CN110865085A - Full-automatic quartz wafer appearance selecting machine - Google Patents
Full-automatic quartz wafer appearance selecting machine Download PDFInfo
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- CN110865085A CN110865085A CN201911265143.4A CN201911265143A CN110865085A CN 110865085 A CN110865085 A CN 110865085A CN 201911265143 A CN201911265143 A CN 201911265143A CN 110865085 A CN110865085 A CN 110865085A
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- wafer
- appearance
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- blanking
- blowing mechanism
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/363—Sorting apparatus characterised by the means used for distribution by means of air
- B07C5/365—Sorting apparatus characterised by the means used for distribution by means of air using a single separation means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
- G01N2021/0112—Apparatus in one mechanical, optical or electronic block
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N2021/8477—Investigating crystals, e.g. liquid crystals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8841—Illumination and detection on two sides of object
Abstract
The invention discloses a full-automatic quartz crystal wafer appearance selector, and aims to provide a full-automatic quartz crystal wafer appearance selector with high detection efficiency. The invention comprises a machine table, wherein a rotary motor, a vibration feeding tray, a wafer front detection mechanism, a wafer back detection mechanism, a first blanking blowing mechanism, a second blanking blowing mechanism, a good product discharging tray and a defective product discharging tray are arranged on the machine table, a rotary table is arranged on the rotary motor in a matching manner, the vibration feeding tray, the wafer front detection mechanism, the wafer back detection mechanism, the good product discharging tray and the defective product discharging tray are sequentially arranged outside the rotary table in a matching manner, and the first blanking blowing mechanism and the second blanking blowing mechanism are arranged above the rotary table and are respectively matched with the good product discharging tray and the defective product discharging tray. The invention is applied to the technical field of quartz wafer appearance sorting machines.
Description
Technical Field
The invention relates to an appearance selector, in particular to a full-automatic quartz wafer appearance selector.
Background
Quartz crystal is one of the silicas and is currently the largest volume of crystals used in the world. The electronic element manufactured by utilizing the physical characteristics of the quartz crystal has high frequency stability and is widely applied to the fields of digital circuits, computers, communication and the like. It functions as a frequency source or reference in electronic circuits. With the development of communication and electronic technology, the demand for quartz wafers has also increased substantially. Both natural and man-made quartz crystals are hexagonal cones with anisotropic physical properties. The wafers in the crystal oscillation are cut into square, rectangular and round slices according to different angles with each axis, and the performance of the wafers with different cutting types is different. The quartz wafer needs to be subjected to appearance detection after frequency division of the wafer, and the purpose of the appearance detection is to eliminate defects which affect the electrical performance of the crystal, such as edge breakage, bright spots, surface pollution and the like. The traditional external observation adopts a manual magnifier mode for visual observation, the detection speed is low, the judgment has errors, and the working efficiency is low, so that a full-automatic quartz wafer appearance selector with high detection efficiency needs to be developed at present.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a full-automatic quartz wafer appearance selector with high detection efficiency.
The technical scheme adopted by the invention is as follows: the invention comprises a machine table, wherein a rotary motor, a vibration feeding tray, a wafer front detection mechanism, a wafer back detection mechanism, a first blanking blowing mechanism, a second blanking blowing mechanism, a good product discharging tray and a defective product discharging tray are arranged on the machine table, a rotary table is arranged on the rotary motor in a matching manner, the vibration feeding tray, the wafer front detection mechanism, the wafer back detection mechanism, the good product discharging tray and the defective product discharging tray are sequentially arranged outside the rotary table in a matching manner, and the first blanking blowing mechanism and the second blanking blowing mechanism are arranged above the rotary table and are respectively matched with the good product discharging tray and the defective product discharging tray.
Further, positive detection mechanism of wafer includes first detection support, be provided with first camera and first light source seat on the first detection support, first camera is located the below of carousel, first light source seat is located on the up end of carousel, and is located directly over the first camera, it has first light source to embed in the first light source seat.
Further, wafer reverse side detection mechanism includes the second and detects the support, be provided with second camera and second light source seat on the second detection support, the second camera is located the top of carousel, the second light source seat is located on the lower terminal surface of carousel, and is located under the second camera, it has the second light source to embed in the second light source seat.
Further, a blowing mechanism supporting frame is further arranged on the machine table, and the first blanking blowing mechanism and the second blanking blowing mechanism are arranged on the blowing mechanism supporting frame.
Further, the full-automatic quartz wafer appearance selecting machine further comprises a wafer appearance display screen and a temperature display, the wafer front side detection mechanism and the wafer back side detection mechanism are matched with the wafer appearance display screen, and the temperature display is arranged in the middle of the upper end face of the rotary table.
Furthermore, a wafer conveying groove is formed in the circumferential direction of the rotary disc and is in butt joint with the vibration feeding disc in a matching mode.
The invention has the beneficial effects that: compared with the situation that the work efficiency is low due to manual detection in the prior art, in the embodiment of the invention, the vibration loading tray is configured to load quartz wafers, the turntable is configured to transport the quartz wafers of the vibration loading tray, the wafer front detection mechanism is configured to perform appearance detection on the front side of the quartz wafers on the turntable, the wafer back detection mechanism is configured to perform appearance detection on the back side of the quartz wafers on the turntable, the first unloading blowing mechanism is configured to blow the quartz wafers qualified in appearance detection to the good unloading tray, the second unloading blowing mechanism is configured to blow the quartz wafers unqualified in appearance detection to the bad unloading tray, and the turntable, the vibration loading tray, the wafer front detection mechanism, the wafer detection mechanism and the rotary tray are arranged in a circular shape, The first blanking air blowing mechanism, the second blanking air blowing mechanism, the good product blanking disc and the defective product blanking disc are arranged, so that the detection efficiency is high.
Drawings
FIG. 1 is a schematic plan view of the present invention;
FIG. 2 is a schematic plan view of a wafer front side inspection mechanism;
FIG. 3 is a schematic plan view of a wafer backside inspection mechanism.
Detailed Description
As shown in fig. 1 to 3, in the present embodiment, the present invention includes a machine table 1, a rotating motor 2, a vibration loading tray 3, a wafer front side detection mechanism 4, a wafer back side detection mechanism 5, a first unloading blowing mechanism 6, a second unloading blowing mechanism 7, a good product unloading tray 8, and a bad product unloading tray 9 are arranged on the machine table 1, a turntable 10 is cooperatively arranged on the rotating motor 2, the vibration loading tray 3, the wafer front side detection mechanism 4, the wafer back side detection mechanism 5, the good product unloading tray 8, and the bad product unloading tray 9 are sequentially cooperatively arranged outside the turntable 10, and the first unloading blowing mechanism 6 and the second unloading blowing mechanism 7 are both located above the turntable 10 and respectively cooperate with the good product unloading tray 8 and the bad product unloading tray 9. The rotary table 10 is a glass rotary table, and compared with the situation that the work efficiency is low due to manual detection in the prior art, in the embodiment of the invention, the vibration loading tray 3 is configured to load quartz wafers, the rotary table 10 is configured to transport the quartz wafers of the vibration loading tray 3, the wafer front surface detection mechanism 4 is configured to perform appearance detection on the front surface of the quartz wafers on the rotary table 10, the wafer back surface detection mechanism 5 is configured to perform appearance detection on the back surface of the quartz wafers on the rotary table 10, the first unloading blowing mechanism 6 is configured to blow the quartz wafers qualified in the appearance detection to the good product unloading tray 8, the second unloading blowing mechanism 7 is configured to blow the quartz wafers unqualified in the appearance detection to the bad product unloading tray 9, and the rotary table 10, the vibration loading tray 3, the rotary table and, The wafer front side detection mechanism 4, the wafer back side detection mechanism 5, the first blanking air blowing mechanism 6, the second blanking air blowing mechanism 7, the good product blanking disc 8 and the defective product blanking disc 9 are arranged, so that the wafer front side detection device has the advantage of high detection efficiency.
In this embodiment, the wafer front side inspection mechanism 4 includes a first inspection support 401, a first camera 402 and a first light source seat 403 are disposed on the first inspection support 401, the first camera 402 is located below the turntable 10, the first light source seat 403 is located on the upper end surface of the turntable 10 and is located right above the first camera 402, and a first light source is embedded in the first light source seat 403. The first camera 402 is configured to perform an appearance inspection of one surface of the quartz wafer.
In this embodiment, the wafer reverse side inspection mechanism 5 includes a second inspection support 501, a second camera 502 and a second light source seat 503 are disposed on the second inspection support 501, the second camera 502 is located above the turntable 10, the second light source seat 503 is located on the lower end surface of the turntable 10 and is located right below the second camera 502, and a second light source is embedded in the second light source seat 503. The second camera 502 is configured to perform appearance inspection on the other surface of the quartz wafer.
In this embodiment, a blowing mechanism support frame 11 is further disposed on the machine platform 1, and the first blanking blowing mechanism 6 and the second blanking blowing mechanism 7 are both disposed on the blowing mechanism support frame 11.
In this embodiment, the full-automatic quartz wafer appearance sorting machine further comprises a wafer appearance display screen and a temperature display 12, the wafer front side detection mechanism 4 and the wafer back side detection mechanism 5 are matched with the wafer appearance display screen, and the temperature display 12 is arranged in the middle of the upper end face of the turntable 10. The wafer appearance display screen is configured to display the quartz wafer shot during detection, so that a user can visually observe the detection process, and the temperature display 12 is configured to display the ambient temperature during detection.
In this embodiment, a wafer transportation groove 13 is formed in the circumferential direction of the turntable 10, and the wafer transportation groove 13 is in butt joint with the vibrating feeding tray 3.
While the embodiments of the present invention have been described in terms of practical embodiments, they are not to be construed as limiting the meaning of the present invention, and modifications of the embodiments and combinations with other embodiments will be apparent to those skilled in the art in light of the present description.
Claims (6)
1. The utility model provides a machine is selected to full-automatic quartz wafer outward appearance which characterized in that: which comprises a machine table (1), wherein a rotating motor (2), a vibration feeding tray (3), a wafer front detection mechanism (4), a wafer back detection mechanism (5), a first blanking blowing mechanism (6), a second blanking blowing mechanism (7), a good product discharging tray (8) and a defective product discharging tray (9) are arranged on the machine table (1), a rotary table (10) is arranged on the rotary motor (2) in a matching way, the vibration feeding disc (3), the wafer front side detection mechanism (4), the wafer back side detection mechanism (5), the good product discharging disc (8) and the defective product discharging disc (9) are arranged outside the rotary table (10) in a matching way in sequence, the first blanking blowing mechanism (6) and the second blanking blowing mechanism (7) are both positioned above the turntable (10), and are respectively matched with the good product blanking disc (8) and the defective product blanking disc (9).
2. The fully automatic quartz wafer appearance picker according to claim 1, wherein: wafer front side detection mechanism (4) includes first detection support (401), be provided with first camera (402) and first light source seat (403) on first detection support (401), first camera (402) are located the below of carousel (10), first light source seat (403) are located on the up end of carousel (10), and are located directly over first camera (402), it has first light source to embed in first light source seat (403).
3. The fully automatic quartz wafer appearance picker according to claim 1, wherein: the wafer reverse side detection mechanism (5) comprises a second detection support (501), a second camera (502) and a second light source seat (503) are arranged on the second detection support (501), the second camera (502) is located above the rotary disc (10), the second light source seat (503) is located on the lower end face of the rotary disc (10) and located under the second camera (502), and a second light source is embedded in the second light source seat (503).
4. The fully automatic quartz wafer appearance picker according to claim 1, wherein: the machine table (1) is further provided with a blowing mechanism support frame (11), and the first blanking blowing mechanism (6) and the second blanking blowing mechanism (7) are arranged on the blowing mechanism support frame (11).
5. The fully automatic quartz wafer appearance picker according to claim 1, wherein: the full-automatic quartz wafer appearance selecting machine further comprises a wafer appearance display screen and a temperature display (12), the wafer front side detection mechanism (4) and the wafer back side detection mechanism (5) are matched with the wafer appearance display screen, and the temperature display (12) is arranged in the middle of the upper end face of the rotary table (10).
6. The fully automatic quartz wafer appearance picker according to claim 1, wherein: and a wafer conveying groove (13) is formed in the circumferential direction of the rotary disc (10), and the wafer conveying groove (13) is in butt joint with the vibration feeding disc (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911265143.4A CN110865085A (en) | 2019-12-11 | 2019-12-11 | Full-automatic quartz wafer appearance selecting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911265143.4A CN110865085A (en) | 2019-12-11 | 2019-12-11 | Full-automatic quartz wafer appearance selecting machine |
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| Publication Number | Publication Date |
|---|---|
| CN110865085A true CN110865085A (en) | 2020-03-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911265143.4A Pending CN110865085A (en) | 2019-12-11 | 2019-12-11 | Full-automatic quartz wafer appearance selecting machine |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111359917A (en) * | 2020-03-09 | 2020-07-03 | 崔亮 | Circuit board test equipment |
| CN113649298A (en) * | 2021-08-23 | 2021-11-16 | 深圳市优界科技有限公司 | Full-automatic wafer sorting machine |
-
2019
- 2019-12-11 CN CN201911265143.4A patent/CN110865085A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111359917A (en) * | 2020-03-09 | 2020-07-03 | 崔亮 | Circuit board test equipment |
| CN113649298A (en) * | 2021-08-23 | 2021-11-16 | 深圳市优界科技有限公司 | Full-automatic wafer sorting machine |
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