CN113645831B - 一种线路板加工用灯珠贴片机 - Google Patents
一种线路板加工用灯珠贴片机 Download PDFInfo
- Publication number
- CN113645831B CN113645831B CN202110913341.8A CN202110913341A CN113645831B CN 113645831 B CN113645831 B CN 113645831B CN 202110913341 A CN202110913341 A CN 202110913341A CN 113645831 B CN113645831 B CN 113645831B
- Authority
- CN
- China
- Prior art keywords
- fixed
- block
- rod
- circuit board
- lamp bead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011324 bead Substances 0.000 title claims abstract description 27
- 230000000087 stabilizing effect Effects 0.000 claims abstract description 18
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 229910052742 iron Inorganic materials 0.000 abstract description 3
- 230000002950 deficient Effects 0.000 abstract 1
- 238000001514 detection method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110913341.8A CN113645831B (zh) | 2021-08-10 | 2021-08-10 | 一种线路板加工用灯珠贴片机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110913341.8A CN113645831B (zh) | 2021-08-10 | 2021-08-10 | 一种线路板加工用灯珠贴片机 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113645831A CN113645831A (zh) | 2021-11-12 |
CN113645831B true CN113645831B (zh) | 2022-12-09 |
Family
ID=78420456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110913341.8A Active CN113645831B (zh) | 2021-08-10 | 2021-08-10 | 一种线路板加工用灯珠贴片机 |
Country Status (1)
Country | Link |
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CN (1) | CN113645831B (zh) |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5372423B2 (ja) * | 2008-07-25 | 2013-12-18 | Juki株式会社 | 電子部品搭載ヘッド |
CN103619156B (zh) * | 2013-12-11 | 2016-08-31 | 深圳市唐德机械有限公司 | 全自动散料插件机的散料送料供料系统 |
CN106428744B (zh) * | 2016-10-26 | 2020-02-21 | 江苏比微曼智能科技有限公司 | 一种自动贴膜机构及方法 |
CN207820472U (zh) * | 2018-01-26 | 2018-09-04 | 深圳市宝峰达科技有限公司 | 一种高效自动贴片设备 |
CN207927149U (zh) * | 2018-03-02 | 2018-09-28 | 深圳艾华信电子有限公司 | 一种smt贴片机贴片送料装置 |
CN208445935U (zh) * | 2018-06-01 | 2019-01-29 | 盐城合众联通信息技术有限公司 | 一种多功能贴片机 |
CN109275331B (zh) * | 2018-10-16 | 2024-02-23 | 珠海广浩捷科技股份有限公司 | 一种新型的物料吸嘴装置 |
CN109413988B (zh) * | 2018-12-20 | 2021-01-05 | 深圳市亚星达科技有限公司 | 防跑偏可更换吸嘴的贴片机 |
CN210226097U (zh) * | 2019-02-01 | 2020-03-31 | 江苏优茂电子科技有限公司 | 一种贴片机用吸嘴安装座 |
CN211003495U (zh) * | 2019-11-07 | 2020-07-14 | 山东省青东智能科技有限公司 | 一种四关节工业搬运机器人 |
CN111447825A (zh) * | 2020-04-25 | 2020-07-24 | 安徽槿琳科技有限公司 | 一种线路板加工用灯珠贴片机 |
CN212629106U (zh) * | 2020-09-10 | 2021-02-26 | 杭州临安劲龙电子有限公司 | 一种可以夹持不同尺寸电路板的贴片机 |
CN213044061U (zh) * | 2020-09-27 | 2021-04-23 | 深圳市协力智能科技有限公司 | 一种具有自动输送结构的自动插端机 |
CN112770530B (zh) * | 2021-01-27 | 2022-07-29 | 佛山市德艾光电科技有限公司 | 一种电子元器件自动化贴片机 |
CN113068394A (zh) * | 2021-04-16 | 2021-07-02 | 福建省泉州市培元中学 | 自助智能零件贴片助手 |
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2021
- 2021-08-10 CN CN202110913341.8A patent/CN113645831B/zh active Active
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Publication number | Publication date |
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CN113645831A (zh) | 2021-11-12 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A lamp bead mounting machine for circuit board processing Effective date of registration: 20230224 Granted publication date: 20221209 Pledgee: Jingde Xingye financing Company limited by guarantee Pledgor: Anhui Jinlin Technology Co.,Ltd. Registration number: Y2023980033411 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20221209 Pledgee: Jingde Xingye financing Company limited by guarantee Pledgor: Anhui Jinlin Technology Co.,Ltd. Registration number: Y2023980033411 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Lamp Bead SMT Machine for PCB Processing Granted publication date: 20221209 Pledgee: Jingde Xingye financing Company limited by guarantee Pledgor: Anhui Jinlin Technology Co.,Ltd. Registration number: Y2024980006343 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |