CN113649298A - Full-automatic wafer sorting machine - Google Patents

Full-automatic wafer sorting machine Download PDF

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Publication number
CN113649298A
CN113649298A CN202110965992.1A CN202110965992A CN113649298A CN 113649298 A CN113649298 A CN 113649298A CN 202110965992 A CN202110965992 A CN 202110965992A CN 113649298 A CN113649298 A CN 113649298A
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CN
China
Prior art keywords
power mechanism
wafer
axis power
base frame
clamp
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Granted
Application number
CN202110965992.1A
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Chinese (zh)
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CN113649298B (en
Inventor
卢国强
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Shenzhen Yougen Technology Co ltd
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Shenzhen Yougen Technology Co ltd
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Priority to CN202110965992.1A priority Critical patent/CN113649298B/en
Publication of CN113649298A publication Critical patent/CN113649298A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/361—Processing or control devices therefor, e.g. escort memory
    • B07C5/362—Separating or distributor mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/38—Collecting or arranging articles in groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C2501/00—Sorting according to a characteristic or feature of the articles or material to be sorted
    • B07C2501/0063—Using robots
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The utility model relates to a full-automatic wafer sorting machine, relate to wafer sorting machine's technical field, the power distribution box comprises a box body, it places the platform to be provided with in the box, it is provided with the sorting mechanism who is used for selecting separately the crystalline grain to place the bench, it is provided with fixture to place the bench, fixture is last to be provided with anchor clamps one and anchor clamps two, anchor clamps one and anchor clamps two are arranged in moving in the box and move the wafer to sorting mechanism, it can dismantle to be connected with unsorted piece magazine and categorised empty/full dish magazine to place the bench, fixture is arranged in moving the wafer among the unsorted piece magazine to sorting mechanism, fixture is arranged in moving the wafer after sorting to categorised empty/full dish magazine. This application has the effect of the efficiency of the wafer of the separation of promotion.

Description

Full-automatic wafer sorting machine
Technical Field
The application relates to the technical field of wafer sorting machines, in particular to a full-automatic wafer sorting machine.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, the wafer sorting machine is used for sorting crystal grains, after the crystal grains are sorted by the wafer sorting machine, the crystal grains with similar processing quality can be arranged on an empty wafer ring, further, the photoelectric characteristics of the newly formed wafer are more stable, and different wafers can be moved to different positions and collected by the wafer sorting machine.
The related wafer sorting machine comprises a box body, a clamping mechanism, a sorting mechanism, an unsorted sheet material box and a sorted empty/full sheet material box, wherein an opening is formed in the box body, a door body is connected to the box body in a rotating mode and used for plugging the opening of the box body and sealing the box body, so that dust is reduced to enter the box body and affect the performance of wafers, the clamping mechanism and the sorting mechanism are arranged in the box body, the unsorted sheet material box and the sorted empty/full sheet material box are detachably connected in the box body, a user places randomly distributed wafers in the unsorted sheet material box, the unsorted sheet material box is arranged in the box body, the clamping mechanism can automatically move and clamp the wafers in the unsorted sheet material box, the wafers are moved to the sorting mechanism through the clamping mechanism, the sorting mechanism picks out randomly distributed crystal grains according to data input by the user and arranges the sorting mechanism on another wafer ring, and therefore the processing quality of the crystal grains on the wafer rings is close to each other wafer ring, and finishing the sorting.
The above related technical solutions have the following drawbacks: in the process of wafer sorting, the clamping mechanism needs to move in the box body, the time required by wafer conveying is long, and the sorting efficiency is low.
Disclosure of Invention
In order to improve the efficiency of sorting wafers, the application provides a full-automatic wafer sorting machine.
The application provides a full-automatic wafer sorting machine adopts following technical scheme:
the utility model provides a full-automatic wafer sorting machine, the power distribution box comprises a box body, be provided with in the box and place the platform, it is provided with the sorting mechanism who is used for selecting separately the crystalline grain to place the bench, it is provided with fixture I to place the bench, fixture I and fixture II are provided with, fixture I and fixture II are arranged in moving in the box and move the wafer to sorting mechanism, it can dismantle and be connected with unsorted piece magazine and categorised empty/full dish magazine to place the bench, fixture is arranged in moving the wafer in the unsorted piece magazine to sorting mechanism, fixture is arranged in moving the wafer after sorting to categorised empty/full dish magazine.
By adopting the technical scheme, through setting up the placing table in the box, make unsorted piece magazine and categorised empty/full dish magazine can set up placing the bench, through placing bench and setting up sorting mechanism, make sorting mechanism can select separately the crystalline grain on the wafer, the wafer after the selection is put into different categorised empty/full dish magazines according to processingquality and photoelectric property, and then play the effect of selecting separately the wafer, through setting up fixture on placing the bench, set up anchor clamps one and anchor clamps two on fixture, make fixture can drive anchor clamps one and anchor clamps two and remove, and then make anchor clamps one and anchor clamps two can both the centre gripping and carry the wafer, fixture can carry two piece wafer removal simultaneously, and then reduce and remove a large amount of wafer required time, reach the effect that promotes wafer sorting efficiency.
Optionally, the clamping mechanism comprises an X-axis power mechanism and a Y-axis power mechanism, the Z-axis power mechanism I and the Z-axis power mechanism II are connected, the X-axis power mechanism is arranged above the placing table in a hanging mode, the Y-axis power mechanism is connected to the X-axis power mechanism and used for driving the Y-axis power mechanism to slide, the sliding direction of the Y-axis power mechanism is parallel to that of the placing table, a base frame is arranged on the Y-axis power mechanism and used for driving the base frame to slide, the sliding direction of the base frame is parallel to that of the placing table, the sliding direction of the base frame is perpendicular to that of the X-axis power mechanism, the Z-axis power mechanism I and the Z-axis power mechanism II are arranged on the base frame, the Z-axis power mechanism I is connected with the clamp I, the clamp I slides along the direction close to and far away from the placing table through the Z-axis power mechanism I, the Z-axis power mechanism II is connected with the clamp II, and the clamp II slides along the direction close to and far away from the placing table through the Z-axis power mechanism II.
Through adopting above-mentioned technical scheme, through making unsettled setting of X axle power mechanism place the bench side, make Y axle power mechanism connect on X axle power mechanism, make X axle power mechanism can drive Y axle power mechanism reciprocating motion on the horizontal direction, through set up the bed frame on Y axle power mechanism, make the bed frame can move placing the bench side through X axle power mechanism and Y axle power mechanism, through set up Z axle power mechanism one and Z axle power mechanism two on the bed frame, thereby make anchor clamps one and anchor clamps two can follow bed frame length direction reciprocating motion, and then make anchor clamps one and anchor clamps two can be close to and keep away from and place the bench side and move, reach the effect of pressing from both sides and getting the wafer and moving up, X axle power mechanism and Y axle power mechanism can move the wafer on anchor clamps one and the anchor clamps two at this moment.
Optionally, the X-axis power mechanism is set as a linear motor, the linear motor includes a stator and a rotor, the stator is disposed above the placing table, the stator is parallel to the placing table, the rotor is slidably connected to the stator near one side of the placing table, and the rotor is connected to the Y-axis power mechanism.
Through adopting above-mentioned technical scheme, set up linear electric motor through placing the platform top, make the active cell be connected with Y axle power mechanism to make Y axle power mechanism can follow stator length direction reciprocating motion, reach the effect of removal anchor clamps one and anchor clamps two.
It is optional, Y axle power mechanism includes the base plate, the driving gear, driven gear, the area body and slide, the base plate is fixed on the active cell, the base plate is perpendicular with the stator, the base plate with place the platform parallel, driving gear and driven gear rotate to be connected on the base plate, driving gear and driven gear's line is parallel with the base plate, driving gear and driven gear all cooperate with the area body, slide sliding connection is on the base plate, the slip direction and the base plate of slide are parallel, slide and area body fixed connection, be provided with self-locking motor on the driving gear, self-locking motor passes through the driving gear and drives the area body rotation, and then make slide reciprocating motion on the base plate, the bed frame is fixed on the slide.
Through adopting above-mentioned technical scheme, through connecting the base plate on the stator, set up driving gear and driven gear on the base plate, the user can rotate through auto-lock motor control driving gear, and then makes the area body rotate on the base plate, through sliding connection slide on the base plate, makes slide and area body coupling, and the user can rotate through the control area body, and then makes the slide reciprocal slip on the base plate, plays the effect of removing anchor clamps one and anchor clamps two.
Optionally, the first Z-axis power mechanism comprises a first driving wheel, a first driven wheel, a first belt and a first mounting plate, the first driving wheel and the first driven wheel are rotatably connected to the base frame, a connecting line of the first driving wheel and the first driven wheel is parallel to the length direction of the base frame, the first belt is sleeved on the first driving wheel and the first driven wheel, the first mounting plate is slidably connected to the base frame, the sliding direction of the first mounting plate is parallel to the length direction of the base frame, and the first mounting plate is fixed to the first belt.
Through adopting above-mentioned technical scheme, through set up action wheel one on the bed frame and follow driving wheel one, make the belt one set establish action wheel one and follow driving wheel one on, and then make the area body can rotate on the bed frame, through sliding connection mounting panel one on the bed frame, make anchor clamps fixed connection on mounting panel one to make mounting panel one can slide on the bed frame through belt one, reach the effect of control anchor clamps position.
Optionally, a protective sleeve ring is arranged on the base frame, a gap exists between the protective sleeve ring and the base frame, and the first clamp and the second clamp are arranged in the protective sleeve ring.
By adopting the technical scheme, the first clamp and the second clamp are arranged in the protective sleeve ring by arranging the protective sleeve ring on the base frame, so that the protective sleeve ring has the effect of protecting the wafer, when the first clamp clamps the wafer and moves into the protective sleeve ring, the protective sleeve ring can be sleeved outside the wafer and protects the wafer, and the probability that a user bumps the wafer when replacing an unclassified wafer material box and a classified empty/full material box is reduced.
Optionally, be provided with a plurality of direction runners on the bed frame, the direction runner includes connecting plate and a plurality of wheel body, and the wheel body rotates to be connected on the connecting plate, and the connecting plate setting is on the bed frame, and the wheel body is used for the butt on the wafer lateral wall.
Through adopting above-mentioned technical scheme, through setting up a plurality of connecting plates on the bed frame, make the wheel body rotate to be connected on the connecting plate to when making anchor clamps one and two centre gripping wafers of anchor clamps, the lateral wall of wafer can the butt on the wheel body, makes the direction runner play limiting displacement, when anchor clamps one and two insert sorting mechanism with the wafer and loosen the wafer, can make the vertical whereabouts of wafer under the effect of direction runner, crooked probability when reducing the wafer whereabouts.
Optionally, the two sides of the sorting mechanism are respectively provided with a selecting module and a binding module, the selecting module and the binding module are used for placing the wafer, and the first clamp slides through the first Z-axis power mechanism and inserts the wafer into the selecting module and the binding module.
Through adopting above-mentioned technical scheme, select the module and bind the module through setting up on sorting mechanism, make and select the module and can be used for depositing unsorted wafer, fixture can take out unsorted wafer from the unsorted sheet stock casket, fixture can take out fast through rectilinear movement and be located the wafer ring of selecting the module and binding on the module, reaches the effect of raising efficiency.
Optionally, the length direction of the connecting line of the selecting module and the binding module is parallel to the length direction of the stator.
By adopting the technical scheme, the connecting line length of the selecting module and the binding module is parallel to the length direction of the stator, when the clamping mechanism needs to replace the wafer bound on the binding module, the wafer can be moved on the stator through the rotor, the response of the Y-axis power mechanism is reduced, and the wafer replacing efficiency of the clamping mechanism can be improved.
To sum up, the beneficial technical effect of this application does:
1. the placing table is arranged in the box body, so that an unclassified wafer material box and a classified empty/full tray material box can be arranged on the placing table, the sorting mechanism is arranged on the placing table, so that grains on a wafer can be sorted by the sorting mechanism, the sorted wafer can be placed into different classified empty/full tray material boxes according to the processing quality and the photoelectric characteristic, and then the effect of sorting the wafer is achieved;
2. the protective sleeve ring is arranged on the base frame, so that the first clamp and the second clamp are arranged in the protective sleeve ring, the protective sleeve ring has the effect of protecting the wafer, when the first clamp clamps the wafer and moves into the protective sleeve ring, the protective sleeve ring can be sleeved outside the wafer and protects the wafer, and the probability that a user collides the wafer when replacing an unclassified wafer material box and a classified empty/full wafer material box is reduced;
3. through set up a plurality of connecting plates on the bed frame, make the wheel body rotate to be connected on the connecting plate to when making anchor clamps one and anchor clamps two centre gripping wafer, the lateral wall of wafer can the butt on the wheel body, makes the direction runner play limiting displacement, when anchor clamps one and anchor clamps two insert sorting mechanism with the wafer and loosen the wafer, can make the wafer vertical whereabouts under the effect of direction runner, crooked probability when reducing the wafer whereabouts.
Drawings
Fig. 1 is a schematic overall structure diagram of an embodiment of the present application.
Fig. 2 is a schematic view of an installation structure of a clamping mechanism according to an embodiment of the present application.
Fig. 3 is an enlarged schematic view of a portion a in fig. 2.
Fig. 4 is a schematic structural diagram of a clamping mechanism according to an embodiment of the present application.
Fig. 5 is a schematic structural view of a Y-axis power mechanism according to an embodiment of the present application.
Fig. 6 is a schematic view of an installation structure of the first Z-axis power mechanism according to the embodiment of the present application.
Fig. 7 is an enlarged schematic view of a portion a in fig. 6.
Fig. 8 is a schematic view of an installation structure of a first driving motor according to an embodiment of the present application.
Reference numerals: 1. a box body; 11. a placing table; 12. a door body; 2. a clamping mechanism; 20. a frame body; 21. an X-axis power mechanism; 211. a stator; 212. a mover; 22. a Y-axis power mechanism; 221. a substrate; 222. a driving gear; 2221. a self-locking motor; 223. a driven gear; 224. a belt body; 225. a slide plate; 230. a base frame; 231. a Z-axis power mechanism I; 2311. a first driving wheel; 2312. a driven wheel I; 2313. a first belt; 2314. a first mounting plate; 2315. driving a motor I; 232. a Z-axis power mechanism II; 2321. a second driving wheel; 2322. a second driven wheel; 2323. a second belt; 2324. a second mounting plate; 2325. a second driving motor; 241. a first clamp; 242. a second clamp; 25. a protective collar; 26. a guide runner; 261. a connecting plate; 262. a wheel body; 3. a sorting mechanism; 31. selecting a module; 311. a first groove; 32. a binding module; 321. a second groove; 4. an unclassified sheet magazine; 5. sorted empty/full tray magazines; 6. the sorting tray is not full of tray boxes.
Detailed Description
The present application is described in further detail below with reference to figures 1-8.
The embodiment of the application discloses a full-automatic wafer sorting machine. Referring to fig. 1 and 2, the portable air conditioner comprises a case body 1, wherein the case body 1 is vertically arranged on the ground, and a cavity is formed in the case body 1. The side wall of the box body 1 is provided with an opening, the box body 1 is rotatably connected with a door body 12, the door body 12 can rotate and plug the opening of the box body 1, and then the cavity of the box body 1 is closed, so that dust is reduced to enter the box body 1. The box body 1 is provided with a placing platform 11, and the placing platform 11 is horizontally fixed in the box body 1.
Referring to fig. 2 and 3, the sorting mechanism 3 is disposed on the upper surface of the placing table 11, the selecting module 31 and the binding module 32 are disposed on the placing table 11, and the selecting module 31 and the binding module 32 are disposed on two sides of the sorting mechanism 3, respectively. The selecting module 31 is used for installing wafers to be selected, the wafers to be selected comprise a wafer ring and a plurality of grains which are in mixed distribution of multiple types, round holes are formed in the wafer ring, the grains are distributed in the round holes in an arrayed mode, a blue film is pasted on the wafer ring and has viscosity, and the grains are pasted on the blue film. The binding module 32 is used for installing a crystal grain-free wafer ring, the sorting mechanism 3 can select a vacuum adsorption device, the sorting mechanism 3 can adsorb crystal grains on a wafer to be sorted, the crystal grains are moved to the wafer ring on the binding module 32, and then the crystal grains are bonded in the wafer ring without the crystal grains, so that the crystal grains with similar processing quality are arranged in the wafer ring on the binding module 32, and the purpose of sorting is achieved.
Referring to fig. 1 and 2, a clamping mechanism 2 is disposed on the upper surface of a placing table 11, an unsorted wafer magazine 4, a sorted empty/full magazine 5 and a plurality of sorted-tray unfilled-magazine 6 are detachably connected to the upper surface of the placing table 11, the unsorted wafer magazine 4 is used for placing unsorted wafers, and the sorted empty/full magazine 5 is used for placing empty wafer rings without crystal grains. The chucking mechanism 2 can take out unsorted wafers and empty wafer rings and mount them in the sorting mechanism 3, and mount specific-grade crystal grains in the randomly distributed wafers in the empty wafer rings. In this embodiment, six sorting tray underfilled tray magazines 6 may be provided, and the clamping mechanism 2 may pick out the dies according to six photoelectric characteristic standards and install the dies in the empty wafer ring, and respectively install the wafer rings with different grades of dies in the sorting tray underfilled tray magazines 6. After the sorting of the crystal grains of one grade is finished, the clamping mechanism 2 moves the crystal ring provided with the sorted crystal grains to the sorting tray less full tray box 6, and takes out a second empty crystal ring from the sorted empty/full tray box 5, so that the sorting mechanism 3 can mount the crystal grains of the next grade on the crystal ring. With the sorting, the number of hollow wafer rings in the sorted empty/full tray 5 is gradually reduced, at this time, the sorting mechanism 3 continuously installs the crystal grains in the unsorted wafers in different wafer rings until the same grade of crystal grains are arranged on the wafer rings and a new sorted wafer is formed, the clamping mechanism 2 puts the sorted wafers into the empty slots of the sorted empty/full tray 5 at this time, so that the sorted empty/full tray 5 can collect the sorted wafers, the user can continuously replace the sorted empty/full tray 5, the empty wafer rings can be continuously put into the clamping mechanism 2 and can be taken out by the clamping mechanism 2, and meanwhile, the sorted wafers can be taken out and processed in the next step. Along with the processing, the wafers to be sorted in the unsorted wafer magazine 4 are gradually sorted, so that no crystal grains exist in the wafer ring in the unsorted wafer magazine 4, and a user can take out and replace the unsorted wafer magazine 4, so that a new wafer to be sorted can be placed in the box body 1, and the sorting mechanism 3 can continuously sort the crystal grains.
Referring to fig. 1 and 2, a chucking mechanism 2 is suspended above an unsorted sheet cassette 4 and a sorted empty/full tray cassette 5, and the chucking mechanism 2 is used for chucking wafers in the unsorted sheet cassette 4 and inserting the wafers to be sorted into a sorting module 31. The clamping mechanism 2 is used for clamping and moving the wafers in the unsorted wafer cassette 4, so that the wafers in the unsorted wafer cassette 4 can be installed on the selecting module 31 or moved back to the unsorted wafer cassette 4, the clamping mechanism 2 can clamp and move the wafer rings in the sorted disc unfilled wafer cassette 6, the wafer rings without crystal grains can be installed on the binding module 32, and after a sufficient number of crystal grains are installed in the wafer rings without crystal grains, the clamping mechanism 2 can move the wafer rings to the specific sorted empty/full wafer cassette 5. The process is repeated by the clamping mechanism 2, so that the unsorted crystal grains in the unsorted wafer cassette 4 can be arranged in the same wafer ring according to the processing quality, and the wafer ring is classified and collected according to the processing quality, thereby completing the sorting.
Referring to fig. 4 and 5, the chucking mechanism 2 includes an X-axis power mechanism 21, a Y-axis power mechanism 22, and a Z-axis power mechanism including a first Z-axis power mechanism 231 and a second Z-axis power mechanism 232. Two frame bodies 20 are fixed on the upper surface of the placing table 11 through bolts, and the frame bodies 20 are oppositely arranged on two opposite side edges of the placing table 11. The X-axis power mechanism 21 is horizontally disposed on the frame body 20, and both ends of the X-axis power mechanism 21 are respectively fixed on one frame body 20, so that the X-axis power mechanism 21 is suspended above the placing table 11. The X-axis power mechanism 21 includes a linear module, the linear module may select a linear motor, the linear motor includes a stator 211 and a mover 212, two ends of the stator 211 in the length direction are respectively fixed on the frame body 20, the mover 212 is slidably connected to the stator 211, and the mover 212 is located below the stator 211. The Y-axis power mechanism 22 is fixed to the mover 212. The user can move the Y-axis power mechanism 22 over the placing table 11 through the X-axis power mechanism 21, and then the Y-axis power mechanism 22 is moved to above the selecting module 31 and the binding module 32 and holds the wafer.
Referring to fig. 4 and 5, the Y-axis power mechanism 22 includes a base 221, a driving gear 222, a driven gear 223, a belt 224, and a slider 225, and the base 221 is horizontally disposed and fixedly coupled to the mover 212. The longitudinal direction of the substrate 221 is perpendicular to the longitudinal direction of the stator 211. The driving gear 222 and the driven gear 223 are rotatably coupled to the base plate 221, and a line connecting the driving gear 222 and the driven gear 223 is parallel to a longitudinal direction of the base plate 221. The belt body 224 is sleeved on the driving gear 222 and the driven gear 223, gear teeth are arranged on the inner ring of the belt body 224, and the driving gear 222 and the driven gear 223 are clamped with the belt body 224. The driving gear 222 is provided with a self-locking motor 2221, the self-locking motor 2221 is a stepping motor, so that the precision of the Y-axis power mechanism is improved, a shell of the self-locking motor 2221 is fixed on the substrate 221, and an output shaft of the self-locking motor 2221 penetrates through the substrate 221 and is coaxially connected to the driving gear 222. The user can rotate the belt 224 on the base plate 221 through the driving gear 222 by controlling the self-locking motor 2221 to rotate forward and backward. The slide plate 225 is slidably coupled to a lower surface of the base plate 221, and a sliding direction of the slide plate 225 is parallel to a longitudinal direction of the base plate 221. The sliding plate 225 is fixedly connected to the strap 224 by means of bonding or clipping, and when the self-locking motor 2221 rotates, the sliding plate 225 can move through the strap 224, thereby achieving an effect of reciprocating the sliding plate 225 on the substrate 221 along the length direction of the substrate 221.
Referring to fig. 6 and 7, a base frame 230 is disposed on the sliding plate 225, the base frame 230 is a rectangular plate structure, the base frame 230 is used for mounting a first Z-axis power mechanism 231 and a second Z-axis power mechanism 232, and the length directions of the stator 211 and the substrate 221 are perpendicular to the length direction of the base frame 230. The first Z-axis power mechanism 231 and the second Z-axis power mechanism 232 are respectively disposed on two opposite surfaces of the base frame 230. The connecting line of the first Z-axis power mechanism 231 and the second Z-axis power mechanism 232 is parallel to the length direction of the stator 211. The first Z-axis power mechanism 231 is provided with a first clamp 241, and the second Z-axis power mechanism 232 is provided with a second clamp 242. The first clamp 241 and the second clamp 242 can be selected from a finger cylinder. The first Z-axis power mechanism 231 is used for driving the first clamp 241 to move on the base frame 230, the sliding direction of the first clamp 241 on the base frame 230 is parallel to the length direction of the base frame 230, and the first clamp 241 can move above the placing table 11 through the first X-axis power mechanism 21, the first Y-axis power mechanism 22 and the first Z-axis power mechanism 231, so that the wafer clamping effect is achieved. The second Z-axis power mechanism 232 is used for driving the second clamp 242 to slide on the base frame 230, the sliding direction of the second clamp 242 on the base frame 230 is parallel to the length direction of the base frame 230, and the second clamp 242 can move above the placing table 11 through the X-axis power mechanism 21, the Y-axis power mechanism 22 and the second Z-axis power mechanism 232 and clamp the wafer.
Referring to fig. 6 and 8, the first Z-axis power mechanism 231 includes a first driving wheel 2311, a first driven wheel 2312, a first belt 2313 and a first mounting plate 2314, the first driving wheel 2311 and the first driven wheel 2312 are rotatably connected to the base frame 230, a connecting line of the first driving wheel 2311 and the first driven wheel 2312 is parallel to the base frame 230, the first belt 2313 is sleeved on the first driving wheel 2311 and the first driven wheel 2312, the first driving wheel 2311 and the first driven wheel 2312 are gears, gear teeth are formed in the inner ring of the first belt 2313, and the first driving wheel 2311 and the first driven wheel 2312 are meshed with the first belt 2313 through the gear teeth. The driving wheel I2311 is provided with a driving motor I2315, the driving motor I2315 is set to be a self-locking motor, and the self-locking motor is set to be a stepping motor. The shell of the first driving motor 2315 is fixed on the base frame 230, and the output shaft of the first driving motor 2315 is coaxially connected to the first driving wheel 2311. The first mounting plate 2314 is slidably connected to the base frame 230, and the sliding direction of the first mounting plate 2314 is parallel to the length direction of the base frame 230. The first mounting plate 2314 is fixed to the first strap 2313. A user can control the first driving motor 2315 to rotate forwards and reversely to enable the first belt 2313 to rotate through the first driving wheel 2311, and further enable the first mounting plate 2314 to slide on the base frame 230. The first clamping devices 241 are fixedly connected to the first mounting plate 2314, and the first clamping devices 241 can be close to or far away from the placing table 11 through the first mounting plate 2314, so that the effect of clamping wafers is achieved.
Referring to fig. 7 and 8, the second Z-axis power mechanism 232 includes a second driving wheel 2321, a second driven wheel 2322, a second belt 2323 and a second mounting plate 2324, the second driving wheel 2321 and the second driven wheel 2322 are rotatably connected to a side surface of the base frame 230 away from the first driving wheel 2311, and a connection line of the second driving wheel 2321 and the second driven wheel 2322 is parallel to the length direction of the base frame 230. The second belt 2323 is sleeved on the second driving wheel 2321 and the second driven wheel 2322. The second driving wheel 2321 and the second driven wheel 2322 are gears, gear teeth are formed in the inner ring of the second belt 2323, and both the second driving wheel 2321 and the second driven wheel 2322 are meshed with the second belt 2323. A second driving motor 2325 is arranged on the base frame 230, the second driving motor 2325 is a self-locking motor, the housing of the second driving motor 2325 is fixed on the base frame 230, and the output shaft of the second driving motor 2325 is coaxially connected to the second driving wheel 2321. The second mounting plate 2324 is slidably connected to the base frame 230, and a sliding direction of the second mounting plate 2324 is parallel to a length direction of the base frame 230. The second mounting plate 2324 is fixed on the second belt 2323, and a user can control the second belt 2323 to rotate through the second driving motor 2325, so that the second mounting plate 2324 fixed on the second belt 2323 can reciprocate on the base frame 230. The surface of one side, far away from the first clamp 241, of the second mounting plate 2324 is provided with a plurality of second clamps 242, and the second clamps 242 can be close to or far away from the placing table 11 through the second mounting plate 2324, so that the effect of clamping the wafer is achieved.
Referring to fig. 4, a protection collar 25 is fixedly connected to the base frame 230, the protection collar 25 is sleeved outside the base frame 230, a gap exists between the protection collar 25 and the base frame 230, and the first clamp 241 and the second clamp 242 are arranged in the protection collar 25. The protective collar 25 is fixed to the base frame 230 by welding. The protective ring 25 has the effect of protecting the wafer, when the first clamp 241 and the second clamp 242 clamp the wafer and move upwards, the wafer can be located in the protective ring 25, and at the moment, when a user replaces the unsorted wafer cassette 4 and the sorted empty/full wafer cassette 5, the probability of impacting the wafer can be reduced, and the wafer is further protected.
Referring to fig. 4, a plurality of guide rollers 26 are disposed on the base frame 230, each guide roller 26 includes a connecting plate 261 and a plurality of rollers 262, two rollers 262 are rotatably connected to each connecting plate 261, and a connecting line of the rollers 262 is parallel to the length direction of the base frame 230. The guide wheels 26 are disposed on two opposite surfaces of the base frame 230, and the first clamp 241 and the second clamp 242 are both provided with connecting plates 261, so that when the first clamp 241 and the second clamp 242 clamp the wafer to move upwards, the wafer can move vertically between the two connecting plates 261, and at this time, two sidewalls of the wafer abut against the wheel 262. The wheel body 262 plays a role in guiding and limiting, the wheel body 262 can clamp the wafer and enable the wafer to be located at a fixed position on the base frame 230, when the first clamp 241 and the second clamp 242 loosen the wafer, and the wafer is inserted into the selecting module 31, the wheel body 262 can clamp the wafer, so that the probability of wafer position deviation during wafer clamping is reduced, the probability of the wafer being inserted into the selecting module 31 in a skew mode is reduced, and the wafer can be smoothly inserted into the selecting module 31, the binding module 32, the unsorted wafer material box 4 and the sorted empty/full wafer material box 5.
Referring to fig. 3, the selecting module 31 is formed with a first recess 311, and the wafer is inserted into the first recess 311, so that the wafer can be fixed on the selecting module 31. The length direction of the first groove 311 is perpendicular to the placing table 11, and the first clamp 241 can vertically move through the first Z-axis power mechanism 231 and insert the wafer into the first groove 311. The binding module 32 is provided with a second groove 321, and the opening direction of the second groove 321 is parallel to the opening direction of the first groove 311.
The implementation principle of the embodiment of the application is as follows: through placing platform 11 in box 1, set up sorting mechanism 3 on placing platform 11, and then make sorting mechanism 3 can select separately and insert the wafer in binding module 32, through setting up fixture 2 on placing platform 11, set up anchor clamps 241 and anchor clamps two 242 on fixture 2, thereby make anchor clamps 241 and anchor clamps two 242 all can freely remove and centre gripping wafer on three degree of freedom, anchor clamps 241 and anchor clamps two 242 all can centre gripping wafer ring, thereby make fixture 2 can carry two wafer ring removals simultaneously, and then promote fixture 2 and remove the efficiency of wafer.
The embodiments of the present invention are preferred embodiments of the present application, and the scope of protection of the present application is not limited by the embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (9)

1. The utility model provides a full-automatic wafer sorter which characterized in that: the wafer sorting device comprises a box body (1), a placing table (11) is arranged in the box body (1), a sorting mechanism (3) used for sorting crystal grains is arranged on the placing table (11), a clamping mechanism (2) is arranged on the placing table (11), a first clamp (241) and a second clamp (242) are arranged on the clamping mechanism (2), the first clamp (241) and the second clamp (242) are used for moving in the box body (1) and moving wafers into the sorting mechanism (3), an unsorted sheet material box (4) and a classified empty/full material box (5) are detachably connected to the placing table (11), the clamping mechanism (2) is used for moving the wafers in the unsorted sheet material box (4) into the sorting mechanism (3), and the clamping mechanism (2) is used for moving the sorted wafers into the classified empty/full material box (5).
2. The fully automatic wafer handler of claim 1, wherein: the clamping mechanism (2) comprises an X-axis power mechanism (21), a Y-axis power mechanism (22), a Z-axis power mechanism I (231) and a Z-axis power mechanism II (232), the X-axis power mechanism (21) is arranged above the placing table (11) in a suspended mode, the Y-axis power mechanism (22) is connected to the X-axis power mechanism (21), the X-axis power mechanism (21) is used for driving the Y-axis power mechanism (22) to slide, the sliding direction of the Y-axis power mechanism (22) is parallel to the placing table (11), a base frame (230) is arranged on the Y-axis power mechanism (22), the Y-axis power mechanism (22) is used for driving the base frame (230) to slide, the sliding direction of the base frame (230) is parallel to the placing table (11), the sliding direction of the base frame (230) is perpendicular to the sliding direction of the X-axis power mechanism (21), the Z-axis power mechanism I (231) and the Z-axis power mechanism II (232) are arranged on the base frame (230), the first Z-axis power mechanism (231) is connected with the first clamp (241), the first clamp (241) slides in the direction close to and far away from the placing table (11) through the first Z-axis power mechanism (231), the second Z-axis power mechanism (232) is connected with the second clamp (242), and the second clamp (242) slides in the direction close to and far away from the placing table (11) through the second Z-axis power mechanism (232).
3. The fully automatic wafer handler of claim 2, wherein: the X-axis power mechanism (21) is set to be a linear motor, the linear motor comprises a stator (211) and a rotor (212), the stator (211) is arranged above the placing table (11), the stator (211) is parallel to the placing table (11), the rotor (212) is connected to one side, close to the placing table (11), of the stator (211) in a sliding mode, and the rotor (212) is connected with the Y-axis power mechanism (22).
4. The fully automatic wafer handler of claim 3, wherein: the Y-axis power mechanism (22) comprises a substrate (221), a driving gear (222), a driven gear (223), a belt body (224) and a sliding plate (225), the substrate (221) is fixed on a rotor (212), the substrate (221) is perpendicular to a stator (211), the substrate (221) is parallel to a placing table (11), the driving gear (222) and the driven gear (223) are rotatably connected onto the substrate (221), a connecting line of the driving gear (222) and the driven gear (223) is parallel to the substrate (221), the driving gear (222) and the driven gear (223) are both matched with the belt body (224), the sliding plate (225) is slidably connected onto the substrate (221), the sliding direction of the sliding plate (225) is parallel to the substrate (221), the sliding plate (225) is fixedly connected with the belt body (224), a self-locking motor (2221) is arranged on the driving gear (222), the self-locking motor (2221) drives the belt body (224) to rotate through the driving gear (222), further, the slide plate (225) is reciprocated on the base plate (221), and the base frame (230) is fixed to the slide plate (225).
5. The fully automatic wafer handler of claim 4, wherein: the first Z-axis power mechanism (231) comprises a first driving wheel (2311), a first driven wheel (2312), a first belt (2313) and a first mounting plate (2314), the first driving wheel (2311) and the first driven wheel (2312) are rotatably connected to the base frame (230), a connecting line of the first driving wheel (2311) and the first driven wheel (2312) is parallel to the length direction of the base frame (230), the first belt (2313) is sleeved on the first driving wheel (2311) and the first driven wheel (2312), the first mounting plate (2314) is slidably connected to the base frame (230), the sliding direction of the first mounting plate (2314) is parallel to the length direction of the base frame (230), and the first mounting plate (2314) is fixed to the first belt (2313).
6. The fully automatic wafer handler of claim 2, wherein: a protective sleeve ring (25) is arranged on the base frame (230), a gap exists between the protective sleeve ring (25) and the base frame (230), and the first clamp (241) and the second clamp (242) are arranged in the protective sleeve ring (25).
7. The fully automatic wafer handler of claim 6, wherein: the wafer polishing device is characterized in that a plurality of guide rotating wheels (26) are arranged on the base frame (230), each guide rotating wheel (26) comprises a connecting plate (261) and a plurality of wheels (262), each wheel (262) is rotatably connected to the corresponding connecting plate (261), each connecting plate (261) is arranged on the base frame (230), and each wheel (262) is used for abutting against the side wall of a wafer.
8. The fully automatic wafer handler of claim 3, wherein: sorting mechanism (3) both sides are provided with respectively and select module (31) and bind module (32), select module (31) and bind module (32) and be used for placing the wafer, and anchor clamps (241) slide and insert the wafer and select module (31) and bind module (32) through Z axle power mechanism (231).
9. The fully automatic wafer handler of claim 8, wherein: the length direction of the connecting line of the selecting module (31) and the binding module (32) is parallel to the length direction of the stator (211).
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