CN110948428A

CN110948428A - EMMC chip burning clamp and burning method thereof

Info

Publication number: CN110948428A
Application number: CN201911422350.6A
Authority: CN
Inventors: 黄德波; 郭旭; 胡旻韬; 付聪; 蔡宏; 田学林
Original assignee: Wuhu Hongjing Electronics Co Ltd
Current assignee: Wuhu Hongjing Electronics Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-04-03
Anticipated expiration: 2039-12-31
Also published as: CN110948428B

Abstract

The invention relates to an EMMC chip burning clamp and a burning method thereof, belonging to the technical field of chip burning, the burning clamp comprises an installation base, a pressure cover plate and a pressing component, wherein an insulating block for clamping and positioning an EMMC chip is embedded in the installation base, a double-end elastic thimble is embedded in the insulating block, one end of the installation base is hinged with the pressure cover plate, and the pressure cover plate is provided with the pressing component for pressing and positioning the double-end elastic thimble on the EMMC chip. The signal pins on the EMMC chip can be electrically connected with the PCB board by a pressing and positioning mode without repeatedly welding the EMMC chip on the PCB board, after the burn-in is finished, the EMMC chip is convenient to disassemble, the tin ball implanting operation is not required to be carried out again, the burn-in efficiency is improved, and the burn-in cost is reduced.

Description

EMMC chip burning clamp and burning method thereof

Technical Field

The invention relates to the technical field of chip burning, in particular to an EMMC chip burning clamp and a burning method thereof.

Background

At present, most of chips are burned, namely, programs are written in by various burners, wherein the chips of the EMMC embedded multimedia controller are welded on corresponding bonding pads of a PCB in a surface patch element mode, then burning is carried out by the burners, and after burning is finished, the burned chips need to be detached by using a hot air gun.

Firstly, in a research and development or test stage, a storage chip needs to be frequently and repeatedly welded on a PCB, so that the position of a bonding pad corresponding to the PCB is easily damaged, the PCB is scrapped after being welded for many times, and meanwhile, the chip is damaged due to repeated welding of the storage chip, so that the yield of finished products is influenced; secondly, after the burning is finished and the chip is detached, the solder ball pins on the surface of the chip are lost, and the burned chip needs to be sent to a third party to implant the solder balls again, but the success rate of implanting the solder balls is low at present, the charging is high, the manufacturing period is long, the manufacturing efficiency of a finished product is low, and the cost is improved.

Disclosure of Invention

In order to solve the technical problems, the invention provides an EMMC chip burning clamp which mainly solves the problems of low burning efficiency, high cost and low yield of finished products of the existing EMMC chip, and aims to design a burning clamp which can electrically connect a signal pin on the EMMC chip with a PCB (printed circuit board) in a pressing and positioning mode without repeatedly welding the EMMC chip on the PCB, and after burning is finished, the EMMC chip is convenient to disassemble without carrying out solder ball planting again, so that the burning efficiency is improved, and the burning cost is reduced.

In order to achieve the purpose, the technical scheme adopted by the invention for solving the technical problems is as follows: EMMC chip burns record anchor clamps, EMMC chip includes a plurality of signal pins that are connected with the PCB board electricity that chip body and middle part set up, burn record anchor clamps including installation base, pressure cover board and compress tightly the subassembly, it has the collets with EMMC chip joint location to inlay in the installation base, it has double-end elasticity thimble to inlay in the collets, the upper end of double-end elasticity thimble stretches out the collets, the lower extreme of double-end elasticity thimble is located in the collets, the one end of installation base with the pressure cover board is articulated to link to each other, be provided with on the pressure cover board with double-end elasticity thimble compresses tightly the location and is in compress tightly the subassembly on the EMMC chip.

Furthermore, the double-end elasticity thimble is provided with a plurality ofly, the quantity of double-end elasticity thimble with signal pin's quantity equals on the EMMC chip, and every double-end elasticity thimble is relative with signal pin on the EMMC chip.

Furthermore, the insulating block comprises a trapezoid block and a positioning bottom plate which are detachably connected, the double-end elastic ejector pins are embedded in the trapezoid block, guide holes I which are opposite to the double-end elastic ejector pins are formed in the upper portion of the positioning bottom plate, and mounting grooves matched with the EMMC chip in a positioning and clamping mode are formed in the lower portion of the positioning bottom plate.

Furthermore, the double-end elastic thimble is provided with a guide sleeve, a spring and a double-end thimble from outside to inside in sequence, the guide sleeve is embedded in the trapezoidal block and comprises an inner accommodating cavity and guide holes II at two ends, the guide holes II are in clearance fit with the double-end thimble, the double-end thimble is sleeved with the spring in an outer mode, the spring is accommodated in the accommodating cavity, and the upper portion of the double-end thimble is in stop fit with the guide sleeve and the upper end of the spring.

Furthermore, an annular boss is arranged on the upper portion of the double-head ejector pin, the upper end of the annular boss is in blocking fit with the guide hole II, and the lower end of the annular boss is in blocking fit with one end of the spring.

Further, the compressing assembly comprises a rotating handle, a single-head screw and a pressing block, a threaded hole and a mounting hole are sequentially formed in the middle of the compressing cover plate from top to bottom, the single-head screw is in threaded fit with the threaded hole, the pressing block is in clearance fit with the mounting hole, one end of the single-head screw is fixedly connected with the rotating handle, and the other end of the single-head screw is connected with the pressing block in a pressing mode through a bearing.

Furthermore, a pressing groove in clearance fit with the pressing block is formed in the upper end of the insulating block, an insulating pressing plate is arranged in the pressing groove, and pinching grooves facilitating the insulating pressing plate to be taken out are formed in two sides of the pressing groove; the rotating handle is provided with two positioning columns, and the outer sides of the positioning columns are provided with arc-shaped grooves which are convenient for fingers to hold rotating.

Furthermore, one end of the installation base is provided with a positioning lug, one end of the pressurizing cover plate is provided with a hinged lug matched with the positioning lug, the positioning lug and the hinged lug are matched to form a through hole, a rotating shaft penetrates through the through hole, and a torsion spring is sleeved outside the rotating shaft.

Furthermore, the other end of the pressurizing cover plate is provided with a positioning buckle, and a positioning clamping groove matched with the positioning buckle in a clamping mode is arranged on the installation base.

A burning method of an EMMC chip utilizes the burning clamp of the EMMC chip, and comprises the following steps:

1) selecting a positioning bottom plate in clamping fit with the EMMC chip, connecting the EMMC chip card in a mounting groove of the positioning bottom plate, and mounting the positioning bottom plate provided with the EMMC chip on the trapezoidal block;

2) placing the burning clamp provided with the EMMC chip in a bonding pad of a PCB, placing an insulating pressing plate in a pressing groove at the upper end of an insulating block, and fastening a pressing cover plate on an installation base;

3) rotating the rotating handle to enable the pressing block to tightly press and position the double-end elastic thimble on the EMMC chip, and enabling a signal pin on the EMMC chip to be electrically connected with the PCB;

4) connecting the PCB with a chip burner through a data line, and burning a software program into the EMMC chip;

5) after the burning is finished, the rotating handle is rotated reversely, the insulating pressing plate is taken out after the pressurizing cover plate is opened, and the burnt EMMC chip is taken down from the positioning bottom plate.

The invention has the beneficial effects that:

1. the EMMC chip burning clamp clamps and positions the EMMC chip through the insulating block, then acts on one end of the double-end elastic thimble through the pressing component, so that the other end of the double-end elastic thimble is pressed and positioned on the EMMC chip, the signal pin on the EMMC chip is electrically connected with the PCB, the EMMC chip is not required to be repeatedly welded on the PCB, and after burning is finished, the EMMC chip is detached from the insulating block, so that the EMMC chip is convenient to detach, the EMMC chip is not damaged, the tin ball planting operation is not required to be carried out again, the burning efficiency is improved, and the burning cost is reduced.

2. In addition, the insulating block comprises a trapezoid block and a positioning bottom plate which are detachably connected, the positioning bottom plate is matched with the EMMC chip in a positioning clamping mode, and the corresponding positioning bottom plate can be selected to be installed on the trapezoid block according to the EMMC chips with different sizes, so that the EMMC chip is positioned more stably, and the universality of the burning clamp is improved; the pressing assembly comprises a rotating handle, a single-head screw and a pressing block, the pressing block is moved up and down by rotating the rotating handle, the pressing block presses and positions the double-head elastic thimble on the EMMC chip, and a signal pin on the EMMC chip is electrically connected with the PCB, so that the pressing assembly is suitable for pressing and positioning the EMMC chips with different thickness sizes, and the universality of the burning clamp is further improved; one end of the pressurizing cover plate is elastically hinged to the mounting base, the other end of the pressurizing cover plate is connected with the mounting base in a clamped mode, the stability of compressing and positioning is further improved, and the success rate of burning is guaranteed.

In conclusion, the burning clamp provided by the invention has the advantages of simple overall structure, stable positioning and compression, convenience in operation and strong universality, the signal pin on the EMMC chip can be electrically connected with the PCB in a compression and positioning mode, the EMMC chip does not need to be repeatedly welded on the PCB, the EMMC chip is convenient to disassemble after burning is finished, the tin ball planting operation is not needed again, the burning efficiency is improved, and the burning cost is reduced.

Drawings

The contents of the expressions in the various figures of the present specification and the labels in the figures are briefly described as follows:

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a top view of the mounting base of the present invention;

FIG. 3 is a sectional view taken along line A-A of FIG. 2;

FIG. 4 is a schematic view of an enlarged portion of FIG. 3;

FIG. 5 is a schematic view of the construction of the pressure cover plate according to the present invention;

FIG. 6 is a sectional view taken along line B-B of FIG. 5;

the labels in the above figures are: 1. the mounting structure comprises a mounting base, 11 positioning lugs, 12 positioning clamping grooves, 2 pressurizing cover plates, 21 threaded holes, 22 mounting holes, 23 hinged lugs, 3 pressing components, 31 rotating handles, 311 positioning columns, 312 arc-shaped grooves, 32 single-end screws, 33 pressing blocks, 4 insulating blocks, 41 trapezoidal blocks, 42 positioning bottom plates, 421 guiding holes I, 422 mounting grooves, 43 pressing grooves, 44 holding grooves, 5 double-end elastic ejector pins, 51 guiding sleeves, 511 accommodating cavities, 512 guiding holes II, 52 springs, 53 double-end ejector pins, 54 annular bosses, 6 rotating shafts, 7 torsion springs, 8 positioning fasteners and 9 insulating pressing plates.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and the following embodiments are used for illustrating the present invention and are not intended to limit the scope of the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The specific implementation scheme of the invention is as follows: the invention provides a traditional EMMC chip which comprises a chip body and a plurality of signal pins arranged in the middle of the chip body and electrically connected with a PCB (printed circuit board), and the traditional EMMC chip comprises a mounting base 1, a pressurizing cover plate 2 and a pressing component 3, wherein an insulating block 4 for clamping and positioning the EMMC chip is embedded in the mounting base 1, a double-head elastic thimble 5 is embedded in the insulating block 4, the upper end of the double-head elastic thimble 5 extends out of the insulating block 4, the lower end of the double-head elastic thimble 5 is positioned in the insulating block 4, one end of the mounting base 1 is hinged with the pressurizing cover plate 2, and the pressurizing cover plate 2 is provided with the pressing component 3 for pressing and positioning the double-head elastic thimble 5 on the EMMC chip. This burn and record anchor clamps pass through insulating block 4 with EMMC chip joint location, then through compressing tightly the end that stretches out that 3 effects on double-end elasticity thimble 5 of subassembly, make the other end of double-end elasticity thimble 5 compress tightly the location on the EMMC chip, be connected signal pin and PCB board electric connection on the EMMC chip, need not to weld the EMMC chip on the PCB board repeatedly, and burn and record and accomplish the back, with EMMC chip follow insulating block 4 on dismantle can, it is convenient to dismantle, harmless to the EMMC chip, need not to plant the tin ball operation again, the efficiency of burning and recording is improved, the cost of burning and recording is reduced.

Specifically, as shown in fig. 2, a plurality of double-ended elastic ejector pins 5 are provided, the number of the double-ended elastic ejector pins 5 is equal to the number of the signal pins on the EMMC chip, and each double-ended elastic ejector pin 5 is opposite to the signal pin on the EMMC chip, so that the double-ended elastic ejector pin 5 abuts against the surface of the EMMC chip and acts on the corresponding signal pin, and the signal pin is in close contact with a pad on the PCB to achieve electrical connection.

Specifically, as shown in fig. 3, the insulating block 4 includes a trapezoid block 41 and a positioning bottom plate 42 which are detachably connected, a double-headed elastic thimble 5 is embedded in the trapezoid block 41, the upper portion of the positioning bottom plate 42 is provided with a guide hole i 421 opposite to the double-headed elastic thimble 5, so that the lower end of the double-headed elastic thimble 5 can extend through the guide hole i 421, the lower portion of the positioning bottom plate 42 is provided with a mounting groove 422 matched with an EMMC chip in a positioning and clamping manner, so that the double-headed elastic thimble 5 extends out of the guide hole i 421 to the mounting groove 422, the EMMC chip is pressed and positioned, and the corresponding positioning bottom plate 42 can be selected according to EMMC chips of different sizes to match the mounting groove 422 and the EMMC chip in a clamping manner, and then the positioning bottom plate 42 provided with the EMMC chip is mounted on the trapezoid block through a bolt, so that the EMMC chip is positioned more. As shown in fig. 4, the double-ended resilient thimble 5 is sequentially provided with a guide sleeve 51, a spring 52 and a double-ended thimble 53 from outside to inside, the guide sleeve 51 is embedded in the positioning hole of the trapezoidal block 41, the guide sleeve 51 comprises an inner accommodating cavity 511 and two guide holes ii 512 at two ends, the inner diameter of the accommodating cavity 511 is larger than the diameter of the guide hole ii 512, the guide hole ii 512 is in clearance fit with the double-ended thimble 53, the spring 52 is sleeved outside the double-ended thimble 53, the spring 52 is accommodated in the accommodating cavity 511, two ends of the spring 52 are in contact with two ends of the accommodating cavity 511, the spring 52 can enable the double-ended thimble 53 to be reset without acting force, the upper portion of the double-ended thimble 53 is provided with an annular boss 54, the upper end of the annular boss 54 is in stop fit with the guide hole ii 512, the lower end of the annular boss 54 is in stop fit with one end of the spring 52, the annular boss 54, the upper end of the double-head thimble 53 is pressed, the double-head thimble 53 moves downwards in the guide sleeve 51 under the action of the spring 52, the lower end of the double-head thimble 53 extends into the mounting groove 422 through the guide hole I421, an EMMC chip in the mounting groove 422 is pressed and positioned, when the pressure of the upper end of the double-head thimble 53 disappears, the double-head thimble 53 moves upwards in the guide sleeve 51 to reset under the action of the spring 52, the double-head thimble 53 is separated from the surface of the EMMC chip, and the EMMC chip is conveniently detached from the mounting groove 422.

Specifically, as shown in fig. 1, 5 and 6, the compressing assembly 3 includes a rotating handle 31, a single-head screw 32 and a pressing block 33, a threaded hole 21 and a mounting hole 22 are sequentially formed in the middle of the pressing cover plate 2 from top to bottom, a threaded section of the single-head screw 32 is in threaded fit with the threaded hole 21, the pressing block 33 is in clearance fit with the mounting hole 22, the upper end of the single-head screw 32 is fixedly connected with the rotating handle 31 by welding, a polished rod section of the single-head screw 32 is in press fit with the pressing block 33 by a bearing, when the rotating handle 31 is rotated, the single-head screw 32 rotates up or down in the threaded hole 21 to drive the pressing block 33 to move up and down along the mounting hole 22, so as to compress the pressing block 33 on the insulating block, move down the double-head thimble 53 to be in press fit with the surface of the EMMC chip, so as to electrically connect the signal pin of the EMMC chip with the pad of the PCB board, the compressing assembly 3, the universality of the burning clamp is improved. Optimally, a pressing groove 43 in clearance fit with the pressing block 33 is formed in the upper end of the insulating block 4, an insulating pressing plate 9 is arranged in the pressing groove 43, the insulating pressing plate 9 is a disposable insulating sheet and plays a role in electrical insulation, and arc-shaped holding grooves 44 are formed in two sides of the pressing groove 43, so that the insulating pressing plate 9 can be conveniently taken out after the burning is finished, and a new insulating pressing plate 9 can be conveniently replaced for the next burning; wherein, the rotating handle 31 is provided with two positioning columns 311, the outer sides of the positioning columns 311 are provided with arc grooves 312 which facilitate fingers to hold rotating, the rotating handle 31 is rotated conveniently by holding the arc grooves 312, the pressing block 33 is pressed on the insulating block 4, and the operation is more convenient.

Specifically, as shown in fig. 1, one end of the mounting base 1 is provided with a positioning lug 11, one end of the pressure cover plate 2 is provided with a hinge lug 23 matched with the positioning lug 11, the positioning lug 11 and the hinge lug 23 are matched to form a through hole, a rotating shaft 6 is penetrated in the through hole, the rotating shaft 6 is externally sleeved with a torsion spring 7, two ends of the torsion spring 7 are respectively abutted against the end parts of the mounting base 1 and the pressure cover plate 2, so that the elastic hinge joint of the mounting base 1 and the pressure cover plate 2 is realized, the opening of the pressure cover plate 2 is more convenient, in order to stably press the pressure cover plate 2 on the mounting base 1, the other end of the pressure cover plate 2 is provided with a positioning buckle 8, the end part of the positioning buckle 8 is provided with a hook, the mounting base 1 is provided with a positioning clamp groove 12 in snap fit with the hook on the positioning buckle 8, after the pressure cover plate 2 is closed, the positioning buckle, the pressurizing cover plate 2 is stably pressed on the mounting base 1, the clamping hook has elasticity, and the clamping hook can be separated from the positioning clamping groove 12 manually, so that the pressurizing cover plate 2 is convenient to open.

The method for burning the EMMC chip by using the EMMC chip burning clamp comprises the following steps:

1) selecting a positioning bottom plate 42 in clamping fit with the EMMC chip, connecting the EMMC chip card in a mounting groove 422 of the positioning bottom plate 42, and mounting the positioning bottom plate 42 provided with the EMMC chip on the trapezoidal block 41 through bolts;

2) placing the burning clamp provided with the EMMC chip on a PCB, enabling a signal pin on the EMMC chip to be positioned on a pad corresponding to the PCB, placing an insulating pressing plate 9 in a pressing groove 43 at the upper end of an insulating block 4, turning over a pressurizing cover plate 2, and buckling the pressurizing cover plate in a positioning clamping groove 12 of an installation base 1 through a positioning buckle 8 on the pressurizing cover plate;

3) rotating the rotating handle 31 to enable the pressing block 33 to move downwards to enable the double-head elastic thimble 5 to extend into the mounting groove 422 through the guide hole I421, and compressing and positioning the EMMC chip in the mounting groove 422 to enable a signal pin on the EMMC chip to be electrically connected with the PCB;

5) after the burning is finished, the rotating handle 31 is rotated reversely, the pressing block 33 moves upwards, the double-head elastic thimble 5 resets and leaves the surface of the EMMC chip, the positioning buckle 8 is separated from the positioning clamping groove 12 manually, the pressurizing cover plate 2 is opened, the insulating pressing plate 9 is taken out, and the burnt EMMC chip is taken down from the positioning bottom plate 42.

While the foregoing is directed to the principles of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. An EMMC chip burning clamp comprises a chip body and a plurality of signal pins arranged in the middle of the chip body and electrically connected with a PCB, it is characterized in that the burning clamp comprises a mounting base (1), a pressure cover plate (2) and a pressing component (3), an insulating block (4) for clamping and positioning the EMMC chip is embedded in the mounting base (1), a double-head elastic thimble (5) is embedded in the insulating block (4), the upper end of the double-head elastic thimble (5) extends out of the insulating block (4), the lower end of the double-head elastic thimble (5) is positioned in the insulating block (4), one end of the mounting base (1) is hinged with the pressurizing cover plate (2), and the pressurizing cover plate (2) is provided with a compressing component (3) for compressing and positioning the double-head elastic thimble (5) on the EMMC chip.

2. The EMMC chip burning clamp of claim 1, wherein: the double-end elastic ejector pins (5) are arranged in a plurality of numbers, the number of the double-end elastic ejector pins (5) is equal to the number of the signal pins on the EMMC chip, and each double-end elastic ejector pin (5) is opposite to the signal pin on the EMMC chip.

3. The EMMC chip burning clamp of claim 2, wherein: insulating block (4) are including dismantling trapezoidal piece (41) and the location bottom plate (42) of connection, it has to inlay in trapezoidal piece (41) double-end elasticity thimble (5), the upper portion of location bottom plate (42) be provided with relative guiding hole I (421) of double-end elasticity thimble (5), the lower part of location bottom plate (42) be provided with EMMC chip location joint complex mounting groove (422).

4. The EMMC chip burning clamp of claim 3, wherein: the double-end elastic thimble (5) is provided with a guide sleeve (51), a spring (52) and a double-end thimble (53) from outside to inside in proper order, the guide sleeve (51) is inlaid in the trapezoidal block (41), the guide sleeve (51) comprises an inner accommodating cavity (511) and guide holes II (512) at two ends, the guide holes II (512) are in clearance fit with the double-end thimble (53), the double-end thimble (53) is externally sleeved with the spring (52), the spring (52) is accommodated in the accommodating cavity (511), and the upper part of the double-end thimble (53) is in stop fit with the guide sleeve (51) and the upper end of the spring (52).

5. The EMMC chip burning clamp of claim 4, wherein: an annular boss (54) is arranged at the upper part of the double-head ejector pin (53), the upper end of the annular boss (54) is in stop fit with the guide hole II (512), and the lower end of the annular boss (54) is in stop fit with one end of the spring (52).

6. The EMMC chip burning clamp of any one of claims 1-5, wherein: compress tightly subassembly (3) including twist grip (31), single-end screw rod (32) and briquetting (33), the middle part of pressurized cover board (2) has from top to bottom set gradually screw hole (21) and mounting hole (22), single-end screw rod (32) with screw hole (21) screw-thread fit, briquetting (33) with mounting hole (22) clearance fit, the one end of single-end screw rod (32) with twist grip (31) are fixed continuous, the other end of single-end screw rod (32) pass through the bearing with briquetting (33) pressure equipment links to each other.

7. The EMMC chip burning clamp of claim 6, wherein: a pressing groove (43) in clearance fit with the pressing block (33) is formed in the upper end of the insulating block (4), an insulating pressing plate (9) is arranged in the pressing groove (43), and pinching grooves (44) facilitating taking out of the insulating pressing plate (9) are formed in two sides of the pressing groove (43); two positioning columns (311) are arranged on the rotating handle (31), and arc-shaped grooves (312) which are convenient for fingers to hold rotating are arranged on the outer sides of the positioning columns (311).

8. The EMMC chip burning clamp of claim 6, wherein: the one end of installation base (1) is provided with location lug (11), the one end of pressure apron (2) be provided with location lug (11) complex articulated lug (23), location lug (11) with form the cross-under hole after articulated lug (23) cooperation, the cross-under has worn pivot (6) in the cross-under hole, torsion spring (7) have been cup jointed outward in pivot (6).

9. The EMMC chip burning clamp of claim 8, wherein: the other end of the pressurizing cover plate (2) is provided with a positioning buckle (8), and a positioning clamping groove (12) matched with the positioning buckle (8) in a clamping mode is arranged on the installation base (1).

10. An EMMC chip burning method, which uses the EMMC chip burning clamp as claimed in any one of claims 1-8, wherein: the method comprises the following steps:

1) selecting a positioning bottom plate (42) matched with the EMMC chip in a clamping manner, clamping the EMMC chip in a mounting groove (422) of the positioning bottom plate (42), and mounting the positioning bottom plate (42) provided with the EMMC chip on a trapezoidal block (41);

2) placing the burning clamp provided with the EMMC chip in a bonding pad of a PCB, placing an insulating pressing plate (9) in a pressing groove (43) at the upper end of an insulating block (4), and buckling a pressing cover plate (2) on an installation base (1);

3) rotating a rotating handle (31) to enable a pressing block (33) to tightly press and position the double-head elastic thimble (5) on the EMMC chip and enable a signal pin on the EMMC chip to be electrically connected with a PCB;

5) after the burning is finished, the rotating handle (31) is rotated reversely, the pressure cover plate (2) is opened, the insulating pressing plate (9) is taken out, and the burnt EMMC chip is taken down from the positioning bottom plate (42).