CN113632206A - 衬底处理方法及衬底处理装置 - Google Patents

衬底处理方法及衬底处理装置 Download PDF

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Publication number
CN113632206A
CN113632206A CN202080024060.0A CN202080024060A CN113632206A CN 113632206 A CN113632206 A CN 113632206A CN 202080024060 A CN202080024060 A CN 202080024060A CN 113632206 A CN113632206 A CN 113632206A
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CN
China
Prior art keywords
substrate
liquid
film
removal
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080024060.0A
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English (en)
Chinese (zh)
Inventor
奥谷学
吉田幸史
上田大
张松
安田周一
柴山宣之
金松泰范
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Publication of CN113632206A publication Critical patent/CN113632206A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CN202080024060.0A 2019-03-25 2020-03-06 衬底处理方法及衬底处理装置 Pending CN113632206A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-056285 2019-03-25
JP2019056285A JP7191748B2 (ja) 2019-03-25 2019-03-25 基板処理方法および基板処理装置
PCT/JP2020/009778 WO2020195722A1 (ja) 2019-03-25 2020-03-06 基板処理方法および基板処理装置

Publications (1)

Publication Number Publication Date
CN113632206A true CN113632206A (zh) 2021-11-09

Family

ID=72610098

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080024060.0A Pending CN113632206A (zh) 2019-03-25 2020-03-06 衬底处理方法及衬底处理装置

Country Status (5)

Country Link
JP (1) JP7191748B2 (ko)
KR (1) KR102652831B1 (ko)
CN (1) CN113632206A (ko)
TW (1) TWI785316B (ko)
WO (1) WO2020195722A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022104259A (ja) * 2020-12-28 2022-07-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システムおよび基板処理方法
JP2023005188A (ja) 2021-06-28 2023-01-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、および、基板処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5852898B2 (ja) 2011-03-28 2016-02-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US10464107B2 (en) * 2013-10-24 2019-11-05 SCREEN Holdings Co., Ltd. Substrate processing method and substrate processing apparatus
JP6308910B2 (ja) 2013-11-13 2018-04-11 東京エレクトロン株式会社 基板洗浄方法、基板洗浄システムおよび記憶媒体
JP6371253B2 (ja) * 2014-07-31 2018-08-08 東京エレクトロン株式会社 基板洗浄システム、基板洗浄方法および記憶媒体
JP6951229B2 (ja) * 2017-01-05 2021-10-20 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
WO2018128093A1 (ja) 2017-01-05 2018-07-12 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
JPWO2019009054A1 (ja) * 2017-07-03 2020-04-16 東京エレクトロン株式会社 基板処理システム、基板洗浄方法および記憶媒体
JP6993806B2 (ja) * 2017-07-31 2022-01-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
JP7191748B2 (ja) 2022-12-19
TWI785316B (zh) 2022-12-01
KR20210139418A (ko) 2021-11-22
JP2020161525A (ja) 2020-10-01
WO2020195722A1 (ja) 2020-10-01
TW202042331A (zh) 2020-11-16
KR102652831B1 (ko) 2024-03-29

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