KR101004416B1 - Inspection apparatus for led having transtering unit and method of led transfer led using the same - Google Patents

Abstract

PURPOSE: A light emitting diode chip inspecting apparatus equipped with a light emitting diode chip transferring unit and a light emitting diode chip transferring method using the same are provided to minimize the breakage of a light emitting diode chip while the light emitting diode chip is transferred using a gripper. CONSTITUTION: A wafer includes light emitting diode chips and the adhering faces of the light emitting diode chips. A stage(163) is arranged on the bottom side of the wafer and includes needles and curved surfaces. The needles pressurize the bottom side of the light emitting diode chips. A gripper(161) inhales the light emitting diode chips on the upper side of the wafer and transfers the inhaled light emitting diode chips.

Description

LED chip inspection device with LED chip transfer unit and LED chip transfer method using same {INSPECTION APPARATUS FOR LED HAVING TRANSTERING UNIT AND METHOD OF LED TRANSFER LED USING THE SAME}

The present invention relates to an LED chip inspection apparatus having an LED chip transfer unit and an LED chip transfer method using the same. More specifically, the LED chip is seated on a stage including an arc-shaped curved surface, and the mounted LED chip is to be transferred. The present invention relates to an LED chip inspection device having an LED chip transfer unit capable of facilitating transfer of an LED chip by minimizing friction with a stage, and an LED chip transfer method using the same.

LED chip used in electronic products (LED_ Light Emitting Diode) chip is a kind of light emitting device using a semiconductor that converts electricity to light, it is also called a light emitting diode (Luminescent diode). LED chips are smaller than conventional light sources, have a long life, low power consumption, and fast response speeds, and are therefore used in various fields such as display lamps, numeric display devices, and backlights of various electronic devices.

In this case, the LED chip is manufactured through an epi process (EPI), a chip process (Fabrication) and a package process (Package), etc., the LED chip after the package process is subjected to an inspection process. In the inspection process, LED chips that do not operate normally are excluded, and LED chips that operate normally are classified and loaded according to their performance.

The inspection process may be divided into a process of inspecting the characteristics of the LED chip and a process of classifying and loading the LED chips having finished the characteristic inspection by grade according to the inspection result.

The inspection process apparatus includes a supply unit on which a wafer on which a plurality of LED chips are seated is loaded, an inspection unit inspecting characteristics of the LED chip on the wafer supplied from the supply unit, and a loading unit sorting and loading the LED chips inspected by the inspection unit according to the characteristics. Include.

At this time, each of the supply unit and the loading unit has a wafer on which the LED chip is seated or a completed wafer on which the LED chip on which the inspection is completed is seated on the stage. In addition, the supply unit and the loading unit are provided with a gripper for transferring the LED chip on each stage.

The gripper is positioned on the LED chip to be transported to suck the LED chip through vacuum suction, and the sucked LED chip is fixed to the gripper in a vacuum state and transported.

At this time, the stage on which the wafer or the finished wafer is seated is formed in a plane, and the adhesion force is generated between the LED chip and the plane of the stage during the vacuum suction of the gripper due to the stage formed in the plane. The LED chip may be damaged due to the phenomenon in which the gripper forcibly transfers the LED chip by the generated adhesion force.

In addition, the stage is provided with a needle. The needle applies pressure to the bottom of the LED chip when the gripper vacuums the LED chip so that the LED chip can be detached from the stage. Here, the stage may be formed with a hole for the needle to puncture the stage, the needle presses the LED chip bottom surface through the hole. At this time, the LED chip may be damaged by the pressure applied to the LED chip by the needle.

In addition, an adhesive surface is provided on the bottom surface of the LED chip to prevent the LED chip from being separated from the wafer. As the needle is punctured, a hole through which the needle penetrates is formed in the adhesive surface. Because holes formed in the adhesive surface make it difficult to reuse the adhesive surface, resource waste occurs.

An embodiment of the present invention provides an LED chip inspection apparatus having an LED chip transfer unit capable of minimizing damage to the LED chip and transferring the LED chip to another position, and an LED chip transfer method using the same.

An LED chip inspection apparatus having an LED chip transfer unit according to an embodiment of the present invention includes a wafer including an LED chip and an adhesive surface provided on the LED chip bottom surface; A stage provided on the bottom surface of the wafer and having a needle member configured to press the LED chip bottom surface, the stage including an arcuate curved surface; And a gripper for sucking and transporting the LED chip on the stage.

By the above configuration, the adhesion between the LED chip and the stage can be reduced, and the breakage of the LED chip can be minimized during the gripper conveying the LED chip.

The curved surface may be formed to be bent in the lower direction of the stage. For example, the curved surface may be formed in a semicircular shape in the direction of the stage inner surface with respect to the upper surface of the stage, and the curved surface formed as described above may reduce the adhesion between the upper surface of the stage and the LED chip.

The needle member may protrude by puncturing the curved surface, and the needle member may protrude before the gripper sucks and transports the LED chip. In this case, the needle member may protrude to a position lower than the top surface of the stage. That is, the needle member may serve to support the LED chip bottom because the gripper is positioned on the bottom of the LED chip and protrudes to a lower position than the top surface of the stage before the gripper transfers the LED chip.

On the other hand, the stage may include a vacuum suction unit for sucking the vacuum between the adhesive surface and the curved surface when the needle member protrudes through the curved surface. When the vacuum suction unit sucks the vacuum between the adhesive surface and the curved surface, the peripheral adhesive surface around the LED located on the needle member may be bent and deformed in the curved surface direction. For example, when the needle member punctures the curved surface and the vacuum suction unit sucks the vacuum between the adhesive surface and the curved surface, the LED chip positioned on the needle member may be supported by the needle member. At this time, the peripheral adhesive surface around the LED chip located on the needle member by the suction force of the vacuum suction unit is bent and deformed in the direction of the curved surface. In this way, since the LED chip positioned on the needle member by the vacuum suction unit has a protruding effect in the gripper direction, the gripper can more easily suck and transfer the LED chip.

The gripper may include a tension to minimize breakage of the LED chip when the gripper sucks and transports the LED chip. Tension allows the gripper to elastically move up and down when the gripper is located on the top of the LED chip, and prevents the gripper from impacting the LED chip on the suction force that sucks the LED chip as the gripper elastically moves up and down. Can be.

The LED chip inspection apparatus may include a supply unit supplying a wafer, an inspection unit inspecting LED chip characteristics on the wafer supplied from the supply unit, and a loading unit classifying and loading the LED chips inspected by the inspection unit according to the characteristics. In this case, the stage may be provided in the inspection unit or the loading unit.

On the other hand, a wafer comprising an adhesive surface of the LED chip and the bottom surface of the LED chip according to an embodiment of the present invention, a stage having an arcuate curved surface on the bottom surface of the wafer, the LED transfer unit including a gripper provided on the wafer According to the LED transfer method, The step of mounting the wafer on the stage; The needle member provided on the stage protrudes the curved surface; Suctioning a vacuum between the adhesive surface and the curved surface; And the gripper suctioning and transferring the LED chip, wherein the curved surface may be bent in a downward direction of the stage.

The needle member may include a step of protruding to a position lower than the top surface of the stage in the step in which the needle member provided in the stage protrudes through the curved surface. As the needle member protrudes to a position lower than the top surface of the stage, the needle member may support the LED chip bottom without perforating the adhesive surface of the wafer.

In addition, the step of sucking the vacuum between the adhesive surface and the curved surface includes the step of bending the circumferential adhesive surface around the LED chip located on the needle member in the direction of the curved surface. That is, as the circumferential adhesive surface around the LED chip positioned on the needle member is bent in the curved surface direction through the above steps, the LED chip positioned on the needle member may protrude relatively in the gripper direction. This allows the gripper to easily transfer the LED chip.

Meanwhile, before the gripper sucks and transports the LED chip, the gripper may include placing the gripper on the LED chip positioned on the needle member. That is, the gripper may be positioned on the LED chip to transfer the selected LED chip. At this time, the gripper may elastically move up and down to prevent breakage of the LED chip, and the tension may be guided to guide the elastic motion. It may include.

According to an embodiment of the present invention, a curved surface may be formed on the stage on which the wafer is seated, and the LED chip may be positioned to correspond to the formed curved surface. As the LED chip corresponds to the curved surface as described above, even when the gripper sucks and transports the LED through vibration suction, the LED chip can be prevented from being damaged. That is, the needle member of the stage may support the bottom of the LED chip to be transferred, and the LED chip on the needle member may protrude in the gripper direction because the vacuum is sucked between the curved surface and the adhesive surface of the wafer. As a result, it is possible to minimize the damage of the LED chip by minimizing the adhesion between the stage and the LED chip.

1 is a perspective view showing an LED chip inspection apparatus having an LED chip transfer unit according to an embodiment of the present invention.
FIG. 2 is a perspective view schematically illustrating a configuration of an LED chip inspection apparatus including the LED chip transfer unit of FIG. 1.
3A to 3C are cross-sectional views illustrating a cross-sectional view taken along the line I-I of FIG. 2.
Figure 4 is a flow chart according to the LED chip transfer method according to the LED chip transfer unit according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited or limited by the embodiments. Like reference numerals in the drawings denote like elements.

1 is a perspective view showing an LED chip inspection apparatus having an LED chip transfer unit according to an embodiment of the present invention, Figure 2 is a schematic view showing the configuration of the LED chip inspection apparatus having an LED chip transfer unit of FIG. One perspective view.

Prior to describing the drawings, the LED chip inspection apparatus 100 of the present invention may inspect the LED chip 14 on the wafer 10. For example, the inspection apparatus 100 may track the LED chip 14 seated on the wafer 10 and inspect the characteristics of the LED chip 14, and the LED chip 14 that has been inspected may be inspected. Can be classified according to. In particular, the LED chip 14 may be inspected for characteristics such as light and current of the LED chip 14 in the process of inspecting the LED chip 14, and the LED chip 14 may be graded according to the above characteristics in the process of inspecting the LED chip 14. This can be applied. The LED chip 14 to which the grade is applied may be classified according to the grade in the loading unit described later. In this case, the inspection criteria for inspecting the LED chip 14 may be variously changed according to an inspection apparatus for inspecting the LED chip 14, an inspection environment, and the like.

In addition, the expansion operation may be performed first to check the characteristics of the LED chip 14. The expansion operation extends the wafer 10 to widen the gap of each LED chip seated on the wafer 10 to minimize the interference between the LED chips, and is a preliminary operation in order to easily remove the tested LED chip from the wafer. It can be said. In the following drawings, the wafer 10 preceded by the expansion operation will be described by way of example, and the present invention is not limited by the gap between the LED chips for each expansion operation.

First, referring to FIG. 1, the LED inspection apparatus 100 may include a housing 100 in which a plurality of equipments for inspecting the characteristics of the LEDs or for separating and loading the LEDs according to the inspected results are accommodated. The information input unit 120 may be provided outside the housing 100.

The housing 110 may be partitioned into a plurality of layers. For example, the housing 110 may be divided into an upper layer 110a and a lower layer 110b, and for convenience of description, the housing 110 is described as an example divided into upper and lower layers 110a and 110b. 110 may be partitioned into a single layer, a plurality of layers of three or more layers.

The information input unit 120 may input information necessary for LED inspection, transfer, etc., which are performed in the LED inspection apparatus 100, or may visually confirm the input information.

Next, referring to FIG. 2, the LED inspection apparatus 100 includes a supply unit 130, a moving unit 140, an inspection unit 150, and a loading unit 160.

The supply unit 130 may be loaded with a plurality of wafers 10 on which the LED chip 14 to be examined is loaded. At this time, the supply unit 130 may be formed with a plurality of slits so that the wafer 10 can be loaded, 10 to 11 slits are formed in the supply unit 130 according to an embodiment of the present invention 10 to 11 Wafers may be loaded.

An inspection unit 150 may be provided behind the supply unit 130. The inspection unit 150 may have a wafer 10 seated thereon and a measurement unit (not shown) for measuring the seated wafer 10. In addition, the inspection unit 150 may further include a scan vision (not shown) that tracks the LED chip 14 and scans a map of the LED chip 14. The LED chip characteristics may be inspected through the measuring unit and the scan vision, and the grade may be applied to the LED chips according to the inspected results.

On the other hand, the supply unit 130 may be mounted on the moving unit 140, the moving unit 140 may be a mobile unit for moving the supply unit 130 to the upper layer (110a) and lower layer (110b). The moving unit 140 may move the supply unit 130 to a position adjacent to the loading unit 160 provided in the lower layer 110b. As such, the moving unit 140 moves the supply unit 130 to a position adjacent to the loading unit 160, thereby minimizing a copper wire for classifying the LED chip that has been inspected in the wafer 10 loaded on the supply unit 130. do.

Meanwhile, the stacking unit 160 provided in the lower layer 110b includes a sorting member 164 and a stacking member 166. On the sorting member 164, the wafer 10 on which the LED completed by the inspection unit 150 is loaded may be individually seated. In addition, the loading member 166 may be mounted with a loading stage for separating and loading the LED chip that has been inspected from the wafer 10 seated on the sorting member 164 by grade.

The sorting member 164 and the loading member 166 may be provided with an adhesive surface to prevent the LED chip from being separated from the wafer 10 in the wafer 10 and the loading wafer. In addition, the bottom surface of the wafer 10 and the loading wafer may include a stage on which the wafer 10 and the loading wafer are seated, and a gripper provided on the wafer 10 and the loading wafer to suck and transfer the LED chip.

On the other hand, the loading unit 160 may include an LED chip transfer unit that can transfer the LED chip. The LED chip transfer unit may be provided in the sorting member 164 or the loading member 166 to guide the transfer of the LED chip when the LED chip is transferred from the sorting member 164 to the loading member 166.

For example, the stage on which the wafer 10 or the loading wafer is seated may be formed in an arc shape, and a needle member provided on the stage may press the LED chip on the wafer. At this time, the gripper 161 may transfer the LED chip through vacuum suction. When the gripper 161 transfers the LED chip through vacuum suction, suction force may be generated between the stage and the LED chip, and the LED chip may be damaged by the suction force generated. However, as the stage is formed in an arc shape as in the embodiment of the present invention, it is possible to prevent the LED chip from being damaged by minimizing the suction force between the LED chip and the stage.

On the other hand, the LED chip transfer unit may be provided in each of the sorting member 164 and the loading member 166, alternatively may be provided in any one of the sorting member 164 or the loading member 166. In addition, although the LED chip transfer unit according to an embodiment of the present invention is described with an example provided in any one of the sorting member 164 or the loading member 166, in some cases, the LED chip transfer unit to the inspection unit 150 This may be provided. That is, the inspection unit 150 according to the embodiment of the present invention inspects the LED chip characteristics on the wafer, but alternatively, separates the LED chips from the wafer 10 to test each LED chip characteristic. In this case, an LED chip transfer unit may be provided in the inspection unit to transfer the LED chip whose characteristics are to be examined from the wafer.

Hereinafter, the LED chip transfer unit will be described in more detail with reference to the accompanying drawings.

Prior to the drawings, the LED chip transfer unit according to an embodiment of the present invention will be described with an example provided in the sorting member 164 of the loading unit 160, as described above the LED chip transfer unit is in accordance with the conditions of the invention Can be provided to various devices accordingly. In addition, although the sorting member 164 according to the embodiment of the present invention is provided in a state perpendicular to the loading member 166, the drawings described below will be described by way of example shown in a horizontal state for convenience of description. Shall be.

3A to 3C are cross-sectional views illustrating a cross-sectional view taken along the line I-I of FIG. 2.

3A to 3C, the LED chip transfer unit includes a wafer 10, a stage 163, and a gripper 161.

The LED chip of the LED chip to be inspected by the inspector 150 or the LED chip inspected by the inspector 150 may be loaded on the wafer 10, and the LED chip loaded on the wafer 10 may be loaded on the wafer 10. By the way, the present invention is not limited. Hereinafter, the present invention will be described with an example in which the LED chip 14 that has been inspected by the inspection unit 150 is loaded.

The wafer 10 also includes an adhesive surface 12 such that the LED chip 14 can be temporarily fixed to the wafer 10. The adhesive surface 12 may be formed of an adhesive tape to be fixed on the wafer 10 before the LED chip 14 is transferred.

The stage 163 may be provided on the bottom surface of the wafer 10 and may include a needle member 165 capable of pressing the bottom surface of the LED chip 14. In addition, the stage 163 may further include a curved surface 162 formed in an arc shape.

The curved surface 162 may be formed at a position corresponding to the LED chip 14, and generally, the lowest point of the curved surface 162 and the LED chip 14 to be transferred correspond to each other. In addition, in the exemplary embodiment of the present invention, for example, the curved surface is formed at a position corresponding to the LED chip for convenience of description, but preferably, the LED chip 14 is positioned at the position corresponding to the curved surface 162. Can be. In this case, the curved surface 162 may be formed to be bent in a downward direction of the stage 163, and the needle member 165 may be provided at the bottom of the lowest surface of the curved surface 162.

The needle member 165 may protrude by puncturing the curved surface 162. When the needle member 165 protrudes by puncturing the curved surface 162, the gripper 161 may lead to the LED chip 14. Can be protruded before transporting. That is, the needle member 165 protrudes toward the bottom surface of the LED chip 14 before the gripper 161, which will be described later, transfers the LED chip 14, so that the LED chip 14 protrudes in the direction of the gripper 161. And, it may serve to support the protruding LED chip (14).

In this case, the needle member 165 may protrude to a position lower than the top surface of the stage 163. That is, when the needle member 165 protrudes through the curved surface 162, the needle member 165 protrudes to a position lower than the top surface of the stage 163, so that the needle member 165 does not form a hole in the adhesive surface 12. To support the chip 14.

When the LED chip 14 is transferred by the stage 163 formed as described above, adhesion force with the stage 163 may be reduced, thereby preventing breakage of the LED chip. That is, by forming the curved surface 162 on the stage 163 as described above, the area where the bottom surface of the LED chip 14 is in contact with the upper surface of the stage 163 is reduced. In particular, in the process of transferring the LED chip 14, the gripper transfers the LED chip 14 through vacuum suction, and when the gripper vacuum sucks the LED chip 14, the adhesive surface 12 of the bottom surface of the LED chip 14 ) And the adhesion between the stage 163 is increased. In this case, the curved surface 162 is formed in the lower direction of the stage 163, and the needle chip 165 protrudes through the formed curved surface 162 so that the protruding needle member 165 is transferred to the LED chip 14. Will be supported. As a result, since the area where the adhesive surface 12 and the stage 163 contact each other is reduced in addition to the area supported by the needle member 165, the adhesion force between the adhesive surface 12 and the stage 163 is reduced, thereby leading to the LED chip 14. It is possible to reduce the breakage of the LED chip 14 more easily.

Meanwhile, the stage 163 may include a vacuum suction member (not shown) for sucking the vacuum between the adhesive surface 12 and the curved surface 162 when the needle member 165 protrudes through the curved surface 162. Can be.

The vacuum suction member may allow the circumferential adhesive surface around the LED chip 14 positioned on the needle member 165 that drills the curved surface 162 to be bent and deformed in the direction of the curved surface 162. As such, the gripper 161 supports the LEDs supported by the needle member 165 by allowing the vacuum suction member to bend the peripheral adhesive surface around the LED chip 14 positioned on the needle member 165 toward the curved surface 162. The chip 14 can be easily sucked and transported.

When the needle member 165 protrudes through the curved surface 162 and sucks the vacuum between the adhesive surface 12 and the curved surface 162, the LED chip 14 to suck and transfer the gripper 161 is It may protrude in the direction of the gripper 161. In order to transfer the protruding LED chip 14 as described above, the gripper 161 may be located on the upper surface of the LED chip 14, and the gripper 161 moves the LED chip 14 to another position through vacuum suction. The LED chip 14 may be transferred.

When the gripper 161 transfers the LED chip 14, a tension (not shown) may be included to prevent damage of the LED chip 14. The tension enables the gripper 161 to elastically move up and down, thereby preventing the pressure applied to the LED chip 14.

As described above, the curved surface 162 is formed on the stage 163 on which the wafer 10 on which the LED chip 14 is loaded is seated, whereby the gripper 161 is transported by the gripper 161. The adhesion between the 161 and the bottom surface of the LED chip 14 may be minimized. That is, the gripper 161 may transfer the LED chip 14 through vacuum suction. At this time, the adhesion between the LED chip 14 and the stage 163 increases, and if the LED chip 14 is forcibly transferred, the LED chip 14 may be damaged. In order to prevent such a phenomenon, a curved surface 162 is formed on the stage 163 to be transferred, and the peripheral surface around the LED chip 14 positioned on the needle member 165 protruding from the curved surface 162 is formed. Vacuum suction in the direction of the curved surface 162 to allow the LED chip 14 positioned on the needle member 165 to protrude in the direction of the gripper 161. As a result, the gripper 161 can vacuum suction and transfer the LED chip 14 positioned on the needle member 165 without surrounding interference, and the LED chip 14 also reduces the adhesion to the upper surface of the stage 163. Because of this, it can be transported without damage.

On the other hand, Figure 4 is a flow chart according to the LED chip transfer method according to the LED chip transfer unit according to an embodiment of the present invention.

Prior to describing the drawings, the same or equivalent components as those described above in the LED inspection and classification method 500 according to the embodiment of the present invention are given the same or equivalent reference numerals and the description thereof is omitted. Let's do it.

Referring to FIG. 4, an LED chip transfer method including an LED chip transfer unit including a wafer, a stage 163 including an arcuate curved surface 162 of a bottom surface of the wafer, and a gripper 161 provided on the wafer. According to the method, the wafer is seated on the stage (S410), the needle member provided on the stage is perforated to project the curved surface (S420), the step of sucking the vacuum between the adhesive surface and the curved surface (S430) and the gripper LED It may include the step of sucking and transferring the chip (S440).

The needle member 165 may include a step of protruding to a position lower than the top surface of the stage 163 in the step (S420) of the needle member provided in the stage to puncture the curved surface. That is, the needle member 165 protrudes to a position lower than the top surface of the stage 163, thereby not forming holes in the adhesive surface 12 of the LED chip 14 positioned on the needle member 165. I can only support it.

Meanwhile, in the step of sucking the vacuum between the adhesive surface and the curved surface (S430), the circumferential adhesive surface around the LED chip 14 positioned on the needle member 165 may be bent and deformed toward the curved surface 162. can do.

That is, the needle member 165 may be able to support the bottom surface of the LED chip 14 on the needle member 165 by puncturing the curved surface 162. Then, by sucking the vacuum between the adhesive surface 12 and the curved surface 162, the peripheral adhesive surface around the LED chip 14 located on the needle member 165 can be bent in the direction of the curved surface 162. . As a result, the LED chip 14 on the needle member 165 protrudes toward the gripper 161, so that the gripper 161 sucks and transfers only the LED chip 14 on the needle member 165.

As described above, the present invention has been described by specific embodiments such as specific components and the like. For those skilled in the art to which the present invention pertains, various modifications and variations are possible. Accordingly, the spirit of the present invention should not be construed as being limited to the embodiments described, and all of the equivalents or equivalents of the claims, as well as the following claims, belong to the scope of the present invention .

10: wafer 14: LED chip
100: LED chip inspection device 110: housing
130: supply part 140: moving part
150: inspection unit 160: loading unit
162: curved surface 163: stage
165: needle member

Claims (13)

A wafer comprising an LED chip and an adhesive surface provided on the LED chip bottom surface;
A stage provided on the bottom surface of the wafer and having a needle member configured to press the LED chip bottom surface, the stage including an arcuate curved surface; And
A gripper for sucking and transporting the LED chip on the wafer;
LED chip inspection device having an LED chip transfer unit comprising a. The method of claim 1,
LED chip inspection device having an LED chip transfer unit, characterized in that the curved surface is bent in the lower direction of the stage. The method of claim 1,
And the needle member protrudes from the curved surface, and the needle member protrudes before the gripper sucks and transfers the LED chip. The method of claim 3,
And the needle member protrudes to a lower position than the top surface of the stage. The method according to any one of claims 1 to 4,
The stage, the LED chip inspection device having an LED chip transfer unit, characterized in that it comprises a vacuum suction member for sucking the vacuum between the adhesive surface and the curved surface when the needle member is punched through the curved surface. . The method of claim 5,
When the vacuum suction member sucks the vacuum between the adhesive surface and the curved surface, the circumferential adhesive surface around the LED chip located on the needle member is bent and deformed in the direction of the curved surface LED chip transfer unit LED chip inspection device provided. The method of claim 5,
The gripper is an LED chip inspection device having an LED chip transfer unit, characterized in that it comprises a tension to minimize damage of the LED chip when the gripper sucks and transports the LED chip. The method of claim 5,
And an LED chip transfer unit including a supply unit supplying the wafer, an inspection unit inspecting the LED chip characteristics on the wafer supplied from the supply unit, and a loading unit classifying and stacking the LED chips inspected by the inspection unit according to characteristics. In one LED chip feeder,
The LED chip testing unit having an LED chip transfer unit, characterized in that provided in the inspection unit. The method of claim 5,
And an LED chip transfer unit including a supply unit supplying the wafer, an inspection unit inspecting the LED chip characteristics on the wafer supplied from the supply unit, and a loading unit classifying and stacking the LED chips inspected by the inspection unit according to characteristics. In one LED chip feeder,
The LED chip inspection unit having an LED chip transfer unit, characterized in that provided in the loading portion. In the LED transfer method according to the LED transfer unit comprising a wafer comprising an adhesive surface of the LED chip and the LED chip bottom, a stage comprising an arcuate curved surface on the bottom surface of the wafer, the gripper provided on the wafer,
Mounting the wafer on the stage;
The needle member provided on the stage protrudes the curved surface;
Suctioning a vacuum between the adhesive surface and the curved surface; And
And the gripper sucks and transports the LED chip.
The curved surface is the LED conveying method according to the LED conveying unit, characterized in that formed bent in the downward direction of the stage. The method of claim 10,
And the needle member protrudes to a position lower than the uppermost surface of the stage in the step where the needle member provided on the stage protrudes the curved surface. The method of claim 10,
The method of claim 1, wherein in the step of sucking the vacuum between the adhesive surface and the curved surface, the peripheral adhesive surface around the LED chip positioned on the needle member is bent and deformed in the curved surface direction. The method according to any one of claims 10 to 12,
And the gripper is positioned on the LED chip positioned above the needle member before the gripper sucks and transfers the LED chip.

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