CN113795922A - 成像装置 - Google Patents
成像装置 Download PDFInfo
- Publication number
- CN113795922A CN113795922A CN202080034002.6A CN202080034002A CN113795922A CN 113795922 A CN113795922 A CN 113795922A CN 202080034002 A CN202080034002 A CN 202080034002A CN 113795922 A CN113795922 A CN 113795922A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
- H10F39/80373—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor characterised by the gate of the transistor
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/809—Constructional details of image sensors of hybrid image sensors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/018—Manufacture or treatment of image sensors covered by group H10F39/12 of hybrid image sensors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/196—Junction field effect transistor [JFET] image sensors; Static induction transistor [SIT] image sensors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8033—Photosensitive area
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
- H10F39/80377—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor characterised by the channel of the transistor, e.g. channel having a doping gradient
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/813—Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/199—Back-illuminated image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/807—Pixel isolation structures
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019118489 | 2019-06-26 | ||
| JP2019-118489 | 2019-06-26 | ||
| PCT/JP2020/025037 WO2020262541A1 (ja) | 2019-06-26 | 2020-06-25 | 撮像装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113795922A true CN113795922A (zh) | 2021-12-14 |
Family
ID=74061704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080034002.6A Pending CN113795922A (zh) | 2019-06-26 | 2020-06-25 | 成像装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12183756B2 (https=) |
| EP (1) | EP3993012A4 (https=) |
| JP (1) | JPWO2020262541A1 (https=) |
| KR (1) | KR102826722B1 (https=) |
| CN (1) | CN113795922A (https=) |
| TW (1) | TWI868171B (https=) |
| WO (1) | WO2020262541A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119851575A (zh) * | 2023-10-16 | 2025-04-18 | 武汉华星光电半导体显示技术有限公司 | 发光器件驱动背板 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12349492B2 (en) * | 2021-03-30 | 2025-07-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photodiode structure for image sensor |
| KR102913462B1 (ko) * | 2021-04-19 | 2026-01-15 | 삼성전자주식회사 | 이미지 센서 |
| TW202414802A (zh) | 2022-09-26 | 2024-04-01 | 力晶積成電子製造股份有限公司 | 影像感測器結構 |
| US20240250098A1 (en) * | 2023-01-25 | 2024-07-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Image sensor device and method of manufacturing the same |
| WO2024202616A1 (ja) * | 2023-03-31 | 2024-10-03 | ソニーセミコンダクタソリューションズ株式会社 | 光検出装置、光検出装置の製造方法及び電子機器 |
Citations (17)
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| JPH1187684A (ja) * | 1997-09-13 | 1999-03-30 | Nikon Corp | 固体撮像装置及びその製造方法 |
| JPH11274316A (ja) * | 1998-03-19 | 1999-10-08 | Toshiba Microelectronics Corp | 半導体装置 |
| JP2005286074A (ja) * | 2004-03-29 | 2005-10-13 | Sharp Corp | 固体撮像素子およびその駆動方法、電子情報機器 |
| JP2006024907A (ja) * | 2004-06-07 | 2006-01-26 | Canon Inc | 固体撮像装置 |
| JP2007228460A (ja) * | 2006-02-27 | 2007-09-06 | Mitsumasa Koyanagi | 集積センサを搭載した積層型半導体装置 |
| JP2008078302A (ja) * | 2006-09-20 | 2008-04-03 | Canon Inc | 撮像装置および撮像システム |
| CN101197388A (zh) * | 2006-10-04 | 2008-06-11 | 索尼株式会社 | 固态成像装置及其制造方法以及电子装置 |
| US20090289282A1 (en) * | 2008-05-22 | 2009-11-26 | Morikazu Tsuno | Solid state imaging device and method for manufacturing the same |
| US20100237436A1 (en) * | 2009-03-23 | 2010-09-23 | Kabushiki Kaisha Toshiba | Semiconductor device |
| JP2014022561A (ja) * | 2012-07-18 | 2014-02-03 | Sony Corp | 固体撮像装置、及び、電子機器 |
| US8736015B2 (en) * | 2011-09-27 | 2014-05-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit structure and method of forming the same |
| JP2015032687A (ja) * | 2013-08-02 | 2015-02-16 | ソニー株式会社 | 撮像素子、電子機器、および撮像素子の製造方法 |
| JP2018129374A (ja) * | 2017-02-07 | 2018-08-16 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置および半導体装置の製造方法 |
| WO2018180570A1 (ja) * | 2017-03-30 | 2018-10-04 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子、電子機器、および半導体装置 |
| US20180323231A1 (en) * | 2016-01-19 | 2018-11-08 | Olympus Corporation | Solid-state imaging device and imaging apparatus |
| EP3435416A2 (en) * | 2017-07-24 | 2019-01-30 | Panasonic Intellectual Property Management Co., Ltd. | Imaging device |
| CN109300924A (zh) * | 2017-07-24 | 2019-02-01 | 松下知识产权经营株式会社 | 摄像装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS6355960A (ja) | 1986-08-27 | 1988-03-10 | Hitachi Ltd | 半導体装置 |
| JP2004214413A (ja) * | 2002-12-27 | 2004-07-29 | Toshiba Corp | 半導体装置 |
| JP5151012B2 (ja) | 2005-05-30 | 2013-02-27 | 富士電機株式会社 | 半導体装置の製造方法 |
| US8049256B2 (en) * | 2006-10-05 | 2011-11-01 | Omnivision Technologies, Inc. | Active pixel sensor having a sensor wafer connected to a support circuit wafer |
| JP5444899B2 (ja) * | 2008-09-10 | 2014-03-19 | ソニー株式会社 | 固体撮像装置の製造方法、および固体撮像装置の製造基板 |
| JP5985136B2 (ja) | 2009-03-19 | 2016-09-06 | ソニー株式会社 | 半導体装置とその製造方法、及び電子機器 |
| JP5791571B2 (ja) * | 2011-08-02 | 2015-10-07 | キヤノン株式会社 | 撮像素子及び撮像装置 |
| US8941204B2 (en) * | 2012-04-27 | 2015-01-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for reducing cross talk in image sensors |
| JP6021762B2 (ja) | 2013-08-28 | 2016-11-09 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置および製造方法、並びに、電子機器 |
| CN107113387B (zh) * | 2014-11-12 | 2020-09-18 | 索尼公司 | 固态成像装置及电子设备 |
| JP6744748B2 (ja) * | 2016-04-06 | 2020-08-19 | キヤノン株式会社 | 固体撮像装置及びその製造方法 |
| JP6685992B2 (ja) | 2017-12-28 | 2020-04-22 | ユニ・チャーム株式会社 | 吸収性物品 |
-
2020
- 2020-06-24 TW TW109121739A patent/TWI868171B/zh active
- 2020-06-25 KR KR1020217040472A patent/KR102826722B1/ko active Active
- 2020-06-25 JP JP2021527735A patent/JPWO2020262541A1/ja active Pending
- 2020-06-25 WO PCT/JP2020/025037 patent/WO2020262541A1/ja not_active Ceased
- 2020-06-25 EP EP20830597.9A patent/EP3993012A4/en active Pending
- 2020-06-25 US US17/620,237 patent/US12183756B2/en active Active
- 2020-06-25 CN CN202080034002.6A patent/CN113795922A/zh active Pending
Patent Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1187684A (ja) * | 1997-09-13 | 1999-03-30 | Nikon Corp | 固体撮像装置及びその製造方法 |
| JPH11274316A (ja) * | 1998-03-19 | 1999-10-08 | Toshiba Microelectronics Corp | 半導体装置 |
| JP2005286074A (ja) * | 2004-03-29 | 2005-10-13 | Sharp Corp | 固体撮像素子およびその駆動方法、電子情報機器 |
| JP2006024907A (ja) * | 2004-06-07 | 2006-01-26 | Canon Inc | 固体撮像装置 |
| JP2007228460A (ja) * | 2006-02-27 | 2007-09-06 | Mitsumasa Koyanagi | 集積センサを搭載した積層型半導体装置 |
| JP2008078302A (ja) * | 2006-09-20 | 2008-04-03 | Canon Inc | 撮像装置および撮像システム |
| CN101197388A (zh) * | 2006-10-04 | 2008-06-11 | 索尼株式会社 | 固态成像装置及其制造方法以及电子装置 |
| US20090289282A1 (en) * | 2008-05-22 | 2009-11-26 | Morikazu Tsuno | Solid state imaging device and method for manufacturing the same |
| US20100237436A1 (en) * | 2009-03-23 | 2010-09-23 | Kabushiki Kaisha Toshiba | Semiconductor device |
| JP2010225768A (ja) * | 2009-03-23 | 2010-10-07 | Toshiba Corp | 半導体装置 |
| US8736015B2 (en) * | 2011-09-27 | 2014-05-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit structure and method of forming the same |
| JP2014022561A (ja) * | 2012-07-18 | 2014-02-03 | Sony Corp | 固体撮像装置、及び、電子機器 |
| JP2015032687A (ja) * | 2013-08-02 | 2015-02-16 | ソニー株式会社 | 撮像素子、電子機器、および撮像素子の製造方法 |
| US20180323231A1 (en) * | 2016-01-19 | 2018-11-08 | Olympus Corporation | Solid-state imaging device and imaging apparatus |
| JP2018129374A (ja) * | 2017-02-07 | 2018-08-16 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置および半導体装置の製造方法 |
| WO2018180570A1 (ja) * | 2017-03-30 | 2018-10-04 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子、電子機器、および半導体装置 |
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Non-Patent Citations (1)
| Title |
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| 张万荣, 曾峥, 罗晋生, 西安交通大学: "Si1-ZGeZ基区杂质和Ge组份分布对HBT基区渡越时间的影响", 西安交通大学学报, no. 08, 20 August 1996 (1996-08-20) * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119851575A (zh) * | 2023-10-16 | 2025-04-18 | 武汉华星光电半导体显示技术有限公司 | 发光器件驱动背板 |
Also Published As
| Publication number | Publication date |
|---|---|
| US12183756B2 (en) | 2024-12-31 |
| KR102826722B1 (ko) | 2025-06-30 |
| TW202107722A (zh) | 2021-02-16 |
| EP3993012A1 (en) | 2022-05-04 |
| TWI868171B (zh) | 2025-01-01 |
| WO2020262541A1 (ja) | 2020-12-30 |
| US20220367536A1 (en) | 2022-11-17 |
| EP3993012A4 (en) | 2022-08-31 |
| KR20220023996A (ko) | 2022-03-03 |
| JPWO2020262541A1 (https=) | 2020-12-30 |
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