CN217546636U - Suction nozzle and device with suction nozzle - Google Patents

Abstract

The application provides a suction nozzle and equipment that has the suction nozzle, the suction nozzle includes suction nozzle body and suction head, the suction nozzle body is connected with the suction head, the surface that the suction head deviates from the suction nozzle body has at least one absorption sand grip, the mounting hole has on the suction nozzle body, at least one suction hole has on the absorption sand grip, the suction hole runs through the suction head and adsorbs the sand grip, the suction head has first recess towards the surface of suction nozzle body, the suction hole is through first recess and installation Kong Qilu intercommunication, the suction hole is used for adsorbing the chip. The suction nozzle can adsorb the chip that the regional area of leaving white is less and the regional area of sensitization is great, has solved the limited problem of application scope of suction nozzle among the prior art.

Description

Suction nozzle and device with suction nozzle

Technical Field

The application relates to the technical field of chip installation, in particular to a suction nozzle and equipment with the suction nozzle.

Background

COB (Chip on Board) may be referred to as Chip on Board technology, in which Die Bonding (DB) is one of the processes of COB. Die bonding is to bond a chip to a Flexible Printed Circuit (FPC). Die bonding requires that a chip is sucked from a silicon wafer through a suction nozzle of die bonding equipment and transferred to an FPC with glue so as to fix the chip on the FPC.

The chip can have the sensitization region and be located the white region of sensitization region periphery side, current suction nozzle can include integrated into one piece's suction nozzle body and suction head, suction head and suction nozzle body intercommunication, closed annular suction inlet has on the suction head, annular suction inlet and the regional contact of white leaving and set up a week around the white region, annular suction inlet forms confined cavity jointly with this white region and sensitization region, solid brilliant equipment provides vacuum adsorption power through the suction nozzle body to the suction head to follow the chip absorption chip on the silicon chip. Due to the processing error of the suction nozzle and the suction error of the suction nozzle, the chip is required to have a sufficient margin area, and the area of the chip can be increased or the area of the photosensitive area can be reduced.

Thus, it is difficult for the suction nozzle to suck a chip having a small margin area and a large light sensing area. This results in a limited application range of the suction nozzle.

SUMMERY OF THE UTILITY MODEL

The application provides a suction nozzle and equipment that has the suction nozzle has solved the limited problem of application scope of suction nozzle among the prior art.

In a first aspect, the application provides a suction nozzle, the suction nozzle is used for adsorbing the chip, the suction nozzle includes suction nozzle body and suction head, the suction nozzle body is connected with the suction head, the surface that the suction head deviates from the suction nozzle body has at least one absorption sand grip, the mounting hole has on the suction nozzle body, at least one suction hole has on the absorption sand grip, the suction hole runs through the suction head and adsorbs the sand grip, the suction head has first recess towards the surface of suction nozzle body, the suction hole is through first recess and installation Kong Qilu intercommunication, the suction hole is used for adsorbing the chip.

In one possible implementation, the suction nozzle provided by the application has a shape matched with that of the chip.

In a possible implementation manner, the suction nozzle provided by the application has the advantages that the shape of the suction head is matched with that of the chip, and the suction raised line is in contact with the chip when the chip is sucked by the suction hole.

In a possible implementation manner, the suction nozzle provided by the present application, the adsorption convex strip is disposed on a side edge of the suction head deviating from the surface of the suction nozzle body, and an extending direction of the adsorption convex strip is consistent with an extending direction of a side edge of the suction head corresponding to the adsorption convex strip.

In a possible implementation manner, the present application provides a suction nozzle, wherein the suction ribs are arranged on one side edge of the suction head, and the number of the suction ribs is at least one.

In a possible implementation manner, the suction nozzle provided by the present application has the adsorption ribs arranged on two sides of the suction head, wherein the quantity of the adsorption ribs is at least two.

In a possible implementation manner, the present application provides a suction nozzle, wherein the suction ribs are arranged on three side edges of the suction head, wherein the number of the suction ribs is at least three.

In a possible implementation manner, the suction nozzle provided by the present application has at least two suction holes on each suction protrusion, and the suction holes are uniformly spaced along the extending direction of the suction protrusion.

In one possible implementation, the suction nozzle body and the suction head are connected in an inserting mode.

In a possible implementation manner, one side of the suction nozzle body, which faces the suction head, is provided with a second groove, and the mounting hole is communicated with the second groove;

at least part of the suction head is inserted into the second groove, and at least part of the outer side wall of the suction head is abutted against the inner side wall of the second groove.

In one possible implementation, the suction nozzle body and the suction head are in interference fit;

or the suction nozzle body and the suction head are bonded.

In a possible implementation manner, in the suction nozzle provided by the present application, the mounting hole is a step hole, the first groove is communicated with the small-diameter end of the step hole, the suction hole is communicated with the first groove, and an axis of the suction hole is parallel to an axis of the mounting hole.

In a second aspect, embodiments of the present application further provide an apparatus having a suction nozzle, including an apparatus body and the suction nozzle provided in the first aspect, which is connected to the apparatus body.

The suction nozzle that this application embodiment provided and the equipment that has the suction nozzle, the suction nozzle comprises suction nozzle body and suction head two parts, has the absorption sand grip on the suction head, sets up first recess on the surface of suction head towards the suction nozzle body, and first recess is used for communicateing the mounting hole on suction hole and the suction nozzle body on the suction head to provide the gas circuit intercommunication between suction hole and mounting hole, be used for adsorbing the chip. For prior art, adsorb the sand grip in this application and need not to set up a week around keeping white the region, the shared regional area of keeping white of adsorbing the sand grip is less. From this, the suction nozzle that this application embodiment provided can adsorb the less and great chip of photosensitive area of margin area, from this, has solved the limited problem of application scope of suction nozzle among the prior art.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

FIG. 1 is a diagram illustrating a chip structure in the prior art;

FIG. 2 is a schematic structural diagram of a nozzle provided in an embodiment of the present application;

FIG. 3 is a schematic view of an internal structure of a nozzle provided in an embodiment of the present application;

FIG. 4 is a schematic structural view of a suction head and a suction rib in a suction nozzle provided in an embodiment of the present application;

FIG. 5 is a view illustrating a usage status of a nozzle provided in an embodiment of the present application;

FIG. 6 is a first schematic view illustrating a position of an absorption protrusion strip in the suction nozzle according to the embodiment of the present application;

FIG. 7 is a state diagram of the use of FIG. 6;

FIG. 8 is a second schematic view illustrating a position of an adsorption protrusion strip in the suction nozzle according to the embodiment of the present application;

FIG. 9 is a state diagram of the use of FIG. 8;

FIG. 10 is a third schematic view illustrating a position of an adsorption protrusion in a nozzle according to an embodiment of the present application;

FIG. 11 is a fourth schematic view illustrating the positions of the suction ribs in the suction nozzle according to the embodiment of the present application;

FIG. 12 is a fifth schematic view illustrating a position of an adsorption rib in the suction nozzle according to the embodiment of the present application;

FIG. 13 is a state diagram of the use of FIG. 12;

FIG. 14 is a sixth schematic view illustrating the positions of the suction ribs in the suction nozzle according to the embodiment of the present application;

FIG. 15 is a state diagram of the use of FIG. 14;

FIG. 16 is a seventh schematic view illustrating a position of an adsorption rib in the suction nozzle according to the embodiment of the present application;

FIG. 17 is a state diagram of the use of FIG. 16;

FIG. 18 is an eighth schematic view illustrating a position of an adsorption rib in the suction nozzle according to the embodiment of the present application;

FIG. 19 is the use state diagram of FIG. 18;

FIG. 20 is a ninth schematic view illustrating a position of an adsorption rib in a suction nozzle according to an embodiment of the present application;

FIG. 21 is the use state diagram of FIG. 20;

fig. 22 is a schematic structural view of a nozzle body in a nozzle provided in an embodiment of the present application.

Description of reference numerals:

10-a chip;

11-a chip body;

12-pin;

13-a photosensitive region;

14-white space;

D ₁ -a first width;

D ₂ -a second width;

100-a nozzle body;

110-mounting holes;

111-a first via;

112-a second via;

120-a second groove;

200-a suction head;

220-a first groove;

300-adsorbing the convex strips;

310-suction hole.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

Moreover, the terms "first," "second," and the like, are used solely to distinguish similar objects and are not to be construed as indicating or implying relative importance or otherwise implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature.

The assembly of chips in the modules such as the camera of the mobile terminal and the fingerprint can adopt a Chip On Board (COB) technology. Among them, die Bonding (DB) is one of COB processes. Die bonding is to bond a chip to a Flexible Circuit board (FPC). The die bonding needs to suck the chip from the silicon wafer through a suction nozzle of die bonding equipment and transfer the chip to the FPC with glue, the suction nozzle puts the chip on the glue on the FPC, and the chip is fixed on the FPC through the glue.

Fig. 1 is a schematic diagram of a chip in the prior art. Referring to fig. 1, the chip 10 in the camera module or the fingerprint module of the mobile terminal may include a chip body 11, where the chip body 11 has a plurality of pins 12, each pin 12 forms a pin area, and a photosensitive area 13 is provided in an area surrounded by the pin areas.

Have higher requirement to chip 10's cleanliness in camera module or the fingerprint module, consequently, set up on chip 10 and leave blank area 14. During the chip suction, the suction nozzle is in contact with the margin region 14 of the chip 10 to avoid the photosensitive region 13, the pin region, and the edge of the chip 10, thereby preventing the chip 10 from being contaminated.

The suction nozzle of the die bonding equipment can comprise a suction nozzle body and a suction head communicated with the suction nozzle body, a closed annular suction port is arranged on the suction head, the annular suction port is in contact with the blank leaving area 14 and is arranged around the blank leaving area 14 for a circle, the annular suction port, the blank leaving area 14 and the photosensitive area 13 form a closed cavity together, and the die bonding equipment provides vacuum adsorption force for the suction head through the suction nozzle body so as to suck a chip on a silicon wafer with a plurality of chips.

It should be noted that a first region is formed between the edge of the photosensitive region 13 and the edge of the chip body 11, a second region is formed between the edge of the photosensitive region 13 and the edge of the pin, and the first region and the second region together form a ring of blank regions 14.

Please refer to fig. 1, in which the width of the first region is a first width D ₁ A first width D ₁ Is the distance between the edge of the photosensitive region 13 and the edge of the chip body 11; the width of the second region is a second width D ₂ A second width D ₂ Is the distance between the edge of the photosensitive area 13 and the edge of the pin 12. In the prior art, the suction nozzle is made of rubber and is formed by injection molding through a mold. The margin region 14 cannot be too small due to a processing error of the suction nozzle and a suction error of the suction nozzle in order to enable the suction nozzle to suck the chip, and the first width D is required ₁ Greater than or equal to 0.15mm and less than or equal to 0.2mm, a second width D ₂ Greater than or equal to 0.15mm and less than or equal to 0.2mm. If the chip is ensured to have enough margin area 14, the area of the chip can be increased or the area of the photosensitive area 13 can be reduced.

However, reducing the area of the light-sensing region 13 reduces the area ratio of the chip light-sensing region 13 to the entire chip body 11, which reduces the performance of the module. The whole area of increase chip can guarantee photosensitive region 13's area, nevertheless leads to the module cost to increase, and the whole size of corresponding module also can increase, is unfavorable for mobile terminal's miniaturization.

With the requirement of low cost and small size, the area occupation ratio of the light sensing area 13 of the chip 10 with the same specification is higher and higher, and the white space area 14 which can be sucked by the suction nozzle is smaller and smaller. Thus, the conventional suction nozzle is difficult to adsorb a chip with a small white remaining area and a large light sensing area. This results in a limited application range for the mouthpiece.

Based on this, this application provides a suction nozzle and has equipment of suction nozzle, and the suction nozzle can adsorb the less and great chip of sensitization regional area of leaving white region area, has solved the limited problem of application scope of suction nozzle among the prior art.

The present application will now be described with reference to the drawings and specific examples.

FIG. 2 is a schematic structural diagram of a nozzle provided in an embodiment of the present application; FIG. 3 is a schematic view of an internal structure of a nozzle provided in an embodiment of the present application; FIG. 4 is a schematic structural view of a suction head and a suction rib in a suction nozzle provided in an embodiment of the present application; fig. 5 is a use state diagram of a suction nozzle provided by the embodiment of the application. Referring to fig. 2 to 5, the embodiment of the present application provides a nozzle, the nozzle is used for adsorbing a chip 10, the nozzle includes a nozzle body 100 and a suction head 200, the nozzle body 100 is connected to the suction head 200, at least one adsorption rib 300 is provided on a surface of the suction head 200 facing away from the nozzle body 100, a mounting hole 110 is provided on the nozzle body 100, at least one suction hole 310 is provided on the adsorption rib 300, the suction hole 310 penetrates through the suction head 200 and the adsorption rib 300, a first groove 220 is provided on a surface of the suction head 200 facing the nozzle body 100, and the suction hole 310 is in air path communication with the mounting hole 110 through the first groove 220 for adsorbing the chip 10.

The chip 10 may have a regular shape such as a rectangular shape or a circular shape, or may have an irregular shape, and the chip 10 has a margin region 14 for easy suction. For convenience of description, the chip 10 is illustrated as a rectangle in the embodiments and the drawings of the present application.

In the present application, the suction nozzle may be connected to a device having a vacuum suction force, for example, the suction nozzle may be connected to a die bonder or a die bonder. The die bonder or the chip mounter is provided with an ejector rod, the suction nozzle is inserted into the ejector rod, and suction force is provided for the suction nozzle through the ejector rod.

Specifically, the ejector pin is inserted into the nozzle body 100. The mounting hole 110 may be a stepped hole including a first through hole 111 and a second through hole 112 coaxially communicating, an outer sidewall of the ejector pin abutting against an inner sidewall of the first through hole 111, the ejector pin providing a suction force to the second through hole 112. The inner diameter of the first through hole 111 may be larger than the inner diameter of the second through hole 112, and the ejector rod is inserted into the first through hole 111 with a larger aperture, thereby facilitating the insertion of the ejector rod with the nozzle body 100.

The first groove 220 is communicated with the second through hole 112, and the suction hole 310 is communicated with the first groove 220, so that the collection and the summarization of air flow are facilitated, and the stability of vacuum adsorption force is enhanced. Further, the axis of the suction hole 310 is parallel to the axis of the mounting hole 110. Thus, the resistance is reduced, and the vacuum adsorption force is enhanced.

In a specific implementation, the suction head 200 is further connected to the suction nozzle body 100, the suction convex strip 300 on the suction head 200 contacts the blank area 14, the first groove 220 is disposed on a surface of the suction head 200 facing the suction nozzle body 100, the first groove 220 is used for communicating the suction hole 310 with the second through hole 112, so as to provide air path communication between the suction hole 310 and the second through hole 112, and a suction force is applied to the blank area 14 of the chip 10 through the second through hole 112 and the suction hole 310 in sequence, so that, in a suction state, the first through hole 111, the second through hole 112, each suction hole 310 and the blank area 14 opposite to the suction hole 310 form a closed cavity together, thereby adsorbing the chip 10 on the suction head 200.

In the present application, the suction ribs 300 are located on the surface of the suction head 200 facing away from the nozzle body 100, wherein the suction ribs 300 can be integrally formed with the suction head 200. Thereby, the molding of the adsorption protrusion 300 is facilitated.

The suction nozzle provided by the embodiment of the application is composed of a suction nozzle body 100 and a suction head 200, wherein the suction head 200 is provided with a suction convex strip 300, a first groove 220 is arranged on the surface of the suction head 200 facing the suction nozzle body 100, and the first groove 220 is used for communicating a suction hole 310 with a mounting hole 110, so that an air path is provided between the suction hole 310 and the mounting hole 110 to communicate with a suction chip 10. For prior art, adsorb sand grip 300 in this application need not to set up a week around leaving white region 14, and the occupied leaving white region 14 area of adsorbing sand grip 300 is less. Therefore, the suction nozzle provided by the embodiment of the application can adsorb the chip 10 with a smaller area of the margin area 14 and a larger area of the photosensitive area 13, and therefore, the problem that the application range of the suction nozzle in the prior art is limited is solved.

In the present application, the shape of the suction head 200 is matched with the shape of the chip 10, and the suction ribs 300 are brought into contact with the chip 10 when the chip 10 is sucked by the suction holes 310.

The same silicon wafer has a plurality of chips 10, in order to facilitate the suction nozzle to suck the chips 10, in a specific implementation, the shape of the suction head 200 may be adaptively designed according to the shape of the chips 10, and when the suction holes 310 suck the chips 10, the suction convex strips 300 are in contact with the chips 10. In this way, alignment of the suction nozzle with the chip 10 is facilitated. Illustratively, the tip may be circular in shape equal to the diameter of the chip, or it may be rectangular in shape equal to the length and width of the chip. The shape of the suction head 200 may be matched with the shape of the chip 10, and the shape of the suction head 200 is not limited in this embodiment.

FIG. 6 is a first schematic view illustrating a position of an adsorption protrusion strip in a suction nozzle according to an embodiment of the present application; FIG. 7 is a state diagram of the use of FIG. 6; FIG. 8 is a second schematic view illustrating a position of an absorption protrusion strip in the suction nozzle according to the embodiment of the present application; FIG. 9 is a state diagram of the use of FIG. 8; FIG. 10 is a third schematic view illustrating a position of an adsorption protrusion in a nozzle according to an embodiment of the present application; FIG. 11 is a fourth schematic view illustrating a position of an absorption rib of the suction nozzle according to the embodiment of the present application; FIG. 12 is a fifth schematic view illustrating a position of an adsorption rib in the suction nozzle according to the embodiment of the present application; FIG. 13 is the use state diagram of FIG. 12; fig. 14 is a sixth schematic view illustrating positions of suction ribs in the suction nozzle according to the embodiment of the present application; FIG. 15 is a state diagram of the use of FIG. 14; FIG. 16 is a seventh schematic view illustrating a position of an adsorption rib in the suction nozzle according to the embodiment of the present application; FIG. 17 is the use state diagram of FIG. 16; FIG. 18 is an eighth schematic view illustrating a position of an adsorption rib in the suction nozzle according to the embodiment of the present application; FIG. 19 is the use state diagram of FIG. 18; FIG. 20 is a ninth schematic view illustrating a position of an adsorption rib in a suction nozzle according to an embodiment of the present application; fig. 21 is a state diagram of fig. 20 in use.

It should be noted that, when the surface of the suction head deviating from the suction nozzle body is provided with the adsorption convex strip, the adsorption convex strip can be arranged on the side edge of the suction head, the adsorption convex strip can be flush with the side surface of the suction head, and the adsorption convex strip can also be arranged at a certain distance from the side edge of the suction head or the side surface of the suction head. Wherein the distance can be adaptively set according to the size of the chip. For convenience of describing the extending direction of the adsorption ribs, the adsorption ribs are disposed on the side of the tip.

Referring to fig. 6 to 21, in the present application, the suction ribs 300 are provided on the side of the suction head 200 facing away from the surface of the nozzle body 100, and the extending direction of the suction ribs 300 coincides with the extending direction of the side of the suction head 200 corresponding to the suction ribs 300. For example, when the tip 200 has a rectangular shape, the suction ribs 300 corresponding to the width direction of the tip 200 may extend in the width direction of the tip 200, and the suction ribs 300 corresponding to the length direction of the tip 200 may extend in the length direction of the tip 200. Thus, when the shape of the suction head 200 is matched with the shape of the chip 10, the suction ribs 300 on the suction head 200 are brought into contact with the margin areas 14.

When the nozzle 200 is rectangular, the direction in which the side of the nozzle 200 extends is the X-direction or the Y-direction in fig. 6, the X-direction in fig. 6, 8, 10 to 12, 14, 16, 18 and 20 is the longitudinal direction of the nozzle 200, and the Y-direction in fig. 6, 8, 10 to 12, 14, 16, 18 and 20 is the width direction of the nozzle 200.

The extending direction of one adsorption convex strip 300 can be consistent with the length direction of the suction head 200, the extending direction of the other adsorption convex strip 300 can be consistent with the width direction of the suction head 200, and in the specific design, the practical selection can be performed according to the whole size of the chip 10, as long as the adsorption chip 10 which enables the suction nozzle to be stable can be used, and the embodiment is not limited herein.

Next, the arrangement of the adsorption beads 300 will be described.

The adsorption ribs 300 are provided on one side of the suction head 200, wherein the number of the adsorption ribs 300 is at least one.

In a possible implementation manner, the suction ribs 300 may be arranged as shown in fig. 6, and the light-sensing regions 13 in the chips 10 sucked by the suction nozzles may extend along the remaining side of the suction head 200, i.e., the light-sensing regions 13 in the chips 10 sucked by the suction nozzles may extend toward at least one of the + X direction, + Y direction, and-Y direction in fig. 7, so as to increase the areas of the light-sensing regions 13. While fig. 6 shows the suction ribs 300 disposed along one side of the suction head 200 in the width direction, it will be understood that the suction ribs may be disposed along the other side of the suction head in the width direction.

Referring to fig. 10, two or more adsorption protrusions 300 may be provided at intervals on the same side in the width direction of the tip 200.

In another possible implementation manner, the suction ribs 300 may be arranged as shown in fig. 8, in which case the light sensing regions 13 in the chip 10 sucked by the suction nozzle may extend along the remaining side of the suction head 200, i.e., the light sensing regions 13 in the chip 10 sucked by the suction nozzle may extend toward at least one of the + X direction, -X direction and-Y direction in fig. 9, so as to increase the area of the light sensing regions 13. While fig. 8 shows the suction ribs 300 disposed along one side of the length of the tip 200, it will be appreciated that the suction ribs may be disposed along the other side of the length of the tip.

Referring to fig. 11, two or more adsorption protrusions 300 may be provided at intervals on the same side in the longitudinal direction of the tip 200.

The adsorption ribs 300 are provided on both sides of the suction head 200, wherein the number of the adsorption ribs 300 is at least two.

In one possible implementation, the suction ribs 300 may be oppositely disposed as shown in fig. 12 and 14, i.e., disposed on two opposite sides of the suction head, so that the suction function is more symmetrically stabilized. At this time, the light sensing regions 13 in the chip 10 sucked by the suction nozzle may be extended toward both the + X direction and the-X direction in fig. 13 to increase the area of the light sensing regions 13. The light sensing regions 13 in the chip 10 sucked by the suction nozzle may be extended toward both the + Y direction and the-Y direction in fig. 15 to increase the area of the light sensing regions 13.

In another possible implementation, as shown in FIG. 16, two vertical sides of the suction head 200 may be provided with suction ribs 300. At this time, the light sensing region 13 in the chip 10 sucked by the suction nozzle may be extended toward both the + X direction and the-Y direction in fig. 17.

It will be appreciated that in addition to FIG. 16, the other two perpendicular sides of the tip may be provided with suction ribs. At this time, the light sensing area in the chip sucked by the suction nozzle may extend toward the side of the suction head where the suction ribs are not provided.

It is possible to realize that two or more suction ribs 300 may be provided at intervals on the same side of the tip 200.

The adsorption ribs 300 are provided on three sides of the suction head 200, wherein the number of the adsorption ribs 300 is at least three.

As shown in FIGS. 18 and 20, the suction ribs 300 are provided on three sides of the tip 200, respectively. At this time, the light sensing region 13 in the chip 10 sucked by the suction nozzle may be extended toward the-Y direction in fig. 19. The light sensing region 13 in the chip 10 sucked by the suction nozzle may extend in the + Y direction in fig. 21.

It will be appreciated that in addition to FIGS. 18 and 20, the other three sides of the tip may be provided with suction beads. At this time, the light sensing area in the chip sucked by the suction nozzle may extend toward the side of the suction head where the suction ribs are not provided.

Wherein, two or more adsorption protrusions 300 may be provided at intervals on the same side of the suction head 200.

With continued reference to fig. 2, 3 and 6, in the suction nozzle provided in the embodiment of the present application, each of the suction ribs 300 has at least two suction holes 310, and the suction holes 310 are uniformly spaced along the extending direction of the suction ribs 300. By uniformly providing the plurality of suction holes 310, suction points of the suction nozzle and the chip 10 are increased, so that the suction nozzle can apply uniform suction force to the chip 10.

Fig. 22 is a schematic structural view of a nozzle body in a nozzle provided in an embodiment of the present application. Referring to fig. 3 to 5 and 22, in the present application, the nozzle body 100 and the suction head 200 are connected by plugging. The nozzle body 100 and the suction head 200 are connected by a plug-in manner, thereby facilitating the connection of the suction head 200 to the nozzle body 100.

In a specific implementation, one surface of the nozzle body 100 facing the suction head is provided with a second groove 120, the mounting hole 110 is communicated with the second groove 120, at least part of the suction head 200 is inserted into the second groove 120, and at least part of the outer side wall of the suction head 200 abuts against the inner side wall of the second groove 120.

In the present application, the suction head may be partially inserted into the second recess, as shown in FIG. 3, and the suction head 200 may be fully inserted into the second recess 120, thereby increasing the stability of the installation of the suction head 200. As long as the insertion of the suction head 200 with the nozzle body 100 is ensured.

When the suction head 200 is inserted into the second recess 120, the outer side wall of the suction head 200 abuts against the inner side wall of the second recess 120, so that a gap between the suction head 200 and the second recess 120 can be prevented from being generated, thereby affecting the suction force of the suction hole 310.

The groove bottom of the second recess 120 may be a flat surface, and the surface of the suction head 200 facing the nozzle body 100 may be a flat surface, and when the suction head 200 is inserted into the second recess 120, the surface of the suction head 200 facing the nozzle body 100 abuts against the groove bottom of the second recess 120, thereby increasing the stability of the connection of the suction head 200 with the nozzle body 100. Meanwhile, the groove bottom of the second groove 120 provides a positioning reference for the installation of the suction head 200, and when the surface of the suction head 200 facing the suction nozzle body 100 is abutted against the groove bottom of the second groove 120, the insertion operation of the suction head 200 and the suction nozzle body 100 is completed.

Specifically, the suction head 200 is in interference fit with the second groove 120; alternatively, the nozzle body 100 and the suction head 200 are bonded. Thereby, the suction head 200 is fixed to the suction nozzle body 100.

It is realized that when the suction head 200 is inserted into the nozzle body 100, i.e. when the suction head 200 is inserted into the second recess 120 of the nozzle body 100, the outer side wall of the suction head 200 is bonded to the inner side wall of the second recess 120, and/or the surface of the suction head 200 facing the nozzle body 100 is bonded to the bottom of the second recess 120. The suction nozzle body can also be inserted on the suction head, and the outer side wall of the suction nozzle body is adhered to the inner side wall of the suction head.

The embodiment of the application also provides equipment with the suction nozzle, which comprises an equipment body and the suction nozzle connected with the equipment body and provided by the embodiment.

The structure and the usage of the suction nozzle are described in detail in the above embodiments, and are not described in detail herein.

It should be noted that the device with the suction nozzle may be a die bonder or a chip mounter. The device body can comprise a workbench, a vacuum assembly, a push rod and the like, wherein the workbench is used for respectively placing the flexible circuit board and the silicon chip with a plurality of chips, the vacuum assembly is used for providing vacuum suction force for the push rod, the push rod is communicated with the mounting hole 110 of the suction nozzle, and the suction force is provided for the chip through the mounting hole 110 and the suction hole 310 so as to suck the chip on the silicon chip and transfer the chip to the flexible circuit board.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (12)

1. A suction nozzle is characterized in that the suction nozzle is used for adsorbing a chip and comprises a suction nozzle body and a suction head, wherein the suction nozzle body is connected with the suction head, at least one adsorption raised line is arranged on the surface of the suction head, which is far away from the suction nozzle body, the suction nozzle body is provided with a mounting hole, and the adsorption raised line is provided with a suction hole; the suction hole penetrates through the suction head and the adsorption convex strip, a first groove is formed in the surface, facing the suction nozzle body, of the suction head, the suction hole is communicated with the installation Kong Qilu through the first groove, and the suction hole is used for adsorbing the chip.

2. The suction nozzle as claimed in claim 1, wherein the suction head has a shape matching a shape of the chip, and the suction ribs are in contact with the chip when the suction hole sucks the chip.

3. The suction nozzle according to claim 2, wherein said suction ribs are provided on a side of said suction head facing away from a surface of said nozzle body, and an extending direction of said suction ribs coincides with an extending direction of a side of said suction head corresponding to said suction ribs.

4. The suction nozzle as claimed in claim 3, wherein the suction ribs are provided on one side edge of the suction head, wherein the number of the suction ribs is at least one.

5. The suction attachment according to claim 3, wherein said suction ribs are provided on both side edges of said suction head, wherein the number of said suction ribs is at least two.

6. The suction attachment as claimed in claim 3, wherein the suction ribs are provided on three sides of the suction head, wherein the number of the suction ribs is at least three.

7. A suction nozzle according to any one of claims 1 to 6, wherein each of said suction ribs has at least two of said suction holes, said suction holes being arranged at regular intervals along an extending direction of said suction rib.

8. A nozzle according to any one of claims 1 to 6, wherein said nozzle body and said nozzle head are plug-in connected.

9. A suction nozzle as claimed in claim 8, wherein a face of the nozzle body facing the suction head has a second recess, the mounting aperture communicating with the second recess;

at least part of the suction head is inserted into the second groove, and at least part of the outer side wall of the suction head is abutted to the inner side wall of the second groove.

10. The suction nozzle as set forth in claim 9 wherein said nozzle body and said suction head are an interference fit;

or, the suction nozzle body is adhered to the suction head.

11. The suction nozzle according to any one of claims 1 to 6, wherein said mounting hole is a stepped hole, said first recess communicates with a small-diameter end of said stepped hole, said suction hole communicates with said first recess, and an axis of said suction hole is parallel to an axis of said mounting hole.

12. An appliance having a suction nozzle, characterized by comprising an appliance body and the suction nozzle of any one of claims 1 to 11 connected to the appliance body.

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