TWM615156U - Chip mapping-sorter - Google Patents

Abstract

This model discloses a wafer sorting machine, which includes: a cabinet, a first carrier ring bearing, a second carrier ring bearing, a picking device, a working platform, and a carrier ring pick-and-place device; the carrier ring pick-and-place device includes a driving element and two Transfer arms, the two transfer arms are both installed on the drive element, and each transfer arm can move independently under the drive of the drive element to transfer and place the wafer picking area and the carrier ring sorting area The wafer carrier ring. The wafer sorter provided by the new model can realize the rapid replacement of the wafer carrier ring by setting two transfer arms that can be independently controlled, thereby shortening the replacement time of the wafer carrier ring and improving the wafer carrier ring compared with the existing single-arm wafer sorter. The loading efficiency of the wafer carrier ring.

Description

Wafer sorter

The model belongs to the technical field of sorting and picking equipment, and specifically relates to a wafer sorting machine.

Before wafers are cut into wafers, the wafers on the wafer carrier ring are usually tested with probes, and the wafers are classified according to their electrical, optical, and appearance characteristics, and different types of wafers Its location (Mapping) is recorded in the controller of the probe equipment or the defective product is marked, and then the wafer is placed on the wafer carrier ring, and the aforementioned cutting process is performed to cut the wafer into multiple individual wafers.

Then, the chip sorter (Chip Mapping-Sorter) neatly sorts and arranges the same type of wafers on the film of another wafer carrier ring according to the position information of the wafers provided by the probe equipment to facilitate the subsequent process The operation of the equipment.

In the entire wafer sorting process, the carrier ring pick-and-place device needs to be used many times to transfer the wafer carrier ring between the wafer picking area and the carrier ring classification area. However, the carrier ring pick-up device of the existing wafer sorter The placement device has only a single transfer arm, and can only perform a single transfer and place action at a time (only one of the pick and place actions can be performed), which results in every time the wafer carrier ring is transferred and placed , The transfer arm needs to reciprocate back and forth to pick and place the wafer carrier ring, and the work efficiency is low.

Therefore, in view of the above technical problems, it is necessary to provide a new wafer sorter.

The purpose of the present invention is to provide a wafer sorter with high efficiency in transferring and placing the wafer carrier ring to solve the problems in the prior art.

In order to achieve the above purpose, the technical solution provided by the present invention is as follows: A wafer sorter, which can be used for picking wafers on a wafer carrier ring, includes: a cabinet with a working chamber in which a wafer picking area and a carrier ring classification area are arranged; a first carrier ring bearing is provided In the wafer picking area and used to carry the first wafer carrier ring; the second carrier ring holder is arranged in the wafer picking area and used to carry the second wafer carrier ring; the picking device is arranged in the wafer picking area and used to carry the The wafers on the first wafer carrier ring on the first carrier ring holder are picked up to the second wafer carrier ring carried on the second carrier ring holder; the working platform is set in the working chamber and is used The first carrier ring bearing and the second carrier ring bearing are placed; the carrier ring pick-and-place device is set in the working chamber and includes a drive element and two transfer arms, both of which are installed on the On the driving element, each transfer arm can move independently under the driving of the driving element to transfer and place the wafer carrier ring in the wafer picking area and the carrier ring sorting area.

Further, the transfer arm includes an extension rod and a clamping head for clamping the wafer carrier ring. The first end of the extension rod is mounted on the driving element and can be moved under the driving of the driving element. The fetching head is installed on the second end of the extension rod.

Further, the clamping head includes a base, a clamping member, and an air cylinder for driving the clamping member. The base is fixedly installed on the second end of the extension rod, the air cylinder is fixed on the base, and the The clamping piece is connected with the piston rod of the air cylinder and can perform the clamping action under the drive of the air cylinder.

Further, the clamping member has two clamping parts, and the clamping parts can be opened and closed under the driving of the air cylinder to take and place the wafer carrier ring.

Further, the driving element includes a translation mechanism and a lifting mechanism, the lifting mechanism is installed on the translation mechanism and can move laterally under the drive of the translation mechanism, and the first end of the extension rod is installed on the lifting mechanism and can be Driven by the lifting mechanism, it moves longitudinally.

Further, the cabinet includes a casing and a cabinet door installed on the casing, and the casing and the cabinet door jointly enclose a working chamber of the cabinet.

Further, an air filter fan set is provided on the top plate of the housing, the air filter fan set is in communication with the working chamber of the cabinet, and the air filter fan set filters the outside air through the air filter fan set and blows it into The working chamber.

Further, the bottom plate of the housing is provided with a plurality of exhaust holes for exhausting the gas in the working chamber.

Further, the first ring bearing seat and the second ring bearing seat are arranged opposite to each other, and the picking device is arranged between the first ring bearing seat and the second ring bearing seat.

Further, the picking device includes a rotating mechanism and a wafer picking arm arranged on the rotating mechanism, and the wafer picking arm can be positioned between the first carrier ring bearing and the second carrier ring bearing under the rotation of the rotating mechanism Rotate so that the wafer picking arm can pick the wafers on the first wafer carrier ring to the second wafer carrier ring.

Compared with the prior art, the wafer sorter provided by the present invention can realize rapid replacement of the wafer carrier ring by setting two transfer arms that can be independently controlled, thereby shortening the wafer load compared to the existing single-arm wafer sorter. The replacement time of the ring improves the loading efficiency of the wafer carrier ring.

1: Cabinet

11: shell

12: cabinet door

13: working chamber

131: Wafer picking area

132: Carrying ring classification area

21: The first carrier ring bearing

22: The second carrier ring bearing

3: picking device

31: Rotating mechanism

32: Wafer picking arm

33: Vacuum nozzle

4: Work platform

41: The first carrier ring box

42: second carrier ring box

43: Rotating table

44: Vent

5: Carrying ring pick and place device

51: drive element

511: translation mechanism

512: Lifting mechanism

52: transfer arm

521: Extension Rod

522: Gripping Head

522a: Pedestal

522b: Clamping

522c: Cylinder

522d: Clip part

6: Air filter fan group

71: The first chip carrier ring

72: second wafer carrier ring

8: chip

In order to more clearly describe the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed in the description of the embodiments. Obviously, the drawings in the following description are only some of the embodiments recorded in the present application. For those with ordinary knowledge in the technical field, they can also obtain other drawings based on these drawings without paying creative labor.

Fig. 1 is a three-dimensional structural diagram of a preferred embodiment of the present invention; Fig. 2 is an internal view of the embodiment shown in Fig. 1; Fig. 3 is a structural diagram of the transfer arm in the embodiment shown in Fig. 1; Fig. 4 is Fig. 1 The structure diagram of the picking device in the illustrated embodiment.

Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the drawings. However, these implementations do not limit the present invention, and the structural, method, or functional changes made by those skilled in the art based on these implementations are all included in the protection scope of the present invention.

It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or can also exist in the middle of the component. When an element is considered to be "connected" to another element, it can be directly connected to the other element or may be present in both at the same time. In the illustrated embodiment, the direction indications, namely up, down, left, right, front and back, etc., are relative for Explain that the structure and movement of the different parts of the new model are relative. These representations are appropriate when the parts are in the positions shown in the figures. However, if the description of the component location changes, it is considered that these representations will also change accordingly.

Unless otherwise defined, all technical and scientific terms used herein have the same meanings commonly understood by those with ordinary knowledge in the technical field to which the present invention belongs. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The term "and/or" as used herein includes any and all combinations of one or more related listed items.

Please refer to FIG. 1, the wafer sorter in a preferred embodiment of the present invention can be used to pick the wafers on the wafer carrier ring. The wafer sorter includes: a cabinet 1, a first carrier ring holder 21, a first carrier ring The second carrier ring bearing 22, the picking device 3, the working platform 4 and the carrier ring pick-and-place device 5.

The cabinet 1 has a working chamber 13 in which a wafer picking area 131 and a carrier ring sorting area 132 are provided. The wafer picking area 131 is located on one side of the carrier ring sorting area 132.

The first carrier ring holder 21 is provided in the wafer picking area 131 in the working chamber 13 and is used to carry the first wafer carrier ring 71, and the first wafer carrier ring 71 can be used to place the wafer 8 to be sorted. The second carrier ring holder 22 is also provided in the wafer picking area 131 in the working chamber 13 and is used to carry the second wafer carrier ring 72, which can be used to place and pick from the first wafer carrier ring 71 Removed wafer.

The picking device 3 is arranged in the wafer picking area 131 and is used for picking the wafers on the first wafer carrier ring 71 carried on the first carrier ring holder 21 to the second wafers carried on the second carrier ring holder 22载环72上。 Carrying ring 72.

Please refer to FIGS. 1 and 2 at the same time. The ring-carrying pick-and-place device 5 is set in the working chamber 13 and includes a driving element 51 and two transfer arms 52. The two transfer arms 52 are both mounted on the drive element 51. In addition, each transfer arm 52 can move independently under the drive of the driving element 51 to transfer and place the wafer carrier rings in the wafer picking zone 131 and the carrier ring sorting zone 132. By providing two independently controllable transfer arms 52, one of the transfer arms 52 can be taken out first when replacing the wafer carrier rings on the first carrier ring holder 21 or the second carrier ring holder 22 The wafer carrier ring to be replaced on the first carrier ring holder 21 or the second carrier ring holder 22 is then placed on the first carrier ring holder 21 or the wafer carrier ring to be replaced by another transfer arm 52 Compared with the existing single-arm wafer sorter, the replacement time of the wafer carrier ring is shortened and the loading efficiency of the wafer carrier ring is improved.

In an exemplary embodiment, the transfer arm 52 includes an extension rod 521 and a clamping head 522 for clamping a wafer carrier ring. The first end of the extension rod 521 is mounted on the driving element 51 and can be mounted on the driving element Moving under the driving of 51, the gripping head 522 is mounted on the second end of the extension rod 521 and can move with the movement of the extension rod 521.

Please refer to FIG. 3, the clamping head 522 includes a base 522a, a clamping member 522b, and an air cylinder 522c for driving the clamping member 522b. Wherein, the base 522a is fixedly installed on the second end of the extension rod 521, and the air cylinder 522c is fixedly installed on the base 522a, and the clamping member 522b can be driven by the air cylinder 522c to perform a clamping action. The clamping member 522b has two clamping portions 522d, and the two clamping portions 522d can be opened and closed under the driving of the air cylinder 522c to clamp or place the wafer carrier ring.

Please refer to FIGS. 1 and 2 again. Specifically, the driving element 51 includes a translation mechanism 511 and a lifting mechanism 512. The lifting mechanism 512 is mounted on the translation mechanism 511, that is, the lifting mechanism 512 can be driven by the translation mechanism 511. Lateral movement; the first end of the extension rod 521 is mounted on the lifting mechanism 512, that is, the extension rod 521 can move longitudinally under the drive of the lifting mechanism 512, so that the extension rod 521 can be driven by the driving element 51 to achieve horizontal or longitudinal movement . By driving the extension rod 521 by the driving element 51, the clamping head 522 can be moved to the wafer picking area 131 and the carrier ring sorting area 132 to clamp and transfer the wafer carrier rings in the two areas. The preferred selection of the translation mechanism 511 and the lifting mechanism 512 is a guide rail type driving mechanism.

In an exemplary embodiment, the cabinet 1 includes a cuboid-shaped housing 11 and a cabinet door 12 hingedly mounted on the housing 11. The housing 11 and the cabinet door 12 jointly enclose a working cavity of the cabinet 1. Room 13. A transparent glass window is provided on the cabinet door 12 of the cabinet 1 so that the staff can observe the situation in the working chamber 13 through the glass window.

Specifically, an air filter fan group 6 is provided on the top plate of the housing 11, and the air filter fan group 6 is in communication with the working chamber 13 of the cabinet 1, and external air is blown into the air filter fan group 6, and then passes through The air filter fan group 6 enters the working chamber 13 of the cabinet 1. The high efficiency air filter (HEPA) can be selected in the air filter fan group 6.

Specifically, the working platform 4 of the housing 11 is provided with a plurality of exhaust holes 44 for exhausting the gas in the working chamber 13, and the gas in the working chamber 13 of the cabinet 1 can be exhausted through the setting of the exhaust holes 44 , So as to maintain a dust-free working environment in the working chamber 13.

In an exemplary embodiment, the first ring bearing seat 21 and the second ring bearing seat 22 are arranged opposite to each other, so that the first ring bearing seat 21 and the second ring bearing seat 22 carried on the first ring bearing The wafer placement surfaces of the wafer carrier ring 71 and the second wafer carrier ring 72 can be arranged in parallel and opposite to each other on the work platform 4.

4, the picking device 3 includes a rotating mechanism 31 and a wafer picking arm 32 provided on the rotating mechanism 31. The rotating mechanism 31 can rotate around a center of rotation, and the wafer picking arm 32 can rotate on the rotating mechanism 31. Under the action, it rotates between the first carrier ring bearing 21 and the second carrier ring bearing 22, so that the wafer picking arm 32 can load the wafer on the first wafer carrier ring 71 carried on the first carrier ring bearing 21 The wafers are picked up on the second wafer carrier ring 72 carried on the second carrier ring holder 22.

Specifically, one end of the wafer picking arm 32 of the picking device 3 is connected to the rotating mechanism 31, and the other end of the wafer picking arm 32 has a vacuum nozzle 33, which is used to remove the wafer on the first wafer carrier ring 71. The wafers are picked up and then rotated to the second wafer carrier ring 72 to place the picked wafers on the second wafer carrier ring 72.

In an exemplary embodiment, a rotating table 43 is provided on the work platform for placing and rotating the first carrier ring box 41 of the first wafer carrier ring 71 (the wafer carrier ring to be sorted) and the first carrier box 41 for placing the second wafer The second carrier ring box 42 of the carrier ring 72 (the wafer carrier ring with blank adhesive film), so as to realize the classification and placement of the first wafer carrier ring 71 and the second wafer carrier ring 72. A plurality of first wafer carrier rings 71 can be placed in the first ring carrier box 41 in advance, and a plurality of second wafer carrier rings 72 can be placed in the second ring carrier box 42 in advance.

The following is a further explanation of the present invention in conjunction with specific working scenarios: During the sorting operation of the wafers on a certain first wafer carrier ring 71 (the wafer carrier ring to be sorted), you can first control a transfer arm 52 to move The next first wafer carrier ring 71 to be replaced is moved to the top of the first carrier ring holder 21 in advance. When the first wafer carrier ring 71 on the first carrier ring holder 21 has completed the sorting operation, it needs to be replaced. In the case of a first wafer carrier ring 71, the first wafer carrier ring 71 to be replaced on the first carrier ring holder 21 is taken out by controlling the other transfer arm 52, and after removal, the first wafer carrier ring 71 to be replaced is controlled to be clamped. The transfer arm 52 of the wafer carrier puts the first wafer to be replaced on the first carrier ring holder 21, which can quickly complete the replacement of the first wafer carrier ring 71, thereby shortening the first wafer carrier ring 71 Replacement time.

The replacement process of the second wafer carrier ring 72 (the wafer carrier ring with blank adhesive film) is similar to that of the first wafer carrier ring 71, and will not be repeated here.

In summary, the wafer sorter provided by the present invention can realize rapid replacement of the wafer carrier ring by providing two independently controllable transfer arms 52, thereby shortening the wafer carrier ring compared with the existing single-arm wafer sorter. Change the time and improve the loading efficiency of the wafer carrier ring.

For those with ordinary knowledge in the technical field, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description, so it is intended to fall within the claims. All changes within the meaning and scope of the equivalent elements of are included in this new model.

In addition, it should be understood that although this specification is described in accordance with the embodiments, not each embodiment only contains an independent technical solution. This narration in the specification is only for clarity, and those with ordinary knowledge in the technical field should Taking the description as a whole, the technical solutions in the various embodiments can also be appropriately combined to form other embodiments that can be understood by those with ordinary knowledge in the technical field.

1: Cabinet

11: shell

12: cabinet door

13: working chamber

131: Wafer picking area

132: Carrying ring classification area

21: The first carrier ring bearing

22: The second carrier ring bearing

3: picking device

4: Work platform

41: The first carrier ring box

42: second carrier ring box

43: Rotating table

44: Vent

5: Carrying ring pick and place device

6: Air filter fan group

71: The first chip carrier ring

72: second wafer carrier ring

8: chip

Claims (10)

A wafer sorter, which can be used to pick wafers on a wafer carrier ring, is characterized by comprising: a cabinet with a working chamber in which a wafer picking area and a carrier ring classification area are arranged; a first carrier ring carrier Seat, arranged in the wafer picking area and used for carrying the first wafer carrier ring; second carrier ring holder, arranged in the wafer picking area and used for carrying the second wafer carrier ring; picking device, arranged in the wafer picking area and used for Pick up the wafers on the first wafer carrier ring carried on the first carrier ring holder to the second wafer carrier ring carried on the second carrier ring holder; the working platform is arranged in the working chamber , Used to place the first carrier ring bearing and the second carrier ring bearing; the carrier ring pick-and-place device is set in the working chamber, and includes a drive element and two transfer arms, both of which are It is installed on the driving element, and each of the transfer arms is individually moved under the drive of the driving element to transfer and place the wafer carrier rings in the wafer picking area and the carrier ring sorting area. The wafer sorter according to claim 1, wherein the transfer arm includes an extension rod and a gripping head for gripping the wafer carrier ring, and the first end of the extension rod is mounted on the driving element and It can be moved under the drive of the driving element, and the gripping head is installed on the second end of the extension rod. The wafer sorter according to claim 2, wherein the gripping head includes a base, a gripping member, and an air cylinder for driving the gripping member, and the base is fixedly installed on the second extension rod. At the end, the air cylinder is fixed on the base, and the clamping piece is connected with the piston rod of the air cylinder and can be driven by the air cylinder to perform a clamping action. The wafer sorter according to claim 3, wherein the clamping member has two clamping parts, and the clamping parts can be opened and closed under the driving of the air cylinder to take and place the wafer carrier ring. The wafer sorter according to claim 4, wherein the driving element includes a translation mechanism and a lifting mechanism, the lifting mechanism is installed on the translation mechanism and can move laterally under the drive of the translation mechanism, and the extension rod The first end is installed on the lifting mechanism and can move longitudinally under the drive of the lifting mechanism. The wafer sorter according to claim 1, wherein the cabinet includes a casing and a cabinet door installed on the casing, and the casing and the cabinet door jointly enclose the working chamber of the cabinet . The wafer sorter according to claim 6, wherein an air filter fan group is provided on the top plate of the housing, the air filter fan group is in communication with the working chamber of the cabinet, and the air filter fan group is The outside air is filtered by the air filter fan group and then blown into the working chamber. The wafer sorter according to claim 7, wherein the working platform is provided with a plurality of exhaust holes for discharging gas in the working chamber. The wafer sorter according to claim 1, wherein the first carrier ring bearing and the second carrier ring bearing are arranged opposite to each other, and the picking device is arranged on the first carrier ring bearing and the second carrier ring bearing. Between seats. The wafer sorter according to claim 9, wherein the picking device includes a rotating mechanism and a wafer picking arm provided on the rotating mechanism, and the wafer picking arm can move on the second rotating mechanism under the rotation of the rotating mechanism. A carrier ring holder rotates between the second carrier ring holder, so that the wafer picking arm can pick up the wafers on the first wafer carrier ring to the second wafer carrier ring.

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