KR20170018607A - Apparatus for sorting electronic device - Google Patents

Apparatus for sorting electronic device Download PDF

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Publication number
KR20170018607A
KR20170018607A KR1020150112446A KR20150112446A KR20170018607A KR 20170018607 A KR20170018607 A KR 20170018607A KR 1020150112446 A KR1020150112446 A KR 1020150112446A KR 20150112446 A KR20150112446 A KR 20150112446A KR 20170018607 A KR20170018607 A KR 20170018607A
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KR
South Korea
Prior art keywords
electronic
wafer
sorting
swing arm
linear driving
Prior art date
Application number
KR1020150112446A
Other languages
Korean (ko)
Inventor
유병소
장현삼
이병식
김종수
김승규
Original Assignee
(주)큐엠씨
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Publication date
Application filed by (주)큐엠씨 filed Critical (주)큐엠씨
Priority to KR1020150112446A priority Critical patent/KR20170018607A/en
Publication of KR20170018607A publication Critical patent/KR20170018607A/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67271Sorting devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Abstract

The present invention proposes an apparatus for sorting an electronic device. According to an embodiment of the present invention, the apparatus for sorting an electronic device includes: a wafer table mounted thereon with a plurality of electronic devices; a sorting table placed thereon with the electronic device picked up from the wafer table and arranged to be perpendicular to the wafer table; and a pickup apparatus for picking up the electronic device from the wafer table and transferring and placing the picked electronic device to the sorting table. The pickup apparatus includes: a swing arm for picking up or placing the electronic device; a rotation driving source for rotating the swing arm between a pickup position for picking up the electronic device from the wafer table and a placing position for placing the picked electronic device on the sorting table; a first linear driving unit positioned between the wafer table and the rotation driving source to move the swing arm in the direction of the wafer table; and a second linear driving unit positioned between the sorting table and the rotation driving source to move the swing arm in the direction of the sorting table.

Description

[0001] APPARATUS FOR SORTING ELECTRONIC DEVICE [0002]
The present invention relates to an electronic device classifying apparatus.
An electronic device is an integrated circuit composed of semiconductors whose electrical conductivity is higher than that of an insulator and lower than that of a conductor such as a metal. The original chip is used to refer to a piece of thin plate, or to a semiconductor circuit.
Electronic devices are the basic components for making modern computers, and they support the electronic industry as a key to performing arithmetic operations, information storage, and control of other chips.
The electronic devices can be inspected in the state of being placed on the wafer, and the electronic devices that have been inspected in the state of being placed on the wafer can be used only for pick-and-place devices Such as waffle packs.
On the other hand, Korean Patent Laid-Open Publication No. 10-2014-0120989 (entitled " Device for Classifying Devices ") discloses a device for picking up elements placed on a wafer and minimizing a time for loading the elements on a tray. A pair of tray transferring parts for transferring the tray on which the device is to be loaded to both sides of the wafer table, and a pair of tray transferring parts disposed on both sides of the wafer table and having elements on the wafer mounted on the wafer table alternately And a pair of conveying tools for picking up the tray and loading it onto the tray.
Such an electronic element sorting apparatus has a problem in that the time required for the lifting and lowering operation is added in the process of moving the electronic element, and the sorting speed of the electronic element is slowed down.
In addition, the electronic device transferred by the transfer tool can be influenced by the vibration generated by the lifting and lowering operation. Accordingly, there has been a demand for development of an electronic device for classifying a new structure.
It is an object of the present invention to solve the problems of the prior art described above and to provide a method and apparatus for quickly and stably performing a transferring process of an electronic device to shorten the working time and improve the applicability without changing the configuration or changing the size of the wafer table And an object of the present invention.
According to an aspect of the present invention, there is provided an electronic device classifying apparatus comprising: a wafer table on which a plurality of electronic devices are mounted; A sorting table in which electronic elements picked up from the wafer table areplashed and placed in a state perpendicular to the wafer table; And a pick-up device for picking up an electronic element from the wafer table and for transporting and flipping the picked-up electronic element to the sorting table, the pick-up device comprising: a swing arm for picking up or playing the electronic element; A rotation driving source for rotating the swing arm between a pick-up position for picking up an electronic element from the wafer table and a pick-up position of the picking-up electronic element; A first linear driving unit positioned between the wafer table and the rotation driving source and moving the swing arm toward the wafer table; And a second linear driving unit positioned between the sorting table and the rotation driving source and moving the swing arm toward the sorting table.
According to the present invention, since the wafer table and the sorting table are vertically arranged, the transferring process of the electronic device can be performed quickly and stably, thereby shortening the working time and improving the productivity .
Further, there is an effect that it is possible to have a high applicability without changing the configuration or changing the size of the wafer, including the wafer transfer section for driving the wafer table.
1 is a perspective view of an electronic device according to an embodiment of the present invention.
2 is a front view of an electronic device according to an embodiment of the present invention.
3 is a cross-sectional view of a pickup apparatus according to an embodiment of the present invention.
4 is a side view of a pickup device according to an embodiment of the present invention.
5 is a cross-sectional view of a swing arm according to an embodiment of the present invention.
6 is a partial cross-sectional view of a linear driving unit according to an embodiment of the present invention.
7 is a diagram for explaining a method of picking up an electronic device using a pickup device according to an embodiment of the present invention.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. It should be understood, however, that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In the drawings, the same reference numbers are used throughout the specification to refer to the same or like parts.
Throughout this specification, when a part is referred to as being "connected" to another part, it is not limited to a case where it is "directly connected" but also includes the case where it is "electrically connected" do.
Throughout this specification, when a member is " on " another member, it includes not only when the member is in contact with the other member, but also when there is another member between the two members.
Throughout this specification, when an element is referred to as "including " an element, it is understood that the element may include other elements as well, without departing from the other elements unless specifically stated otherwise. The terms "about "," substantially ", etc. used to the extent that they are used throughout the specification are intended to be taken to mean the approximation of the manufacturing and material tolerances inherent in the stated sense, Accurate or absolute numbers are used to help prevent unauthorized exploitation by unauthorized intruders of the referenced disclosure. The word " step (or step) "or" step "used to the extent that it is used throughout the specification does not mean" step for.
The present invention relates to an electronic element sorting apparatus. For reference, the electronic device classified by the electronic device classifier may be a light emitting diode (LED), but is not limited thereto, and various types of semiconductor chips may be included.
FIG. 1 is a perspective view of an electronic device according to an embodiment of the present invention. FIG. 2 is a front view of an electronic device according to an embodiment of the present invention. FIG. 4 is a side view of a pickup device according to an embodiment of the present invention, FIG. 5 is a cross-sectional view of a swing arm according to an embodiment of the present invention, FIG. 6 is a cross- FIG. 7 is a view for explaining a method of picking up an electronic device using a pickup device according to an embodiment of the present invention.
Hereinafter, an electronic element classifying apparatus 10 (hereinafter referred to as "present electronic classifying apparatus 10") according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG.
The electronic element classifying apparatus 10 includes a wafer table 100, a sorting table 200, and a pick-up apparatus 300.
A plurality of electronic elements are seated on the wafer table 100. Illustratively, a plurality of electronic devices may be formed by dicing the wafer and may be seated in the wafer table 100 in a diced wafer state.
Further, the wafer table 100 is arranged vertically. The above-described vertical arrangement means that the wafer table 100 is placed in a standing state so that the normal line of the table on which the electronic devices are mounted is directed substantially in the horizontal direction.
In addition, the vertically arranged wafer table 100 may have a mount portion for loading electronic devices. Such a mount portion can seat the electronic device through the adhesive material. However, the loading means for the electronic device is not limited to the mount portion including the adhesive material.
The wafer table 100 may further include a wafer transfer unit 110 for moving the wafer table 100 in all directions with respect to the plane direction. Illustratively, the wafer table 100 can be linearly moved and rotated in the plane direction with respect to the table on which the electronic elements are mounted through the wafer transfer unit 110. In other words, the wafer table 100 can be rotated about the Y axis, the Z axis direction, and the axis perpendicular to the YZ plane through the wafer transfer unit 110.
The electronic element classifying apparatus 10 may further include a first camera section 510 for photographing an electronic element picked up on the wafer table 100. Illustratively, the first camera unit 510 is located on the wafer table 100, and can photograph the electronic device picked up through the pickup device 300, thereby determining the position and direction of the electronic device. Also, by grasping the position and direction of the electronic device from the first camera unit 510, the position and orientation of the wafer table 100 can be adjusted and picked up accurately using the pickup device 300. [
In addition, the electronic elements mounted on the wafer table 100 can be transferred to the sorting table 200 through the pick-up device 300.
The sorting table 200 can be an electronic element that is picked up from the wafer table 100. The sorting table 200 and the wafer table 100 can be used for various purposes through the pick-up device 300. Illustratively, the electronic elements loaded in the wafer table 100 are transferred to the sorting table 200, so that the electronic elements can be sorted and the electronic elements classified in the wafer table 100 are loaded on the sorting table 200 Classified electronic devices can be stacked by type.
In addition, the sorting table 200 is arranged perpendicular to the wafer table 100. The sorting table 200 arranged vertically with the wafer table 100 may have an attaching portion for loading electronic elements. However, the present invention is not limited to this, and an electronic device package in which a lead frame on which a separate electronic device is mounted is placed on the sorting table 200 and an electronic device is mounted on the lead frame can be manufactured.
In addition, the sorting table 200 may further include a sorting table transfer unit 210 for moving the sorting table 200 in all directions with respect to the planar direction. Illustratively, the sorting table 200 can be moved linearly and rotationally in a plane direction with respect to a table on which electronic elements are loaded through the sorting table transfer unit 210. In other words, the sorting table 200 can be rotated about an X-axis, a Y-axis direction, and an axis perpendicular to the XY-plane through the sorting table transfer unit 210.
The electronic device classifying apparatus 10 may further include a second camera unit 520 for photographing the sorting table 200 on which the picked-up electronic device is seated. For example, the second camera unit 520 photographs the sorting table 200 on which the picked-up electronic elements are seated, and grasps the position and direction of the sorting table 200 on which the electronic elements are seated. In addition, it is possible to grasp the position where the electronic device is seated from the second camera unit 520 and adjust the position and direction of the sorting table 200, thereby accurately positioning the electronic device at a desired position.
The pick-up device 300 picks up electronic elements from the wafer table 100 and transfers picked-up electronic elements to the sorting table 200 and flicks them.
The pick-up device 300 is provided between the wafer table 100 and the sorting table 200 disposed vertically to each other and is capable of transferring the electronic devices from the wafer table 100 to the sorting table 200. At this time, the pick-up device 300 can transfer the electronic elements mounted on the wafer table 100 to the sorting table 200 while sorting the electronic elements, but merely transfers the electronic elements classified in the wafer table 100 to the sorting table 200 It can also be transported.
Hereinafter, a pickup apparatus 300 according to an embodiment of the present invention will be described in detail with reference to FIGS. 3 to 7. FIG.
3, the pickup device 300 includes a swing arm 310, a rotation driving source 330, a first linear driving unit 410, and a second linear driving unit 420.
The swing arm 310 picks up or flicks the electronic component. In detail, the swing arm 310 picks up an electronic element located on the wafer table 100, and can fling the picked-up electronic element to the sorting table 200.
The rotation drive source 330 rotates the swing arm 310 between a pick-up position for picking up the electronic element from the wafer table 100 and a picking-up position for picking up the picked-up electronic element to the sorting table 200. The rotation axis of the rotation driving source 330 may be disposed at an angle of 45 degrees with respect to the normal line of the wafer table 100 and the normal line of the sorting table 200.
Illustratively, the rotation driving source 330 rotates the swing arm 310 located at the pick-up position for picking up the electronic element from the wafer table 100, Position.
The first linear driving unit 410 is positioned between the wafer table 100 and the rotation driving source 330 and moves the swing arm 310 toward the wafer table 100. In other words, the first linear driving unit 410 can move the swing arm 310 located at the pickup position toward the wafer table 100. The first linear driving unit 410 may be fixedly coupled to a rotation stop 340 described later and may be rotated to linearly move the swing arm 310 located at the pickup position toward the wafer table 100.
The second linear driving unit 420 is positioned between the sorting table 200 and the rotation driving source 330 and moves the swing arm 310 toward the sorting table 200. In other words, the second linear driving unit 420 can move the swing arm 310 located at the loading position in the direction of the sorting table 200. The second linear driving unit 420 may be fixedly coupled to a rotation stop 340 described later and may linearly move the swing arm 310 located at the loading position toward the sorting table 200 by rotating the second linear driving unit 420.
In addition, the first linear driving unit 410 and the second linear driving unit 420 may be driven based on the voice coil motor. The present electronic element classifier 10 precisely adjusts the position and force of the swing arm 310 by moving the swing arm 310 using the linear driving units 410 and 420 constituted by voice coil motors, Can be minimized.
4, the electronic device classifier 10 may further include a rotation plate 320 and a rotation guide unit 340.
The swing arm 320 is fixed to the swing arm 310 and can be rotated by the rotation driving source 330. A plurality of swing arms 310 may be disposed on the rotation plate 320 at predetermined angles about the rotation axis of the rotation driving source 330. 4, four swing arms 310 may be fixed to the swing plate 320 so as to have an angle of 90 degrees with respect to the rotation axis of the rotation driving source 330. As shown in FIG. The rotation driving source 330 rotates the rotating plate 320 by 90 degrees so that the swing arm 310 picks up the electronic elements on the sorting table 200 at the pick-up position for picking up the electronic elements located on the wafer table 100 You can move to the loading position where you are playing.
The rotation guide part 340 may include a guide groove 341 for guiding the movement of the swing arm 310 with the other end of the swing arm 310 inserted. Accordingly, the swing arm 310 can be moved along the guide groove 341 of the rotation guide portion 340. The bearing portion 313 is located at the other end of the swing arm 310 and the bearing portion 313 is inserted into the guide groove 341 and can be smoothly rotated.
Referring to FIG. 5, the swing arm 310 according to an embodiment of the present invention will be described in detail.
The swing arm 310 may include a frame portion 311, a pickup portion 312, a bearing portion 313, and an LM guide portion 314.
As shown in Fig. 5, the frame portion 311 may be formed by bending in an L shape.
The pick-up section 312 is located at one end of the frame section 311, and can pick up or flick electronic elements. Illustratively, the pickup unit 312 can pick up the electronic device by vacuum suction or release the vacuum state to release the pickup state of the electronic device. In this way, since the electronic element is transferred through vacuum suction, breakage of the electronic element can be minimized. Further, the power of the vacuum suction of the pick-up section 312 for transferring the electronic element may be gas, and the gas power may be supplied through the gas supply section.
The bearing portion 313 is located at the other end of the frame portion 311 and may include a bearing. The bearing portion 313 is inserted into the guide groove 341 of the rotation guide portion 340 and the bearing of the bearing portion 313 is brought into contact with the inner side surface of the guide groove 341, It can be smoothly moved.
The LM guide unit 314 can guide the pickup unit 312 to linearly move in the axial direction forming the angle of 45 degrees with the rotation axis of the rotation driving source 330. [ The LM guide part 314 is fixed to the rotary plate 320 on one side and can be coupled to the frame part 311 so as to be slidably movable. The frame portion 311 is formed with a sliding groove and the LM guide is inserted into the sliding groove so that the frame portion 311 is rotated by the first linear driving portion 410 or the second linear driving portion 420, And may be linearly moved in the axial direction at an angle of 45 degrees with respect to the rotation axis of the rotating shaft 330.
 Referring to FIG. 6, the linear driving units 410 and 420 according to an embodiment of the present invention will be described.
The first linear driving part 410 includes a first insertion groove 411 into which the bearing part 313 of the swing arm 310 is inserted and the second linear driving part 420 includes a bearing part of the swing arm 310 313 may be inserted in the second insertion groove 421.
The first linear driving unit 410 may be disposed in the direction in which the wafer table 100 is positioned or in the direction in which the wafer table 100 is positioned when the bearing portion 313 of the swing arm 310 is inserted into the first insertion groove 411. [ (100).
When the bearing portion 313 of the swing arm 310 is inserted into the second insertion groove 421, the second linear driving portion 420 moves the swing arm 310 in the direction in which the sorting table 200 is positioned, It can be moved in a direction away from the main body 200.
The insertion grooves of the first linear driving part 410 and the second linear driving part 420 may be positioned on the guide groove 341 of the rotation guide part 340. In other words, the swing arm 310 can be moved along the groove formed by the guide groove 341 of the rotation guide portion 340 and the insertion grooves 411, 421.
Referring to FIG. 7, a method of picking up an electronic device using a pickup device 300 according to an embodiment of the present invention will be described in detail.
The bearing portion 313 of the swing arm 310 may be positioned in the first insertion groove 411 of the first linear driving portion 410. In this case, At this time, the first linear driving unit 410 may be driven to move the pickup unit 312 of the swing arm 310 toward the wafer table 100 to pick up the electronic device located on the wafer table 100 . At this time, the first camera unit 510 can be used to grasp the position of the electronic device, and adjust the position and direction of the wafer table 100 before picking up the electronic device.
The first linear driving unit 410 transfers the swing arm 310 in a direction away from the wafer table 100 so that the first insertion groove 411 of the first linear driving unit 410 rotates And can be moved so as to coincide with the guide groove 341 of the guide portion 340.
The swing arm 310 is moved along the guide groove 341 of the rotation guide part 340 through the rotation driving source 330 so that the bearing part 313 of the swing arm 310 is rotated by the second linear driving part 420 In the second insertion groove 421 of the base plate 421.
After the bearing portion 313 of the swing arm 310 is positioned in the second insertion groove 421 and the second linear driving portion 420 is driven to move the pickup portion 312 of the swing arm 310 to the sorting table 200 ), And the electronic device can be flashed with the sorting table 200. [ At this time, the position and orientation of the sorting table 200 on which the electronic device is mounted can be adjusted by detecting the position where the electronic device is seated by using the second camera unit 520.
The second linear driving part 420 moves the swing arm 310 in a direction away from the sorting table 200 so that the second insertion groove 421 of the second linear driving part 420 And can be moved so as to coincide with the guide groove 341 of the rotary guide portion.
It will be understood by those of ordinary skill in the art that the foregoing description of the embodiments is for illustrative purposes and that those skilled in the art can easily modify the invention without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.
The scope of the present invention is defined by the appended claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.
10: Electronic element classification device
100: wafer table 110: wafer transfer part
200: sorting table 210: sorting table transferring part
300: Pickup device
310: swing arm 311: frame part
312: pickup part 313: bearing part
314: LM guide portion
320: a rotating plate 330:
340: rotation guide portion 341: guide groove
410: first linear driving part 411: first insertion groove
420: second linear driving part 421: second insertion groove
510: first camera unit 520: second camera unit

Claims (7)

  1. In the electronic element sorting apparatus,
    A wafer table on which a plurality of electronic elements are seated;
    A sorting table in which electronic elements picked up from the wafer table areplashed and placed in a state perpendicular to the wafer table; And
    And a pick-up device for picking up the electronic element from the wafer table and for transporting and flipping the picked-up electronic element to the sorting table,
    The pick-
    A swing arm that picks up or flicks the electronic device;
    A rotation drive source for rotating the swing arm between a pick-up position for picking up an electronic element from the wafer table and a pick-up position for picking up the picked-up electronic element on the sorting table;
    A first linear driving unit positioned between the wafer table and the rotation driving source and moving the swing arm toward the wafer table; And
    And a second linear driving unit positioned between the sorting table and the rotation driving source and moving the swing arm toward the sorting table.
  2. The method according to claim 1,
    The pick-
    A swing plate to which the swing arm is fixed and rotated by the rotation driving source; And
    Further comprising a rotation guide portion in which the other end of the swing arm is inserted and in which a guide groove for guiding movement of the swing arm is formed.
  3. The method according to claim 1,
    The swing arm
    A frame part;
    A pickup unit located at one end of the frame unit and picking up or flipping the electronic device;
    A bearing portion located at the other end of the frame portion and having a bearing; And
    And an LM guide unit for guiding the pickup unit to linearly move in an axial direction at 45 degrees with the rotation axis of the rotation drive source.
  4. The method according to claim 1,
    Wherein the first linear driving unit includes a first insertion groove into which the other end of the swing arm is inserted,
    And the second linear driving unit includes a second insertion groove into which the other end of the swing arm is inserted.
  5. The method according to claim 1,
    Wherein the first linear driving unit and the second linear driving unit are constituted by a voice coil motor.
  6. The method according to claim 1,
    A first camera section for photographing an electronic element picked up by the swing arm on the wafer table,
    And a second camera section for photographing the sorting table on which the picked-up electronic element is seated.
  7. The method according to claim 1,
    A wafer transfer section for transferring the wafer table in the Y-axis and Z-axis directions, and
    And a sorting table transfer unit for transferring the sorting table in the X-axis and Y-axis directions.
KR1020150112446A 2015-08-10 2015-08-10 Apparatus for sorting electronic device KR20170018607A (en)

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Application Number Priority Date Filing Date Title
KR1020150112446A KR20170018607A (en) 2015-08-10 2015-08-10 Apparatus for sorting electronic device

Publications (1)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019125127A1 (en) * 2019-09-18 2021-03-18 Mühlbauer Gmbh & Co. Kg Component handling, component inspection
WO2021052745A1 (en) 2019-09-18 2021-03-25 Muehlbauer GmbH & Co. KG Component handling device with component inspecting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019125127A1 (en) * 2019-09-18 2021-03-18 Mühlbauer Gmbh & Co. Kg Component handling, component inspection
WO2021052745A1 (en) 2019-09-18 2021-03-25 Muehlbauer GmbH & Co. KG Component handling device with component inspecting device
WO2021052756A1 (en) 2019-09-18 2021-03-25 Muehlbauer GmbH & Co. KG Component handling comprising component inspection

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