CN113825819B - 黏合剂组合物及其选定方法、黏合剂膜及其制造方法以及黏合体及其制造方法 - Google Patents
黏合剂组合物及其选定方法、黏合剂膜及其制造方法以及黏合体及其制造方法 Download PDFInfo
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- CN113825819B CN113825819B CN201980096455.9A CN201980096455A CN113825819B CN 113825819 B CN113825819 B CN 113825819B CN 201980096455 A CN201980096455 A CN 201980096455A CN 113825819 B CN113825819 B CN 113825819B
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- 150000003553 thiiranes Chemical group 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C09J171/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L15/00—Compositions of rubber derivatives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
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PCT/JP2019/025686 WO2020261501A1 (ja) | 2019-06-27 | 2019-06-27 | 接着剤組成物及びその選定方法、接着フィルム及びその製造方法、並びに接着体及びその製造方法 |
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CN113825819B true CN113825819B (zh) | 2023-09-12 |
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JP (1) | JP7380687B2 (ja) |
KR (1) | KR102661680B1 (ja) |
CN (1) | CN113825819B (ja) |
WO (1) | WO2020261501A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2008133391A (ja) * | 2006-11-29 | 2008-06-12 | Toray Fine Chemicals Co Ltd | 接着剤組成物 |
JP2016169337A (ja) * | 2015-03-13 | 2016-09-23 | ナミックス株式会社 | 樹脂組成物及びそれを用いた接着剤 |
JP2018104653A (ja) * | 2016-12-28 | 2018-07-05 | 日立化成株式会社 | 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤 |
WO2019022062A1 (ja) * | 2017-07-26 | 2019-01-31 | リンテック株式会社 | 半導体用接着フィルム及び半導体用接着シート |
Family Cites Families (4)
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JP4110589B2 (ja) * | 1997-03-31 | 2008-07-02 | 日立化成工業株式会社 | 回路用接続部材及び回路板の製造法 |
JP5157208B2 (ja) | 2006-03-20 | 2013-03-06 | 日立化成株式会社 | ダイボンドダイシングシート |
JP5914123B2 (ja) | 2012-04-11 | 2016-05-11 | 積水化学工業株式会社 | 電子部品用接着剤及び電子部品用接着フィルム |
KR102389948B1 (ko) | 2016-11-18 | 2022-04-21 | 가부시끼가이샤 쓰리본드 | 카메라 모듈용 양이온 경화성 접착제 조성물, 경화물 및 접합체 |
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- 2019-06-27 WO PCT/JP2019/025686 patent/WO2020261501A1/ja active Application Filing
- 2019-06-27 CN CN201980096455.9A patent/CN113825819B/zh active Active
- 2019-06-27 JP JP2021528797A patent/JP7380687B2/ja active Active
- 2019-06-27 KR KR1020217037020A patent/KR102661680B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008133391A (ja) * | 2006-11-29 | 2008-06-12 | Toray Fine Chemicals Co Ltd | 接着剤組成物 |
JP2016169337A (ja) * | 2015-03-13 | 2016-09-23 | ナミックス株式会社 | 樹脂組成物及びそれを用いた接着剤 |
JP2018104653A (ja) * | 2016-12-28 | 2018-07-05 | 日立化成株式会社 | 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤 |
WO2019022062A1 (ja) * | 2017-07-26 | 2019-01-31 | リンテック株式会社 | 半導体用接着フィルム及び半導体用接着シート |
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WO2020261501A1 (ja) | 2020-12-30 |
KR20220018962A (ko) | 2022-02-15 |
JPWO2020261501A1 (ja) | 2020-12-30 |
KR102661680B1 (ko) | 2024-04-26 |
CN113825819A (zh) | 2021-12-21 |
JP7380687B2 (ja) | 2023-11-15 |
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