CN113774320B - Film forming apparatus and component peeling apparatus - Google Patents

Film forming apparatus and component peeling apparatus Download PDF

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Publication number
CN113774320B
CN113774320B CN202111090638.5A CN202111090638A CN113774320B CN 113774320 B CN113774320 B CN 113774320B CN 202111090638 A CN202111090638 A CN 202111090638A CN 113774320 B CN113774320 B CN 113774320B
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China
Prior art keywords
protective sheet
electronic component
sheet
mounting table
component
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CN202111090638.5A
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Chinese (zh)
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CN113774320A (en
Inventor
西垣寿
铃木端生
吉村浩司
神戸优
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority claimed from JP2018190780A external-priority patent/JP7320932B2/en
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to CN202111090638.5A priority Critical patent/CN113774320B/en
Publication of CN113774320A publication Critical patent/CN113774320A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0005—Separation of the coating from the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The application provides a film forming apparatus and a component peeling apparatus, which can prevent residue from remaining on electronic components and peel the electronic components from a sheet. An electronic component having an exposed surface of an electrode adhered to an adhering surface of a protective sheet is put into a film forming apparatus. The film forming apparatus includes a film forming process section and a peeling process section. The film forming processing section forms a film of a film forming material on the electronic component. The peeling processing unit peels the electronic component from the protective sheet after the film is formed by the film forming processing unit. The peeling processing section includes: a mounting table for supporting the electronic component attached to the protective sheet; a chuck for holding an end portion of the protective sheet, relatively moving with respect to the mounting table, and continuously peeling the protective sheet toward an opposite end of the end portion; and a fixing portion for fixing the position of the electronic component.

Description

Film forming apparatus and component peeling apparatus
The application is a divisional application of the original application number 201811329890.5, the application date 2018, 11 and 09, and the name of the application is a film forming device and a part removing device.
Technical Field
The present application relates to a film forming apparatus for forming a film on an electronic component attached to a protective sheet, and a component peeling apparatus for peeling the electronic component having the film formed thereon from the protective sheet.
Background
Many electronic components such as semiconductor devices are mounted on wireless communication devices typified by mobile phones. The electronic component is transported from the processing apparatus to the processing apparatus for various processes. As a representative example of the treatment, formation of an electromagnetic wave shielding film can be cited. In order to prevent the influence on the communication characteristics, the electromagnetic wave shielding film suppresses the influence of electromagnetic waves such as leakage of electromagnetic waves to the outside on the inside and outside. In general, an electronic component is formed by forming an outer shape with a sealing resin, and conductive electromagnetic wave shielding films are provided on top and side surfaces of the sealing resin in order to shield electromagnetic waves (see patent document 1).
As a method for forming the electromagnetic wave shielding film, an electroplating method is known. However, since the plating method requires a wet step such as a pretreatment step, a plating step, and a post-treatment step such as water washing, an increase in manufacturing cost of electronic parts cannot be avoided. Therefore, a sputtering method as a dry step is attracting attention. In the sputtering method, an inert gas is introduced into a vacuum vessel in which a target is disposed, and a dc voltage is applied. Then, the ions of the inert gas which have been plasmatized collide with the target of the film-forming material, and the particles which have been knocked out from the target are deposited on the electronic component. The deposited layer becomes an electromagnetic wave shielding film.
A film forming apparatus for realizing a sputtering method comprises: the spin coater comprises a cylindrical chamber having a vacuum chamber inside, a turntable accommodated in the chamber and having a rotation axis coaxial with the chamber, and a film forming position partitioned in the chamber. The electronic component is mounted on the turntable, and the turntable is rotated in the circumferential direction, whereby the electronic component is brought to a film formation position, and the electromagnetic wave shielding film is formed. In this way, the processing apparatus also carries the electronic component in rotation.
In such a conveyance of electronic components inside and outside the apparatus, there is a concern that the electronic components are subjected to inertial force by acceleration, deceleration, rotation, or the like, and the electronic components are reversed or come off from the film forming position. Therefore, the electronic component is attached to the adhesive film, and is transported and the electromagnetic wave shielding film is formed (see patent document 2). The electronic component can be held in place by the adhesive force against the inertial force.
Conventionally, an electronic component attached to an adhesive film is peeled off from the adhesive film using a lifter (see patent document 3). As shown in fig. 29, the topping device includes a pin body 8 movable in the axial direction. An adhesive film 9 to which an electronic component 60 is attached is provided at the tip of the pin body 8. The pin body 8 is faced upward from the side opposite to the adhesion surface of the electronic part 60 to the adhesive film 9. The pin body 8 deforms the adhesive film 9 into a mountain shape having the apex of the electronic component 60 to be peeled. Therefore, the adhesion area of the electronic component 60 and the adhesive film 9 is reduced, whereby the electronic component 60 is peeled from the adhesive film 9.
[ Prior Art literature ]
[ patent literature ]
Patent document 1: international publication No. 2013/035819
Patent document 2: japanese patent laid-open No. 6-97268
Patent document 3: japanese patent laid-open No. 1-321650
Disclosure of Invention
[ problem to be solved by the invention ]
As shown in fig. 30, a plurality of electronic components 60 are adhered to the adhesive film 9 with gaps provided therebetween. From the viewpoint of productivity, the intervals between the electronic components 60 attached to the adhesive film 9 are narrow. Therefore, when one electronic component 60 is pushed up, the strain of the adhesive film 9 also propagates to the adhesion region of the adjacent electronic component 60. Then, in the period in which the peeling object is lifted up, a part of the adjacent electronic component 60 may be peeled off from the adhesive film 9, and the peeling portion 91 may be generated.
When the peeling of the peeling object is completed, the pin body 8 retreats in the axial direction, and therefore, the flexure of the adhesive film 9 is eliminated. Then, the adhesive film 9 is reattached to the peeled portion 91, and a reattachment portion 92 of the adhesive film 9 is generated in the electronic component 60. Fig. 31 is a photograph showing the state of the electrode 602 after the adhesive film 9 is reattached to the electronic component 60 and peeled off. As shown in fig. 31, when the adhesive film 9 is reattached, residues 93 of the adhesive film 9 may be generated in the electrode 602. The residue 93 of the adhesive film 9 may burn and carbonize during reflow (reflow) when the electronic component 60 is packaged, and may cause connection failure or the like.
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a film forming apparatus and a component peeling apparatus for peeling an electronic component, which have completed film formation, from a sheet while preventing residue from remaining on the electronic component.
[ means of solving the problems ]
In order to achieve the above object, the present invention provides a film forming apparatus for an electronic component having an electrode exposed surface adhered to an adhesive surface of a protective sheet, comprising: a film forming processing unit for forming a film of a film forming material on the electronic component; and a peeling processing unit configured to peel the electronic component from the protective sheet after the film is formed by the film forming processing unit; wherein the peeling processing section includes: a mounting portion for supporting the electronic component attached to the protective sheet; a chuck for holding an end portion of the protective sheet, relatively moving with respect to the mounting portion, and continuously peeling the end portion toward an opposite end of the end portion; and a fixing portion for fixing a position of the electronic component when the electronic component is peeled from the protective sheet.
The method may further include: and a guide portion protruding toward an end of the protection sheet, the clip being located at a protruding destination of the guide portion before gripping the end of the protection sheet, and the guide portion facing the clip and guiding the end of the protection sheet toward the clip.
The method may further include: a sheet stopper that moves along the protective sheet together with the chuck and creates a base point of peeling.
The sheet stopper may be located near a projecting destination of the guide portion when the guide portion projects, and may be configured to clamp an end portion of the protection sheet, from which the guide portion has been peeled, together with the guide portion, and guide the protection sheet toward the chuck.
The sheet stopper may be a roller having an axis orthogonal to a moving direction of the sheet stopper.
The fixing portion may be: and a part stop part which keeps a distance smaller than the length of the electronic part relative to the sheet stop part to follow and presses the electronic part to float upwards.
The component stopper may be: a cylindrical roller having an axis orthogonal to the moving direction of the component stopper and capable of rotating the axis.
The fixing portion may be provided on the mounting portion, and may fix the electronic component to the mounting surface.
In order to achieve the above object, the present invention provides a component peeling apparatus for peeling an electronic component, which is formed by adhering an electrode exposed surface to an adhesive surface of a protective sheet and forming a film of a film-forming material, from the protective sheet, the apparatus comprising: a mounting part for supporting the electronic component adhered to the protective sheet; a chuck for holding an end portion of the protective sheet, relatively moving with respect to the mounting portion, and continuously peeling the end portion toward an opposite end of the end portion; and a fixing portion for fixing a position of the electronic component when the electronic component is peeled from the protective sheet.
[ Effect of the invention ]
According to the present invention, it is possible to prevent residue from remaining on the electronic component and peel off the electronic component having completed film formation from the protective sheet.
Drawings
Fig. 1 is a side view showing an electronic component subjected to a film formation process.
Fig. 2 is a side view showing a state of an electronic component subjected to a film formation process.
Fig. 3 is an exploded perspective view showing the state of the electronic component when subjected to the film forming process.
Fig. 4 is a transition diagram showing a film forming process flow of an electronic component.
Fig. 5 is a block diagram showing the structure of the film forming apparatus.
Fig. 6 is a schematic view showing a structure of the buried processing unit.
Fig. 7 (a) to (g) are transition diagrams schematically showing states of the embedded processing section in respective steps.
Fig. 8 is an enlarged view of the electronic components embedded in the processing section.
Fig. 9 is a schematic view showing the structure of the board mounting portion.
Fig. 10 (a) to (e) are transition diagrams schematically showing the state of the board mounting section in each step.
Fig. 11A and 11B are schematic diagrams showing the structure of the film formation processing section.
Fig. 12 is a schematic view showing the structure of the plate releasing section.
Fig. 13 (a) to (e) are transition diagrams schematically showing the state of the plate canceling portion in each step.
Fig. 14 is a schematic view showing another configuration of the plate canceling portion.
Fig. 15 is a schematic view showing still another configuration of the plate releasing section.
Fig. 16 is a schematic view showing the structure of the peeling treatment section.
Fig. 17 is a view showing the upper surface of the part-embedded sheet in the peeling treatment section.
Fig. 18 (a) to (f) are transition diagrams schematically showing the state of the peeling processing section in each step.
Fig. 19 is a schematic view showing a state of preventing the electronic component from floating up.
Fig. 20 is a photograph of the electrode after the electronic component is peeled from the protective sheet by the peeling processing section.
Fig. 21 is a plan view showing another embodiment of the part-embedded sheet in the peeling treatment section.
Fig. 22 is a plan view showing another embodiment of the part-embedded sheet in the peeling treatment section.
Fig. 23 is a plan view showing another embodiment of the part-embedded sheet in the peeling treatment section.
Fig. 24 is a plan view of a peeling treatment section according to another embodiment.
Fig. 25 is a partially enlarged perspective view of the peeling treatment portion of the end portion of the collet grip protecting piece.
Fig. 26 is a view for explaining the recovery of the protective sheet.
Fig. 27 is a cross-sectional view of the electronic component transfer tray including the mounting table and the ejection table.
Fig. 28 is a block diagram showing another configuration of the film forming apparatus.
Fig. 29 is a schematic view showing the structure of a conventional overhead device.
Fig. 30 is a schematic view showing the top of an electronic component in a conventional top-up device.
Fig. 31 is a photograph showing the state of the electrode after the adhesive film is reattached to the electronic component and peeled off.
[ description of symbols ]
1: buried processing part
11: top part
111: interior space
112: planar surface
113: air hole
114: pneumatic supply hole
115: o-shaped ring
12: mounting table
121: interior space
122: planar surface
123: air hole
124: pneumatic supply hole
125: push rod insertion hole
13: push rod
14: closed space
2: board mounting part
21: top part
211: interior space
212: planar surface
213: air hole
214: pneumatic supply hole
215: o-shaped ring
22: mounting table
221: an opening
222: edge part
223: pneumatic supply hole
224: push rod insertion hole
23: push rod
24a: closed space
24b: closed space
3: film forming processing unit
31: chamber chamber
311: processing position
312: film formation position
32: sampling room
33: partition part
34: rotary table
35: surface treatment part
36: sputtering source
361: target(s)
4: plate releasing part
41: top part
411: interior space
412: planar surface
413: air hole
414: pneumatic supply hole
415: o-shaped ring
42: mounting table
421: an opening
422: edge part
423: pneumatic supply hole
424: push rod insertion hole
43: push rod
44: clamping block
45: closed space
5: peeling treatment unit
51: mounting table
511: planar surface
512: interior space
513: air hole
514: pneumatic supply hole
515: guide insertion hole
52: clamping head
52a, 52b: plate-like body
521: lifting mechanism
53: guide part
54: sheet stopper
55: part stop
60: electronic component
60a: stripping starting end
601: electrode exposed surface
602: electrode
603: top surface
604: side surface
605: electromagnetic wave shielding film
61: protective sheet
611: adhesive surface
612: non-adhesive surface
613: outer frame region
614: middle frame region
615: parts arrangement area
62: frame
621: guide insertion hole
622: incision
63: cooling plate
631: push rod insertion hole
632: air hole
64: adhesive sheet
65: part-non-mounting sheet
66: part carried sheet
67: part embedded sheet
68: parts carrying board
7: film forming apparatus
71: transfer unit
73: conveying part
74: control unit
75: pneumatic circuit
8: pin body
80: base seat
80a: an opening
81: sheet feeding table
81a: rotary mechanism
811a: rotary shaft
82: platform
821: drive unit
822: guide piece
83: discharge table
831: discharge tray
83a: rotary mechanism
833a: rotary shaft
83b: tubular member
84: rotary mechanism
85: rotating arm
85a: suction cup
86: plate-like body
9: adhesive film
91: stripping part
92: reattachment site
93: residues from the treatment of plant diseases
94: gap of
H2: height of (1)
H1: height (thickness)
R: region(s)
Detailed Description
(electronic parts)
Fig. 1 is a side view showing an electronic component subjected to a film formation process. As shown in fig. 1, an electromagnetic wave shielding film 605 is formed on the surface of the electronic component 60. The electronic component 60 is a surface-mounted component such as a semiconductor chip, a diode, a transistor, a capacitor, or a surface acoustic wave (Surface Acoustic Wave, SAW) filter. The semiconductor chip is an integrated circuit such as an integrated circuit (Integrated Circuit, IC) or a large-scale integrated circuit (Large Scale Integrated circuit, LSI) in which a plurality of electronic elements are integrated. The electronic component has a substantially rectangular parallelepiped shape such as a Ball Grid Array (BGA), a Land Grid Array (LGA), a small outline package (Small Outline Package, SOP), a quad flat package (Quad Flat Package, QFP), a wafer level package (Wafer Level Package, WLP), and the like, and is formed as an electrode exposed surface 601. The electrode exposed surface 601 is a surface where the electrode 602 is exposed and is opposed to the package substrate to be connected thereto. The electrode 602 is an electrode called a ball bump or a solder ball bump, and is formed by mounting a ball-shaped solder (solder ball) having a diameter of several tens of μm to several hundreds of μm on a pad electrode.
The electromagnetic wave shielding film 605 shields electromagnetic waves. The electromagnetic wave shielding film 605 is formed of a material such as Al, ag, ti, nb, pd, pt, zr, for example. The electromagnetic wave shielding film 605 may be formed of a magnetic material such as Ni, fe, cr, co. Further, a film of SUS, ni, ti, V, ta or the like may be formed as a base layer of the electromagnetic wave shielding film 605, or a film of SUS, au or the like may be formed as a protective layer on the outermost surface.
The electromagnetic wave shielding film 605 is formed on the top surface 603 and the side surface 604 of the electronic component 60, that is, the outer surface other than the electrode exposed surface 601. The top surface 603 is a surface opposite to the electrode exposed surface 601. The side surface 604 is an outer peripheral surface that connects the top surface 603 and the electrode exposed surface 601 and extends at a different angle from the top surface 603 and the electrode exposed surface 601. In order to obtain a shielding effect of blocking electromagnetic waves, the electromagnetic wave shielding film 605 may be formed at least on the top surface 603. An off-the-figure ground pin (ground pin) is present on side 604. The electromagnetic wave shielding film 605 for the side surface is also formed for grounding of the electromagnetic wave shielding film 605. In addition, the electronic component 60 may be referred to as the electronic component 60 including the electromagnetic wave shielding film 605 in a state where the electromagnetic wave shielding film 605 is formed. The top surface 603 and the side surface 604 are referred to as the top surface 603 and the side surface 604, respectively, regardless of whether the electromagnetic wave shielding film 605 is formed or the electromagnetic wave shielding film 605 is not formed. That is, the surface of the electromagnetic wave shielding film 605 formed on the top surface 603 of the electronic component 60 is also referred to as the top surface 603, and the surface of the electromagnetic wave shielding film 605 formed on the side surface 604 is also referred to as the side surface 604.
(during film formation treatment)
Fig. 2 is a side view showing the state of the electronic component after the film formation treatment. Fig. 3 is an exploded perspective view showing the state of the electronic component when the film forming process is performed. As shown in fig. 2 and 3, the electrode 602 of the electronic component 60 is embedded in the protective sheet 61 in advance, and the electrode exposed surface 601 is closely adhered to the protective sheet 61. By embedding the protective sheet 61 in the electrode 602, particles of the electromagnetic wave shielding film 605 are prevented from reaching the electrode 602 during film formation. In addition, by the close contact between the electrode exposed surface 601 and the protective sheet 61, the space between the electrode exposed surface 601 and the protective sheet 61 for the particles of the electromagnetic wave shielding film 605 to enter is lost, and the possibility that the particles of the electromagnetic wave shielding film 605 reach the electrode 602 is reduced.
The protective sheet 61 is a synthetic resin having heat resistance such as polyethylene naphthalate (Polyethylene naphthalate, PEN) and Polyimide (PI). One surface of the protective sheet 61 is an adhesive surface (adhesive layer) 611 having flexibility in which the electrode 602 is immersed and adhesiveness in which the electrode exposed surface 601 is brought into close contact. As the adhesive surface 611, various materials having adhesiveness such as silicone-based and acrylic-based resins, urethane resins, and epoxy resins can be used.
The adhesion surface 611 is divided into an outer frame region 613 extending inward from the end of the protective sheet 61 by a predetermined distance, a middle frame region 614 extending inward from the inner periphery of the outer frame region 613 by a predetermined distance, and a component arrangement region 615 located further inward than the middle frame region 614. The electronic component 60 is stuck in the component arrangement area 615. A frame 62 is attached to the outer frame region 613. The middle frame region 614 is a range where warpage of the protective sheet 61 occurs, and neither the frame 62 nor the electronic component 60 is attached. The opposite surface of the adhesion surface 611 is a non-adhesion surface 612. The areas of the non-adhesive surface 612 corresponding to the outer frame area 613, the middle frame area 614, and the component arrangement area 615 are also referred to as only the outer frame area 613, the middle frame area 614, and the component arrangement area 615.
The protective sheet 61 is adhered to the cooling plate 63 via an adhesive sheet 64. The cooling plate 63 is made of metal such as SUS, ceramic, resin, or other material having high thermal conductivity. The cooling plate 63 is a heat dissipation path for dissipating heat from the electronic component and suppressing excessive heat storage. The adhesive sheet 64 has adhesiveness on both sides, improves the adhesion between the protective sheet 61 and the cooling plate 63, and ensures a heat transfer area to the cooling plate 63.
The height H1 from the surface of the component arrangement region 615 to the upper end surface of the frame 62 is higher than the height H2 from the surface of the component arrangement region 615 to the top surface 603 of the electronic component 60 (see fig. 4). In addition, the height H1 may be changed to the thickness H1 for convenience, but the meaning is the same. In short, if a flat plate is placed on the frame 62, the top surface 603 of the electronic component 60 does not reach the flat plate.
A guide insertion hole 621 is formed through one end of the frame 62. The guide insertion hole 621 has an opening of an elongated ellipse, rectangle, circle, or the like along the end of the frame 62, and penetrates the surface of the frame 62 that is adhered to the protective sheet 61 and the opposite exposed surface thereof. That is, for example, when a bar-shaped member is inserted into the guide insertion hole 621 and the end portion of the protection sheet 61 is pressed (see (a) to (f) in fig. 18), one end portion of the protection sheet 61 is peeled off from the frame 62.
A push rod (pusher) insertion hole 631 is formed in the cooling plate 63 and the adhesive sheet 64. The push rod insertion hole 631 does not coincide with the guide portion insertion hole 621, and is provided at a position blocked by the frame 62. The plurality of push rod insertion holes 631 are penetrated in the following manner: when, for example, a rod-like member is inserted into the push rod insertion hole 631 and the frame 62 is pushed up by the front end of the rod-like member, the frame 62 is lifted up in parallel as a whole. For example, if the frame 62 is a rectangular frame, the push rod insertion holes 631 are located at four corners or further at the centers of the sides. The rod-shaped member desirably has a rectangular distal end surface, that is, a thin plate-like or L-shaped cross section, from the viewpoint of maintaining parallelism of the frame 62, but is not limited thereto, and may have a circular distal end surface. The push rod insertion hole 631 has a rectangular shape, an L-shape, or a circular shape, respectively.
Further, a plurality of fine air holes 632 are formed in the cooling plate 63 and the adhesive sheet 64 within the part arrangement region 615 of the adhesive protection sheet 61. The air hole 632 is, for example, a minute cylindrical shape or a slit shape. The air holes 632 are provided to uniformly apply negative or positive pressure to at least the part arrangement region 615 of the protection sheet 61 attached to the cooling plate 63 through the air holes 632.
(film Forming Process flow)
In the film forming process, the electronic component 60 having the electromagnetic wave shielding film 605 formed thereon and separated into individual pieces is obtained through a component mounting step, a component embedding step, a board mounting step, a film forming step, a board removing step, and a component peeling step.
Fig. 4 is a diagram showing a flow of a film forming process of an electronic component. As shown in fig. 4, in the component mounting step, the electronic components 60 are arranged in the component arrangement region 615 in a state in which the electrode exposed surface 601 of the electronic components 60 and the component non-mounting sheet 65, to which the frame 62 has been attached to the protective sheet 61, are opposed. A state in which the frame 62 is attached to the protective sheet 61 and the electronic components 60 are arranged, but the electrode 602 is not yet embedded is referred to as a component mounted sheet 66.
In the component embedding step, the electrode 602 is embedded in the protective sheet 61 with respect to the component mounted sheet 66, and the electrode exposed surface 601 is brought into close contact with the protective sheet 61. The state in which the electrode 602 has been embedded in the protective sheet 61, regardless of whether the electromagnetic wave shielding film 605 is formed or not, is referred to as a part embedded sheet 67. In the board mounting step, the component embedded sheet 67 is closely attached to the cooling board 63 via the adhesive sheet 64. The state in which this cooling plate 63 is mounted is referred to as a component mounting plate 68.
In the film formation step, particles of the electromagnetic wave shielding film 605 are deposited from the top surface 603 side of the electronic component 60, and the electromagnetic wave shielding film 605 is formed on the electronic component 60. At this time, the electrode 602 of the electronic component 60 is buried in the protective sheet 61, and the electrode exposed surface 601 is closely adhered to the protective sheet 61, whereby particles of the electromagnetic wave shielding film 605 are prevented from adhering to the electrode 602.
In the plate releasing step, the cooling plate 63 is removed, and the shape of the part embedded piece 67 is restored. Then, in the component peeling step, the electronic component 60 and the frame 62 are peeled off from the protective sheet 61, and the protective sheet 61 is separated from the electronic component 60 and the frame 62. The film formation process is ended in this manner.
(film Forming apparatus)
Fig. 5 shows a film forming apparatus that performs the parts embedding step, the board mounting step, the film forming step, the board removing step, and the parts peeling step in the above film forming process flow. As shown in fig. 5, the film forming apparatus 7 includes: an embedding processing section 1, a board mounting section 2, a film forming processing section 3, a board releasing section 4, and a peeling processing section 5. The parts are connected by a conveying part 73, and members necessary for the respective steps are input and members which have been processed in the respective steps are discharged. The conveying unit 73 may be a conveyor, for example, or a conveying table movable along a linear rail by a ball screw or the like.
The film forming apparatus 7 includes a control unit 74, such as a computer or a microcomputer, which includes a central processing unit (Central Processing Unit, CPU), a Read Only Memory (ROM), a random access Memory (Random Access Memory, RAM), and a signal transmission circuit, and is configured to control operation timings (timings) of the respective constituent elements included in the embedded processing unit 1, the board mounting unit 2, the film forming processing unit 3, the board release unit 4, and the peeling processing unit 5. Further, a pneumatic circuit 75 is accommodated, and positive or negative pressure is supplied to the embedded processing section 1, the board mounting section 2, the film formation processing section 3, the board release section 4, and the peeling processing section 5. The control unit 74 also controls the solenoid valve in the pneumatic circuit 75 to switch between generating negative pressure, releasing negative pressure, generating positive pressure, and releasing positive pressure.
(buried processing portion)
The embedding processing unit 1, which is responsible for the component embedding step, will be described. Fig. 6 is a schematic diagram showing the structure of the embedded processing unit 1. The component-mounted sheet 66 is put into the embedded processing section 1. The embedded processing unit 1 attracts the protective sheet 61 to the electronic component 60 while blocking the electronic component 60, and presses the protective sheet 61 against the electronic component 60. Thus, the embedding processing part 1 traps the electrode 602 of the electronic component 60 in the protective sheet 61, and further, the electrode exposed surface 601 is closely adhered to the protective sheet 61.
As shown in fig. 6, the embedded processing unit 1 includes a top 11 and a mounting table 12. The top 11 and the mounting table 12 are blocks having an inner space 111 and an inner space 121. The top 11 is disposed opposite to the mounting table 12, and has flat surfaces 112 and 122 parallel to each other on opposite sides. The flat surfaces (112, 122) are the same size and shape as the component-mounted sheet 66 or wider than the component-mounted sheet 66. The position of the stage 12 is not moved. On the other hand, the top 11 is liftable and lowerable with respect to the mounting table 12. The top 11 is at least close to the distance from the mounting table 12 to the thickness H1 of the frame 62 on which the component mounting piece 66 is mounted.
A component mounted sheet 66 is placed on the mounting table 12. The flat surface 122 of the mounting table 12 serves as a mounting surface for the component mounted sheet 66. The flat surface 122 includes an adhesive anti-slip member. In addition, a plurality of air holes 123 that open into the internal space 121 are formed in the flat surface 122 of the mounting table 12. The air hole 123 has a through-hole having a size and shape equal to those of the inner side of the frame 62 on which the component mounting piece 66 is mounted, or at least a size and shape equal to those of the component arrangement region 615. When the mounted part 66 is mounted on the mounting table 12, the through-hole 123 is located opposite to the inner region of the frame 62 or opposite to the part arranging region 615.
In the internal space 121 of the mounting table 12, an air pressure supply hole 124 is further formed in a portion different from the flat surface 122. The air pressure supply hole 124 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe, a positive pressure supply pipe, and the like, which are not shown. Accordingly, positive pressure or negative pressure is selectively generated in the air hole 123 by the air pressure supply hole 124 and the inner space 121.
Further, a push rod insertion hole 125 penetrating the mounting table 12 is opened in the flat surface 122 of the mounting table 12. The push rod insertion hole 125 is provided outside the penetration range of the air hole 123. Specifically, when the mounted piece 66 is mounted, the push rod insertion hole 125 is located so as to avoid the guide insertion hole 621 of the frame 62 and to be blocked by the frame 62. The push rod 13 is inserted in this push rod insertion hole 125. The push rod 13 can be moved out and into the flat surface 122 of the mounting table 12. The push rods 13 are provided with rigidity, number and arrangement intervals of such a degree that when protruding from the push rod insertion holes 125, the mounted parts pieces 66 are separated from the mounting table 12 and can be lifted and supported in parallel. For example, if the frame 62 has a rectangular outer shape, the bar body is arranged corresponding to each corner of the frame 62.
Further, a plurality of air holes 113 that open into the inner space 111 are also formed in the flat surface 112 of the top 11. The air hole 113 has a through-hole area having the same size and shape as the inside of the frame 62 of the mounted sheet 66, or at least the same size and shape as the part arranging area 615, and extends over the whole part arranging area 615. When the mounted part 66 is mounted on the mounting table 12, the through-hole 113 is located opposite to the inner region of the frame 62 or opposite to the part arranging region 615.
In the internal space 111 of the top 11, an air pressure supply hole 114 is formed in a portion different from the flat surface 112. The air pressure supply hole 114 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe, and the like, which are not shown. Accordingly, a negative pressure is generated in the air hole 113 through the air pressure supply hole 114 and the inner space 111.
Further, on the flat surface 112 of the top 11, along the frame 62 of the component mounted sheet 66 placed on the mounting table 12, an O-ring 115 surrounding the penetration range of the air hole 113 is provided.
Fig. 7 (a) to (g) show the flow of the operation of the implantation processing unit 1. Fig. 7 (a) to (g) are transition diagrams schematically showing states of the embedded processing section 1 in the respective steps. First, as shown in fig. 7 (a), the component-mounted sheet 66 is put into the embedded processing section 1. The top 11 is sufficiently separated from the mounting table 12, and the push rod 13 projects the tip end from the flat surface 122 of the mounting table 12. When the component placement piece 66 is put in, the frame 62 of the component placement piece 66 is aligned with the push rod 13, and the component placement piece 66 is supported on the push rod 13.
Then, as shown in fig. 7 (b), the push rod 13 is retracted into the push rod insertion hole 125. Thereby, the component mounted sheet 66 is lowered onto the flat surface 122 of the mounting table 12. The top 11 is moved toward the mounting table 12. The frame 62 of the component mounted sheet 66 is sandwiched between the flat surface 112 of the top 11 and the flat surface 122 of the mounting table 12. The height H1 from the surface of the component arrangement region 615 to the upper end face of the frame 62 is higher than the height H2 from the surface of the component arrangement region 615 to the top face 603 of the electronic component 60. Therefore, when the frame 62 has been sandwiched, the top surface 603 of the electronic part 60 does not reach the flat surface 112 of the top 11. Therefore, the component arrangement region 615 carrying the electronic component 60 is enclosed in the sealed space 14 surrounded by the flat surface 112 of the top 11, the protective sheet 61, and the frame 62 and sealed by the O-ring 115.
When the component arrangement region 615 is sealed in the sealed space 14, as shown in fig. 7 (c), negative pressure is generated in the air hole 123 of the mounting table 12, and the protection sheet 61 is adsorbed on the flat surface 122. Then, as shown in fig. 7 (d), a negative pressure is also generated in the air hole 113 of the top 11, and the closed space 14 in which the component arrangement region 615 is sealed is depressurized. That is, the top 11 and the two air holes (113, 123) of the mounting table 12 function as pressure reducing portions. The degree of depressurization is desirably the same pressure achieved by the two air holes (113, 123) and is near vacuum. The reason why the negative pressure is generated at the first time in the air hole 123 of the stage 12 is that: by first adsorbing the protective sheet 61 to the mounting table 12, the pressure on the lower side of the protective sheet 61 is prevented from becoming excessively large with respect to the pressure on the upper side during the depressurization of the sealed space 14, and the electronic component 60 is thereby prevented from abruptly protruding toward the flat surface 112 of the top 11.
When the depressurization is completed, as shown in fig. 7 (e), the air hole 123 on the table 12 side is gradually changed from the negative pressure to the positive pressure while maintaining the negative pressure on the top 11 side, and the air hole 123 on the table 12 is converted to the positive pressure. The electronic component 60 and the protective sheet 61 are slowly sucked upward toward the flat surface 112 of the top 11, and are also slowly pushed upward. The electronic component 60 is pressed by the flat surface 112 of the top 11 to be blocked. On the other hand, since the adhesive surface 611 has flexibility, the protective sheet 61 is further attracted toward the flat surface 112 even after the electronic component 60 has been blocked, and is further pushed upward toward the flat surface 112.
Then, the electrode 602 of the electronic component 60 is buried in the protective sheet 61, more specifically, in the adhesion surface 611 of the protective sheet 61, and further, the electrode exposure surface 601 of the electronic component 60 is closely adhered to the protective sheet 61. At this time, the flat surface 112 of the top 11 includes the part alignment area 615, so that the part alignment area 615 is flat. In other words, the part arrangement region 615 does not bend. Therefore, the electrode 602 is prevented from being buried insufficiently at the end of the component arrangement region 615, or the electrode exposed surface 601 is prevented from being adhered insufficiently.
The adhesion between the electrode exposed surface 601 and the protective sheet 61 is performed under a reduced pressure, and no air or very little air is present in the sealed space. Therefore, there is a low possibility that bubbles intrude between the electrode exposed surface 601 and the protective sheet 61.
Fig. 8 is an enlarged view of the electronic components 60 embedded in the processing unit 1. As shown in fig. 8, the positive pressure generated in the mounting table 12 uniformly pushes up at least the part arrangement region 615 of the protection sheet 61. Then, the protective sheet 61 having flexibility is pushed further toward the flat surface 112 of the top 11 without being blocked by the electronic component 60 in each gap between the adjacent electronic components 60. Then, the adhesive surface 611 of the protective sheet 61 rises until reaching the lower side of the electronic component 60, and the protective sheet 61 is also closely adhered to the lower side of the electronic component 60. Therefore, particles of the electromagnetic wave shielding film 605 can be more reliably prevented from entering between the electrode exposed surface 601 and the protective sheet 61.
When the electrode 602 of the electronic component 60 is embedded in the protective sheet 61 and the electrode exposed surface 601 of the electronic component 60 is brought into close contact with the lower side surface of the protective sheet 61, the push rod 13 is moved in the axial direction along the push rod insertion hole 125 as shown in fig. 7 (f) and is again brought out of the flat surface 122 of the mounting table 12. At the same time, the top 11 is moved away from the mounting table 12 at a speed equal to the forward speed of the push rod 13. Finally, as shown in fig. 7 (g), the push rod 13 is stopped, and the top 11 is further separated from the mounting table 12, whereby the insertion of the component embedded piece 67 is released. Thus, the electronic component 60 is embedded in the protective sheet 61 by the embedding processing unit 1.
The negative pressure on the top 11 side and the positive pressure on the mounting table 12 side may be released from the time from the completion of the adhesion of the electrode exposed surface 601 of the electronic component 60 to the protective sheet 61 in fig. 7 (e) to the raising of the top 11 in fig. 7 (g). In the negative pressure on the top 11 side, it is preferable that the electronic component 60 is stably held by the protective sheet 61 at the time of raising the push rod 13 in fig. 7 (f) if the negative pressure on the top 11 side is released immediately before raising the top 11 in fig. 7 (g).
In this way, the top 11 and the mounting table 12 form a fixing portion for sandwiching the component mounted sheet 66 by sandwiching the frame 62 from both sides. The top 11, the protective sheet 61 and the frame 62 form a closed space 14 in which the component arrangement region 615 is enclosed. The O-ring 115 improves the sealing property of the sealed space 14 by sealing. The air hole 113 of the ceiling 11 serves as a decompression portion for decompressing the closed space 14.
The flat surface 122 of the mounting table 12 serves as a mounting surface for the component mounted sheet 66. The air hole 123 opened in the flat surface 122 of the mounting table 12 serves as an anti-collision member that generates negative pressure at the time of decompression of the closed space 14 to prevent the electronic component 60 from protruding toward the flat surface 112 of the top 11, and a pressing member that presses the component arrangement region 615 against the flat surface 112 of the top 11 by positive pressure and interacts with the negative pressure of the top 11 to embed the electrode 602 of the electronic component 60.
The flat surface 112 of the top 11 serves as a flattening member for flattening the component arrangement region 615 and improving the embedding effect of the electrode 602 and the adhesion effect of the electrode exposed surface 601. The air hole 113 opened in the flat surface 112 of the top 11 serves as an upward suction member that presses the component arrangement region 615 against the flat surface 112 of the top 11 by interaction with positive pressure of the mounting table 12 by negative pressure and embeds the electrode 602 of the electronic component 60, and a side lower covering member that sucks the protective sheet 61 upward into a gap between the electronic components 60 by interaction with positive pressure of the mounting table 12 and brings the protective sheet 61 into close contact with a side lower portion of the electronic component 60.
In this way, the embedding processing part 1 embeds the electrode 602 of the electronic component 60 in the adhesion surface 611 of the protective sheet 61, but has a pressure reducing part that reduces the pressure in the space including the electronic component 60 and the component arrangement region 615. After the pressure is reduced, the electronic component 60 and the protective sheet 61 are pressed against each other. As a result, there is no problem that bubbles enter between the electrode exposed surface 601 of the electronic component 60 and the protective sheet 61 and insufficient adhesion occurs, and there is a reduced possibility that a gap is generated between the electrode exposed surface 601 of the electronic component 60 and the protective sheet 61, and it is possible to avoid a situation in which particles of the electromagnetic wave shielding film 605 adhere to the electrode 602.
The buried processing unit 1 includes a flat surface 112 of the top 11. The flat surface 112 is located opposite to the protective sheet 61 across the electronic component 60 and faces the electronic component 60. The pressure between the mounting table 12 and the protective sheet 61, that is, the space on the opposite side of the protective sheet 61 from the flat surface 112 is relatively higher than the pressure of the space between the protective sheet 61 and the flat surface 112. Thus, the electronic component 60 and the protective sheet 61 are oriented to the flat surface 112, and the flat surface 112 is made to act as a stopper to press the electronic component 60 and the protective sheet 61 against each other. Therefore, the component arrangement region 615 of the protective sheet 61 is flattened, and the electrode exposed surface 601 of the electronic component 60 and the protective sheet 61 are pressed against each other in a state of being parallel to each other. Therefore, the room for the entry of bubbles is further lost.
The implantation processing unit 1 has a mounting surface (flat surface 122) of the mounting table 12, that is, on the opposite side of the flat surface 112 from the protective sheet 61. Then, an air hole 123 is formed in the mounting table 12, which opens at the mounting surface and generates a negative pressure during the decompression of the closed space 14 to separate the protection sheet 61 from the flat surface 112. This can prevent the electronic component 60 from being damaged by the electronic component suddenly projecting toward the flat surface 112 during the decompression of the sealed space 14.
The air hole 113 of the top 11 and the air hole 123 of the mounting table 12, which press the electronic component 60 and the protective sheet 61 against each other, are used as the pressure reducing portion, but a 3 rd air hole may be formed in the closed space 14 separately, and negative pressure may be generated in the 3 rd air hole to reduce the pressure.
The air hole 123 on the mounting table 12 side is converted into a positive pressure after the pressure in the sealed space 14 is reduced, and the protective sheet 61 is further pressed against the electronic component 60 blocked by the flat surface 112. Thus, the protective sheet 61 is raised together with the adhesive surface 611 in the gap between the electronic components 60, and the lower side surface of the electronic components 60 may be covered with the protective sheet 61. Therefore, the occurrence of a gap between the electrode exposed surface 601 and the protective sheet 61 can be reliably prevented. Even in the case of electronic parts such as SOP and QFP having a thin plate-like electrode at the lower side, the electrode 602 is covered with the protective sheet 61, and the adhesion of particles of the electromagnetic wave shielding film 605 can be prevented, and the film forming apparatus 7 can be applied.
In addition, the mechanism of action of the top 11 and the mechanism of action of the push rod 13 can be applied to a known mechanism, and the present invention is not limited by the mechanism.
For example, a ball screw for extending the shaft in a direction from the top 11 toward the table 12 and a rail guide for extending the shaft in a direction from the top 11 toward the table 12 are connected to the top 11. The top 11 moves along the guide rail toward the mounting table in accordance with the rotation direction of the screw shaft. The ball screw and the guide rail are extended so that the top 11 approaches the mounting table 12 to a distance of the thickness H1 of the frame 62 of the component mounted sheet 66.
In addition, the rear end portion of the push rod 13 becomes a cam follower (cam follower). The cam follower follows the circumferential surface of the oval cam. The cam shaft is supported by a rotary motor and rotatable in a circumferential direction. When the rotation motor is driven and the cam rotates, the cam follower lifts the bulging portion of the cam, the push rod 13 is pushed upward, and the tip of the push rod 13 protrudes from the insertion hole.
Further, as a method of fixing the mounted sheet 66, the frame 62 is sandwiched between the top 11 and the mounting table 12, the closed space 14 is formed between the top 11 and the protective sheet 61, and the frame 62, and both positive pressure and negative pressure are selectively generated in the air hole 123 of the mounting table 12, but the present invention is not limited thereto. For example, one or both of the top 11 and the mounting table 12 may be cup-shaped, and the component mounted sheet 66 may be accommodated in an internal space formed by the top 11 and the mounting table 12. It may also include a block that sandwiches the frame 62 from both sides, and the component-mounted sheet 66 may be sandwiched by the blocks. In this case, the height of the frame 62 is not limited. Both the through-holes for generating negative pressure and the through-holes for generating positive pressure may be formed in the flat surface 122 of the mounting table 12.
(Board mounting part)
Next, the board mounting portion 2 that is responsible for the board mounting step will be described. Fig. 9 is a schematic diagram showing the structure of the board mounting portion 2. The part embedded sheet 67 produced by the embedded processing section 1 and the cooling plate 63 to which the adhesive sheet 64 is adhered in advance are put into the plate mounting section 2. The board mounting portion 2 presses the part embedded piece 67 against the blocked cooling plate 63, and attracts the part embedded piece 67 to the cooling plate 63, thereby bringing the part embedded piece 67 into close contact with the cooling plate 63 via the adhesive sheet 64.
As shown in fig. 9, the board mounting portion 2 includes a top 21 and a mounting table 22. The top 21 is disposed opposite to the mounting table 22. The position of the stage 22 is not moved. On the other hand, the top 21 is liftable and lowerable with respect to the mounting table 22. The top 21 is at least close to the distance from the mounting table 22 to the thickness H1 of the frame 62 of the component embedded sheet 67.
The top 21 is a block having an internal space 211, and has a flat surface 212 on a surface facing the mounting table 22. The mounting table 22 has a cup shape with a bottom. The opening 221 of the mounting table 22 is directed toward the top 21. The flat surface 212 of the top 21 is the same size and shape as the part embedded piece 67 or wider than the part embedded piece 67. On the other hand, the opening 221 of the mounting table 22 has a containing area equal to or larger than the component arrangement area 615 and equal to or smaller than the middle frame area 614. The edge 222 of the mounting table 22 surrounding the opening 221 has a width equal to or greater than the width of the frame 62.
In this mounting table 22, the edge portion 222 supports the cooling plate 63, and the opening 221 is closed by the cooling plate 63. The surface of the cooling plate 63 opposite to the surface to which the adhesive sheet 64 is attached is abutted against the edge portion 222. Further, the embedded part 67 is placed on the cooling plate 63 so as to face the adhesive sheet 64. An air pressure supply hole 223 is formed in the bottom of the stage 22. The air pressure supply hole 223 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe, and the like, which are not shown. Accordingly, a negative pressure is generated in the air hole 632 of the cooling plate 63 placed to close the opening 221.
Further, a push rod insertion hole 224 penetrating the mounting table 22 is formed in the edge 222 of the mounting table 22. The push rod insertion hole 224 is formed at a position corresponding to the push rod insertion hole 631 of the cooling plate 63, and is closed by the frame 62 while avoiding the guide insertion hole 621 of the frame 62 when the component embedded piece 67 is placed on one side. The push rod 23 is inserted into this push rod insertion hole 224. The push rod 23 can penetrate the mounting table 22, the cooling plate 63 and the adhesive sheet 64 to be moved.
The push rods 23 are provided with rigidity, number, and arrangement intervals such that the embedded parts 67 are spaced apart from the cooling plate 63 and supported in parallel in a state protruding from the cooling plate 63. For example, if the outer shape of the frame 62 is rectangular, the frame 62 is arranged as a bar body corresponding to each corner of the frame 62. The push rod insertion holes 224 are also provided corresponding to the number and positional relationship of the push rods 23.
Then, a plurality of air holes 213 that open into the inner space 211 are formed in the flat surface 212 of the top 21. The air hole 213 is formed in the same size and shape as the inner side of the frame 62 of the embedded component piece 67 or at least in the same size and shape as the component arrangement region 615. When the embedded component piece 67 is placed on the mounting table 22, the through-hole 213 is located at a position where the component arrangement region 615 is covered (see fig. 10 a).
In the internal space 211 of the top 21, an air pressure supply hole 214 is formed in a portion different from the flat surface 212. The air pressure supply hole 214 is connected to an air pressure circuit 75 including a compressor, a positive pressure supply pipe, a negative pressure supply pipe, and the like, which are not shown. Accordingly, positive and negative pressures are selectively generated in the air hole 213 by the air pressure supply hole 214 and the inner space 211.
Further, on the flat surface 212 of the top 21, along the frame 62 of the component embedded sheet 67 placed on the mounting table 22, an O-ring 215 surrounding the penetration range of the air hole 213 is provided.
Fig. 10 (a) to (e) show a flow of the operation of the board mounting portion 2. Fig. 10 (a) to (e) are transition diagrams schematically showing the state of the board mounting section 2 in each step. First, as shown in fig. 10 (a), the top 21 is first separated from the mounting table 22. A cooling plate 63 is mounted on the mounting table 22 in advance. The push rod 23 is inserted through the cooling plate 63 and the adhesive sheet 64 and protrudes toward the top 21. In this state, the frame 62 of the part embedded sheet 67 is aligned with the push rod 23, and the part embedded sheet 67 is supported by the push rod 23. Then, the top 21 is lowered toward the push rod 23, and the frame 62 of the component embedded piece 67 is sandwiched between the top 21 and the push rod 23.
At this time, the height H1 from the surface of the component arrangement region 615 to the upper surface of the frame 62 is higher than the height H2 from the surface of the component arrangement region 615 to the top surface 603 of the electronic component 60. Therefore, when the frame 62 has been sandwiched, the top surface 603 of the electronic part 60 does not reach the flat surface 212 of the top 21. Therefore, at least the part arrangement region 615 is enclosed in the sealed space 24a formed by the top 21, the protection sheet 61, and the frame 62 and sealed by the O-ring 215.
When the component arrangement region 615 is sealed in the sealed space 24a, a negative pressure is generated in the flat surface 212 of the top 21. The electronic component 60 is attracted to the flat surface 212. The embedded part 67 is strained in the middle frame region 614, and the entire part arrangement region 615 is attracted to the flat surface 212 while remaining flat. Therefore, the part arrangement region 615 does not flex like a bend, and the embedded electrode 602 does not separate from the protective sheet 61. Further, it is preferable that the flat surface 212 of the top 21 is provided with a negative pressure so that the electronic component 60 does not abruptly protrude toward the flat surface 212 and the pressure gradually decreases.
Then, as shown in fig. 10 (b), the push rod 23 and the top 21 are lowered toward the stage 22 at equal speeds. Further, the region of the frame 62 where the parts have been embedded in the sheet 67 is brought into contact with the adhesive sheet 64 on the cooling plate 63. Further, the top 21 is moved toward the mounting table 22, whereby the region of the frame 62 is adhered to the adhesive sheet 64. In this stage, the negative pressure of the top 21 is maintained, and the part embedded sheet 67 is attracted to the flat surface 212 of the top 21, so that the part arrangement region 615 is not in contact with the adhesive sheet 64.
Here, when no negative pressure is generated in the top 21, the part embedded sheet 67 contacts the adhesive sheet 64 in the presence of air. Then, there is a concern that air bubbles enter between the part embedded sheet 67 and the adhesive sheet 64. If the bubbles enter, the heat transfer area reaching the cooling plate 63 decreases, and the heat dissipation effect of the electronic component 60 at the time of film formation decreases. However, in the board mounting portion 2, the part embedded sheet 67 is lifted in a direction away from the adhesive sheet 64 in the presence of air, so that the entry of air bubbles is prevented.
When the frame 62 is closely adhered to the adhesive sheet 64, the non-adhesive surface 612 of the protective sheet 61 and the adhesive sheet 64 side of the cooling plate 63 are sealed in the sealed space 24b formed by the protective sheet 61, the cooling plate 63 and the frame 62. When the sealed space 24b is formed, as shown in fig. 10 (c), the negative pressure is generated in the mounting table 22 while maintaining the negative pressure of the top 21. The air holes 632 of the cooling plate 63 and the air holes 632 of the adhesive sheet 64 decompress the sealed space 24b between the cooling plate 63 provided with the adhesive sheet 64 and the protective sheet 61. At this time, the negative pressure generated in the mounting table 22 is slightly closer to the atmospheric pressure than the negative pressure generated in the top 21, and is preferably set to a level that can maintain the suction of the electronic component 60 to the top 21.
When the pressure in the sealed space 24b between the cooling plate 63 provided with the adhesive sheet 64 and the protective sheet 61 is reduced, the negative pressure of the top 21 is gradually changed to positive pressure while maintaining the negative pressure of the mounting table 22 as shown in fig. 10 (d). The part embedded sheet 67 is slowly attracted downward toward the adhesive sheet 64, and in addition, the part embedded sheet 67 is pressed downward, and the part embedded sheet 67 is pressed against the adhesive sheet 64 adhered to the cooling plate 63. The embedded part 67 is attached to the cooling plate 63 via the adhesive sheet 64.
Finally, as shown in fig. 10 (e), the top 21 is moved so as to be separated from the mounting table 22, and the insertion of the embedded component piece 67, the adhesive sheet 64, and the cooling plate 63 is released. Thus, the component mounting board 68 including the electronic component 60, the protective sheet 61, the adhesive sheet 64, and the cooling plate 63 is completed. The positive pressure generated in the top 21 and the negative pressure generated in the mounting table 22 may be released during the period in which the top 21 is separated from the mounting table 22.
That is, the top 21, the push rod 23, and the mounting table 22 serve as driving portions for bringing the embedded parts 67 and the cooling plate 63 into proximity. The top 21 and the mounting table 22 serve as fixing portions for sandwiching the embedded parts 67 and the cooling plate 63, and also serve as pressing portions for pressing the frame 62 and the cooling plate 63 to bring them into close contact. The air pressure supply hole 223 of the mounting table 22 serves as a pressure reducing portion for reducing the pressure in the sealed space 24b between the embedded component piece 67 and the cooling plate 63. The air hole 213 of the top 21 serves as a pressure reducing portion for reducing the pressure in the sealed space 24a between the flat surface 212 of the top 21 and the component embedded piece 67.
The flat surface 212 of the top 21 serves as a spacer member that prevents air bubbles from entering between the part embedded sheet 67 and the cooling plate 63 by generating negative pressure prior to the pressure reduction between the part embedded sheet 67 and the cooling plate 63, and a pressing member that causes the part embedded sheet 67 to be brought into close contact with the cooling plate 63 by positive pressure and suction by the negative pressure of the mounting table 22. The mounting table 22 is an adsorption member that causes the part embedded sheet 67 to be brought into close contact with the cooling plate 63 by the negative pressure and the pressing operation by the positive pressure of the top 21.
In this way, the board mounting section 2 attaches the protective sheet 61 with the electrode 602 of the electronic component 60 embedded therein to the cooling board 63. The board mounting portion 2 has a decompression portion that decompresses the space between the component arrangement region 615 and the cooling board 63. After the pressure is reduced by the pressure reducing portion, the protection sheet 61 and the cooling plate 63 are pressed against each other. Thus, bubbles do not enter between the protective sheet 61 and the cooling plate 63, and a sufficient heat transfer area to the cooling plate 63 can be ensured.
The plate mounting portion 2 has air holes 213 on the flat surface 212 of the top 21, that is, on the opposite side of the cooling plate 63 from the protective sheet 61, for sucking up the protective sheet 61 by negative pressure to separate the cooling plate 63 from the protective sheet 61. The air hole 213 maintains a negative pressure until the decompression between the part embedded plate 67 and the cooling plate 63 by the decompression section is completed. This prevents the protective sheet 61 from sticking to the cooling plate 63 in a state where the pressure reduction is not completed, and can further reduce the concern that air bubbles enter between the protective sheet 61 and the cooling plate 63, and sufficiently secure a heat transfer area to the cooling plate 63.
In addition, the negative pressure is generated at the latest from the space between the cooling plate 63 provided with the adhesive sheet 64 and the protective sheet 61 before the air hole 213 opened in the flat surface 212 of the top 21 descends from the push rod 23 and the top 21 is abutted against the mounting table 22 via the frame 62 of the part embedded sheet 67, that is, from the time before the part embedded sheet 67 approaches the cooling plate 63. This prevents the protective sheet 61 from being erroneously stuck to the cooling plate 63 before the push rod 23 provided with the protective sheet 61 (the embedded part 67) starts to descend.
In addition, the board mounting portion 2 has a flat surface 212 of the top portion 21. The flat surface 212 is located opposite to the cooling plate 63 with the protective sheet 61 interposed therebetween, and faces the electronic component 60. The air holes 213 separating the cooling plate 63 from the protective sheet 61 before the decompression between the part embedded sheet 67 and the cooling plate 63 is completed are opened on this flat surface 212. Thus, the protective sheet 61 is not bent and deflected by the pressure difference between the front and back of the protective sheet 61 during the pressure reduction, and the protective sheet 61 can be flattened, so that the electronic component 60 can be prevented from being peeled off from the protective sheet 61 during the board mounting.
The air hole 213 on the top 21 side is changed from negative pressure generation to positive pressure generation after the part is embedded between the sheet 67 and the cooling plate 63, and presses the protection sheet 61 against the cooling plate 63. That is, the air hole 213 serves as a partition portion between the protection sheet 61 and the cooling plate 63, a pressure reducing portion, and a pressing member between the protection sheet 61 and the cooling plate 63. However, the functions of the isolating, decompressing, and sealing members may be realized by the air holes that are independent of each other.
For example, as in the present embodiment, the cooling plate 63 is provided with the air holes 632. The board mounting portion 2 includes a mounting table 22 on which a cooling board 63 is mounted and which generates negative pressure. The protective sheet 61 may be attracted to the cooling plate 63 through the mounting table 22 on which the cooling plate 63 is mounted and the air holes 632 of the cooling plate 63.
The mechanism of operation of the top 21 and the mechanism of operation of the push rod 23 may be any known mechanism, and the present invention is not limited by the mechanism.
For example, a ball screw for extending the shaft in a direction from the top 21 toward the mounting table 22 and a rail guide for extending the shaft in a direction from the top 21 toward the mounting table 22 are connected to the top 21. In this case, the top 21 moves along the guide rail toward the mounting table 22 in accordance with the rotation direction of the screw shaft. The ball screw and the guide rail are extended so that the top 21 approaches the mounting table 22 to a distance of the thickness H1 of the frame 62 of the component embedded piece 67.
In addition, the rear end portion of the push rod 23 becomes a cam follower. The cam follower follows the circumferential surface of the oval cam. The cam shaft is supported by a rotary motor and rotatable in a circumferential direction. When the rotation motor is driven and the cam rotates, the cam follower lifts the cam bulge, and the push rod 23 is pushed up.
Further, as a method of forming the closed space 24a and the closed space 24b, the part embedded piece 67 and the cooling plate 63 may be formed by the top 21 and the mounting table 22 without being an element of the forming member. For example, one or both of the top 21 and the mounting table 22 may be cup-shaped, and may be accommodated in a single space formed by the top 21 and the mounting table 22 so as to include the embedded piece 67 and the cooling plate 63, and the front and back of the embedded piece 67 may be divided by the top 21 and the mounting table 22. However, in this case, the top 21 is desirably a side wall which is formed by standing a flat surface 212 surrounding the opening of the air hole 213 and extends toward the mounting table 22. The side wall is closely contacted with the flat surface of the mounting table 22 to form a closed space. An O-ring 215 is first disposed on the end face of the sidewall.
(film Forming processing section)
Next, the film formation processing section 3 that performs the film formation step will be described. Fig. 11A and 11B are schematic views showing the structure of the film formation processing section 3. The film formation processing section 3 forms an electromagnetic wave shielding film 605 on each of the electronic components 60 on the component mounting board 68 by sputtering. As shown in fig. 11A and 11B, the film formation processing section 3 includes a chamber 31 and a sampling (load-lock) chamber 32. The chamber 31 is a cylindrical vacuum chamber having a diameter enlarged in a radial direction more than the axial direction. The chamber 31 is partitioned into a plurality of fan-shaped areas by a partition 33 extending in the radial direction. The processing position 311 and the film formation position 312 are allocated to a part of the fan-shaped region.
The partition 33 extends from the top surface toward the bottom surface of the chamber 31, but does not reach the bottom surface. A turntable 34 is provided in the bottom surface side space without the partition 33. The rotary table 34 has a disk shape coaxial with the chamber 31 and rotates in the circumferential direction. The component mounting plate 68 put into the chamber 31 from the sampling chamber 32 is mounted on the turntable 34, and surrounds the processing position 311 and the film forming position 312 while being swirled in a circular path.
In order to maintain the position of the component mounting board 68 with respect to the turntable 34, the turntable 34 is provided with a holding member for holding the component mounting board 68, such as a groove, a hole, a protrusion, a jig, a fixture, a mechanical chuck, or an adhesive chuck.
The surface treatment section 35 is provided at the treatment position 311. The surface treatment section 35 is supplied with a process gas such as argon gas, and generates electrons, ions, radicals, and the like by plasmatizing the process gas by applying a high-frequency voltage. For example, the surface treatment unit 35 is a cylindrical electrode opened on the turntable 34 side, and a Radio Frequency (RF) power source applies a high-Frequency voltage.
A target 361 constituting the sputtering source 36 is provided at the film formation position 312, and a sputtering gas, which is an inert gas such as argon, is introduced. The sputtering source 36 applies electric power to the target 361 to plasmatize the sputtering gas, and causes generated ions and the like to collide with the target, thereby striking particles. The target 361 includes a material of the electromagnetic wave shielding film 605. That is, the particles of the electromagnetic wave shielding film 605 are ejected from the target 361, and the ejected particles of the electromagnetic wave shielding film 605 are deposited on the electronic component 60 on the turntable 34.
For example, the film formation positions 312 are provided at two positions. The target materials of the respective film formation sites 312 may be the same material, or may be different materials to form the laminated electromagnetic wave shielding film 605. As a power source for applying power to the sputtering source 36 at each film formation position 312, for example, a well-known power source such as a Direct Current (DC) power source, a DC pulse power source, or an RF power source can be used. The power source for applying power to the sputtering sources 36 may be provided for each sputtering source 36, or a common power source may be switched by a switch.
In the film formation processing section 3, the electromagnetic wave shielding film 605 is formed on the electronic component 60 by etching the electronic component 60 at the processing position 311, cleaning and roughening the surface by ashing to improve the adhesion of the electromagnetic wave shielding film 605 to the electronic component 60, and depositing particles of the target 361 on the electronic component 60 at the film formation position 312. The electrode 602 is embedded in the protective sheet 61, and the electrode exposed surface 601 is closely adhered to the protective sheet 61, so that particles of the electromagnetic wave shielding film 605 are prevented from adhering to the electrode 602, and particles of the electromagnetic wave shielding film 605 are prevented from entering between the electrode exposed surface 601 and the protective sheet 61. Further, heat of the electronic component 60 is conducted to the cooling plate 63, and excessive heat accumulation of the electronic component 60 is suppressed.
The film formation processing unit 3 is a unit that forms a film on the electronic component 60 by sputtering, but the film formation method is not limited thereto. For example, the film formation processing unit 3 may form the electromagnetic wave shielding film 605 on the electronic component 60 by vapor deposition, spray coating, or the like.
(plate releasing section)
Next, the plate releasing unit 4 that performs the plate releasing step will be described. Fig. 12 is a schematic diagram showing the structure of the plate canceling portion 4. After the electromagnetic wave shielding film 605 is formed, the component mounting board 68 is put into the board release portion 4. As an initial step for obtaining each electronic component 60, the board release section 4 peels off the component embedded piece 67 from the cooling board 63.
As shown in fig. 12, the plate releasing portion 4 includes a top 41 and a mounting table 42. The top 41 is disposed opposite to the mounting table 42. The position of the stage 42 is not moved. On the other hand, the top 41 is liftable and lowerable with respect to the mounting table 42. The top 41 is at least close to the distance from the mounting table 42 to the thickness H1 of the frame 62 of the component mounting board 68.
The top 41 is a block having an inner space 411, and has a flat surface 412 on a surface facing the mounting table 42. The mounting table 42 has a cup shape with a bottom, and the opening 421 is directed toward the top 41. The flat surface 412 of the top 41 has the same size and shape as the component mounting board 68 or is wider than the component mounting board 68. On the other hand, the opening 421 of the mounting table 42 has a containing area equal to or larger than the component arrangement area 615 and equal to or smaller than the middle frame area 614. The edge 422 of the mounting table 42 surrounding the opening 421 has a width equal to or greater than the width of the frame 62.
In the mounting table 42, the edge 422 supports the component mounting plate 68, and the opening 421 is closed by the component mounting plate 68. The cooling plate 63 side abuts on the edge 422. An air pressure supply hole 423 is formed in the bottom of the mounting table 42. The air pressure supply hole 423 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe, and the like, which are not shown. Therefore, positive pressure is generated in the air hole 632 of the component mounting board 68 placed by closing the opening 421.
Further, a push rod insertion hole 424 penetrating the mounting table 42 is formed in the edge 422 of the mounting table 42. The insertion position of the push rod insertion hole 424 coincides with the push rod insertion hole 631 of the cooling plate 63, and when the component mounting plate 68 is placed on one side, the push rod insertion hole 621 of the frame 62 is avoided and the push rod insertion hole is blocked by the frame 62. The push rod 43 is inserted into this push rod insertion hole 424. The push rod 43 is axially movable so that its tip protrudes to a position higher than the frame 62 of the component mounting board 68 placed on the mounting table 42.
The push rod 43 peels the component mounting board 68 from the cooling plate 63 against the adhesive force of the adhesive sheet 64, separates the component mounting board 68 from the cooling plate 63, and is provided in such a degree of rigidity, number, and positional relationship that the component mounting board 68 can be lifted up and supported in parallel. For example, if the outer shape of the frame 62 is rectangular, the frame 62 is arranged as a bar body corresponding to each corner of the frame 62. The push rod insertion holes 424 are also provided corresponding to the number and positional relationship of the push rods 43.
A pair of clamping blocks 44 are disposed on both sides of the mounting table 42. The clamping block 44 clamps only the cooling plate 63 in the component mounting plate 68 placed on the mounting table 42. That is, the pair of clamp blocks 44 are arranged at the same height as the cooling plate 63 mounted on the mounting table 42, and have the same thickness as the cooling plate 63. The clamp blocks 44 can be brought into contact with and separated from each other around the cooling plate 63. However, the clamp block 44 is stationary in the direction in which the top 41 and the mounting table 42 are aligned.
Then, a plurality of air holes 413 are formed in the flat surface 412 of the top 41 to open into the internal space 411. The air holes 413 have a range in which the size and shape are the same as those of the inner side of the frame 62 of the protective sheet 61, or at least the size and shape are the same as those of the component arrangement region 615. When the component mounting board 68 is placed on the mounting table 42, the penetration position of the air hole 413 is a position covered by the component arrangement region 615.
In the internal space 411 of the top 41, an air pressure supply hole 414 is formed in a portion different from the flat surface 412. The air pressure supply hole 414 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe, and the like, which are not shown. Accordingly, a negative pressure is generated in the air hole 413 through the air pressure supply hole 414 and the inner space 411.
Further, on the flat surface 412 of the top 41, along the frame 62 of the component mounting board 68 placed on the mounting table 42, an O-ring 415 surrounding the penetration range of the air hole 413 is provided.
Fig. 13 (a) to (e) show a flow of the operation of the plate canceling portion 4. Fig. 13 (a) to (e) are transition diagrams schematically showing the state of the plate canceling portion 4 in each step. First, as shown in fig. 13 (a), the top 41 is separated from the mounting table 42, and the push rod 43 is first buried in the push rod insertion hole 424 of the mounting table 42. Then, the component mounting board 68 is mounted on the mounting table 42. When the component mounting board 68 is mounted, the cooling plate 63 is first fixed by the clamp block 44.
Then, as shown in fig. 13 (b), the top 41 is lowered toward the mounting table 42, and the flat surface 412 of the top 41 is brought into contact with the frame 62 of the component mounting board 68. At this time, the height H1 from the surface of the component arrangement region 615 to the upper surface of the frame 62 is higher than the height H2 from the surface of the component arrangement region 615 to the top surface 603 of the electronic component 60. Therefore, when the frame 62 has been sandwiched, the top surface 603 of the electronic part 60 does not reach the flat surface 412 of the top 41. Therefore, at least the part arrangement region 615 is enclosed in the sealed space 45 formed by the top 41, the protection sheet 61, and the frame 62 and sealed by the O-ring 415.
When the component arrangement region 615 is sealed in the sealed space 45, as shown in fig. 13 (c), a negative pressure is generated in the top 41, and a positive pressure is generated in the mounting table 42. Thus, the force of sucking upward toward the flat surface 412 of the top 41 and the force of pushing upward away from the mounting table 42 in the direction toward the flat surface 412 of the top 41 act on the part arrangement region 615 inside the frame 62. By this upward suction force and upward pushing force, a force sufficient to peel off the part alignment area 615 from the cooling plate 63 acts in the part alignment area 615, and the part alignment area 615 peels off from the cooling plate 63.
At the point of time when the component arrangement region 615 is peeled off, the protective sheet 61 is flat without being strained, so that the momentum of the component arrangement region 615 toward the flat surface 412 of the top 41 is small, and the situation that the electronic component 60 peels off from the protective sheet 61 or the electronic component 60 flies out from the protective sheet 61 is prevented. In case that the component arrangement region 615 is peeled off abruptly, the flat surface 412 of the top 41 is also controlled, and the electronic component 60 is blocked by the flat surface 412, so that the concern that the electronic component 60 peels off from the protective sheet 61 or falls off from the protective sheet 61 is reduced.
In order to further improve the effect of reducing the concern of peeling or falling off of the electronic component 60 from the protective sheet 61, it is preferable that the interval between the top surface 603 and the flat surface 412 of the electronic component 60 is extremely small in a state before the protective sheet 61 is peeled off from the cooling plate 63. Therefore, the distance between the top surface 603 and the flat surface 412 of the electronic component 60 is preferably set to be the minimum necessary distance for peeling the protective sheet 61 from the cooling plate 63. The space in the opening 421 of the mounting table 42 may be divided into a plurality of spaces or the like so that the air hole 632 in which the positive pressure acts gradually increases with respect to the plurality of air holes 632 of the cooling plate 63, for example, so that the air hole 632 in which the positive pressure acts increases from one end portion to the other end portion of the cooling plate 63, and a plurality of systems for generating the positive pressure may be provided. By this arrangement, the component arrangement region 615 can be prevented from peeling off from the cooling plate 63 at a time, and the electronic component 60 can be prevented from being abruptly protruded toward the flat surface 412 of the top 41.
When the component arrangement region 615 peels off, the electronic component 60 contacts the flat surface 412 of the top 41, and only the middle frame region 614 of the protective sheet 61 is deflected, so that at least the component arrangement region 615 is maintained flat. In other words, if the flat surface 412 of the top 41 is not present, the protection sheet 61 is bent so as to contain air therein. Then, there is a concern that the electronic component 60 peels off from the protective sheet 61, but the component arrangement region 615 remains flat, so peeling of the electronic component 60 is suppressed.
When the component arrangement region 615 is peeled off from the cooling plate 63, as shown in fig. 13 (d), the push rod 43 is brought into contact with the frame 62 through the push rod insertion hole 424 of the mounting table 42, the push rod insertion hole 631 of the cooling plate 63, and the push rod insertion hole 631 of the adhesive sheet 64. The push rod 43 is further advanced, and the top 41 is moved away from the mounting table 42 at a speed equal to the push rod 43. Since the cooling plate 63 is held by the holding block 44 and is fixed in position, the outer frame region 613 to which the frame 62 is attached is peeled off from the cooling plate 63, and the entire protective sheet 61 is peeled off from the cooling plate 63. At this time, the positive pressure of the stage 42 and the negative pressure of the top 41 are maintained. Therefore, the part arrangement region 615 hangs down toward the cooling plate 63 due to its own weight, and the reattachment is suppressed.
Finally, as shown in fig. 13 (e), the push rod 43 is stopped, and the top 41 is moved so as to be further separated from the mounting table 42, whereby the clamping of the component embedded piece 67 is released, and the peeling of the protective piece 61 from the cooling plate 63 is completed. The positive pressure of the table 42 and the negative pressure of the top 41 may be released during this period.
That is, the top 41 becomes a fixed portion of the frame 62 that is pushed out of position from the part arrangement region 615. The air pressure supply hole 423 of the mounting table 42 serves as a positive pressure generation hole, and serves as a pressurizing member for pressurizing the component arrangement region 615 through the air hole 632 of the cooling plate 63, and peeling the component arrangement region 615 from the cooling plate 63 earlier than the frame 62. The air holes 413 of the top 41 serve as negative pressure generating holes and as suction parts arranging areas 615, and assist the peeling from the cooling plate 63.
The flat surface 412 of the top 41 serves as a stopper for preventing the electronic component 60 from peeling off or coming off from the protective sheet 61 when the component arrangement region 615 has been peeled off, and further serves as a flattening member for flattening the protective sheet 61 and preventing the electronic component 60 from peeling off from the protective sheet 61. The push rod 43 serves as an upper top member for peeling the frame 62 from the cooling plate 63 after the part arranging area 615 has been peeled off.
In this way, after the film forming step, the plate releasing unit 4 removes the cooling plate 63. The plate releasing unit 4 includes a positive pressure generating hole, as an example, the air pressure supply hole 423 of the mounting table 42, and a fixing unit, as an example, the top 41. The positive pressure generating hole is provided in a range including the part arrangement region 615 so as to face the cooling plate 63, and generates positive pressure. The fixing portion presses the part of the protection sheet 61 separated from the part arrangement region 615 during the period in which the positive pressure generating hole presses the part arrangement region 615, for example, the frame 62, and releases the pressing after the part arrangement region 615 has been separated from the cooling plate 63.
Accordingly, the protection sheet 61 is maintained flat when the component arrangement region 615 is peeled off, and thus, a situation in which the component arrangement region 615 jumps up due to a reaction in which the protection sheet 61 returns to flat is avoided. Therefore, the electronic component 60 is prevented from peeling off and coming off from the protective sheet 61.
The plate releasing portion 4 has a flat surface 412 of the top portion 41 separated from the protective sheet 61 on the top portion 41 side, that is, on the opposite side of the protective sheet 61 from the cooling plate 63. The flat surface 412 presses the bulge of the component arrangement area 615 first during the period in which the component arrangement area 615 is pressurized. Thus, the component arrangement region 615 is flat, and peeling of the electronic component 60 can be prevented. In addition, the flat surface 412 also blocks the electronic component 60 in case the component arrangement region 615 jumps up, so that the electronic component 60 can be further suppressed from peeling off and coming off from the protective sheet 61.
The plate releasing portion 4 has a negative pressure generating hole for generating a negative pressure so as to face the protective sheet 61. As an example, an air hole 413 for generating negative pressure is provided in the flat surface 412 of the top 41. The air hole 413 attracts the protection sheet 61 as the part arrangement region 615 is pressurized by the air hole 632. Therefore, the protection sheet 61 can be peeled off from the cooling plate 63 with assistance of the pressing of the part arrangement region 615, and peeling failure is less likely to occur.
The plate release portion 4 includes a push rod 43. After the component arrangement area 615 has been separated from the cooling plate 63, the push rod 43 advances in the cooling plate 63, and pushes up the pressed portion of the frame 62 or the like in a direction away from the cooling plate 63. Thus, after the component arrangement region 615 has been peeled off, the protective sheet 61 can be peeled off as a whole. In addition, the fixing portion, which is an example of the top 41, may be separated from the protection sheet 61 as the push rod 43 advances when the pressing is released.
The mechanism of operation of the top 41, the mechanism of operation of the clamp block 44, and the mechanism of operation of the push rod 43 may be any known mechanism, and the present invention is not limited by the mechanism.
For example, a ball screw for extending the shaft in a direction from the top 41 toward the mounting table 42 and a rail guide for extending the shaft in a direction from the top 41 toward the mounting table 42 are connected to the top 41. In this case, the top 41 moves along the guide rail toward the mounting table 42 in accordance with the rotation direction of the screw shaft. The ball screw and the guide rail are extended so that the top 41 approaches the mounting table 42 to the thickness H1 of the frame 62 of the component mounting board 68.
Further, on the outer side of the clamp blocks 44, the circumferential surfaces of the oval cams are brought into contact with the pair of clamp blocks 44 individually. The cam shaft is supported by a rotary motor and rotatable in a circumferential direction. When the rotation motor is driven, the cam rotates, and the bulging portion of the cam collides with the clamp block 44, so that the clamp block 44 is pushed away in the direction of the cooling plate 63, and the cooling plate 63 is clamped.
In addition, the rear end portion of the push rod 43 becomes a cam follower. The cam follower follows the circumferential surface of the oval cam. The cam shaft is supported by a rotary motor and rotatable in a circumferential direction. When the rotation motor is driven and the cam rotates, the cam follower lifts the cam bulge, and the push rod 43 is pushed upward.
The plate release unit 4 also releases the protective sheet 61 from the cooling plate 63 by generating positive pressure in the mounting table 42. The flat surface 412 of the top 41 has an additional function of making the peeled protective sheet 61 follow the flatness, and the air holes 413 opened in the flat surface 412 of the top 41 have an additional function of assisting the pressurization by the mounting table 42. Therefore, as shown in fig. 14, the top 41 may have a square tubular shape in which the opening edge is abutted against the frame 62, and the flat surface 412 may be omitted. As shown in fig. 15, the air holes 413 may be omitted from the flat surface 412 of the top 41.
(peeling treatment section)
Finally, the peeling processing section 5 responsible for the component peeling step will be described. Fig. 16 is a schematic diagram showing the structure of the peeling treatment section 5. The embedded part 67 from which the cooling plate 63 is removed via the plate removing unit 4 is put into the peeling unit 5, and as a final stage, the electronic parts 60 are peeled from the protective sheet 61. When separated from the film forming apparatus 7, the peeling processing unit 5 may be referred to as a peeling processing apparatus.
As shown in fig. 16, the peeling processing section 5 includes: a mounting table 51 for mounting the component embedded sheet 67; the chuck 52 holding the protective sheet 61 and continuously moving; a guide 53 for hanging the end of the protective sheet 61 to make the gripping head 52 hold the protective sheet 61; a sheet stopper 54 for manufacturing a peeling base point of the protective sheet; and a component stopper 55 for preventing the electronic component 60 from floating upward.
The mounting table 51 has a flat surface 511 on which the component embedded sheet 67 is mounted. The component embedded piece 67 faces the electronic component 60 to the flat surface 511, and the top surface 603 of the electronic component 60 is brought into contact with the mounting surface, and the protection piece 61 is placed facing upward. The flat surface 511 includes an anti-slip member having adhesion, and the blocking property of the electronic component 60 is improved. The outer peripheral region of the flat surface 511 is hollowed down by a depth corresponding to the height H1 from the surface of the component arrangement region 615 to the end face of the frame 62 minus the height H2 from the surface of the component arrangement region 615 to the top face 603 of the electronic component 60, so that the frame 62 is entered and the electronic component 60 is placed on the flat surface 511 while the protective sheet 61 is kept flat.
The mounting table 51 is a block having an inner space 512. A plurality of air holes 513 are formed in a region facing the component arrangement region 615 on the flat surface 511 of the mounting table 51. The air hole 513 communicates with the internal space 512 of the stage 51. In the internal space 512 of the mounting table 51, an air pressure supply hole 514 is formed in a portion different from the flat surface 511. The air pressure supply hole 514 is connected to an air pressure circuit 75 including a compressor, a negative pressure supply pipe, and the like, which are not shown. Accordingly, a negative pressure is generated in the air hole 513 through the air pressure supply hole 514 and the inner space 512. When the component embedded piece 67 has been placed, a guide insertion hole 515 that coincides with the guide insertion hole 621 of the frame 62 is provided in the edge portion of the mounting table 51.
The collet 52 is a pair of blocks with the gripping surfaces facing each other. A pair of blocks can be contacted and separated. The chuck 52 is supported by a moving device movable in the horizontal direction and the vertical direction, and continuously moves along the protection sheet 61 placed on the flat surface 511 of the mounting table 51 at an attack angle of 45 degrees with respect to the flat surface 511. That is, the chuck 52 moves longitudinally on the flat surface 511 of the mounting table 51 and is separated from the mounting table 51. The continuous movement means that the movement is desirably performed at a constant speed without stopping the movement. The collet 52 moves from the end of the protective sheet 61 where the opportunity for gripping has been created to the opposite end of this end. The longitudinal direction of movement of the collet 52 is from the end of the protective sheet 61 where the opportunity for gripping has been created to the opposite end of this end. For example, as shown in fig. 17, the direction is a direction from an end of the protection sheet 61 on the guide portion insertion hole 621 side of the frame 62 to an opposite end of the end.
The sheet stopper 54 is a roller having a cylindrical shape intersecting the long axis of one side of the protective sheet 61 and capable of rotating about the axis. The transverse direction is a direction perpendicular to the moving direction of the collet 52 (see fig. 17). The sheet stopper 54 may be formed of a metal such as stainless steel. In the case where the length of the transverse protection sheet 61 is about 200mm to 300mm, the diameter of the sheet stopper 54 may be set to 5mm to ten or more mm. In this embodiment, a stainless steel cylinder having a diameter of 6mm is used.
The sheet stopper 54 is held at a fixed height with respect to the flat surface 511 of the mounting table 51, and is vertically moved in a direction perpendicular to the long axis, under the holding chuck 52, on the protective sheet 61 mounted on the mounting table 51. The arrangement height of the sheet stopper 54 is identical to the height obtained by combining the electronic component 60 other than the electrode 602 and the protective sheet 61. That is, the sheet stopper 54 moves while pressing the non-adhesive surface 612 of the protective sheet 61. The degree of pressing is set to a degree that does not damage the electrode 602, or does not rub the electrode 602, or does not crush the electrode 602. The movement range of the sheet stopper 54 is set to the opposite end of the protection sheet 61 with the edge of the guide 53, that is, the edge of the guide insertion hole 621 of the frame 62 as a base point.
The component stopper 55 is a roller having a cylindrical shape intersecting the long axis of at least the entire component arrangement region 615 of the protection sheet 61 and capable of rotating about the axis. The part stopper 55 may be formed of a metal such as stainless steel. The diameter of the component stopper 55 may be determined in consideration of the diameter of the sheet stopper 54 and the size of the electronic component 60, but may be disposed closer to the sheet stopper 54 if the diameter is smaller than the diameter of the sheet stopper 54. In the present embodiment, a stainless steel cylinder having the same diameter as the sheet stopper 54 is used.
The component stopper 55 is disposed so as to be able to approach and separate from the sheet stopper 54. While the collet 52 and the sheet stopper 54 are longitudinally moved on the mounting table 51, the part stopper 55 is kept at a fixed distance from the sheet stopper 54 and follows the same. The fixed distance is less than the length of the electronic component 60 (the length of the component stopper 55 in the moving direction) attached to the protective sheet 61. When the collet 52 and the sheet stopper 54 are positioned at the end of the mounting table 51, the part stopper 55 is kept away from the sheet stopper 54 so as to be positioned on the opposite side with respect to the guide insertion hole 621.
The guide 53 is disposed at the same position as the axis of the guide insertion hole 621 of the frame 62. The guide 53 is disposed in the guide insertion hole 515, and its front end faces the guide insertion hole 621 of the frame 62. The guide 53 is movable in the axial direction, protrudes toward the end of the protection sheet 61, and pushes the end of the protection sheet 61 upward toward the collet 52, and advances in the guide insertion hole 621 of the frame 62 before the end of the protection sheet 61 reaches the collet 52. The guide 53 is lifted to peel off one side of the protective sheet 61. Therefore, the guide insertion hole 621 has a pin shape and is provided at a plurality of positions along one side of the protection sheet 61.
For example, as shown in fig. 17, the through-hole positions of the guide insertion holes 621 are equally spaced apart from each other with the center of one side of the frame 62 interposed therebetween. The guide 53 is provided corresponding to the guide insertion hole 621, and the guide 53 is formed in a circular rod shape. The clip 52 and the sheet stopper 54 are longitudinally moved in a direction orthogonal to one side of the frame 62, and the electronic component 60 is peeled from the protective sheet 61.
Fig. 18 (a) to (f) show the flow of the operation of the peeling processing section 5. Fig. 18 (a) to (f) are transition diagrams schematically showing the state of the peeling processing section 5 in each step. First, as shown in fig. 18 (a), the component embedded sheet 67 is placed on the placement table 51 in a state where the top surface 603 of the electronic component 60 is brought into contact with the flat surface 511. That is, a reversing device for reversing the component embedded piece 67 separated from the cooling plate 63 in the plate releasing section 4 up and down is provided between the plate releasing section 4 and the peeling processing section 5, and the component embedded piece 67 is placed on the stage 51 in a state of being reversed. Negative pressure is generated in the air hole 513 of the mounting table 51, and the electronic component 60 is sucked onto the flat surface 511. The sheet stopper 54 is moved to the edge of the guide insertion hole 621 of the frame 62, and the clip 52 is first positioned immediately above the guide insertion hole 621 of the frame 62. The part stopper 55 is first separated from the sheet stopper 54, and the part stopper 55 is first positioned further outside than the guide insertion hole 621 of the frame 62.
As shown in fig. 18 (b), the guide 53 is moved to the upper side in the axial direction. The guide 53 moves in the guide insertion hole 621 of the frame 62 and reaches the end of the protection sheet 61 attached to the frame 62. The guide 53 further advances to protrude the end of the protection sheet 61 in a direction away from the frame 62. Thereby, the end portion of the protective sheet 61 starts to peel off due to the guide portion 53. When the guide portion 53 moves further, the end portion of the protection sheet 61 is sandwiched between the guide portion 53 and the sheet stopper 54 and guided toward the collet 52. In addition, when the end of the protection sheet 61 is being guided by the guide portion 53, the collet 52 may also move toward the end of the protection sheet 61 to meet the end of the protection sheet 61.
As shown in fig. 18 (c), when the end of the protection piece 61 reaches the collet 52, the pair of blocks are closed, and the end of the protection piece 61 is held by the collet 52. When the clip 52 holds the end of the protective sheet 61, as shown in fig. 18 (d), the guide 53 is buried in the guide insertion hole 621 of the frame 62, and then the component stopper 55 is moved, so that the component stopper 55 and the sheet stopper 54 approach each other to a distance less than the length of the electronic component 60.
As shown in fig. 18 (e), the clip 52 and the sheet stopper 54 are moved along the protective sheet 61, and the clip 52 is lifted. Since the end of the protective sheet 61 is held by the collet 52 and the sheet stopper 54 moves on the protective sheet 61, the protective sheet 61 is lifted by the collet 52 with the sheet stopper 54 as a base point, and the electronic component 60 is peeled from the protective sheet 61 with the sheet stopper 54 as a base point. In the case where the peeled protective sheet 61 is peeled while being kept in a vertical state, for example, the horizontal movement and the vertical movement of the chuck 52 may be kept at the same speed component. If the speed components of the horizontal movement and the vertical movement are the same, the peeling can be continuously performed without stopping unless stopping even if the movement speed is changed, but the movement speeds of the horizontal movement and the vertical movement are preferably maintained at a fixed speed.
At this time, as shown in fig. 19, when the peeling of the electronic component 60 from the protective sheet 61 is performed, and only the end portion of the electronic component 60 is sandwiched between the sheet stopper 54 and the flat surface 511 of the mounting table 51, the electronic component 60 is lifted up so as to be lifted off the peeling start 60 a. However, the part stopper 55 follows the sheet stopper 54. The part stopper 55 presses the peeling start end 60a side to be floated. Accordingly, the electronic component 60 is prevented from floating up, and the gap 94 between the electrode 602 peeled off from the protective sheet 61 and the protective sheet 61 remains, so that the electronic component 60 is maintained on the flat surface 511 of the mounting table 51 without reattachment. Further, since the sheet stopper 54 is a roller capable of rotating about an axis, it rotates when the electronic component 60 is pressed, and friction with the electronic component 60 is suppressed.
The sheet stopper 54 moves while pressing the non-adhesive surface 612 of the protective sheet 61. Therefore, before the peeling of the electronic component 60 is started and only the end portion of the electronic component 60 during the peeling is sandwiched between the sheet stopper 54 and the flat surface 511 of the mounting table 51, the sheet stopper 54 is prevented from following the peeled protective sheet 61 of the electronic component 60. However, in order to exert the function of producing the peeling base point by the sheet stopper 54, the sheet stopper 54 does not have to move while pressing the non-adhesive surface 612 of the protective sheet 61. That is, the sheet stopper 54 may be moved at a position slightly apart from the protective sheet 61.
As shown in fig. 18 (f), when the clip 52 and the sheet stopper 54 completely longitudinally break the component arrangement region 615 of the protective sheet 61, all the electronic components 60 are peeled off from the protective sheet 61 and arranged on the flat surface 511 of the mounting table 51. By recovering the electronic component 60, the formation of the electromagnetic wave shielding film 605 in the film forming apparatus 7 is completed. The angle of attack at which the chuck 52 breaks the flat surface 511 of the mounting table 51 and is separated from the mounting table 51 is not limited to 45 degrees. The position of the chuck 52 may be fixed and the mounting table 51 may be continuously moved to peel off the protection sheet 61, or both the chuck 52 and the mounting table 51 may be movable. That is, the chuck 52 and the mounting table 51 may be moved relatively.
Fig. 20 is a photograph of the electrode 602 after the electronic component 60 is peeled from the protective sheet 61 by the peeling processing section 5. According to the peeling processing section 5, the flatness of the protective sheet 61 is always maintained by the sheet stopper 54, and once the protective sheet 61 is peeled, the protective sheet 61 is prevented from being returned to the electronic component 60 and reattached. The position of the electronic component 60 is fixed by the component stopper 55 and the air hole 513 of the mounting table 51, and the electronic component can be prevented from rising up as the protective sheet 61 is attached again. As a result, as shown in fig. 20, no residue of the protective sheet 61 is seen on the electrode 602 of the electronic component 60.
In this way, after the film formation by the film formation processing section 3, the peeling processing section 5 peels the electronic component 60 from the protective sheet 61. The peeling processing section 5 includes a mounting table 51, a chuck 52, and a fixing section for fixing the position of the electronic component 60. The mounting table 51 supports the electronic component 60 that has been attached to the protective sheet 61. The clip 52 holds the end of the protective sheet 61, moves relative to the mounting table 51, and continuously peels off toward the opposite end of the end. When the electronic component 60 is peeled from the protective sheet 61, the fixing portion fixes the position of the electronic component 60. This eliminates the problem that the electronic component 60 and the protective sheet 61 are attached again after being peeled off, and can suppress the generation of the residue 93 of the protective sheet 61 in the electronic component 60.
The fixing portion is, for example, a part stopper 55 or a flat surface 511 of the mounting table 51 through which the air hole 513 is formed. The component stopper 55 follows the sheet stopper 54 by keeping a distance less than the length of the electronic component 60, and presses the electronic component 60 upward. The mounting table 51 adsorbs the electronic component 60 and holds it up. However, the mounting table 51 may not use suction by the air holes 513 as long as it has a function as a fixing portion. For example, the mounting table 51 may be an adhesive chuck, an electrostatic chuck, or a mechanical chuck as long as the electronic component 60 can be fixed.
In addition, a guide portion 53 protruding toward the end of the protection sheet 61 is included. The collet 52 is located at the protruding destination of the guide portion 53 before the end of the protection piece 61 is gripped. The guide 53 faces the collet 52, and guides the end of the protection piece 61 toward the collet 52. This makes it possible to manufacture the collet 52 for gripping, and to reduce the possibility of peeling failure between the electronic component 60 and the protective sheet 61.
Further, the sheet stopper 54 is included, which moves along the protective sheet 61 together with the chuck 52, and which makes a base point of peeling. The sheet stopper 54 is located near the protruding destination of the guide 53, and is guided toward the chuck 52 while sandwiching the end of the protection sheet 61 peeled off by the guide 53 together with the guide 53. Thus, the clip 52 can more reliably hold the end of the protective sheet 61, and the possibility of peeling failure between the electronic component 60 and the protective sheet 61 can be reduced.
The sheet stopper 54 is described as a cylindrical body having an axis orthogonal to the moving direction of the sheet stopper 54, but may be a plate-like body or a block body as long as the sheet stopper can move while pressing the protection sheet 61. The component stopper 55 is also described as a cylindrical body having an axis orthogonal to the moving direction of the component stopper 55, but may be a plate-like body, a block, or a brush. In the case where the component stopper 55 is a cylindrical body, since it is a roller capable of rotating about an axis, it rotates when the electronic component 60 is pressed, and friction with the electronic component 60 is suppressed.
The mechanism of operation of the chuck 52, the mechanism of operation of the sheet stopper 54, the mechanism of operation of the part stopper 55, and the mechanism of operation of the guide 53 may be any known mechanism, and the present invention is not limited by the mechanism.
For example, the following mechanism of operation may be employed in the collet 52. That is, the two blocks are supported by the base, and the block on one side becomes stationary with respect to the base. The blocks on the other side become movable relative to the blocks on one side. The oval cam abuts the outside of the movable block. When the cam is rotated, the block hangs over a long diameter, and the movable block is pressed by the cam and approaches the stationary block. In addition, a compression spring is provided between the pair of blocks, and the compression spring biases the pair of blocks in a direction to expand the distance between the pair of blocks. When the cam is rotated, the block hangs over a short diameter range, and the movable block is separated from the stationary block by the force of the compression spring.
Further, for example, a ball screw extending at an angle of 45 degrees with respect to the flat surface 511 of the mounting table 51 and a guide rail are disposed, and the base of the collet 52 is fixed to the slide of the ball screw and holds the guide rail. When the screw shaft of the ball screw is rotated by the motor, the chuck 52 moves along the guide rail from one end to the other end of the mounting table 51.
Further, with respect to the part stopper 55, an extension spring is interposed between the bases of the support part stopper 55 and the sheet stopper 54 to urge the part stopper 55 and the sheet stopper 54 in a direction to approach each other, and an elliptical cam is disposed between the bases of the support part stopper 55 and the sheet stopper 54 to urge the part stopper 55 and the sheet stopper 54 in a direction to separate against the force of the extension spring in a state where the long diameter range of the cam is in contact with the base.
In addition, the rear end portion of the guide portion 53 becomes a cam follower. The cam follower follows the circumferential surface of the oval cam. The cam shaft is supported by a rotary motor and rotatable in a circumferential direction. When the rotation motor is driven and the cam rotates, the cam follower lifts the cam bulge, and the guide 53 is pushed up.
The insertion positions of the guide insertion holes 621 are equally spaced apart from each other with the center of one side of the frame 62 interposed therebetween. This makes it easy to peel off the entire edge of the protective sheet 61. The guide 53 is provided corresponding to the guide insertion hole 621, and the guide 53 is formed in a circular rod shape. The clip 52 and the sheet stopper 54 are vertically broken in a direction orthogonal to one side of the frame 62, and the electronic component 60 is peeled from the protective sheet 61. The peeling processing unit 5 is not limited to this, and various shapes of guide insertion holes and guides may be used, and various directions may be used for the peeling direction.
For example, as shown in fig. 21, a guide portion 53 having a long rectangular-rectangular cross section at the front end along one side of the frame 62 may be used. According to the guide 53, the protruding range of the protection sheet 61 is increased, so that the protection sheet 61 is easily rolled up, and the end of the protection sheet 61 is easily brought into the chuck 52. As shown in fig. 22, a cutout 622 including an arrangement region of the guide 53 may be formed in the frame 62 instead of the guide insertion hole 621. Further, as shown in fig. 23, the guide insertion hole 621 may be arranged at a corner of the frame 62, and the clip 52 and the sheet stopper 54 may be moved diagonally with the corner of the frame 62 as a peeling start point, and peeled along the diagonal line of the protective sheet 61.
(stripping treatment section of another embodiment)
The peeling processing section 5 according to another embodiment will be described with reference to fig. 24 to 27. The same components and the same functions as those of the above-described embodiment are denoted by the same reference numerals, and detailed description thereof is omitted, so that only the portions different from the above-described embodiment will be described.
Fig. 24 is a plan view of a peeling treatment section 5 according to another embodiment. As shown in fig. 24, the peeling processing section 5 of the present embodiment includes a base 80, a sheet supply table 81, a table 82, a mounting table 51, a chuck 52, a guide 53, and a discharge table 83, and peels the protective sheet 61 by moving the chuck 52 in the up-down direction and the mounting table 51 in the horizontal direction. The base 80 has a horizontal upper surface, and the members (81 to 83) are arranged in parallel in a region R on the base 80.
The sheet feeding table 81 is a rectangular plate-like body having a mounting surface on which the component embedded sheet 67 is mounted, and is configured to be capable of being held in vacuum. The part embedded piece 67 is a part embedded piece 67 provided with a cutout 622 in the frame 62 as shown in fig. 22.
The sheet feeding table 81 is rotatably constituted. Here, the sheet feeding table 81 is connected to a rotation mechanism 81a having a rotation axis 811a parallel to one side thereof, and rotates 180 ° around this rotation axis 811 a. That is, the front and back of the sheet feeding table 81 are symmetrically inverted with respect to the rotation axis 811 a.
The stage 82 is a plate-like body placed on the placement table 51, and is provided at a position facing the reversed sheet feeding table 81. The platform 82 is configured to slide in a direction parallel to the rotation axis 811 a. Here, the stage 82 is connected to the driving unit 821, and linearly moves along a pair of guides 822 provided parallel to the rotation axis 811a with the driving unit 821 as a driving source.
The stage 51 is placed on the stage 82 and held by a vacuum chuck. In this state, the stage 82 moves, and therefore the placement stage 51 is fixed in position on the stage 82. The mounting table 51 has the same configuration as the mounting table 51 of the above embodiment, but partially differs. Hereinafter, different configurations will be mainly described. That is, one end of the mounting table 51 is formed in a comb shape, and the comb-shaped portion is exposed from the stage 82 in a state where it has been mounted on the stage 82. Here, in the state shown in fig. 24, one end of the mounting table 51 is an end located on the opposite side to the side where the chuck 52 is located. The air pressure supply hole 514 is provided in a side surface of the mounting table 51 (see fig. 27).
The mounting table 51 is rotatably configured. Here, the mounting table 51 is rotatably and slidably connected to a rotation mechanism 83a having a rotation shaft 833a parallel to the rotation shaft 811 a. Specifically, a bearing is provided in the mounting table 51, and the rotation shaft 833a is inserted into the bearing. The stage 51 rotates 180 ° around the rotation axis 833a, and the front and back are symmetrically inverted with respect to the rotation axis 833 a. The stage 51 moves linearly along the rotation shaft 833a with the stage 82. That is, the rotation mechanism 83a has a driving portion for rotating the mounting table 51, but does not have a driving portion for linearly moving the mounting table 51, and the linear movement of the mounting table 51 is guided only by the rotation shaft 833 a.
The discharge table 83 is a plate-like body for discharging the electronic component peeled off from the protective sheet 61 of the component embedded sheet 67. A discharge tray 831 for collecting electronic components 60 peeled from the protective sheet 61 of the component embedded sheet 67 is placed on the discharge table 83, and the discharge table 83 is configured to be capable of vacuum sandwiching the discharge tray 831. The discharge table 83 is formed to be one turn larger than the discharge tray 831. A cylindrical member 83b is provided in an outer peripheral region of the discharge table 83, that is, a region between an outer edge of the discharge tray 831 and an outer edge of the discharge table 83. Here, the tubular members 83b are erected at four corners of the discharge table 83. The tubular member 83b has stretchability and sealability, and is configured to be depressurized through the inside of the tube. That is, through holes are provided at four corners of the discharge table 83, and a tubular member 83b is provided so that the through holes communicate with the inside of the cylinder. Specifically, this tubular member 83b is formed in a bellows shape (see fig. 27). The cylindrical member 83b is formed to be longer than the thickness of the discharge tray 831, and has a front end surface positioned higher than the upper surface of the discharge tray 831 in a state where the discharge tray 831 has been mounted on the discharge table 83.
The discharge table 83 is rotatably provided at a position facing the mounting table 51 on the stage 82. Here, the discharge table 83 is connected to the rotation mechanism 83a, rotates 180 ° around the rotation shaft 833a, and the front and back are symmetrically reversed with respect to the rotation shaft 833 a. The rotation mechanism 83a rotates the mounting table 51 and the discharge table 83, but is configured to be capable of rotating both individually by 180 °. The rotation mechanism 83a is guided so as to be capable of linearly moving the mounting table 51, but rotates only the discharge table 83. The rotation mechanism 83a for rotating the mounting table 51 and the discharge table 83 is not limited to a single rotation mechanism, and may be provided individually.
The sheet feeding stage 81 and the discharge stage 83 sandwich the guide 822 of the stage 82, and are arranged in a direction orthogonal to the moving direction of the stage 82. Here, a rectangular region in which the sheet supply table 81 and the discharge table 83 are arranged, that is, a rectangular region indicated by a broken line in fig. 24 is referred to as a region R. The supply of the embedded parts 67 from the sheet supply table 81 to the mounting table 51 and the discharge of the electronic parts 60 from the mounting table 51 to the discharge table 83 described later are performed in this region R.
An opening 80a is provided in the base 80. The opening 80a is provided at a position away from the region R in the movement region of the stage 82. Here, it is penetrated in the central portion of the base 80.
The chuck 52 is disposed above the opening 80a and is lifted up and down, i.e., vertically with respect to the base 80. That is, the chuck 52 is provided with a lifting mechanism 521.
Fig. 25 is an enlarged perspective view of a portion of the peeling treatment section 5 where the clip 52 grips the end portion of the protective sheet 61. The chuck 52 includes a pair of plate-like bodies (52 a, 52 b), and one end portion of the protective sheet 61 is sandwiched between the pair of plate-like bodies (52 a, 52 b). That is, the facing surfaces of the front end portions of the pair of plate-like bodies (52 a, 52 b) serve as the holding surfaces of the holding protection sheet 61. The front end portion of the plate-like body 52b located on the region R side is formed in a comb shape. The pair of plate-like bodies (52 a, 52 b) are arranged vertically with respect to the base 80, and the plate-like body 52a on one side is fixedly provided so as to maintain the state thereof, and the plate-like body 52b on the other side is rotated around a fulcrum like scissors, thereby coming into contact with and separating from the plate-like body 52a on one side.
The guide portion 53 is provided below the opening 80a, passes through the opening 80a, and moves forward and backward obliquely with respect to the base 80 so as to rise more toward the holding surface of the one-side plate-like body 52 a. The advance and retreat of the guide portion 53 is performed by a driving mechanism not shown. The guide portion 53 is a plate-like body having a comb-like front end portion, and the front end portion is disposed obliquely upward with respect to the base 80. The guide portion 53 forms a distal end portion so as to face the grip surface of the plate-like body 52a in parallel or in slight contact with the grip surface in a state where the distal end has reached the ascending end in the advancing and retreating direction of the tilt. The guide 53 is advanced obliquely upward through the opening 80a, and the convex portion forming the comb-shaped portion enters the concave portion of the comb-shaped portion provided at one end of the mounting table 51 and enters the concave portion of the comb-shaped portion of the plate-like body 52 b.
As shown in fig. 24, a rotation mechanism 84 having a rotation axis perpendicular to the base 80 is connected to the lifting mechanism 521. The rotation mechanism 84 is provided with a rotation arm 85 for discharging the protective sheet 61 peeled off by the chuck 52. A suction cup 85a is provided at the front end of the rotary arm 85. The rotary arm 85 is reciprocally rotated between a recovery position shown in the drawing and a suction position of the protection sheet 61 as a position horizontally rotated 180 ° from this position by the rotation mechanism 84. In this suction position, the suction cup 85a is held against the peeled protective sheet 61 of the electronic component 60. The plate-like body 86 is provided so as to be positioned in a fixed manner so as to face each other at a position facing the suction cup 85a located at the suction position.
The operation of the peeling processing section 5 having the above-described configuration will be described. First, the electronic component 60 is set up, the protection sheet 61 is set down, the component embedded sheet 67 is placed on the sheet feeding stage 81, and vacuum clamping is performed by the sheet feeding stage 81. In the region R, the placement table 51 is placed on the stage 82 such that one end of the comb shape is exposed from the stage 82.
In a state where vacuum gripping is performed as described above, the sheet feeding table 81 is rotated by the rotation mechanism 81 a. By this rotation, the sheet feeding stage 81 and the mounting stage 51 sandwich the component embedded sheet 67. At this time, the electronic component 60 is rotated and held so as not to be impacted. By this rotation and clamping, the cutout 622 of the frame 62 of the one end portion of the protection sheet 61, i.e., the part embedded in the sheet 67, is located above one end portion of the comb shape of the mounting table 51.
After the clamped part has been embedded in the sheet 67, the vacuum clamp of the sheet feeding stage 81 is released, and the sheet feeding stage 81 is rotated by the rotating mechanism 81a to return to the original state. In addition, negative pressure is generated in the air hole 513 of the mounting table 51, and the electronic component 60 with the component embedded piece 67 is adsorbed on the flat surface 511. This adsorption is preferably performed before the sheet feeding stage 81 is returned to its original state.
Then, the platform 82 on which the mounting table 51 is placed is linearly moved along the guide 822 toward the side where the opening 80a is provided by the driving portion 821, and the comb-shaped one end portion of the mounting table 51 is stopped at a position on the opening 80 a. At this time, as shown in fig. 25, the comb-shaped portion of the mounting table 51 faces the collet 52 up and down.
In this state, first, the collet 52 is lowered by the elevating mechanism. In addition, as in the above-described embodiment, the sheet stopper 54 is moved to the position immediately below the chuck 52, and the non-adhesive surface 612 of the protective sheet 61 is gently pressed immediately below the chuck 52 (the state shown in fig. 25).
Thereafter, the guide 53 is obliquely raised. In the raising of the guide portion 53, the component stopper 55 is retracted to a position not in contact with the guide portion 53, as in the above-described embodiment. The guide portion 53 advances obliquely upward through the opening 80a, whereby the comb-shaped convex portion of the front end portion of the guide portion 53 enters the concave portion of the comb-shaped portion of the mounting table 51 as shown in fig. 25. In addition, the cutout 622 of the frame 62 in which the component has been embedded in the sheet 67 is located above one end of the comb shape of the mounting table 51, whereby one end of the protection sheet 61 is located above one end of the comb shape of the mounting table 51. Therefore, the end portion of the protective sheet 61 is peeled off from the frame 62 by the front end portion of the guide portion 53 advancing obliquely upward, and the end portion of the protective sheet 61 is wound up with the sheet stopper 54 as a base point.
At this time, the tips of the pair of plate-like bodies (52 a, 52 b) of the collet 52 are opened, and one end of the rolled protection sheet 61 is gripped between the gripping surface of the plate-like body 52a and the tip of the guide portion 53. Thereafter, the other plate-like body 52b is closed. That is, since the convex portion of the comb-shaped portion provided at the front end portion of the plate-like body 52b corresponds to the concave portion of the comb-shaped portion provided at the front end portion of the guide portion 53, the convex portion enters the concave portion, and the one end portion of the protective sheet 61 is sandwiched between the front ends of the plate-like bodies 52a and 52b, thereby holding the protective sheet 61.
When the clip 52 holds the protective sheet 61, the guide 53 is inclined downward and retreats toward the lower side of the base 80. The component stopper 55 is moved from a position where contact with the guide 53 is avoided to a position where a distance from the sheet stopper 54 is fixed and the length of the electronic component 60 is not longer than.
Then, the protective sheet 61 is peeled off. That is, the collet 52 is lifted by the lifting mechanism 521 in a state where one end portion of the protection sheet 61 is held, and the platform 82 on which the mounting table 51 is placed moves toward the region R side along the guide 822. At this time, the collet 52 is lifted at the same speed as the movement of the stage 82 and at a fixed speed, without stopping the movement. The operation in this case is performed in the same manner as the operations shown in fig. 18 (d) to (f) and fig. 19.
When the separation of the protective sheet 61 is completed, the protective sheet 61 faces the plate-like body 86. As shown in fig. 26, the rotary arm 85 is rotated to the suction position by the rotation mechanism 84, the protective sheet 61 is sandwiched by the suction cup 85a at the tip of the rotary arm 85 and the plate-like body 86, and the protective sheet 61 is held by the suction cup 85 a. The surface of the plate-like body 86 facing the protective sheet 61 is provided with irregularities so that the adhesion surface 611 of the protective sheet 61 is not adhered to the plate-like body 86. When the protective sheet 61 is held by the suction cup 85a, the grip by the collet 52 is released.
After the protective sheet 61 is held, the rotary arm 85 is reversely rotated to return to the original position, that is, the recovery position. A recovery box, not shown, is provided below the recovery position, and the protection sheet 61 is released from the holding of the protection sheet 61 to drop the protection sheet 61 into the recovery box, thereby recovering the protection sheet 61.
After the peeling of the protective sheet 61 is completed, the electronic component 60 peeled from the protective sheet 61 is suctioned and held on the mounting table 51, and the frame 62 is supported on the mounting table 51. The placement table 51 is located in the region R by the movement of the stage 82. The discharge table 83 is rotated around a rotation shaft 833a by a rotation mechanism 83a in a state where the discharge tray 831 placed thereon has been vacuum-sandwiched, and is opposed to the placement table 51.
Here, since the tubular members 83b are erected at four corners of the discharge table 83, as shown in fig. 27, the tips of the tubular members 83b are in contact with the mounting table 51, the discharge table 83 faces the mounting table 51, and the discharge tray 831 faces the frame 62 and the electronic components 60. At this time, the portion where the frame 62 is placed is dug down on the mounting table 51, and as shown in the drawing, the upper surface of the frame 62 is at the same level as the upper surface (electrode exposed surface 601) of the electronic component 60.
In this state, the inside of the tubular member 83b is depressurized. When the inside of the bellows-shaped tubular member 83b is depressurized, the tubular member 83b contracts, and the discharge table 83 approaches the mounting table 51. Thus, the discharge tray 831 is in contact with the frame 62 and the electronic components 60 on the mounting table 51. That is, the frame 62 and the electronic component 60 are sandwiched between the discharge tray 831 and the mounting table 51, and the positions thereof are fixed.
Thereafter, the discharge table 83 is rotated by 180 ° around the rotation shaft 833a by the rotation mechanism 83a, and returns to the original position. At this time, the reduced pressure inside the tubular member 83b is maintained, and the mounting table 51 is vacuum-held by the tubular member 83 b. Accordingly, the rotation mechanism 83a rotates the mounting table 51 together with the rotation of the discharge table 83. In this rotation, the frame 62 and the electronic component 60 are sandwiched between the discharge tray 831 and the mounting table 51, so that the positional displacement of the electronic component 60 due to the rotation mechanism 83a can be suppressed.
After this rotation, the vacuum clamp of the stage 51 is released, and positive pressure is generated. This facilitates transfer of the electronic component 60 to the discharge tray 831. In addition, the surface of the discharge tray 831 has adhesiveness, and positional displacement of the electronic component 60 during transfer can be suppressed. Then, the decompression of the cylindrical member 83b is stopped. Thereafter, the mounting table 51 is rotated 180 ° by the rotation mechanism 83a, and returned to the table 82. At this time, the frame 62 is supported only by the mounting table 52, and therefore remains on the discharge tray 831 together with the electronic components 60. Then, the vacuum clamping of the discharge tray 831 by the discharge table 83 is released, and the discharge tray 831 in which the electronic component 60 and the frame 62 are placed is conveyed by a conveying mechanism not shown. This completes the one-time peeling operation. The empty discharge tray 831 is conveyed by a conveying mechanism, not shown, placed on the discharge table 83, and vacuum-clamped, and the component embedded sheet 67 is placed on the sheet supply table 81 by the conveying mechanism, not shown, so that the next peeling operation is started.
As described above, the peeling processing section 5 of the present embodiment has the front end portion of one side (the plate-like body 52 b) of the collet 52, the front end portion of the guide portion 53, and one end portion of the mounting table 51 in a comb shape, and the guide portion 53 is obliquely raised, and the front end portion thereof is passed through the concave portion of the comb-shaped portion of one end portion of the mounting table 51, so that the protection sheet 61 is peeled from the frame 62 and rolled up, and is sandwiched between the guide portion 53 and the other side (the plate-like body 52 a) of the collet 52. Further, from this state, one side of the collet 52 is closed. This makes it possible to more reliably hold the protective sheet 61 by the clip 52.
That is, in the shape of the guide portion 53 of the peeling processing section 5 of the embodiment, the upper position of the guide portion 53 is regulated so that the guide portion 53 does not interfere with the chuck 52. Therefore, the end of the protection sheet 61 that has been pushed up may be bent as a tip of the cover guide 53 due to the flexibility of the protection sheet 61. In this state, there is a concern that the holding by the protection sheet 61 of the collet 52 fails. In contrast, in the peeling processing section 5 of another embodiment in which one side of the guide section 53 and the chuck 52 and one end of the mounting table 52 are comb-shaped, the guide section 53 can be raised to a position closer to the chuck 52. Further, since the guide portion 53 is inclined upward, the guide portion 53 is inclined forward with respect to the other side of the chuck 52, and thus the guide portion 53 in the state in which the protective sheet 61 has been rolled up can press and sandwich the protective sheet 61 while bringing the protective sheet 61 close to the holding surface of the other side of the chuck 52. Further, since the clip 52 has a comb shape on one side, even if the clip 52 is closed on one side, the protective sheet 61 can be held through the comb-shaped portion of the guide 53 without being in contact with the guide 53.
Further, by providing the sheet supply table 81 and the discharge table 83, the loading of the embedded parts 67 and the unloading of the electronic parts 60 can be automated, and workability can be improved. In addition, in a subsequent step, the electronic part 60 is packaged on a substrate of a smart phone, for example. Therefore, in order to facilitate holding of the electronic component 60 by the packaging device in the subsequent step, it is preferable to convey the electronic component in the subsequent step in a state where the top surface 603 on which the electromagnetic wave shielding film 605 is formed is upward. The packaging device is required to have high positioning accuracy, and therefore, the electronic parts 60 on the discharge tray 831 are also required to have position accuracy. Therefore, it is desirable that the electronic component 60 is not shifted as much as possible from the position where the electronic component 60 is arranged on the component mounting-free piece 65.
Therefore, the discharge table 83 is provided with a cylindrical member 83b having stretchability and sealability so as not to cause positional displacement when the electronic component 60 is transferred onto the discharge tray 831. In addition, by imparting tackiness to the surface of the discharge tray 831, positional displacement at the time of transfer of the electronic parts 60 is suppressed, and positional displacement of the electronic parts 60 at the time of conveyance in a subsequent step is suppressed.
Further, the rotation arm 85 and the rotation mechanism 84 are provided separately from the cartridge 52, so that the driving section of the cartridge 52 can be made simple, compared with a configuration in which the cartridge 52 is moved to the installation place of the recovery box after the protective sheet 61 has been peeled off.
The peeling processing section 5 may be provided with a detection section for detecting a tensile force at the time of peeling the protective sheet 61 by the chuck 52, and when the tensile force becomes equal to or greater than a predetermined value, it may be determined that the electronic component 60 is not peeled off from the protective sheet 61 and the operation of the peeling processing section 5 is stopped. Thus, the yield can be improved.
(other embodiments)
The present invention is not limited to the above embodiment, and includes the following aspects. That is, as shown in fig. 28, the film forming apparatus 7 may further include a transfer unit 71 that performs a component mounting step. The transfer unit 71 performs a component mounting step, and transfers the electronic component 60 from the tray on which the electronic component 60 before the film formation process is mounted to the component non-mounted sheet 65. For example, the tray and the component non-mounted sheet 65 may be arranged adjacently, and the transfer unit 71 may be a robot that can move vertically and horizontally in a range including the tray and the component non-mounted sheet 65. The front end of the arm of the robot is provided with, for example, a vacuum chuck. The transfer unit 71 causes negative pressure to be generated on the tray to hold the electronic components 60, and causes the non-mounted parts 65 to release the negative pressure by vacuum breaking, an atmospheric opening, or the like, thereby arranging the electronic components 60 on the non-mounted parts 65.
The film forming apparatus 7 is provided with the embedded processing unit 1, the board mounting unit 2, the film forming processing unit 3, the board releasing unit 4, and the peeling processing unit 5, but the respective units may be configured as separate devices and may be systemized. That is, the embedded processing unit 1 may be an independent embedded processing device, the board mounting unit 2 may be an independent board mounting device, the film forming processing unit 3 may be an independent film forming processing device, the board releasing unit 4 may be an independent board releasing device, and the peeling processing unit 5 may be an independent component peeling device.
In the above embodiment, the height H1 from the surface of the component arrangement region 615 to the upper end surface of the frame 62 is set to be higher than the height H2 from the surface of the component arrangement region 615 to the top surface of the electronic component 60, but the present invention is not limited thereto, and the height H2 may be lower. In this case, the flat surfaces 112, 212, and 412 of the top 11, 21, and 41 may be formed as recesses recessed by an amount corresponding to the difference between the allowable height H1 and the height H2, so that the sealed spaces 14, 24a, and 45 may be formed.
In the peeling processing unit 5, the case where the electronic component 60 is peeled from the protective sheet 61 of the component embedded sheet 67 has been described as the case where the frame 62 is peeled from the protective sheet 61, but the present invention is not limited to this, and the electronic component 60 and the frame 62 may be peeled from the protective sheet 61 by separate steps. In short, the peeling processing section 5 and the component peeling apparatus may include at least a function of peeling the electronic component 60 from the protective sheet 61.
The frame 62 with the embedded parts 67 is supported by the mounting table 51, but the present invention is not limited thereto, and the frame 62 may be held by a holding member such as a vacuum chuck to the mounting table 51, and a releasing member such as a positive pressure supply member or a release pin may be provided to release the frame 62 from the mounting table 51.
While the embodiments and the modifications of the respective parts of the present invention have been described above, the embodiments and the modifications of the respective parts are presented as examples, and are not intended to limit the scope of the invention. The above-described novel embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the scope of the claims.

Claims (9)

1. A film forming apparatus for an electronic component having an electrode exposed surface adhered to an adhesive surface of a protective sheet, comprising:
a film forming processing unit for forming a film of a film forming material on the electronic component; and
a peeling processing unit configured to peel off the electronic component from the protective sheet after film formation by the film formation processing unit;
wherein the peeling processing section includes:
a mounting table for supporting the electronic component attached to the protective sheet;
a chuck for holding an end portion of the protective sheet, relatively moving with respect to the mounting table, and continuously peeling the protective sheet toward an opposite end of the end portion;
a fixing portion for fixing a position of the electronic component when the electronic component is peeled off from the protective sheet; and
a guide portion protruding toward an end of the protective sheet;
wherein the guide part is a plate-shaped body with a comb-shaped front end part,
the clamping head is positioned at the protruding destination of the guiding part before the end part of the protecting sheet is held,
the guide portion faces the clip, and guides an end portion of the protection sheet toward the clip.
2. A component peeling device for peeling an electronic component, which is formed by adhering an electrode exposed surface to an adhesive surface of a protective sheet and forming a film of a film-forming material, from the protective sheet, the component peeling device comprising:
A mounting table for supporting the electronic component attached to the protective sheet;
a chuck for holding an end portion of the protective sheet, relatively moving with respect to the mounting table, and continuously peeling the protective sheet toward an opposite end of the end portion;
a fixing portion for fixing a position of the electronic component when the electronic component is peeled off from the protective sheet; and
a guide portion protruding toward an end of the protective sheet;
wherein the guide part is a plate-shaped body with a comb-shaped front end part,
the clamping head is positioned at the protruding destination of the guiding part before the end part of the protecting sheet is held,
the guide portion faces the clip, and guides an end portion of the protection sheet toward the clip.
3. The part peeling apparatus according to claim 2, wherein,
the chuck comprises a pair of plate-shaped bodies, wherein the front end part of one plate-shaped body is comb-shaped,
the guide portion enters a recess of the comb-shaped portion of the one plate-like body at the raised position.
4. The part peeling apparatus according to claim 2, wherein,
one end of the carrying table is comb-shaped,
the guide portion enters into a recess of the comb-shaped portion of the one end portion at the raised position.
5. The part peeling apparatus according to any one of claims 2 to 4, wherein,
the guide portion is inclined upward toward the chuck.
6. The part peeling apparatus according to any one of claims 2 to 5, wherein,
in the electronic component, a frame is adhered to the adhesive surface of the protective sheet, and the electrode exposed surface is located in a region surrounded by the frame of the adhesive surface of the protective sheet;
the guide portion protrudes from a cutout provided in the frame.
7. The part peeling apparatus according to any one of claims 2 to 6, characterized by further comprising:
a discharge stage for discharging the electronic component peeled from the protective sheet; and
a rotation mechanism for rotating the discharge table and the placement table in a reverse manner,
wherein the rotation mechanism rotates a mounting table holding the electronic component peeled from the protective sheet and the discharge table facing the mounting table.
8. The part peeling apparatus according to claim 7, wherein,
a tubular member having stretchability and capable of being depressurized inside is erected on the discharge table,
When the discharge table faces the mounting table, the tubular member is brought into contact with the mounting table, the interior of the tubular member is depressurized to shrink the tubular member, and the discharge table approaches the mounting table.
9. The part peeling apparatus according to any one of claims 2 to 7, characterized by further comprising:
a sheet feeding table includes: a mounting surface on which the protective sheet to which the electronic component has been attached is mounted; and
a rotation mechanism for rotating the sheet feeding table in a reverse manner,
wherein the rotation mechanism rotates the sheet feeding table so that the mounting surface faces the mounting table.
CN202111090638.5A 2017-11-10 2018-11-09 Film forming apparatus and component peeling apparatus Active CN113774320B (en)

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CN202111090638.5A CN113774320B (en) 2017-11-10 2018-11-09 Film forming apparatus and component peeling apparatus
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CN112795878B (en) 2023-06-16

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