CN113795922A - 成像装置 - Google Patents

成像装置 Download PDF

Info

Publication number
CN113795922A
CN113795922A CN202080034002.6A CN202080034002A CN113795922A CN 113795922 A CN113795922 A CN 113795922A CN 202080034002 A CN202080034002 A CN 202080034002A CN 113795922 A CN113795922 A CN 113795922A
Authority
CN
China
Prior art keywords
substrate
region
pixel
semiconductor substrate
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080034002.6A
Other languages
English (en)
Chinese (zh)
Inventor
坂直树
冈本晋太郎
幸山裕亮
森茂贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Semiconductor Solutions Corp
Original Assignee
Sony Semiconductor Solutions Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Semiconductor Solutions Corp filed Critical Sony Semiconductor Solutions Corp
Publication of CN113795922A publication Critical patent/CN113795922A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
    • H10F39/80373Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor characterised by the gate of the transistor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/809Constructional details of image sensors of hybrid image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/018Manufacture or treatment of image sensors covered by group H10F39/12 of hybrid image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/196Junction field effect transistor [JFET] image sensors; Static induction transistor [SIT] image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8033Photosensitive area
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
    • H10F39/80377Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor characterised by the channel of the transistor, e.g. channel having a doping gradient
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/804Containers or encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/805Coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/806Optical elements or arrangements associated with the image sensors
    • H10F39/8063Microlenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/811Interconnections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/813Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/199Back-illuminated image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/807Pixel isolation structures

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
CN202080034002.6A 2019-06-26 2020-06-25 成像装置 Pending CN113795922A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019118489 2019-06-26
JP2019-118489 2019-06-26
PCT/JP2020/025037 WO2020262541A1 (ja) 2019-06-26 2020-06-25 撮像装置

Publications (1)

Publication Number Publication Date
CN113795922A true CN113795922A (zh) 2021-12-14

Family

ID=74061704

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080034002.6A Pending CN113795922A (zh) 2019-06-26 2020-06-25 成像装置

Country Status (7)

Country Link
US (1) US12183756B2 (https=)
EP (1) EP3993012A4 (https=)
JP (1) JPWO2020262541A1 (https=)
KR (1) KR102826722B1 (https=)
CN (1) CN113795922A (https=)
TW (1) TWI868171B (https=)
WO (1) WO2020262541A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119851575A (zh) * 2023-10-16 2025-04-18 武汉华星光电半导体显示技术有限公司 发光器件驱动背板

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12349492B2 (en) * 2021-03-30 2025-07-01 Taiwan Semiconductor Manufacturing Company, Ltd. Photodiode structure for image sensor
KR102913462B1 (ko) * 2021-04-19 2026-01-15 삼성전자주식회사 이미지 센서
TW202414802A (zh) 2022-09-26 2024-04-01 力晶積成電子製造股份有限公司 影像感測器結構
US20240250098A1 (en) * 2023-01-25 2024-07-25 Taiwan Semiconductor Manufacturing Company, Ltd. Image sensor device and method of manufacturing the same
WO2024202616A1 (ja) * 2023-03-31 2024-10-03 ソニーセミコンダクタソリューションズ株式会社 光検出装置、光検出装置の製造方法及び電子機器

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187684A (ja) * 1997-09-13 1999-03-30 Nikon Corp 固体撮像装置及びその製造方法
JPH11274316A (ja) * 1998-03-19 1999-10-08 Toshiba Microelectronics Corp 半導体装置
JP2005286074A (ja) * 2004-03-29 2005-10-13 Sharp Corp 固体撮像素子およびその駆動方法、電子情報機器
JP2006024907A (ja) * 2004-06-07 2006-01-26 Canon Inc 固体撮像装置
JP2007228460A (ja) * 2006-02-27 2007-09-06 Mitsumasa Koyanagi 集積センサを搭載した積層型半導体装置
JP2008078302A (ja) * 2006-09-20 2008-04-03 Canon Inc 撮像装置および撮像システム
CN101197388A (zh) * 2006-10-04 2008-06-11 索尼株式会社 固态成像装置及其制造方法以及电子装置
US20090289282A1 (en) * 2008-05-22 2009-11-26 Morikazu Tsuno Solid state imaging device and method for manufacturing the same
US20100237436A1 (en) * 2009-03-23 2010-09-23 Kabushiki Kaisha Toshiba Semiconductor device
JP2014022561A (ja) * 2012-07-18 2014-02-03 Sony Corp 固体撮像装置、及び、電子機器
US8736015B2 (en) * 2011-09-27 2014-05-27 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit structure and method of forming the same
JP2015032687A (ja) * 2013-08-02 2015-02-16 ソニー株式会社 撮像素子、電子機器、および撮像素子の製造方法
JP2018129374A (ja) * 2017-02-07 2018-08-16 ソニーセミコンダクタソリューションズ株式会社 半導体装置および半導体装置の製造方法
WO2018180570A1 (ja) * 2017-03-30 2018-10-04 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、電子機器、および半導体装置
US20180323231A1 (en) * 2016-01-19 2018-11-08 Olympus Corporation Solid-state imaging device and imaging apparatus
EP3435416A2 (en) * 2017-07-24 2019-01-30 Panasonic Intellectual Property Management Co., Ltd. Imaging device
CN109300924A (zh) * 2017-07-24 2019-02-01 松下知识产权经营株式会社 摄像装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6355960A (ja) 1986-08-27 1988-03-10 Hitachi Ltd 半導体装置
JP2004214413A (ja) * 2002-12-27 2004-07-29 Toshiba Corp 半導体装置
JP5151012B2 (ja) 2005-05-30 2013-02-27 富士電機株式会社 半導体装置の製造方法
US8049256B2 (en) * 2006-10-05 2011-11-01 Omnivision Technologies, Inc. Active pixel sensor having a sensor wafer connected to a support circuit wafer
JP5444899B2 (ja) * 2008-09-10 2014-03-19 ソニー株式会社 固体撮像装置の製造方法、および固体撮像装置の製造基板
JP5985136B2 (ja) 2009-03-19 2016-09-06 ソニー株式会社 半導体装置とその製造方法、及び電子機器
JP5791571B2 (ja) * 2011-08-02 2015-10-07 キヤノン株式会社 撮像素子及び撮像装置
US8941204B2 (en) * 2012-04-27 2015-01-27 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for reducing cross talk in image sensors
JP6021762B2 (ja) 2013-08-28 2016-11-09 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置および製造方法、並びに、電子機器
CN107113387B (zh) * 2014-11-12 2020-09-18 索尼公司 固态成像装置及电子设备
JP6744748B2 (ja) * 2016-04-06 2020-08-19 キヤノン株式会社 固体撮像装置及びその製造方法
JP6685992B2 (ja) 2017-12-28 2020-04-22 ユニ・チャーム株式会社 吸収性物品

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187684A (ja) * 1997-09-13 1999-03-30 Nikon Corp 固体撮像装置及びその製造方法
JPH11274316A (ja) * 1998-03-19 1999-10-08 Toshiba Microelectronics Corp 半導体装置
JP2005286074A (ja) * 2004-03-29 2005-10-13 Sharp Corp 固体撮像素子およびその駆動方法、電子情報機器
JP2006024907A (ja) * 2004-06-07 2006-01-26 Canon Inc 固体撮像装置
JP2007228460A (ja) * 2006-02-27 2007-09-06 Mitsumasa Koyanagi 集積センサを搭載した積層型半導体装置
JP2008078302A (ja) * 2006-09-20 2008-04-03 Canon Inc 撮像装置および撮像システム
CN101197388A (zh) * 2006-10-04 2008-06-11 索尼株式会社 固态成像装置及其制造方法以及电子装置
US20090289282A1 (en) * 2008-05-22 2009-11-26 Morikazu Tsuno Solid state imaging device and method for manufacturing the same
US20100237436A1 (en) * 2009-03-23 2010-09-23 Kabushiki Kaisha Toshiba Semiconductor device
JP2010225768A (ja) * 2009-03-23 2010-10-07 Toshiba Corp 半導体装置
US8736015B2 (en) * 2011-09-27 2014-05-27 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit structure and method of forming the same
JP2014022561A (ja) * 2012-07-18 2014-02-03 Sony Corp 固体撮像装置、及び、電子機器
JP2015032687A (ja) * 2013-08-02 2015-02-16 ソニー株式会社 撮像素子、電子機器、および撮像素子の製造方法
US20180323231A1 (en) * 2016-01-19 2018-11-08 Olympus Corporation Solid-state imaging device and imaging apparatus
JP2018129374A (ja) * 2017-02-07 2018-08-16 ソニーセミコンダクタソリューションズ株式会社 半導体装置および半導体装置の製造方法
WO2018180570A1 (ja) * 2017-03-30 2018-10-04 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、電子機器、および半導体装置
EP3435416A2 (en) * 2017-07-24 2019-01-30 Panasonic Intellectual Property Management Co., Ltd. Imaging device
CN109300924A (zh) * 2017-07-24 2019-02-01 松下知识产权经营株式会社 摄像装置
JP2019024075A (ja) * 2017-07-24 2019-02-14 パナソニックIpマネジメント株式会社 撮像装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
张万荣, 曾峥, 罗晋生, 西安交通大学: "Si1-ZGeZ基区杂质和Ge组份分布对HBT基区渡越时间的影响", 西安交通大学学报, no. 08, 20 August 1996 (1996-08-20) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119851575A (zh) * 2023-10-16 2025-04-18 武汉华星光电半导体显示技术有限公司 发光器件驱动背板

Also Published As

Publication number Publication date
US12183756B2 (en) 2024-12-31
KR102826722B1 (ko) 2025-06-30
TW202107722A (zh) 2021-02-16
EP3993012A1 (en) 2022-05-04
TWI868171B (zh) 2025-01-01
WO2020262541A1 (ja) 2020-12-30
US20220367536A1 (en) 2022-11-17
EP3993012A4 (en) 2022-08-31
KR20220023996A (ko) 2022-03-03
JPWO2020262541A1 (https=) 2020-12-30

Similar Documents

Publication Publication Date Title
US12342093B2 (en) Solid-state image sensor
KR102806487B1 (ko) 고체 촬상 장치
CN113826208B (zh) 摄像装置
KR102826722B1 (ko) 촬상 장치
KR102916763B1 (ko) 촬상 장치
KR20250004392A (ko) 촬상 소자
CN113875010B (zh) 摄像装置
KR102823598B1 (ko) 고체 촬상 장치
CN113940058B (zh) 摄像装置
JP2023169424A (ja) 固体撮像素子
CN113812001B (zh) 半导体装置和成像装置
US20250324800A1 (en) Photodetection element
CN119318225A (zh) 摄像装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination