CN113727533A - 一种连接件及led显示屏 - Google Patents
一种连接件及led显示屏 Download PDFInfo
- Publication number
- CN113727533A CN113727533A CN202010450048.8A CN202010450048A CN113727533A CN 113727533 A CN113727533 A CN 113727533A CN 202010450048 A CN202010450048 A CN 202010450048A CN 113727533 A CN113727533 A CN 113727533A
- Authority
- CN
- China
- Prior art keywords
- welding
- connecting piece
- connector
- groove
- weld
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 claims abstract description 168
- 229910000679 solder Inorganic materials 0.000 claims abstract description 22
- 230000000694 effects Effects 0.000 abstract description 9
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 description 17
- 230000004907 flux Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 230000001965 increasing effect Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1178—Means for venting or for letting gases escape
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010450048.8A CN113727533A (zh) | 2020-05-25 | 2020-05-25 | 一种连接件及led显示屏 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010450048.8A CN113727533A (zh) | 2020-05-25 | 2020-05-25 | 一种连接件及led显示屏 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN113727533A true CN113727533A (zh) | 2021-11-30 |
Family
ID=78671688
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010450048.8A Pending CN113727533A (zh) | 2020-05-25 | 2020-05-25 | 一种连接件及led显示屏 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113727533A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115249679A (zh) * | 2022-09-22 | 2022-10-28 | 江苏长电科技股份有限公司 | 芯片封装结构及其制作方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07288375A (ja) * | 1994-04-19 | 1995-10-31 | Murata Mfg Co Ltd | 回路基板 |
JPH11312545A (ja) * | 1998-04-28 | 1999-11-09 | Nippon Seiki Kk | 接続部材およびこの接続部材を用いた計器装置 |
JP3083783U (ja) * | 2001-08-01 | 2002-02-15 | 鴻海精密工業股▲ふん▼有限公司 | プローブ式電気コネクタ |
US6623283B1 (en) * | 2000-03-08 | 2003-09-23 | Autosplice, Inc. | Connector with base having channels to facilitate surface mount solder attachment |
US20080237302A1 (en) * | 2005-07-28 | 2008-10-02 | Sharp Kabushiki Kaisha | Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure |
CN101336042A (zh) * | 2007-06-29 | 2008-12-31 | 鸿富锦精密工业(深圳)有限公司 | 焊盘、具有该焊盘的电路板和电子装置 |
TW200924586A (en) * | 2007-11-28 | 2009-06-01 | Delta Electronics Inc | Circuit board module with surface mount conductive pin and circuit boards assembly having same |
CN206851145U (zh) * | 2017-07-03 | 2018-01-05 | 北京京东方光电科技有限公司 | 一种电路板、电气元件和显示装置 |
CN212183839U (zh) * | 2020-05-25 | 2020-12-18 | 深圳市大族元亨光电股份有限公司 | 一种连接件及led显示屏 |
-
2020
- 2020-05-25 CN CN202010450048.8A patent/CN113727533A/zh active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07288375A (ja) * | 1994-04-19 | 1995-10-31 | Murata Mfg Co Ltd | 回路基板 |
JPH11312545A (ja) * | 1998-04-28 | 1999-11-09 | Nippon Seiki Kk | 接続部材およびこの接続部材を用いた計器装置 |
US6623283B1 (en) * | 2000-03-08 | 2003-09-23 | Autosplice, Inc. | Connector with base having channels to facilitate surface mount solder attachment |
JP3083783U (ja) * | 2001-08-01 | 2002-02-15 | 鴻海精密工業股▲ふん▼有限公司 | プローブ式電気コネクタ |
US20080237302A1 (en) * | 2005-07-28 | 2008-10-02 | Sharp Kabushiki Kaisha | Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure |
CN101336042A (zh) * | 2007-06-29 | 2008-12-31 | 鸿富锦精密工业(深圳)有限公司 | 焊盘、具有该焊盘的电路板和电子装置 |
TW200924586A (en) * | 2007-11-28 | 2009-06-01 | Delta Electronics Inc | Circuit board module with surface mount conductive pin and circuit boards assembly having same |
CN206851145U (zh) * | 2017-07-03 | 2018-01-05 | 北京京东方光电科技有限公司 | 一种电路板、电气元件和显示装置 |
CN212183839U (zh) * | 2020-05-25 | 2020-12-18 | 深圳市大族元亨光电股份有限公司 | 一种连接件及led显示屏 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115249679A (zh) * | 2022-09-22 | 2022-10-28 | 江苏长电科技股份有限公司 | 芯片封装结构及其制作方法 |
CN115249679B (zh) * | 2022-09-22 | 2023-01-31 | 江苏长电科技股份有限公司 | 芯片封装结构及其制作方法 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Country or region after: China Address after: 518000: floors 1-6, 1-2 and 3-4, building a, Yongwei Industrial Park, No. 118, Yongfu Road, Qiaotou community, Fuhai street, Bao'an District, Shenzhen, Guangdong Province Applicant after: Shenzhen Yaham Optoelectronics Co.,Ltd. Address before: 518000: floors 1-6, 1-2 and 3-4, building a, Yongwei Industrial Park, No. 118, Yongfu Road, Qiaotou community, Fuhai street, Bao'an District, Shenzhen, Guangdong Province Applicant before: YAHAM OPTOELECTRONICS Co.,Ltd. Country or region before: China |