CN1137515C - 芯片卡模块 - Google Patents

芯片卡模块 Download PDF

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CN1137515C
CN1137515C CNB971813981A CN97181398A CN1137515C CN 1137515 C CN1137515 C CN 1137515C CN B971813981 A CNB971813981 A CN B971813981A CN 97181398 A CN97181398 A CN 97181398A CN 1137515 C CN1137515 C CN 1137515C
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chip
card module
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CN1244935A (zh
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D�����°�
D·豪德奥
S·埃默特
H·－G·门施
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Infineon Technologies AG
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Abstract

本发明涉及一个半导体芯片，其除了导线(4)和芯片载体(2)以外含有一个或者多个半导体芯片(3，3’)和可能情况下的一个加固框(5)。半导体芯片和/或加固框借助于一粘结材料(6)进行安装，该粘结材料中混合了作为距离保持的一定尺寸的颗粒(7)。该粘结材料(6)优选是一个弹性粘结材料，该颗粒(7)优选是由变形的材料构成。本发明的作用在于半导体芯片和/或加固框以确定的和平均的距离粘结在底座上。弹性的粘结材料和可变形的材料与芯片卡模块的形状相匹配并且如此避免了粘结的相对平面的损坏。

Description

芯片卡模块
技术领域
本发明涉及一个芯片卡模块，其中通过一特殊的粘结材料固定有一个或者多个半导体芯片和/或一个加固框。该粘结材料的特征在于其中加入有作为距离保持的具有确定尺寸的颗粒。
背景技术
在EP 0 688 051 A1中公开了一芯片卡模块，其中一个芯片粘结在其下的导线之上。在此所应用的粘结材料含有确定尺寸的颗粒并且是各向异性导电的，以此在一侧是芯片而另一侧是导线的成对的相对设立的接触面之间能够实现电接触。
在芯片卡模块中尤其重要的是含有在模块中的半导体芯片一方面以尽可能小的距离粘结在底座上以保证该模块的较小的器件高度，另一方面该粘结材料层在全部的粘结平面上必需是电绝缘的并且具有平均的厚度以避免芯片的变形，该变形能够导致对芯片的损坏。尤其有利的是，如果该粘结层与模块的一定形状相适应并且能够吸收它们，则可以避免该半导体芯片的负载。通过在底座上固定的半导体芯片的平均距离简化了连续处理步骤的过程例如线连接，并且提高了固定芯片卡的可靠性。
相应存在一个加固框，其首先结合一个弹性的载体层进行应用并且能够黏附在该载体层上或者黏附在导线系统上。在后一种情况下该加固框必需与导线系统进行电绝缘，否则通过该粘结层该芯片卡模块的器件高度会变得非常大。
目前已知的解决方案相对于上述的问题具有许多缺点。
发明内容
本发明的任务在于给出一个芯片卡模块，其中一个或者多个半导体芯片和/或一个加固框在上述的并且在全部的粘结平面上以基本上平均的距离在粘结材料层的尽可能小的厚度时粘结在一个底座上。对此该粘结材料层应该在一定的范围内吸收和补偿芯片卡模块的形状，以使该半导体芯片和加固框的损坏可能性被降低。
此任务是通过具有如下技术特征的芯片卡模块进行解决的，即：
芯片卡模块，其含有至少一个芯片载体、一个或者多个半导体芯片和多个导线，一个或者多个半导体芯片借助于一粘结材料进行固定，粘结材料中混合了作为距离保持的一定尺寸的颗粒，其特征在于，该粘结材料是不导电的，并且混合到粘结材料中的颗粒是由不导电的材料塑料或者玻璃组成。
芯片卡模块，其含有至少一个芯片载体、一个或者多个半导体芯片和多个导线，其特征在于，含有一个加固框，该加固框借助于一不导电的粘结材料固定在芯片载体上，并且在粘结材料中混合了由不导电材料塑料或者玻璃构成的并且作为距离保持的具有一定尺寸的颗粒。
优选的改进方式如下所示：
该粘结材料是一硅粘结材料。
该颗粒含有4到40μm之间的直径。
该颗粒是塑料的空心球。
该芯片载体是金属的连接框或者一弹性的载体层。
含有两个半导体芯片，其中在使用了混合有颗粒的粘结材料的情况下，一个半导体芯片黏附在另一个半导体芯片上。
含有一个加固框，其在使用了混合有颗粒的粘结材料的情况下黏附在一个导线系统中。
该加固框含有一个冲压毛边，并且颗粒的直径大于此冲压毛边的高度。
本发明还涉及一个芯片卡模块，其含有至少一个芯片载体、一个或者多个半导体芯片、导线和可能情况下的加固框。至少一个半导体芯片和/或该加固框是借助于不导电的粘结材料固定的，其中混合了作为距离保持的一定尺寸的不导电的颗粒。
加到粘结材料中的一定尺寸的颗粒构成了该粘结材料物质，其按照本发明可以没有掩膜地进行使用，直到被压成一个确定的层厚度，该厚度基本上相应于该颗粒的直径。有利的是所有的颗粒具有基本上相同的尺寸。当此颗粒平均分配到粘结材料中时，然后保证了在将半导体芯片或者加固框压到底座上时，其上可以进行黏附，在整个粘结平面上相对于底座保持一个平均的距离。
颗粒的基本上一致的尺寸并不是本发明的前提条件。另外也是有效的，即除了小尺寸的部分颗粒以外含有足够多的颗粒，其尺寸相应于在半导体芯片或者加固框和底座之间的所希望的距离，并且此颗粒平均分布在粘结材料中。
如上所述，该颗粒的尺寸相应保证了在要固定的器件和底座之间的所希望的距离。该颗粒有利的为球形，并且其直径相应于所希望的粘结层的厚度。因为在粘结材料中含有颗粒，不仅简化了以确定的高度以及与底座的平均的和小的距离对半导体芯片和加固框的固定，而且简化了粘结材料的配料。该配料能够没有粘结剂掩膜地实现，并且多余的粘结材料能够在半导体芯片或者加固框的一侧挤压出来，否则就会构成一个不均匀的粘结连接。
适合于制造芯片卡模块的颗粒尺寸位于4到40μm的范围，并且尤其是大约20μm的直径。
该颗粒能够是由硬的或者不变形的材料例如玻璃或者硬塑料构成。然而该颗粒优选的是由可变形的和尤其是可反向变形的材料可变形的塑料构成。
在塑料中的硬颗粒具有如下缺点，其不能够与芯片卡模块的形状相匹配，并且在这种情况下引起点形的压力负载，这能够损坏粘结的相对平面。在半导体芯片中此点形的压力负载能够引起芯片的裂纹或者甚至的折断，从而整个芯片卡模块损坏。通过使用可变形的填充材料，芯片卡模块的变形能够通过该颗粒进行吸收并且该点形的压力负载在相对平面上能够降低。
塑料材料适合于作为用于填充材料颗粒的可变形或者可反向变形的材料。尤其适合的是塑料材料的空心球，其在压力作用下能够变形。该颗粒的可变形性有利的是不是如此地大，即在将粘结的半导体芯片或者加固框压到底座上时出现颗粒的永久的变形并且该颗粒作为距离保持的功能不再能够满足。
为了补偿芯片卡模块的能够引起损坏的变形，另外有利的是应用了作为粘结材料的弹性的粘结材料。该弹性的粘结材料在此位置实现了芯片卡模块的变形并且这通过已知的方式进行补偿，并且如此在半导体芯片或者加固框上的负载被减少。
所谓的“低压力”粘结材料适合于作为弹性粘结材料，其在例如的热固之后保持弹性。例如能够是称为合成的橡胶或者尤其是硅粘结材料。
本发明尤其适合于应用在具有弹性载体层的芯片卡模块中，然而能够应用在具有一般由金属组成的静止的连接框的芯片卡模块中。另外本发明还能够将加固框固定在一个线路系统中并且提供了尤其的优点，当该加固框被冲压时和含有一个冲压毛边时，其以非常小的距离固定在线路系统中。
附图描述
本发明下面借助于附图进行详细的解释。
图1示意性和以截面图的形式示出了本发明的芯片卡模块，
图2示意性和以截面图的形式示出了另一个本发明的芯片卡模块，
图3示意性示出了具有加固框的本发明的芯片卡模块的俯视图，
图4示意性示出了沿图3的A-A线的部分横截面图。
具体实施方式
图1以横截面图的方式示出了本发明的芯片卡模块1，其中一个半导体芯片3位于一个载体2上，在此情况下是一个塑料载体层(所谓的Chip-On-Flex-Modul)。在该载体上另外含有一个线路4的系统，该半导体芯片3能够与该系统以一般的方式例如导线连接进行接触(未示出)。该半导体芯片3在载体2上的固定通过不导电的粘结材料6实现，其中混合了一定尺寸的按照本发明的不导电的颗粒7。该颗粒的作用一方面是在芯片和载体之间保持所希望的距离，并且另一方面在芯片整个的承载平面上保持恒定的距离。以此在芯片和载体之间的距离保持非常的小。以此通过在载体上的半导体芯片的确定的和准确的位置简化了在芯片和导线之间的导线接触的制造。
图2示出了所谓的芯片在芯片上的模式，其下部分基本上相应于图1示出的模块。在第一个芯片3上固定了另一个芯片3′。此第二个芯片3′借助于确定尺寸的颗粒7填充的粘结材料6进行固定。在所示出的情况下，在两种粘结材料层中的颗粒是同样大的。然而对于不同的粘结材料平面可以选择不同的粘结材料以及具有不同大小的颗粒的粘结材料。为了避免通过芯片卡模块的变形所产生的对芯片的损坏，优选的选择结合有可变形的颗粒，例如塑料空心球的弹性粘结材料作为粘结材料。
在图3中示出了具有半导体芯片3的芯片卡模块，其例如以上述的方式固定在弹性的载体带2上。在芯片的两侧延伸的导线4与该芯片相接触(未示出)。在所示出的模块中在两侧在载体带的上和下部分(固定和接触侧)含有金属化层和导线。这种模块为了稳定一般含有一个加固框，其在图3中以5进行标出。整个框一般由导电的材料并且尤其是由金属构成。其一般地通过冲压制造并且在一侧上经常含有一个冲压毛边(未示出)。另外避免在加固框5和相邻的导线4之间的短接，两者之间的距离必需大于冲压毛边的高度。另外对于芯片卡模块的允许的整个器件高度没有被超出。一精确保持的最小的粘结材料厚度在此是必需的。
按照本发明通过粘结材料6达到了，作为距离保持混合了一定尺寸的颗粒7。图4示出了沿图3的线A-A的横截面的相应的安排。粘结材料6重新是优选的弹性粘结材料，颗粒7是优选可变形的颗粒。

Claims (9)

1.芯片卡模块(1)，其含有至少一个芯片载体(2)、一个或者多个半导体芯片(3，3′)和多个导线(4)，一个或者多个半导体芯片(3，3′)借助于一粘结材料(6)进行固定，粘结材料(6)中混合了作为距离保持的具有一定尺寸的颗粒(7)，其特征在于，该粘结材料(6)是不导电的，并且混合到粘结材料(6)中的颗粒(7)是由不导电的材料塑料或者玻璃组成。
2.芯片卡模块(1)，其含有至少一个芯片载体(2)、一个或者多个半导体芯片(3，3′)和多个导线(4)，其特征在于，含有一个加固框(5)，该加固框(5)借助于一不导电的粘结材料(6)固定在芯片载体上，并且在粘结材料(6)中混合了由不导电材料塑料或者玻璃构成的并且作为距离保持的具有一定尺寸的颗粒(7)。
3.如权利要求1或者2的芯片卡模块，其特征在于，该粘结材料(6)是一硅粘结材料。
4.如权利要求1或者2的芯片卡模块，其特征在于，该颗粒(7)含有4到40μm之间的直径。
5.如权利要求1或者2的芯片卡模块，其特征在于，该颗粒(7)是塑料的空心球。
6.如权利要求1或者2的芯片卡模块，其特征在于，该芯片载体(2)是金属的连接框或者一弹性的载体层。
7.如权利要求1或者2的芯片卡模块，其特征在于，含有两个半导体芯片(3，3′)，其中在使用了混合有颗粒(7)的粘结材料(6)的情况下，一个半导体芯片黏附在另一个半导体芯片上。
8.如权利要求1的芯片卡模块，其特征在于，含有一个加固框(5)，其在使用了混合有颗粒(7)的粘结材料(6)的情况下黏附在一个多个导线(4)上，该多个导线(4)含有用于半导体芯片的外部电接触的多个导线。
9.如权利要求8的芯片卡模块，其特征在于，该加固框(5)含有一个冲压毛边，并且颗粒(7)的直径大于此冲压毛边的高度。
CNB971813981A 1997-01-15 1997-11-18 芯片卡模块 Expired - Fee Related CN1137515C (zh)

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