CN113811815B - 热传导机构 - Google Patents

热传导机构 Download PDF

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Publication number
CN113811815B
CN113811815B CN202080034782.4A CN202080034782A CN113811815B CN 113811815 B CN113811815 B CN 113811815B CN 202080034782 A CN202080034782 A CN 202080034782A CN 113811815 B CN113811815 B CN 113811815B
Authority
CN
China
Prior art keywords
heat
conductive sheet
sheet
heat conductive
conduction mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080034782.4A
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English (en)
Chinese (zh)
Other versions
CN113811815A (zh
Inventor
山田大仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Group Corp
Original Assignee
Sony Group Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Group Corp filed Critical Sony Group Corp
Publication of CN113811815A publication Critical patent/CN113811815A/zh
Application granted granted Critical
Publication of CN113811815B publication Critical patent/CN113811815B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/20—Graphite
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/01—Head-up displays
    • G02B27/017—Head mounted
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/163—Wearable computers, e.g. on a belt
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/64—Constructional details of receivers, e.g. cabinets or dust covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/01—Head-up displays
    • G02B27/0101—Head-up displays characterised by optical features
    • G02B2027/0138—Head-up displays characterised by optical features comprising image capture systems, e.g. camera
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/01—Head-up displays
    • G02B27/017—Head mounted
    • G02B27/0172—Head mounted characterised by optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/01—Head-up displays
    • G02B27/017—Head mounted
    • G02B27/0176—Head mounted characterised by mechanical features
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Optics & Photonics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Mathematical Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN202080034782.4A 2019-05-16 2020-05-08 热传导机构 Active CN113811815B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019093092 2019-05-16
JP2019-093092 2019-05-16
PCT/JP2020/018739 WO2020230745A1 (ja) 2019-05-16 2020-05-08 熱伝導機構

Publications (2)

Publication Number Publication Date
CN113811815A CN113811815A (zh) 2021-12-17
CN113811815B true CN113811815B (zh) 2024-10-29

Family

ID=73290178

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080034782.4A Active CN113811815B (zh) 2019-05-16 2020-05-08 热传导机构

Country Status (5)

Country Link
US (1) US11871549B2 (https=)
JP (1) JP7567783B2 (https=)
CN (1) CN113811815B (https=)
DE (1) DE112020002401T5 (https=)
WO (1) WO2020230745A1 (https=)

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* Cited by examiner, † Cited by third party
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US12453057B2 (en) * 2022-08-19 2025-10-21 Google Llc Thermal management for head mounted wearable device
JP7291897B1 (ja) * 2022-12-26 2023-06-16 パナソニックＩｐマネジメント株式会社 撮像装置

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CN105794201A (zh) * 2013-12-05 2016-07-20 索尼公司 显示设备

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US5910883A (en) * 1997-08-06 1999-06-08 International Business Machines Corporation Hinge incorporating a helically coiled heat pipe for a laptop computer
US5847925A (en) * 1997-08-12 1998-12-08 Compaq Computer Corporation System and method for transferring heat between movable portions of a computer
US6069791A (en) * 1997-08-14 2000-05-30 Fujikura Ltd. Cooling device for notebook personal computer
US6075696A (en) * 1997-11-06 2000-06-13 Compaq Computer Corporation Portable computer with flexible heat spreader plate structure therein
US6097596A (en) * 1998-02-12 2000-08-01 International Business Machines Corporation Portable computer rotational heat pipe heat transfer
US6175493B1 (en) * 1998-10-16 2001-01-16 Dell Usa, Lp Heat transfer from base to display portion of a portable computer
US7280359B2 (en) * 2003-12-11 2007-10-09 Matsushita Electric Industrial Co., Ltd. Heat-radiating structure of electronic apparatus
TWI318338B (en) * 2005-05-19 2009-12-11 Htc Corp Portable electronic device
WO2008041753A1 (en) * 2006-10-04 2008-04-10 Nikon Corporation Electronic device, electronic camera, light source device, illuminating device and projector device
US20080130221A1 (en) * 2006-12-02 2008-06-05 Krishnakumar Varadarajan Thermal hinge for lid cooling
JP5291892B2 (ja) * 2007-05-01 2013-09-18 オリンパスイメージング株式会社 撮像素子モジュール、撮像素子モジュールを用いたレンズユニット及び携帯用電子機器
US8069907B2 (en) * 2007-09-13 2011-12-06 3M Innovative Properties Company Flexible heat pipe
JP4998249B2 (ja) * 2007-12-21 2012-08-15 住友電気工業株式会社 光トランシーバの放熱装置
JP4888413B2 (ja) * 2008-02-14 2012-02-29 富士通株式会社 携帯型電子装置
TWM339030U (en) * 2008-03-17 2008-08-21 Cooler Master Co Ltd Heat conduction structure
JP4548517B2 (ja) 2008-05-26 2010-09-22 株式会社豊田自動織機 発熱部品の実装構造及び実装方法
US8284554B2 (en) * 2010-02-15 2012-10-09 Motorola Mobility Llc Electronic device housing with pivoting and sliding portions
JP2012028940A (ja) 2010-07-21 2012-02-09 Sony Corp 撮像装置
JP2013041934A (ja) * 2011-08-12 2013-02-28 Sony Corp 電子機器及び電子機器の制御方法
KR101895427B1 (ko) * 2011-09-07 2018-09-05 삼성전자주식회사 슬라이딩-틸트 기능을 갖는 전자 기기
JP5903018B2 (ja) * 2012-09-26 2016-04-13 ソニー株式会社 ヘッドマウントディスプレイ
JP6125972B2 (ja) * 2013-10-30 2017-05-10 東芝ホームテクノ株式会社 携帯情報端末
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US10117357B2 (en) * 2015-07-20 2018-10-30 Futurewei Technologies, Inc. Stationary cooling structure for board/chassis-level conduction cooling
JP2017195514A (ja) * 2016-04-20 2017-10-26 キヤノン株式会社 頭部装着装置および把持装置
CN109076720B (zh) * 2016-11-25 2020-01-03 华为技术有限公司 散热板、散热装置和电子设备
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JP6732716B2 (ja) 2017-10-25 2020-07-29 株式会社ソニー・インタラクティブエンタテインメント 画像生成装置、画像生成システム、画像生成方法、およびプログラム
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Patent Citations (2)

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US5646822A (en) * 1995-08-30 1997-07-08 Intel Corporation Heat pipe exchanger system for cooling a hinged computing device
CN105794201A (zh) * 2013-12-05 2016-07-20 索尼公司 显示设备

Also Published As

Publication number Publication date
WO2020230745A1 (ja) 2020-11-19
US11871549B2 (en) 2024-01-09
CN113811815A (zh) 2021-12-17
DE112020002401T5 (de) 2022-01-27
JPWO2020230745A1 (https=) 2020-11-19
US20220256745A1 (en) 2022-08-11
JP7567783B2 (ja) 2024-10-16

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