CN113745145B - Chip transfer system and chip transfer method - Google Patents
Chip transfer system and chip transfer method Download PDFInfo
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- CN113745145B CN113745145B CN202010663143.6A CN202010663143A CN113745145B CN 113745145 B CN113745145 B CN 113745145B CN 202010663143 A CN202010663143 A CN 202010663143A CN 113745145 B CN113745145 B CN 113745145B
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 14
- 238000003466 welding Methods 0.000 claims 6
- 238000010586 diagram Methods 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 10
- 239000012790 adhesive layer Substances 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a chip transfer system and a chip transfer method. The chip transfer system comprises a first chip bearing device, a second chip bearing device and a double-head thimble device. The first chip bearing device comprises a first soft bearing body for bearing a plurality of first chips. The second chip bearing device comprises a second soft bearing body for bearing a plurality of second chips. The double-end thimble device is arranged between the first chip bearing device and the second chip bearing device. The double-end thimble device comprises a double-end thimble capable of being movably arranged between the first chip bearing device and the second chip bearing device. The double-end ejector pin comprises a first ejector pin part for pushing the first chip and a second ejector pin part for pushing the second chip. The first chips and the second chips can be alternately transferred to the first chip bearing structure and the second chip bearing structure.
Description
Technical Field
The present invention relates to a chip transfer system and a chip transfer method, and more particularly, to a light emitting diode chip transfer system and a light emitting diode chip transfer method.
Background
In the prior art, the led chip can be transferred from one carrier to another carrier through the pick-and-place action of the suction nozzle or the pushing action of the ejector pin.
Disclosure of Invention
The invention aims to solve the technical problem of providing a chip transfer system and a chip transfer method aiming at the defects of the prior art.
In order to solve the above technical problems, one of the technical solutions adopted in the present invention is to provide a chip transfer system, which includes: a first chip carrying device, a second chip carrying device and a double-head thimble device. The first chip bearing device comprises a first soft bearing body for bearing a plurality of first chips. The second chip bearing device comprises a second soft bearing body for bearing a plurality of second chips. The double-end thimble device is arranged between the first chip bearing device and the second chip bearing device and comprises a pushing structure for contacting the first soft bearing body and the second soft bearing body and a double-end thimble capable of being movably arranged in the pushing structure. The pushing structure comprises a first pushing part which is contacted with the first soft carrier and a second pushing part which is contacted with the second soft carrier, and the double-end thimble comprises a first thimble part which can be movably exposed outside the first pushing part and a second thimble part which can be movably exposed outside the second pushing part; the first chips are sequentially pushed by the first ejector pin parts of the double-headed ejector pins to move from the first soft carrier to a first chip bearing structure; the second chips are sequentially pushed by the second ejector pin parts of the double-headed ejector pins to move from the second soft carrier to a second chip bearing structure.
In order to solve the above technical problems, another technical solution adopted in the present invention is to provide a chip transferring method, which includes: a first soft carrier through a first chip carrying device for carrying a plurality of first chips; a second soft carrier through a second chip carrying device for carrying a plurality of second chips; executing the step (A): a first thimble part of a double-head thimble device is used for moving a first chip from a first soft bearing body to a first chip bearing structure; executing the step (B): a second thimble part of the double-head thimble device is used for moving a second chip from the second soft bearing body to a second chip bearing structure; and repeatedly executing the step (A) and the step (B) so that the plurality of first chips and the plurality of second chips are alternately transferred onto the first chip carrying structure and the second chip carrying structure.
In order to solve the above-mentioned technical problem, another technical solution adopted by the present invention is to provide a chip transfer system, which includes: a first chip carrying device, a second chip carrying device and a double-head thimble device. The first chip bearing device comprises a first soft bearing body for bearing a plurality of first chips. The second chip bearing device comprises a second soft bearing body for bearing a plurality of second chips. The double-end thimble device is arranged between the first chip bearing device and the second chip bearing device and comprises a double-end thimble capable of being movably arranged between the first chip bearing device and the second chip bearing device. The double-end ejector pin comprises a first ejector pin part for pushing the first chip and a second ejector pin part for pushing the second chip.
The chip transfer system provided by the invention has the beneficial effects that the chip transfer system can be arranged between the first chip bearing device and the second chip bearing device through the technical scheme that the double-head thimble device comprises a double-head thimble movably arranged between the first chip bearing device and the second chip bearing device, and the double-head thimble comprises a first thimble part for pushing the first chip and a second thimble part for pushing the second chip, so that a plurality of first chips and a plurality of second chips can be alternately transferred to the first chip bearing structure and the second chip bearing structure.
The chip transfer method provided by the invention has the beneficial effects that the chip transfer method can be used for performing the following step (A): transferring a first chip from the first flexible carrier to a first chip carrying structure through a first ejector portion of a double-headed ejector pin device "," executing step (B): through a second thimble portion of the double-end thimble device, one of the second chips is moved from the second soft carrier to a second chip bearing structure, and the technical scheme of repeatedly executing the step (A) and the step (B) is adopted, so that a plurality of first chips and a plurality of second chips can be alternately moved to the first chip bearing structure and the second chip bearing structure.
For a further understanding of the nature and the technical aspects of the present invention, reference should be made to the following detailed description of the invention and to the accompanying drawings, which are provided for purposes of reference only and are not intended to limit the invention.
Drawings
Fig. 1 is a flowchart of a chip transferring method provided by the present invention.
Fig. 2 is a schematic diagram of a chip transferring system according to a first embodiment of the present invention for transferring a first chip from a first flexible carrier to a first chip carrier through a first ejector.
Fig. 3 is a schematic diagram of a chip transferring system according to a first embodiment of the present invention for transferring a second chip from a second flexible carrier to a second chip carrier through a second ejector.
Fig. 4 is a schematic diagram of a chip transferring system according to a first embodiment of the present invention for transferring another first chip from a first flexible carrier to a first chip carrier through a first ejector.
Fig. 5 is a schematic diagram of a chip transferring system according to a first embodiment of the present invention for transferring another second chip from a second flexible carrier to a second chip carrier through a second ejector.
Fig. 6 is a schematic diagram of a chip transferring system according to a second embodiment of the present invention for transferring a first chip from a first flexible carrier to a first chip carrier through a first ejector.
Fig. 7 is a schematic diagram of a chip transferring system according to a second embodiment of the present invention for transferring a second chip from a second flexible carrier to a second chip carrier through a second ejector.
Fig. 8 is a schematic diagram of a chip transferring system according to a second embodiment of the present invention for transferring another first chip from a first flexible carrier to a first chip carrier through a first ejector.
Fig. 9 is a schematic diagram of a chip transferring system according to a second embodiment of the present invention for transferring another second chip from a second flexible carrier to a second chip carrier through a second ejector.
Fig. 10 is a schematic diagram of a chip transferring system according to a third embodiment of the present invention for transferring a first chip from a first flexible carrier to a first chip carrier through a first ejector.
Fig. 11 is a schematic diagram of a chip transferring system according to a third embodiment of the present invention for transferring a second chip from a second flexible carrier to a second chip carrier through a second ejector.
Fig. 12 is a schematic diagram of a chip transferring system according to a third embodiment of the present invention for transferring another first chip from a first flexible carrier to a first chip carrier through a first ejector.
Fig. 13 is a schematic diagram of a chip transferring system according to a third embodiment of the present invention for transferring another second chip from a second flexible carrier to a second chip carrier through a second ejector.
Detailed Description
The following specific embodiments are provided to illustrate the embodiments of the present invention related to a chip transfer system and a chip transfer method, and those skilled in the art will be able to understand the advantages and effects of the present invention from the disclosure herein. The invention is capable of other and different embodiments and its several details are capable of modification and variation in various respects and all without departing from the spirit of the present invention. The drawings of the present invention are merely schematic illustrations, and are not intended to be drawn to actual dimensions. The following embodiments will further illustrate the related art content of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention. In addition, the term "or" as used herein shall include any one or combination of more of the associated listed items as the case may be.
Referring to fig. 1 to 11, the present invention provides a chip transfer system S, which includes: a first chip carrying device 1, a second chip carrying device 2 and a double-head thimble device 3. Furthermore, the first chip carrier 1 includes a first flexible carrier 11 for carrying a plurality of first chips C1, and the second chip carrier 2 includes a second flexible carrier 21 for carrying a plurality of second chips C2. In addition, the double-ended ejector 3 is disposed between the first chip carrier 1 and the second chip carrier 2, and the double-ended ejector 3 includes a double-ended ejector 32 movably disposed between the first chip carrier 1 and the second chip carrier 2. In addition, the dual-head ejector pin 32 includes a first ejector pin portion 321 for ejecting the first chip C1 and a second ejector pin portion 322 for ejecting the second chip C2.
First embodiment
Referring to fig. 1 to 5, a first embodiment of the present invention provides a chip transferring method, which includes: first, as shown in fig. 1 and fig. 2, a plurality of first chips C1 are carried by a first flexible carrier 11 of a first chip carrier 1, and a plurality of second chips C2 are carried by a second flexible carrier 21 of a second chip carrier 2 (step S100); next, with reference to fig. 1 and 2, step (a) is performed: a first ejector portion 321 of a double-headed ejector 32 of the double-headed ejector device 3 is used to move a first chip C1 from the first flexible carrier 11 onto a first chip carrier structure 4 (step S102); then, step (B) is performed in cooperation with fig. 1 and 3: a second ejector portion 322 of the double-headed ejector 32 of the double-headed ejector device 3 is used to move a second chip C2 from the second flexible carrier 21 onto a second chip carrying structure 5 (step S104); next, as shown in fig. 1, 4 and 5, the steps (a) and (B) are repeatedly performed, so that the plurality of first chips C1 and the plurality of second chips C2 are alternately transferred onto the first chip carrier structure 4 and the second chip carrier structure 5 (step S106).
For example, as shown in fig. 2 to 5, the first flexible carrier 11 may be a first blue film or any first chip carrier film with an adhesive layer, and the first movable carrier 12 may be a first blue film carrier for carrying the first blue film or any first movable carrier with carrying or clamping functions. In addition, the second flexible carrier 21 may be a second blue film or any second chip carrier film with an adhesive layer, and the second movable carrier 22 may be a second blue film carrier for carrying the second blue film or any second movable carrier with a carrying or clamping function. In addition, the first chip C1 may be a first light emitting diode chip, a first IC chip, or any kind of first electronic component, and the second chip C2 may be a second light emitting diode chip, a second IC chip, or any kind of second electronic component. It is noted that the first chip carrier structure 4 includes a first circuit substrate 41 having a plurality of first conductive contacts 4100 and a plurality of first conductive solder materials 42 (e.g., solder balls, solder paste, or any kind of solder material) disposed on the plurality of first conductive contacts 4100, respectively, and the second chip carrier structure 5 includes a second circuit substrate 51 having a plurality of second conductive contacts 5100 and a plurality of second conductive solder materials 52 (e.g., solder balls, solder paste, or any kind of solder material) disposed on the plurality of second conductive contacts 5100, respectively. However, the above examples are only one possible embodiment and are not intended to limit the present invention.
Referring to fig. 2 to 5, a first embodiment of the present invention provides a chip transfer system S, which includes: a first chip carrying device 1, a second chip carrying device 2 and a double-head thimble device 3. Furthermore, the first chip carrier 1 includes a first flexible carrier 11 for carrying a plurality of first chips C1, and the second chip carrier 2 includes a second flexible carrier 21 for carrying a plurality of second chips C2. In addition, the dual-head ejector 3 is disposed between the first chip carrier 1 and the second chip carrier 2, and the dual-head ejector 3 includes a pushing structure 31 directly or indirectly contacting the first flexible carrier 11 and the second flexible carrier 21, and a dual-head ejector 32 movably disposed in the pushing structure 31.
For example, as shown in fig. 2 to 5, the pushing structure 31 includes a first pushing portion 311 directly or indirectly contacting the first flexible carrier 11 and a second pushing portion 312 directly or indirectly contacting the second flexible carrier 21, and the dual-end ejector pin 32 includes a first ejector pin portion 321 movably exposed outside the first pushing portion 311 and a second ejector pin portion 322 movably exposed outside the second pushing portion 312. Further, the first pushing portion 311 includes a first thimble opening 3111 for exposing the first thimble portion 321, and the second pushing portion 312 includes a second thimble opening 3121 for exposing the second thimble portion 322. In addition, the double-ended ejector pin 32 can move up and down in the ejector structure 31, so that the first ejector pin portion 321 of the double-ended ejector pin 32 can selectively move to the inside of the first ejector portion 311 or the outside of the first ejector portion 311, and the second ejector pin portion 322 of the double-ended ejector pin 32 can selectively move to the inside of the second ejector portion 312 or the outside of the second ejector portion 312. Thus, when the first ejector 321 of the double-ended ejector 32 is moved to the outside of the first pushing portion 311, the first ejector 321 can pierce the first flexible carrier 11 to push the first chip C1. When the second ejector portion 322 of the dual-head ejector 32 is moved outside the second pushing portion 312, the second ejector portion 322 can pierce the second flexible carrier 21 to push the second chip C2. However, the above examples are only one possible embodiment and are not intended to limit the present invention.
For example, as shown in fig. 2 and fig. 4, the plurality of first chips C1 can be sequentially pushed by the first ejector 321 of the double-headed ejector 32 to be transferred from the first flexible carrier 11 to the first chip carrier 4, so that each first chip C1 can be placed on two corresponding first conductive bonding materials 42 of the first chip carrier 4. In addition, as shown in fig. 3 and 5, the plurality of second chips C2 can be sequentially pushed by the second ejector pin portions 322 of the double-headed ejector pins 32 to be transferred from the second flexible carrier 21 to a second chip carrier structure 5, so that each second chip C2 can be placed on two corresponding second conductive bonding materials 52 of the second chip carrier structure 5. It should be noted that, as shown in fig. 2 to 5, the first chip carrier 1 includes a first movable carrier 12 for carrying the first flexible carrier 11, and each first chip C1 can change the position of each first chip C1 relative to the first ejector 321 of the double-ended ejector 32 by moving the first movable carrier 12. In addition, the second chip carrier 2 includes a second movable carrier 22 for carrying the second flexible carrier 21, and each second chip C2 can change the position of each second chip C2 relative to the second ejector pin portion 322 of the double-headed ejector pin 32 by the movement of the second movable carrier 22. However, the above examples are only one possible embodiment and are not intended to limit the present invention.
Accordingly, as shown in fig. 1 to 5, the first ejector pin portion 321 and the second ejector pin portion 322 of the double-headed ejector pin 32 can alternately eject the first chip C1 (as shown in fig. 2 and 4) and the second chip C2 (as shown in fig. 3 and 5), so that the plurality of first chips C1 and the plurality of second chips C2 are alternately moved to the first chip carrying structure 4 (as shown in fig. 2 and 4) and the second chip carrying structure 5 (as shown in fig. 3 and 5).
Second embodiment
Referring to fig. 1 and fig. 6 to fig. 9, a second embodiment of the present invention provides a chip transferring system S and a chip transferring method, and the chip transferring system S includes a first chip carrier 1, a second chip carrier 2 and a dual-head ejector device 3. As can be seen from comparing fig. 6 to 9 with fig. 2 to 5, the second embodiment of the present invention is different from the first embodiment in that: in the second embodiment, the first chip carrier structure 4 includes a first carrier substrate 43 and a first chip adhesive layer 44 disposed on the first carrier substrate 43, and the second chip carrier structure 5 includes a second carrier substrate 53 and a second chip adhesive layer 54 disposed on the second carrier substrate 53.
For example, as shown in fig. 6 and 8, the plurality of first chips C1 can be sequentially pushed by the first ejector 321 of the double-headed ejector 32 to be transferred from the first flexible carrier 11 to a first chip carrier 4, so that each first chip C1 can be adhered to the first chip adhesive layer 44 of the first chip carrier 4. In addition, as shown in fig. 7 and fig. 9, the plurality of second chips C2 can be sequentially pushed by the second ejector portions 322 of the double-headed ejector pins 32 to be transferred from the second flexible carrier 21 to a second chip carrier structure 5, so that each second chip C2 can be adhered to the second chip adhesive layer 54 of the second chip carrier structure 5.
Accordingly, as shown in fig. 1 and fig. 6 to fig. 9, the first ejector pin portion 321 and the second ejector pin portion 322 of the double-headed ejector pin 32 can alternately push the first chip C1 (as shown in fig. 6 and fig. 8) and the second chip C2 (as shown in fig. 7 and fig. 9), so that the plurality of first chips C1 and the plurality of second chips C2 are alternately moved to the first chip carrying structure 4 (as shown in fig. 6 and fig. 8) and the second chip carrying structure 5 (as shown in fig. 7 and fig. 9).
Third embodiment
Referring to fig. 1 and fig. 10 to fig. 13, a third embodiment of the present invention provides a chip transferring system S and a chip transferring method, and the chip transferring system S includes a first chip carrier 1, a second chip carrier 2 and a dual-head ejector device 3. As can be seen from comparing fig. 10 to 13 with fig. 2 to 5, the difference between the third embodiment of the present invention and the first embodiment is that: in the third embodiment, the first pushing portion 311 includes a first ejector opening 3111 for exposing the first ejector portion 321 and a plurality of first air inlets 3112 surrounding the first ejector opening 3111, and the second pushing portion 312 includes a second ejector opening 3121 for exposing the second ejector portion 322 and a plurality of second air inlets 3122 surrounding the second ejector opening 3121.
For example, the first ejector pin opening 3111 can be larger, smaller or equal to the first air suction port 3112, and the first flexible carrier 11 is absorbed by the plurality of first air suction ports 3112 to improve the flatness of the first flexible carrier 11, so that the first ejector pin portion 321 of the dual-head ejector pin 32 can be aligned and push the first chip C1 more accurately, so that the first chip C1 can be transferred onto the first chip carrier structure 4 more accurately. In addition, the second ejector pin opening 3121 can be larger than, smaller than or equal to the second air suction openings 3122, and the second flexible carrier 21 is absorbed by the plurality of second air suction openings 3122 to improve the flatness of the second flexible carrier 21, so that the second ejector pin portion 322 of the dual-head ejector pin 32 can be more accurately aligned with and push the second chip C2, so that the second chip C2 can be more accurately transferred onto the second chip carrier structure 5.
Accordingly, as shown in fig. 1 and fig. 10 to fig. 13, the first ejector pin portion 321 and the second ejector pin portion 322 of the double-headed ejector pin 32 can alternately push the first chip C1 (as shown in fig. 10 and fig. 12) and the second chip C2 (as shown in fig. 11 and fig. 13), so that the plurality of first chips C1 and the plurality of second chips C2 are alternately moved to the first chip carrying structure 4 (as shown in fig. 10 and fig. 12) and the second chip carrying structure 5 (as shown in fig. 11 and fig. 13).
Advantageous effects of the embodiment
One of the advantages of the present invention is that the chip transfer system S provided by the present invention can be configured between the first chip carrier 1 and the second chip carrier 2 by the double-headed thimble device 3, the double-headed thimble device 3 includes a double-headed thimble 32 movably configured between the first chip carrier 1 and the second chip carrier 2, and the double-headed thimble 32 includes a first thimble portion 321 for pushing the first chip C1 and a second thimble portion 322 for pushing the second chip C2, so that the plurality of first chips C1 and the plurality of second chips C2 can be alternately transferred onto the first chip carrier 4 and the second chip carrier 5 (that is, the first thimble portion 321 and the second thimble portion 322 of the double-headed thimble 32 can alternately push the first chip C1 and the second chip C2, so that the plurality of first chips C1 and the plurality of second chips C2 can be alternately transferred onto the first chip carrier 4 and the second chip carrier 5).
The chip transfer method provided by the invention has the beneficial effects that the chip transfer method can be used for performing the following step (A): transferring a first chip C1 from the first flexible carrier 11 onto a first chip carrier structure 4 by a first ejector portion 321 of a double-headed ejector 32 of a double-headed ejector device 3 "," performing step (B): through a second ejector portion 322 of the double-headed ejector 32 of the double-headed ejector device 3, one of the second chips C2 is moved from the second flexible carrier 21 onto a second chip carrier 5, and the steps (a) and (B) are repeatedly performed, so that the plurality of first chips C1 and the plurality of second chips C2 can be alternately moved onto the first chip carrier 4 and the second chip carrier 5 (that is, the first ejector portion 321 and the second ejector portion 322 of the double-headed ejector 32 can alternately push the first chips C1 and the second chips C2, so that the plurality of first chips C1 and the plurality of second chips C2 are alternately moved onto the first chip carrier 4 and the second chip carrier 5).
The above disclosure is only of the preferred embodiments of the present invention and is not intended to limit the scope of the claims, so that all equivalent technical changes made by the specification and drawings of the present invention are included in the scope of the claims.
[ symbolic description ]
S: chip transfer system
1 first chip carrying device
11 first flexible carrier
12 first movable carrier
2 second chip carrying device
21 second flexible carrier
22 second movable carrier
3 double-end thimble device
31 pushing structure
311 first pushing part
3111 first thimble opening
3112 first suction port
312 second pushing portion
3121 a second thimble opening
3122 second suction port
32 double-end thimble
321 first thimble portion
322 a second thimble portion
4 first chip carrying structure
41 first circuit substrate
4100 first conductive contact
42 first conductive solder material
43 first carrier substrate
44 first die attach layer
5 second chip carrying structure
51 second circuit substrate
5100 second conductive contact
52 second conductive solder material
53 a second carrier substrate
54 second die attach layer
C1 first chip
C2, a second chip.
Claims (10)
1. A chip transfer system, the chip transfer system comprising:
the first chip bearing device comprises a first soft bearing body for bearing a plurality of first chips;
the second chip bearing device comprises a second soft bearing body for bearing a plurality of second chips; and
the double-end thimble device is arranged between the first chip bearing device and the second chip bearing device and comprises a pushing structure for contacting the first soft bearing body and the second soft bearing body and a double-end thimble capable of being movably arranged in the pushing structure;
the pushing structure comprises a first pushing part which is contacted with the first soft carrier and a second pushing part which is contacted with the second soft carrier, and the double-end thimble comprises a first thimble part which can be movably exposed outside the first pushing part and a second thimble part which can be movably exposed outside the second pushing part;
the first chips are sequentially pushed by the first thimble parts of the double-headed thimble to move from the first soft bearing body to a first chip bearing structure;
the second chips are sequentially pushed by the second ejector pin parts of the double-headed ejector pins so as to move from the second soft carrier to a second chip bearing structure.
2. The chip transfer system of claim 1, wherein the first chip carrier includes a first movable carrier for carrying the first flexible carrier, and each of the first chips changes a position of each of the first chips relative to the first ejector pin portion of the double-ended ejector pin by movement of the first movable carrier; the second chip bearing device comprises a second movable bearing body for bearing the second soft bearing body, and each second chip changes the position of each second chip relative to the second thimble part of the double-head thimble through the movement of the second movable bearing body; the first flexible carrier is a first blue film, and the first movable carrier is a first blue film carrier for carrying the first blue film; the second flexible carrier is a second blue film, and the second movable carrier is a second blue film carrier for carrying the second blue film; the first chip bearing structure comprises a first circuit substrate with a plurality of first conductive joints and a plurality of first conductive welding materials respectively arranged on the first conductive joints, and the second chip bearing structure comprises a second circuit substrate with a plurality of second conductive joints and a plurality of second conductive welding materials respectively arranged on the second conductive joints.
3. The chip transfer system of claim 1, wherein the first pushing portion includes a first ejector pin opening for exposing the first ejector pin portion and a plurality of first air inlets surrounding the first ejector pin opening, the first ejector pin opening is greater than, less than, or equal to the first air inlets, and the first flexible carrier is adsorbed by the plurality of first air inlets; the second pushing part comprises a second thimble opening for exposing the second thimble part and a plurality of second air suction openings surrounding the second thimble opening, the second thimble opening is larger than, smaller than or equal to the second air suction opening, and the second soft carrier is adsorbed by the plurality of second air suction openings; the first thimble part and the second thimble part of the double-headed thimble alternately push the first chip and the second chip, so that a plurality of the first chips and a plurality of the second chips are alternately moved to the first chip bearing structure and the second chip bearing structure; the first chip bearing structure comprises a first bearing substrate and a first chip adhesion layer arranged on the first bearing substrate, and the second chip bearing structure comprises a second bearing substrate and a second chip adhesion layer arranged on the second bearing substrate.
4. A chip transfer method, the chip transfer method comprising:
a first soft carrier through a first chip carrying device for carrying a plurality of first chips;
a second soft carrier through a second chip carrying device for carrying a plurality of second chips;
executing the step (A): a first thimble part of a double-head thimble device is used for moving one of the first chips from the first soft carrier to a first chip bearing structure;
executing the step (B): a second thimble part of the double-head thimble device is used for moving one of the second chips from the second soft bearing body to a second chip bearing structure; and
repeating the steps (a) and (B) such that a plurality of the first chips and a plurality of the second chips are alternately transferred onto the first chip carrying structure and the second chip carrying structure.
5. The chip transfer method of claim 4, wherein the dual-headed thimble device is disposed between the first chip carrier and the second chip carrier, the dual-headed thimble device comprises a pushing structure contacting the first flexible carrier and the second flexible carrier, and the dual-headed thimble device is movably disposed in the pushing structure; the pushing structure comprises a first pushing part and a second pushing part, wherein the first pushing part is in contact with the first soft carrier, the second pushing part is in contact with the second soft carrier, the first thimble part can be movably exposed out of the first pushing part, and the second thimble part can be movably exposed out of the second pushing part.
6. The chip transfer method of claim 5, wherein the first chip carrier includes a first movable carrier for carrying the first flexible carrier, and each of the first chips changes a position of each of the first chips relative to the first ejector pin portion of the double-headed ejector pin by movement of the first movable carrier; the second chip bearing device comprises a second movable bearing body for bearing the second soft bearing body, and each second chip changes the position of each second chip relative to the second thimble part of the double-head thimble through the movement of the second movable bearing body; the first flexible carrier is a first blue film, and the first movable carrier is a first blue film carrier for carrying the first blue film; the second flexible carrier is a second blue film, and the second movable carrier is a second blue film carrier for carrying the second blue film; the first chip bearing structure comprises a first circuit substrate with a plurality of first conductive joints and a plurality of first conductive welding materials respectively arranged on the first conductive joints, and the second chip bearing structure comprises a second circuit substrate with a plurality of second conductive joints and a plurality of second conductive welding materials respectively arranged on the second conductive joints.
7. The chip transfer method according to claim 5, wherein the first pushing portion includes a first ejector pin opening for exposing the first ejector pin portion and a plurality of first air inlets surrounding the first ejector pin opening, the first ejector pin opening is larger than, smaller than or equal to the first air inlets, and the first flexible carrier is adsorbed by the plurality of first air inlets; the second pushing part comprises a second thimble opening for exposing the second thimble part and a plurality of second air suction openings surrounding the second thimble opening, the second thimble opening is larger than, smaller than or equal to the second air suction opening, and the second soft carrier is adsorbed by the plurality of second air suction openings; the first thimble part and the second thimble part of the double-headed thimble alternately push the first chip and the second chip, so that a plurality of the first chips and a plurality of the second chips are alternately moved to the first chip bearing structure and the second chip bearing structure; the first chip bearing structure comprises a first bearing substrate and a first chip adhesion layer arranged on the first bearing substrate, and the second chip bearing structure comprises a second bearing substrate and a second chip adhesion layer arranged on the second bearing substrate.
8. A chip transfer system, the chip transfer system comprising:
the first chip bearing device comprises a first soft bearing body for bearing a plurality of first chips;
the second chip bearing device comprises a second soft bearing body for bearing a plurality of second chips; and
the double-end thimble device is arranged between the first chip bearing device and the second chip bearing device and comprises a double-end thimble capable of being movably arranged between the first chip bearing device and the second chip bearing device;
the double-end ejector pin comprises a first ejector pin part for pushing the first chip and a second ejector pin part for pushing the second chip.
9. The chip transfer system of claim 8, wherein the first chip carrier includes a first movable carrier for carrying the first flexible carrier, and each of the first chips changes a position of each of the first chips relative to the first ejector pin portion of the double-ended ejector pin by movement of the first movable carrier; the second chip bearing device comprises a second movable bearing body for bearing the second soft bearing body, and each second chip changes the position of each second chip relative to the second thimble part of the double-head thimble through the movement of the second movable bearing body; the first flexible carrier is a first blue film, and the first movable carrier is a first blue film carrier for carrying the first blue film; the second flexible carrier is a second blue film, and the second movable carrier is a second blue film carrier for carrying the second blue film; the first chip bearing structure comprises a first circuit substrate with a plurality of first conductive joints and a plurality of first conductive welding materials respectively arranged on the first conductive joints, and the second chip bearing structure comprises a second circuit substrate with a plurality of second conductive joints and a plurality of second conductive welding materials respectively arranged on the second conductive joints.
10. The chip transfer system of claim 8, wherein the first and second ejector pin portions of the double-ended ejector pin alternately eject the first and second chips such that a plurality of the first and second chips are alternately transferred onto the first and second chip carrying structures; the first chip bearing structure comprises a first bearing substrate and a first chip adhesion layer arranged on the first bearing substrate, and the second chip bearing structure comprises a second bearing substrate and a second chip adhesion layer arranged on the second bearing substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
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| TW109118185A TWI736296B (en) | 2020-05-29 | 2020-05-29 | Chip-transferring system and chip-transferring method |
| TW109118185 | 2020-05-29 |
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| CN113745145A CN113745145A (en) | 2021-12-03 |
| CN113745145B true CN113745145B (en) | 2023-07-21 |
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Also Published As
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| TWI736296B (en) | 2021-08-11 |
| TW202145403A (en) | 2021-12-01 |
| CN113745145A (en) | 2021-12-03 |
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