JP3167516U - Chip classification rotation mechanism - Google Patents

Abstract

Provided is a chip sorting / rotating mechanism that can change a rotation unit to be installed in a sorting tray case module and can reduce a time for waiting for completion of a wafer case module operation in a chip sorting operation process. A chip sorting and rotating mechanism includes a wafer case module, a sorting tray case module, and a pickup module. The wafer case module 10 includes a wafer case 11, the sorting tray case module 20 includes a sorting tray case 21, a rotating unit 23, and a sorting tray two-axis moving unit 22, and the sorting tray case moves the sorting tray biaxially via the rotating unit. The pickup module is rotatably disposed on the unit, and the pickup module includes an arm 31 and is installed between the wafer case module and the sorting tray case module. The arm picks up a plurality of sort waiting chips 40 in the wafer case module and puts them into the sort tray case module 20. [Selection diagram] FIG.

Description

  The present invention relates to a sorting machine, and more particularly to a chip sorting and rotating mechanism.

  Light Emitted Diodes (LEDs) are somewhat different from each chip even if they are produced on the same wafer due to differences in manufacturing process conditions such as diode brightness, wavelength, color temperature, and operating voltage. Therefore, it is necessary to classify them according to their characteristics.

  FIG. 1 is an explanatory view showing the appearance of a conventional horizontal sorter. Wafer case 1 and classification tray case 2 are installed in horizontal biaxial moving units (3a, 3b), respectively. The wafer case 1 is rotatably disposed on the horizontal biaxial moving unit 3a via the rotating unit 4. The arm 5 picks up a plurality of chips 8 waiting for classification in the wafer case 1 and puts them in the classification tray case 2, thereby classifying the plurality of chips 8. The rotation unit 4 adjusts to an optimum angle when the chips 8 in the wafer case 1 are picked up by the arm, so that the chips 8 are arranged in order when the chips 8 are placed on the sorting tray case 2. However, such installation requires a large space for equipment installation, and the number of equipment that can be installed in the factory is limited, resulting in a decrease in production efficiency.

2 and 3 are explanatory diagrams showing the appearance of a conventional upright sorter and a flowchart of the operation. The main structure is almost the same as FIG. Characteristically, FIG. 1 includes horizontal biaxial moving units (3a, 3b), whereas FIG. 2 includes upright biaxial moving units (6a, 6b). This change reduces the space required for equipment installation and increases the number of equipment that can be installed in the factory, leading to increased production efficiency. However, in such an installation method, a wafer case (not shown) is rotatably disposed on the upright biaxial moving unit 6a via the rotation unit 4, and the arm 5 is placed in the wafer 8 waiting for classification from the wafer case. In the process of picking up and putting it in the classification tray case 2, the chip 8 in the classification waiting state must go through the following steps in the wafer case 1.
Step X1—Adjustment of position and angle: The position of the wafer case is adjusted by the upright biaxial moving unit 6a, and the angle is adjusted by the rotating unit 4.
Step X2: Extruding by the head: Using the head 7, the chip 8 in the classification waiting state is slightly extruded from the wafer case.

The classification tray case 2 only needs to perform the following step Y.
Step Y. Position adjustment: The position of the sorting tray case 2 is adjusted by the upright biaxial moving unit 6b.

Finally, the arm 5 performs the following step Z.
Step Z. Pickup of chips: The arm 5 picks up a plurality of chips 8 waiting for classification in the wafer case and puts them in the classification tray case 2.

  From the above, it can be seen that the time taken for steps X1-X2 is longer than the time taken for steps Y. For this reason, the arm 5 cannot place the chip on the sorting tray case 2 in the upright biaxial moving unit 6b without waiting for the end of the steps X1-X2, and the working time can be wasted.

  An object of the present invention is to solve the problem that the time required for the pre-work is too long and the work time is wasted in the sorting process as in a conventional sorter.

  In order to achieve the above object, the present invention provides a tip sorting rotation mechanism. The chip classification rotation mechanism of the present invention includes a wafer case module, a classification tray case module, and a pickup module.

  The wafer case module includes a wafer case, a head unit, and a wafer biaxial moving unit. The wafer case has a wafer, and the wafer has a plurality of chips waiting for classification. The wafer case and the wafer biaxial moving unit are connected, and the head unit operates to push the wafer. The classification tray case module includes a classification tray case, a rotation unit, and a classification tray biaxial movement unit, and the classification tray case is rotatably arranged on the classification tray biaxial movement unit via the rotation unit. The classification tray case has a classification tray, and a plurality of classified chips are placed on the classification tray. The pick-up module includes an arm for picking up the plurality of chips waiting for classification on the wafer and placing them on the classification tray, and is installed between the wafer case module and the classification tray case module.

  With the above-described technique, the present invention is configured such that the classification tray case is rotatably disposed on the classification tray biaxial moving unit via the rotation unit, so that the arm picks up unclassified chips from the wafer case. In the process of placing in the classification tray case, the wafer case module only needs to adjust the position of the wafer biaxial moving unit and the step of pushing out the head, and the classification tray case module is independent of the classification tray biaxial. The process of adjusting the position of the moving unit and adjusting the angle of the rotating unit, which takes a relatively long time, are performed. Therefore, the present invention has an advantage of reducing the time for the sorting tray case module to wait for the work process of the wafer case module to be completed, and shortening the chip sorting work time.

It is explanatory drawing which shows the external appearance of the conventional horizontal classifier. It is explanatory drawing which shows the external appearance of the conventional upright sorter. It is a flowchart which shows the operation | work process of the conventional upright sorter. It is explanatory drawing which shows the external appearance of the Example of this invention. It is a flowchart which shows the operation | work process of the Example of this invention.

  Hereinafter, detailed description and technical contents of the present invention will be described with reference to the drawings.

  FIG. 4 is an explanatory view showing the appearance of an embodiment of the present invention. The chip classification rotation mechanism of the present invention includes a wafer case module 10, a classification tray case module 20, and a pickup module 30.

  In this embodiment, the wafer case module 10 includes a wafer case 11, a head unit 13, and a wafer biaxial moving unit 12. The wafer case 11 has a wafer 111 and is installed perpendicular to the ground. The wafer 111 has a plurality of chips (not shown) waiting for classification. The wafer case 11 and the wafer biaxial moving unit 12 are connected, and the head unit 13 includes a single axis moving unit 131 that moves in a direction perpendicular to the plane of the wafer 111, whereby the wafer case 11 is moved to the wafer biaxial moving unit. After the position adjustment is performed by the head 12, the head unit 13 moves the single-axis moving unit 131 to push the back surface of the wafer 111, and slightly pushes out the chips on the wafer 111.

  The classification tray case module 20 includes a classification tray case 21, a rotation unit 23, and a classification tray biaxial moving unit 22. The classification tray case 21 has a classification tray 211 and is installed perpendicular to the ground. A plurality of classified chips 40 are placed on the classification tray 211. Further, the classification tray case 21 is rotatably disposed on the classification tray biaxial moving unit 22 via the rotation unit 23. Since the plane portion of the rotation unit 23 is parallel to the horizontal movement plane of the classification tray biaxial movement unit 22, the classification tray case 21 can perform position adjustment by biaxial movement and angle adjustment by rotation on the plane. Further, the sorting tray case 21 and the wafer case 11 are installed in parallel, and the pickup module 30 performs the sorting operation of the chips 40 between them.

  The pickup module 30 includes an arm 31 and a pedestal 32 and is installed between the wafer case module 10 and the sorting tray case module 20. The arm 31 is connected to the rotating part 33 via the forward / backward moving part 34, and the rotating part 33 is connected to the pedestal 32. The arm 31 is moved and rotated between the wafer case module 10 and the classification tray case module 20 by the rotating part 33 and the back and forth moving part 34 to pick up a plurality of slightly waiting chips on the wafer 111 that are waiting for classification. Placed on the classification tray 211.

  FIG. 5 is a flowchart showing the work process of the embodiment of the present invention.

  Step A1-Position adjustment: The positional relationship between the wafer case 11 and the pickup module 30 is adjusted by the wafer biaxial moving unit 12.

  Step A2: Extruding by the head: The wafer 111 has an unclassified chip attached to the surface by the surface protection material, and the head unit 13 uses the movement of the single-axis moving unit 131 to push the back surface of the wafer 111, Unclassified chips are slightly pushed out of the wafer 111.

  Step B. Adjustment of position and angle: The positional relationship between the classification tray case 21 and the pickup module 30 is adjusted by the classification tray biaxial movement unit 22, and the angle of the position where the chip 40 is placed is adjusted by the rotation unit 23.

  Step C. Pickup of chips: The arm 31 picks up a plurality of chips waiting for classification on the wafer 111 and places them on the classification tray 211.

  The feature of the present invention is that steps A1 and A2 and step B are performed independently in time. Then, after steps A1 and A2 and step B are completed, step C is performed.

  As described above, according to the present invention, the arm 31 picks up an unclassified chip from the wafer case 11 by disposing the classification tray case 21 to the classification tray biaxial moving unit 22 via the rotation unit 23 so as to be rotatable. In the process of placing on the sorting tray case 21, the wafer case module 10 only needs to perform the position adjustment and the step of pushing out the head, and the sorting tray case module 20 independently performs the position adjustment and angle adjustment steps. Therefore, there is an advantage that the time for the sorting tray case module 20 to wait for the work process of the wafer case module 10 to be completed is reduced, and the chip sorting work time is shortened.

DESCRIPTION OF SYMBOLS 1 Wafer case 2 Classification tray case 3a Horizontal biaxial moving unit 3b Horizontal biaxial moving unit 4 Rotating unit 5 Arm 6a Upright biaxial moving unit 6b Upright biaxial moving unit 7 Head 8 Chip 10 Wafer case module 11 Wafer case 12 Wafer 2 Axis moving unit 13 Head unit 20 Sorting tray case module 21 Sorting tray case 22 Sorting tray biaxial moving unit 23 Rotating unit 30 Pickup module 31 Arm 32 Base 33 Rotating part 34 Back and forth moving part 40 Chip 111 Wafer 131 Single-axis moving unit 211 Classification tray

Claims (3)

A tip (40) classification rotation mechanism,
A wafer case module (10) comprising a wafer case (11) having a wafer (111) having a plurality of chips (40) waiting for classification;
A classification tray case module (20) comprising a classification tray case (21), a rotation unit (23) and a classification tray biaxial movement unit (22);
A pickup module (30) installed between the wafer case module (10) and the classification tray case module (20);
With
The wafer case (11) includes a wafer (111) having the plurality of chips (40) waiting for classification,
The classification tray case (21) is rotatably arranged on the classification tray biaxial moving unit (22) via the rotating unit (23), and the classification tray case (21) has a plurality of classified chips. A sorting tray (211) having (40),
The pickup module (30) includes an arm (31) that picks up the plurality of waiting chips (40) on the wafer (111) and places them on the sorting tray (211). Rotating mechanism.   The chip (40) classification rotation mechanism according to claim 1, wherein the wafer case (11) and the classification tray case (21) are installed in parallel.   2. The chip (40) classification rotation mechanism according to claim 1, wherein a plane portion of the rotation unit (23) is parallel to a horizontal movement plane of the classification tray biaxial movement unit (22).

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