CN113823547A - 收纳装置、基片处理系统和消耗部件的输送方法 - Google Patents
收纳装置、基片处理系统和消耗部件的输送方法 Download PDFInfo
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Abstract
本发明提供能够减少所占空间的收纳装置、基片处理系统和消耗部件的输送方法。收纳装置包括载置台、传感器、旋转部、收纳部和升降部。载置台载置消耗部件。传感器检测消耗部件的方向。旋转部基于由传感器检测出的消耗部件的方向,使消耗部件向规定的方向旋转。收纳部位于载置台的下部,收纳消耗部件。升降部使收纳部升降。
Description
技术领域
本发明涉及收纳装置、基片处理系统和消耗部件的输送方法。
背景技术
在对基片处理系统的基片进行处理的处理装置中,随着处理而腔室内的边缘环、覆盖环等消耗部件消耗,因此需要定期地更换。一直以来,消耗部件的更换通过将处理装置的腔室开放而由作业员进行更换作业,但是考虑将消耗部件输送到输送机器人。在该情况下,进行消耗部件的对位(位置对准),因此,需要收纳消耗部件的收纳部和进行对位(alignment)的对位部。
作为具有收纳部和对位部的装置,提出了以晶片为对象的装置。例如,提出了从晶片收纳装置取出晶片并将其向相邻的载置位置移动,使所载置的晶片旋转,使得晶片的定向平面(orientation flat)对位到一定方向的晶片位置对准装置。
现有技术文献
专利文献
专利文献1:日本特开2008-311391号公报
发明内容
发明要解决的技术问题
本发明提供能够减少所占空间(footprint)的收纳装置、基片处理系统和消耗部件的输送方法。
用于解决技术问题的技术方案
本发明的一个方式的收纳装置包括载置台、传感器、旋转部、收纳部和升降部。载置台载置消耗部件。传感器检测消耗部件的方向。旋转部基于由传感器检测出的消耗部件的方向,使消耗部件向规定的方向旋转。收纳部位于载置台的下部,收纳消耗部件。升降部使收纳部升降。
发明效果
依照本发明,能够减少所占空间。
附图说明
图1是表示本发明的第1实施方式中的基片处理系统的一例的横截俯视图。
图2是表示第1实施方式中的收纳装置的一例的正视截面图。
图3是表示第1实施方式中的收纳装置的一例的侧视截面图。
图4是表示从收纳装置取出盒的情况的一例的侧视截面图。
图5是表示工作台中的边缘环与拾取器的关系的一例的图。
图6是表示在工作台载置有边缘环的状态的一例的图。
图7是表示第1实施方式中的输送处理的一例的流程图。
图8是表示拾取器从盒获取边缘环的状态的一例的图。
图9是表示拾取器在工作台载置边缘环的状态的一例的图。
图10是表示第2实施方式中的收纳装置的一例的正视截面图。
附图标记说明
1 基片处理系统
10 处理系统主体
11a、11b 真空输送室(VTM)
12a、12b 机械臂
13 处理装置(PM)
15 负载锁定装置(LLM)
18 EFEM
20 灰化装置
22、22a 收纳装置
23 闸门
30、70 腔室
31、71 工作台
32 线传感器
33 发光部
34 箱体
35 盒
36、76 滚珠丝杠
37 引导件
38、78 电机
39、79 储存器
40、90 机械室
41、81 窗
42 门
50 边缘环
72 图像传感器
73 基座
74 上部基座
75 基部
100 控制装置
120 拾取器。
具体实施方式
以下,基于附图,详细地说明公开的收纳装置、基片处理系统和消耗部件的输送方法的实施方式。此外,公开技术不由以下的实施方式限定。
为了使输送机器人输送消耗部件,在基片处理系统中增加进行消耗部件的收纳和对位的收纳装置。但是,在将收纳部和对位部相邻地设置的收纳装置中,各个部分需要设置场所,所占空间变大。对此,在设置基片处理系统的工厂中,为了提高空间利用率,人们要求减少所占空间。所以,对于收纳装置,人们也希望减少所占空间。
(第1实施方式)
[基片处理系统1的结构]
图1是表示本发明的第1实施方式中的基片处理系统的一例的横截俯视图。图1所示的基片处理系统1是能够单片地对晶片(例如,半导体晶片。)实施等离子体处理等各种处理的基片处理系统。
基片处理系统1包括处理系统主体10和控制处理系统主体10的控制装置100。处理系统主体10例如如图1所示,包括真空输送室11a、11b、多个处理装置13、多个负载锁定装置15、EFEM(Equipment Front End Module:设备前端模块)18、灰化装置20和收纳装置22。此外,在以下的说明中,将真空输送室11a、11b表示为VTM(Vacuum Transfer Module)11a、11b,将处理装置13表示为PM(Process Module)13,将负载锁定装置15表示为LLM(LoadLock Module)15。
VTM11a、11b各自在俯视时具有大致四边形形状。VTM11a、11b在相对的2个侧面分别连接有多个PM13。此外,VTM11a的此外的相对的2个侧面中的一个侧面连接有LLM15,在另一侧面连接有用于与VTM11b连接的未图示的通路(path)。此外,VTM11a的供LLM15连接的侧面,与2个LLM15相应地设置角度。VTM11b经由未图示的通路与VTM11a连接。VTM11a、11b具有真空室,在内部配置有机械臂12a、12b。
机械臂12a、12b构成为能够旋转、伸缩、升降。机械臂12a、12b通过在配置于前端的拾取器120载置晶片,能够在PM13与LLM15之间输送晶片。此外,机械臂12a、12b通过在拾取器120载置边缘环等消耗部件,能够在PM13与收纳装置22之间输送消耗部件。机械臂12a、12b是真空输送机器人的一例。此外,机械臂12a、12b只要能够在PM13与LLM15之间输送晶片,并且能够在PM13与收纳装置22之间输送消耗部件即可,不限于图1所示的结构。
PM13具有处理室,具有配置于内部的圆柱状的工作台(载置台)。在将晶片载置于工作台后,PM13将内部减压并导入处理气体,然后对内部施加高频电功率以生产等离子体,用等离子体对晶片实施等离子体处理。VTM11a、11b和PM13由可开闭的闸门(gate valve)14分隔。在PM13内的工作台设置有边缘环和覆盖环,该边缘环配置在晶片的周围并用于提高等离子体处理的均匀性,该覆盖环用于保护工作台端部不受等离子体的影响。此外,在与工作台相对的处理室内的上部设置有用于施加高频电功率的上部电极。
LLM15配置在VTM11a与EFEM18之间。LLM15具有能够将内部切换为真空、大气压的内压可变室,具有配置于内部的圆柱状的工作台。LLM15在将晶片从EFEM18送入VTM11a时,将内部维持为大气压而从EFEM18接收了晶片后,将内部减压而向VTM11a送入晶片。此外,在将晶片从VTM11a向EFEM18送出时,在内部维持真空而从VTM11a接收了晶片后,将内部升压至大气压而向EFEM18送入晶片。LLM15和VTM11a由可开闭的闸门16分隔。此外,LLM15和EFEM18由可开闭的闸门17分隔。
EFEM18与VTM11a相对地配置。EFEM18为长方体状,具有FFU(Fan Filter Unit:风机过滤器),是被保持为大气压气氛的大气输送室。沿EFEM18的长边方向的一个侧面,连接有2个LLM15。沿EFEM18的长边方向的另一个侧面,连接有5个装载端阜(LP:Load Port)19。在LP19能够载置作为收纳多个晶片的容器的FOUP(Front-Opening Unified Pod:前开式晶片传送盒)(未图示)。在EFEM18内配置有输送晶片的大气输送机器人(机械臂)。EFEM18是装载装置的一例。
灰化装置20与VTM11b连接。灰化装置20在内部具有圆柱状的工作台。灰化装置20将载置于工作台上的晶片的抗蚀剂剥离。VTM11b和灰化装置20由可开闭的闸门21分隔。
收纳装置22与VTM11b连接。收纳装置22包括:在内部收纳边缘环、覆盖环和上部电极此类的消耗部件的收纳部;以及进行消耗部件的对位(位置对准)的工作台(载置台)和旋转部。收纳装置22能够用机械臂12b的拾取器120将消耗部件从收纳部向工作台移动。进行了对位的消耗部件,由机械臂12b输送到PM13。VTM11b和收纳装置22由可开闭的闸门23分隔。
基片处理系统1具有控制装置100。控制装置100例如为计算机,包括CPU(CentralProcessing Unit:中央处理器)、RAM(Random Access Memory:随机存取存储器)、ROM(ReadOnly Memory:只读存储器)、辅助存储装置等。CPU基于保存在ROM或者辅助存储装置中的程序来动作,控制基片处理系统1的各构成要素的动作。
[收纳装置22的详情]
图2是表示第1实施方式中的收纳装置的一例的正视截面图。图2是从VTM11b侧观察收纳装置22的截面图。如图2所示,收纳装置22在框架24之上设置有腔室30,在腔室30的上部具有机械室40。腔室30能够将内部切换为真空、大气压。此外,对腔室30供给作为吹扫气体的例如N2气体,能够调压。机械室40为大气压气氛。
在腔室30内设置有具有工作台31和设置于工作台31的下部的箱体34的储存器39。储存器39能够借助于滚珠丝杠36升降。在机械室40内设置有检测消耗部件的方向的线传感器32和驱动滚珠丝杠36的电机38。在腔室30与机械室40之间设置有由石英等构成的窗41,以使得线传感器32能够接收后述的发光部33的光。
工作台31载置消耗部件。此外,工作台31具有与线传感器32相对的发光部33。工作台31通过内置在载置面的正下方的旋转部能够向θ方向旋转,使所载置的消耗部件例如边缘环50向规定的方向旋转。即,工作台31进行边缘环50的对位(位置对准)。在对位中,使边缘环50的定向平面(OF)与规定的方向一致。此外,在对位中,可以使边缘环50的中心位置对准。此外,工作台31是载置台和旋转部的一例。另外,在以下的说明中,使用边缘环50作为消耗部件的一例进行说明。
线传感器32检测从后述的发光部33照射来的光的光量,将检测出的光量输出到控制装置100。控制装置100利用检测出的光量根据边缘环50的定向平面是否存在而变化这一点,来检测边缘环50的定向平面。控制装置100基于检测出的定向平面,检测边缘环50的方向。线传感器32例如为CCD(Charge Coupled Device:电荷耦合器件)或者CMOS(Complementary Metal Oxide Semiconductor:互补金属氧化物半导体)等线传感器。
箱体34设置在工作台31的下部,在内部载置盒35。盒35能够从箱体34取出,在内部可收纳边缘环50。盒35中,收纳装置22的正面侧和背面侧开放。箱体34和盒35是收纳部的一例。
储存器39除了工作台31和箱体34之外,还在侧面具有支承在滚珠丝杠36的引导件37。滚珠丝杠36将腔室30的上表面和下表面连接,贯通腔室30的上表面而连接到机械室40内的电机38。腔室30的上表面的贯通部以滚珠丝杠36能够旋转的方式被密封。滚珠丝杠36通过电机38进行旋转,能够使储存器39在上下方向(Z轴方向)上移动。此外,滚珠丝杠36和电机38是升降部的一例。
图3是表示第1实施方式中的收纳装置的一例的侧视截面图。图3是以图中左侧成为VTM11b侧的方式观察收纳装置22的截面图。如图3所示,收纳装置22经由闸门23与VTM11b连接。VTM11b的机械臂12b的拾取器120能够经由闸门23被插入腔室30。拾取器120能够进行载置于盒35内的边缘环50的送出送入以及对工作台31的边缘环50的载置和获取。门42是进行腔室30内的盒35的取出或者设置时进行开闭的门。
在储存器39从腔室30的底面侧使盒35移动至与闸门23相对的位置等的上部为止的情况下,发光部43和个数检测传感器44检测载置于盒35的边缘环50的个数。发光部43例如为LED(Light Emitting Diode:发光二极管)或者半导体激光器等。个数检测传感器44检测从发光部43照射来的光的光量,将检测出的光量输出到控制装置100。控制装置100基于检测出的光量,计测从发光部43照射来的光被边缘环50遮挡的次数,由此检测边缘环50的个数。个数检测传感器44例如为光电二极管、光电晶体管等。此外,个数检测传感器44例如可以使用CCD或者CMOS等线传感器。
图4是表示从收纳装置取出盒时的一例的侧视截面图。如图4所示,在更换载置于盒35的边缘环50时,在将闸门23关闭的状态下,使储存器39向腔室30的底面侧移动。接着,将门42打开而从开口45取出盒35。接着,将载置有更换用的边缘环50的新的盒35经由开口45载置在箱体34,将门42关闭。
下面,使用图5和图6,对工作台31进行说明。图5是表示工作台中的边缘环与拾取器的关系的一例的图。图6是表示在工作台载置有边缘环的状态的一例的图。工作台31包括发光部33、基座60、旋转部61、支承垫62和升降销63。
发光部33被设置成与线传感器32相对。发光部33例如为LED或者半导体激光器等。例如,在图5所示的位置有边缘环50的定向平面(OF)的情况下,从发光部33照射来的光的光量发生变化,因此能够检测到定向平面。旋转部61设置于基座60上。支承垫62在旋转部61在例如设有3个的腕的前端部分设置多个,在旋转时支承边缘环50。旋转部61通过设置在基座60内的未图示的驱动机构进行旋转。支承垫62通过旋转部61旋转而进行旋转。升降销63例如设置4个,通过设置于基座60内的未图示的驱动机构而上升和下降。即,旋转部61位于载置边缘环50的支承垫62的正下方,使作为载置台的支承垫62旋转。旋转部61、支承垫62和升降销63设置于当载置有边缘环50的拾取器120被插入到工作台31上时,与拾取器120不发生干扰的位置。
[输送方法]
下面,对第1实施方式的输送方法进行说明。图7是表示第1实施方式中的输送处理的一例的流程图。在图7中,从盒35的设置至机械臂12b获取已对位的边缘环50进行说明。
首先,作为初始状态,收纳装置22将闸门23和门42关闭,用N2气体对腔室30内进行调压。控制装置100执行盒35的更换准备(步骤S1)。具体而言,控制装置100使储存器39移动至最下部的位置。控制装置100停止向腔室30供给N2气体,在进行了抽真空后将大气导入。控制装置100将驱动系统的电源关闭,解除门42的锁定。
由作业员将门42打开,进行盒35的更换。控制装置100在门42被关闭,由作业员进行规定的操作时,接收到盒35的更换作业的完成(步骤S2)。
控制装置100在盒35的更换结束时,将门42锁定,使储存器39移动到上部的第1位置(步骤S3)。控制装置100使之移动至第1位置,例如储存器39内的盒35与闸门23相对的位置。控制装置100在储存器39移动时,进行储存器39内中是否存在盒35的检测和由个数检测传感器44进行的边缘环50的个数的检测。此外,是否存在盒35的检测,可以使用个数检测传感器44,也可以在箱体34内设置检测用的微开关等来进行。此外,也可以在箱体34设置检测边缘环50是否从盒35突出的传感器来进行。
控制装置100在储存器39移动至上部的第1位置后,对腔室30内进行抽真空,导入N2气体来执行调压(步骤S4)。
控制装置100将闸门23打开,将机械臂12b的拾取器120插入腔室30内。机械臂12b用拾取器120从盒35获取边缘环50,暂时向VTM11b避让(步骤S5)。此外,也可以为,控制装置100在边缘环50向VTM11b避让后,将闸门23关闭。
图8是表示拾取器从盒获取边缘环的状态的一例的图。图8表示在步骤S5中,用拾取器120获取边缘环50的状态。在图8的例子中,储存器39停止在能够从箱体34内二层重叠的盒35中的下层侧的盒35获取边缘环50的第1位置。此外,拾取器120和边缘环50为正在通过闸门23以向VTM11b避让的状态。此外,第1位置根据盒35内的边缘环50的位置而在上下方向上可变。
返回图7的说明。控制装置100在拾取器120和边缘环50向VTM11b的避让结束时,使储存器39移动到下部的第2位置(步骤S6)。控制装置100使之移动至第2位置,例如工作台31的载置面与闸门23相对的位置。控制装置100在将闸门23关闭的情况下,移动到第2位置后将闸门23打开。
控制装置100在储存器39移动到第2位置时,将避让到VTM11b的拾取器120和边缘环50插入腔室30。机械臂12b将拾取器120上的边缘环50载置在工作台31(步骤S7)。
图9是表示拾取器将边缘环载置在工作台的状态的一例的图。图9表示在步骤S7中将拾取器120上的边缘环50载置在工作台31的状态。在图9的例子中,拾取器120为将边缘环50载置到工作台31而正在向VTM11b避让的状态。
返回图7的说明。控制装置100在使机械臂12b的拾取器120避让到VTM11b后,使储存器39移动到上部的第3位置(步骤S8)。第3位置是对位位置的一例,例如能够为图2所示的位置。此外,也可以为,控制装置100在拾取器120避让到VTM11b后,关闭闸门23。
控制装置100通过在第3位置,用线传感器32计测从发光部33照射来的光的光量并且使工作台31旋转,来执行边缘环50的对位(步骤S9)。即,控制装置100基于由线传感器32检测出的边缘环50的方向,使边缘环50向规定的方向旋转。控制装置100在边缘环50的对位完成时,使储存器39移动到下部的第2位置(步骤S10)。控制装置100在将闸门23关闭的情况下,在移动到第2位置后将闸门23打开。
控制装置100在储存器39移动到第2位置时,将避让到VTM11b的拾取器120插入腔室30。机械臂12b使用拾取器120从工作台31获取边缘环50(步骤S10)。控制装置100将闸门23关闭,并且将机械臂12b获取到的边缘环输送至规定的PM13。如上所述,在减少了所占空间的收纳装置22中,能够进行边缘环50等消耗部件的对位和输送。
(第2实施方式)
在第1实施方式中,在工作台31内设置旋转部使边缘环50旋转而进行了对位,但是也可以使固定了载置台、收纳部和升降部的基座旋转,关于该情况的实施方式,作为第2实施方式进行说明。此外,对与第1实施方式相同的结构标注相同的附图标记,从而省略该重复的结构和动作的说明。
[收纳装置22a的结构]
图10是表示第2实施方式中的收纳装置的一例的正视截面图。图10所示的收纳装置22a与第1实施方式的收纳装置22相比,代替腔室30和机械室40而具有腔室70和机械室90。此外,收纳装置22a代替工作台31、线传感器32、滚珠丝杠36、电机38和储存器39而具有工作台71、图像传感器72、滚珠丝杠76、电机78和储存器79。而且,收纳装置22a具有在腔室70的底面设置有滚珠丝杠76和电机78的基座73。此外,储存器79具有工作台71和箱体34。
工作台71是载置台的一例,固定于箱体34。工作台71与第1实施方式的工作台31不同,是单体的且不旋转。图像传感器72设置于机械室90,经由由石英等构成的窗81拍摄载置于工作台71的边缘环50,将拍摄到的图像输出到控制装置100。控制装置100基于所拍摄的图像,检测边缘环50的定向平面。图像传感器72例如为使用CCD或者CMOS等传感器的摄像机。
基座73具有上部基座74和基部75。上部基座74能够在基部75上向θ方向旋转,设置有与滚珠丝杠76连接的电机78。基部75固定于腔室70的底面,通过内置的未图示的电机使上部基座74旋转。即,基座73是旋转部的一例。滚珠丝杠76从上部基座74延伸至腔室70的上表面,上部以能够在腔室70内移动的方式固定。此外,滚珠丝杠76的上部也可以构成为能够沿设置于腔室70的上表面的未图示的导轨移动。滚珠丝杠76通过电机78进行旋转,由此能够借助于引导件37使储存器79在上下方向(Z轴方向)上移动。此外,滚珠丝杠76和电机78是升降部的一例。
在收纳装置22a中,将载置于工作台71的边缘环50对位时,上部基座74旋转,由此工作台71也旋转以使边缘环50的位置对准。由此,与第1实施方式同样地,在减少了所占空间的收纳装置22a中,能够进行边缘环50等消耗部件的对位和输送。
以上,依照上述的各实施方式,收纳装置22、22a包括载置台、传感器、旋转部、收纳部和升降部。载置台(工作台31、71)载置消耗部件(边缘环50)。传感器(线传感器32,图像传感器72)检测消耗部件的方向。旋转部(工作台31、基座73)基于由传感器检测出的消耗部件的方向,使消耗部件向规定的方向旋转。收纳部(箱体34、盒35)位于载置台的下部,收纳消耗部件。升降部(滚珠丝杠36、76、电机38、78)使收纳部升降。其结果,能够使载置台和旋转部与收纳部一体化,因此能够减少收纳装置的所占空间。
另外,依照第1实施方式,旋转部位于载置台的正下方,使载置台旋转。其结果,能够进行边缘环50等消耗部件的对位。
另外,依照第1实施方式,升降部使载置台、旋转部和收纳部升降。其结果,能够使收纳于收纳部的边缘环移动至载置台。
另外,依照第2实施方式,旋转部使固定有载置台、收纳部和升降部的基座旋转。其结果,能够进行边缘环50等消耗部件的对位。
另外,依照上述的各实施方式,消耗部件是边缘环、覆盖环和上部电极之中的一个或者多个。其结果,能够对作为更换对象的各消耗部件进行收纳、对位和输送。
另外,依照第1实施方式,传感器是线传感器。其结果,能够检测边缘环50等消耗部件的方向。
另外,依照第2实施方式,传感器是图像传感器。其结果,能够检测边缘环50等消耗部件的方向。
另外,依照上述的各实施方式,升降部是滚珠丝杠。其结果,能够高精度地控制载置台和收纳部的高度。
另外,依照第1实施方式,控制装置100执行收纳装置22中的消耗部件(边缘环50)的输送方法,该输送方法包括在将收纳装置22的门42和闸门23关闭的状态下,使收纳有消耗部件的收纳部(盒35)移动至与闸门23相对的位置的步骤。控制装置100执行对收纳装置22(腔室30)内进行抽真空并且用吹扫气体进行调压的步骤。控制装置100执行将闸门23打开,真空输送机器人(机械臂12b)从收纳部获取消耗部件的步骤。控制装置100执行使位于收纳部的上部的载置台(工作台31)移动至与闸门23相对的位置的步骤。控制装置100执行将真空输送机器人获取到的消耗部件载置在载置台的步骤。控制装置100执行使载置台移动至对位位置,使消耗部件旋转以进行对位的步骤。控制装置100执行使载置台移动至与闸门相对的位置的步骤。控制装置100执行真空输送机器人从载置台获取消耗部件的步骤。其结果,能够在减少了所占空间的收纳装置22中,进行边缘环50等消耗部件的对位和输送。
应当认为,本次公开的各实施方式在所有方面均是例示,而并非限制性的。上述的各实施方式在不脱离所附的权利要求的范围及其主旨的情况下,能够以各种方式进行省略、替换、改变。
另外,在上述的第2实施方式中,在储存器79设置有工作台71,但并不限于此。例如,也可以在储存器79的箱体34的上部设置升降销,在箱体34的上部载置边缘环50使之连同上部基座74进行旋转。此外,使箱体34的上表面和盒35的上表面为透明部件,通过上部基座74的旋转使收纳于盒35的最上部的边缘环50的方向旋转。
另外,在上述的各实施方式中,工作台31、71固定于箱体34,但并不限于此。例如,也可以将工作台31、71和箱体34分割,而使之分别上下地移动。
Claims (10)
1.一种收纳装置,其特征在于,包括:
载置消耗部件的载置台;
检测所述消耗部件的方向的传感器;
旋转部,其基于由所述传感器检测出的所述消耗部件的方向,使所述消耗部件向规定的方向旋转;
收纳部,其位于所述载置台的下部,收纳所述消耗部件;和
使所述收纳部升降的升降部。
2.如权利要求1所述的收纳装置,其特征在于:
所述旋转部位于所述载置台的正下方,使所述载置台旋转。
3.如权利要求2所述的收纳装置,其特征在于:
所述升降部使所述载置台、所述旋转部和所述收纳部升降。
4.如权利要求1所述的收纳装置,其特征在于:
所述旋转部使固定有所述载置台、所述收纳部和所述升降部的基座旋转。
5.如权利要求1~4中任一项所述的收纳装置,其特征在于:
所述消耗部件是边缘环、覆盖环和上部电极之中的一个或者多个。
6.如权利要求1~5中任一项所述的收纳装置,其特征在于:
所述传感器是线传感器。
7.如权利要求1~5中任一项所述的收纳装置,其特征在于:
所述传感器是图像传感器。
8.如权利要求1~7中任一项所述的收纳装置,其特征在于:
所述升降部是滚珠丝杠。
9.一种基片处理系统,其特征在于,包括:
用于处理基片的一个或者多个处理装置;
装载装置,其设置有能够配置可收纳所述基片的盒的端阜,具有大气输送机器人,所述大气输送机器人能够输送配置于所述端阜的所述盒内的所述基片;
负载锁定装置,其与所述装载装置连接,进行大气与真空的切换;
输送装置,其与所述负载锁定装置连接,具有将所述基片输送到所述处理装置的真空输送机器人;和
与所述输送装置连接的收纳装置,
所述收纳装置包括:
载置消耗部件的载置台;
检测所述消耗部件的方向的传感器;
旋转部,其基于由所述传感器检测出的所述消耗部件的方向,使所述消耗部件向规定的方向旋转;
收纳部,其位于所述载置台的下部,收纳所述消耗部件;和
使所述收纳部升降的升降部。
10.一种消耗部件的输送方法,所述消耗部件是收纳装置中的消耗部件,所述消耗部件的输送方法特征在于,包括:
在将所述收纳装置的门和闸门关闭的状态下,将收纳有所述消耗部件的收纳部移动至与所述闸门相对的位置的步骤;
对所述收纳装置内进行抽真空并且用吹扫气体进行调压的步骤;
将所述闸门打开,真空输送机器人从所述收纳部获取所述消耗部件的步骤;
将位于所述收纳部的上部的载置台移动至与所述闸门相对的位置的步骤;
将所述真空输送机器人获取到的所述消耗部件载置在所述载置台的步骤;
使所述载置台移动至对位位置,使所述消耗部件旋转以进行对位的步骤;
将所述载置台移动至与所述闸门相对的位置的步骤;以及
所述真空输送机器人从所述载置台获取所述消耗部件的步骤。
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