitting unit 11 and the optical signal receiving unit 12, and the covering position of the light shielding layer 14 does not allow the optical signal to pass through so as to ensure that the optical signal passes through the directional light guide channel 15.
The specific implementation of steps S30-S33 can refer to the above description, and will not be described herein.
Based on the same concept, the present disclosure also provides an electronic device, where the electronic device includes the photosensor package structure including the light shielding layer in the above embodiment, or the electronic device includes the photosensor package structure including the light shielding layer manufactured by the above method for manufacturing the photosensor package structure including the light shielding layer.
The present disclosure is to be considered as limited only by the preferred embodiments and not limited to the specific embodiments described herein, and all changes, equivalents and modifications that come within the spirit and scope of the disclosure are desired to be protected.
Claims (10)
1. A photoelectric sensor packaging structure comprising a light shielding layer, the packaging structure comprising:
the optical signal transmission device comprises a substrate, wherein a first mounting position and a second mounting position are arranged on the upper surface of the substrate, an optical signal transmission unit is fixed on the first mounting position, and an optical signal receiving unit is fixed on the second mounting position;
the protective adhesive layer is formed on the upper surface of the substrate in an adhesive injection mode;
the light shielding layer covers the upper surface of the protective adhesive layer through a printing process, and is provided with a directional light guide channel which covers the upper parts of the optical signal transmitting unit and the optical signal receiving unit respectively;
the protective adhesive layer is used for protecting the optical signal transmitting unit and the optical signal receiving unit and allowing the optical signal of the optical signal transmitting unit to pass through; the light shielding layer covers a position which does not allow the optical signal to pass through so as to ensure that the optical signal passes through the directional light guide channel.
2. The photosensor package structure including a light shielding layer according to claim 1, wherein an opening area of a side of the directional light guide channel corresponding to the light signal emitting unit and the light signal receiving unit, which side is away from the substrate, is greater than or equal to an opening area of a side of the directional light guide channel, which side is close to the substrate.
3. The optical sensor package structure of any one of claims 1 to 3, wherein the shape of the opening of the side of the directional light guide channel away from the substrate is the same as the shape of the opening of the side of the directional light guide channel close to the substrate.
4. The photo-sensor package structure comprising a light-shielding layer according to claim 1, wherein the light-shielding layer has a thickness in a range of 20 to 200 μm.
5. The photosensor package structure including a light shielding layer according to claim 1, wherein the area of the directional light guide channel is 0.5 to 1.5 times the surface area of the corresponding light signal emitting unit or light signal receiving unit.
6. The photoelectric sensor packaging structure comprising a light shielding layer according to claim 1, wherein the light shielding layer is manufactured by screen printing, jet printing or 3D printing.
7. The photosensor package structure including a light shielding layer according to any one of claims 1 to 6, wherein a first conductive potential, a first conductive connection site, a second conductive site, and a second conductive connection site are disposed on an upper surface of the substrate, the first mounting site is disposed at the first conductive potential, and the second mounting site is disposed at the second conductive potential;
the optical signal transmitting unit located at the first installation position is communicated with the first conductive connection position through a first conductive wire, and the optical signal receiving unit located at the second installation position is communicated with the second conductive connection position through a second conductive wire.
8. The package structure of a photo sensor including a light shielding layer as claimed in claim 7, wherein a third conducting potential, a third conducting connection site, a fourth conducting potential, and a fourth conducting connection site corresponding to the first conducting potential, the first conducting connection site, the second conducting potential, and the second conducting connection site, respectively, are disposed on the lower surface of the substrate;
the two sides of the substrate are respectively provided with a first through hole for connecting the first conducting potential and the third conducting potential, a second through hole for connecting the first conducting connecting position and the third conducting connecting position, a third through hole for connecting the second conducting potential and the fourth conducting potential, and a fourth through hole for connecting the second conducting connecting position and the fourth conducting connecting position.
9. A method for manufacturing a photoelectric sensor packaging structure comprising a shading layer is characterized by comprising the following steps:
providing a substrate, wherein a first mounting position, a second mounting position, a first conductive connecting position and a second conductive connecting position are arranged on the upper surface of the substrate;
respectively fixing an optical signal transmitting unit and an optical signal receiving unit to a first mounting position and a second mounting position of the substrate, and respectively connecting the optical signal transmitting unit and the optical signal receiving unit with the first conductive connecting position and the second conductive connecting position through a first conductive wire and a second conductive wire;
forming a protective adhesive layer covering the whole upper surface on the upper surface of the substrate by using glue injection equipment, wherein the protective adhesive layer covers the optical signal transmitting unit and the optical signal receiving unit, plays a role in protecting the optical signal transmitting unit and the optical signal receiving unit, and allows an optical signal of the optical signal transmitting unit to pass through;
and forming a light shielding layer covering the protection adhesive layer on the upper surface of the protection adhesive layer by utilizing a screen printing process, wherein the light shielding layer is provided with a directional light guide channel which is respectively covered above the optical signal transmitting unit and the optical signal receiving unit, and the position covered by the light shielding layer does not allow an optical signal to pass through so as to ensure that the optical signal passes through the directional light guide channel.
10. An electronic device, characterized in that the electronic device comprises the photosensor package structure of any one of claims 1 to 8;
alternatively, the first and second electrodes may be,
the electronic device comprises the photoelectric sensor packaging structure manufactured by the manufacturing method of claim 9.
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