CN113630186B

CN113630186B - Optical module and communication method

Info

Publication number: CN113630186B
Application number: CN202111079592.7A
Authority: CN
Inventors: 刘澍; 吴堂猛; 王玲; 石良; 薛登山
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2021-09-15
Filing date: 2021-09-15
Publication date: 2022-09-16
Anticipated expiration: 2041-09-15
Also published as: CN113630186A

Abstract

In the optical module and the communication method provided by the application, the optical module includes: a first IC chip; a second IC chip; the output end of the control switch is electrically connected with the first IC chip and the second IC chip respectively; and the MCU is connected with the input end of the control switch, controls the control switch to switch on the MCU to communicate with the I2C of the first IC chip and the second IC chip so as to realize the I2C communication of the MCU and the first IC chip or the second IC chip in a time-sharing manner. According to the optical module and the communication method, the MCU is switched on to communicate with the I2C of the first IC chip or the second IC chip through the control switch according to the control of the MCU, and the two IC chips can be hung under the same group of I2C pins of the MCU to communicate with the MCU in a time-sharing I2C mode.

Description

Optical module and communication method

Technical Field

The present application relates to the field of optical fiber communication technologies, and in particular, to an optical module and a communication method.

Background

The optical communication technology can be applied to novel services and application modes such as cloud computing, mobile internet, video and the like. The optical module realizes the function of photoelectric conversion in the technical field of optical communication, and is one of key devices in optical communication equipment.

In order to realize the photoelectric conversion of the optical module, the optical module is provided with chips, such as an MCU (microprogrammed control unit), a clock data recovery CDR (clock data recovery), a power management chip, a data processing chip DSP (digital signal processor), a laser driver, a limiting amplifier and the like; there are some chips that need to communicate with the MCU so that the MCU can read data from, write data to, etc. the some chips. The MCU and the chips can communicate through I2C, that is, the I2C pin of the MCU is connected with the I2C pin of the chips through a group of physical wires, so as to realize the connection between the I2C communication host computer (MCU) and the slave computers (chips).

Because there is only one group of I2C pins of the MCU, to implement the communication between the chips and the I2C of the MCU, the chips need to be hung under the same group of I2C pins, and to ensure that the chips can normally communicate with the MCU, the chips should have different device addresses. However, there are some chips with the same device address in some optical modules, so it needs to be solved how the chips with the same device address communicate normally under the same group of I2C pins.

Disclosure of Invention

The application provides an optical module and a communication method, which ensure that two IC chips in the optical module can normally communicate with an MCU (microprogrammed control unit) in a time-sharing manner under the same group I2C of the MCU.

In a first aspect, the present application provides an optical module, comprising:

a first IC chip;

a second IC chip;

the output end of the control switch is electrically connected with the first IC chip and the second IC chip respectively;

and the MCU is connected with the input end of the control switch, controls the control switch to switch on the MCU to communicate with the I2C of the first IC chip or the second IC chip so as to realize the I2C communication of the MCU and the first IC chip or the second IC chip in a time-sharing manner.

In a second aspect, the present application provides a communication method for an optical module, where the MCU sends a command to the control switch to turn on communication with the first IC chip I2C or a command to communicate with the second IC chip I2C;

when the control switch receives an instruction of communicating with a first IC chip I2C, the control switch turns on the MCU to communicate with an I2C of the first IC chip;

when the control switch receives an instruction of communicating with a second IC chip I2C, the control switch turns on the MCU to communicate with an I2C of the second IC chip.

The application provides an optical module and a communication method, wherein the optical module comprises a first IC chip, a second IC chip, an MCU and a control switch; MCU is connected to control switch's input, first IC chip and second IC chip are connected to control switch's output electricity respectively, and control switch switches on MCU and the communication of the I2C of first IC chip or second IC chip according to MCU's control, realizes that two IC chips can hang and establish and share I2C communication with MCU under MCU's the same group I2C pin.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic diagram of an optical communication terminal connection according to some embodiments;

figure 2 is a schematic diagram of an optical network unit structure according to some embodiments;

fig. 3 is a schematic structural diagram of a light module according to some embodiments;

FIG. 4 is an exploded view of a light module according to some embodiments;

fig. 5 is a schematic diagram of an internal structure of a light module according to some embodiments;

FIG. 6 is a schematic diagram of a circuit board according to some embodiments;

fig. 7 is a schematic diagram of a circuit structure on a circuit board according to some embodiments.

Detailed Description

In order to make those skilled in the art better understand the technical solutions in the present disclosure, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so that the transmission of the information is completed. Because the optical signal has the passive transmission characteristic when being transmitted through the optical fiber or the optical waveguide, the information transmission with low cost and low loss can be realized. Since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform interconversion between the electrical signal and the optical signal in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electrical signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electrical port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides and the like through the optical port, realizes electrical connection with an optical network terminal (such as an optical modem) through the electrical port, and the electrical connection is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to the computer and other information processing equipment through a network cable or a wireless fidelity (Wi-Fi).

Fig. 1 is a diagram of optical communication system connections according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, for example, signal transmission of several kilometers (6 kilometers to 8 kilometers), on the basis of which if a repeater is used, ultra-long-distance transmission can be theoretically achieved. Therefore, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may be several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following apparatuses: router, switch, computer, cell-phone, panel computer, TV set etc..

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. The optical module 200 converts an optical signal and an electrical signal to each other, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 includes a housing (housing) having a substantially rectangular parallelepiped shape, and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. The optical module 200 is connected to the network cable 103 via the optical network terminal 100. For example, the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103, and transmits a signal from the network cable 103 to the optical module 200, so that the optical network terminal 100 can monitor the operation of the optical module 200 as an upper computer of the optical module 200. The upper computer of the Optical module 200 may include an Optical Line Terminal (OLT) and the like in addition to the Optical network Terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100, and the network cable 103.

Fig. 2 is a structure diagram of an optical network terminal according to some embodiments, and fig. 2 only shows the structure of the optical module 200 of the optical network terminal 100 in order to clearly show the connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into a cage 106 of the optical network terminal 100, the cage 106 holds the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by a heat sink 107. After the optical module 200 is inserted into the cage 106, an electrical port of the optical module 200 is connected to an electrical connector inside the cage 106, and thus the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. Further, an optical port of the optical module 200 is connected to the optical fiber 101, and the optical module 200 establishes bidirectional electrical signal connection with the optical fiber 101.

Fig. 3 is a schematic structural diagram of an optical module according to some embodiments, and fig. 4 is an exploded structural diagram of an optical module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver.

The shell comprises an upper shell 201 and a lower shell 202, wherein the upper shell 201 is covered on the lower shell 202 to form the shell with two

openings

204 and 205; the outer contour of the housing generally appears square.

openings

204 and 205; the outer contour of the housing generally appears square.

In some embodiments, the lower housing 202 includes a bottom plate and two lower side plates disposed at both sides of the bottom plate and perpendicular to the bottom plate; the upper housing 201 includes a cover plate, and two upper side plates disposed on two sides of the cover plate and perpendicular to the cover plate, and is combined with the two side plates by two side walls to cover the upper housing 201 on the lower housing 202.

The direction of the connecting line of the two

openings

204 and 205 may be the same as the length direction of the optical module 200, or may not be the same as the length direction of the optical module 200. For example, the opening 204 is located at an end portion of the optical module 200 (left end in fig. 3), and the opening 205 is also located at an end portion of the optical module 200 (right end in fig. 3). Alternatively, the opening 204 is located at an end of the optical module 200, and the opening 205 is located at a side of the optical module 200. Wherein, the opening 204 is an electrical port, and the gold finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to receive the external optical fiber 101, so that the optical fiber 101 is connected to an optical transceiver inside the optical module 200.

The upper shell 201 and the lower shell 202 are combined in an assembling mode, so that devices such as the circuit board 300 and the optical transceiver device can be conveniently installed in the shells, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In addition, when the devices such as the circuit board 300 are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of the devices are convenient to arrange, and the automatic implementation production is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking component 203 located on an outer wall of a housing thereof, and the unlocking component 203 is configured to realize a fixed connection between the optical module 200 and an upper computer or release the fixed connection between the optical module 200 and the upper computer.

The unlocking members 203 are located on the outer walls of the two lower side plates of the lower housing 202, and include engaging members that engage with a cage of an upper computer (for example, the cage 106 of the optical network terminal 100. when the optical module 200 is inserted into the cage of the upper computer, the engaging members of the unlocking members 203 fix the optical module 200 in the cage of the upper computer, and when the unlocking members 203 are pulled, the engaging members of the unlocking members 203 move along with the optical module, so that the connection relationship between the engaging members and the upper computer is changed, and the engaging relationship between the optical module 200 and the upper computer is released, so that the optical module 200 can be drawn out from the cage of the upper computer.

The circuit board 300 includes circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as MCU, laser driver chip, amplitude limiting amplifier chip, clock data recovery CDR, power management chip, and data processing chip DSP).

The circuit board 300 connects the above devices in the optical module 200 together according to circuit design through circuit routing to implement functions of power supply, electrical signal transmission, grounding, and the like.

The circuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear a chip; the hard circuit board can also be inserted into an electric connector in the cage of the upper computer, and in some embodiments disclosed in the application, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

Flexible circuit boards are also used in some optical modules; the flexible circuit board is generally used in combination with the rigid circuit board, and for example, the rigid circuit board may be connected to the optical transceiver device to supplement the rigid circuit board. The flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board. In the embodiment of the present application, the optical transceiver device 400 is electrically connected to the circuit board 300 through a flexible circuit board, which is not shown in detail in fig. 4 and can be selected as required; the circuit board 300 supplies power to the optical transceiver 400 through the flexible circuit board, transmits electrical signals, and receives electrical signals output from the optical transceiver sub-assembly 300.

In some embodiments of the present application, the optical module includes a first chip, a second chip and an MCU, where the first chip and the second chip both need to communicate with the MCU through I2C, and in order to facilitate the communication between the first chip and the MCU, the optical module further includes a control switch. MCU is connected to control switch's input electricity, first chip and second chip are connected to control switch's output electricity respectively, and control switch receives MCU control, and control switch switches on MCU and first IC chip, MCU and the I2C communication of second IC chip promptly according to MCU's control switch, and MCU communicates with first chip and the alternate I2C of second chip with the timesharing. In some embodiments of the present application, the first chip may be used for driving light emission, the second chip may be used for signal processing of light reception, but is not limited thereto, and the optical module structure in the embodiments of the present application is not limited to the structure shown in fig. 4.

As shown in fig. 4, in some embodiments, one end of the optical transceiver 400 is connected to the optical fiber adapter 206, the optical transceiver 400 generates signal light and receives signal light from outside of the optical module, and when the optical module is in use, the signal light generated by the optical transceiver 400 is transmitted to outside of the optical module through the optical fiber adapter 206, and the signal light received from outside of the optical module is transmitted to the optical transceiver 400 through the optical fiber adapter 206.

As shown in fig. 4, in some embodiments, the optical transceiver device 400 is a unitary structure including an optical transmit component 410 and an optical receive component 420; the light emitting module 410 and the light receiving module 420 are electrically connected to the circuit board 300 through flexible circuit boards, respectively; of course, the optical transceiver 400 may also include an optical transmit sub-module and an optical receive sub-module, which is not limited to this embodiment.

In some embodiments of the present application, the optical module shown in fig. 4 may be a Combo optical transceiver module for implementing the integration of an XGSPON OLT and a GPON OLT, an EML and DFB laser with center wavelengths of 1577nm and 1490nm are respectively used for downlink of a Combo optical module product to transmit XGSPON downlink and GPON downlink services, and a high-sensitivity APD detector with a wavelength of 1260 to 1280nm is used for uplink to support burst working modes of 9.953Gbps and 2.488 Gbps. Thus, the optical transmit component 410 is used to generate 1577nm and 1490nm wavelength signal light that enables XGSPON and GPON technology transmission; the optical receiving component 420 is used for receiving 1260-1280 nm signal light transmitted by XGSPON and GPON technologies from the outside of the optical module. Of course, in the embodiment of the present application, the wavelength of the downlink light and the wavelength of the uplink light for implementing the XGSPON technology transmission and the GPON technology transmission are not limited to this, and may also be adjusted according to the technical requirements. In the following, taking the Combo optical transceiver module as an example, the first chip and the second chip provided in the embodiment of the present application perform I2C communication with the MCU in a time-sharing manner.

In order to realize the XGS/G Combo OLT to realize high-specification C + + power transmission, in some embodiments of the present application, two IC chips (e.g., GN7153B chips) are used as a driver and a limiting amplifier, respectively, to avoid the problem of crosstalk between transmission and reception and improve the sensitivity margin. Fig. 5 is a schematic structural diagram of the inside of an optical module according to some embodiments. As shown in fig. 5, a first IC chip 303 and a second IC chip 304 are provided on the circuit board 300; the first IC chip 303 is electrically connected to the light emitting module 410, and serves as a driver for implementing XGSPON technology transmission in the light emitting module 410; the second IC chip 304 is electrically connected to the light receiving component 420 and functions as a limiting amplifier for the light receiving component 420 to implement transmission of XGSPON technology. In some embodiments of the present application, the first IC chip or the second IC chip may also be disposed in a cavity of the optical transceiver. In some embodiments of the present application, the first IC chip 303 and the second IC chip 304 may have the same device address.

Fig. 6 is a schematic mechanism diagram of a circuit board according to some embodiments, as shown in fig. 5 and 6, an MCU301 is further disposed on the circuit board 300, and the MCU301 may be used to monitor the states and parameters of the electric devices such as the first IC chip 303 and the second IC chip 304. Therefore, in the optical module, the first IC chip 303 and the second IC chip 304 need to establish I2C communication with the MCU301, but when the first IC chip 303 and the second IC chip 304 have the same device address, if the first IC chip 303 and the second IC chip 304 are directly hung under the same group of I2C wires, the communication response between the first IC chip 303 and the second IC chip 304 and the I2C of the MCU301 is disordered, which causes the first IC chip 303 and the second IC chip 304 to fail to normally perform I2C communication with the MCU301, however, the number of I2C wires of the MCU301 is limited, and therefore, the problem of implementing I2C communication with the first IC chip 303 and the second IC chip 304 under the same group of I2C wires of the MCU301 needs to be solved.

In some embodiments, in order to solve the problem that the MCU301 realizes I2C communication with the first IC chip 303 and the second IC chip 304 under the same group of I2C wires, in this embodiment of the application, as shown in fig. 5 and 6, a control switch 302 is further disposed on the circuit board 300, the control switch 302 is connected between the MCU301 and the first IC chip 303 and the second IC chip 304, the control switch 302 is controlled by the MCU301, and further the MCU301 controls the control switch 302 to switch on the MCU301 to communicate with I2C of the first IC chip 303 and the MCU301 to communicate with I2C of the second IC chip 304. If the input end of the control switch 302 is connected with the MCU301, and the output end is respectively connected with the first IC chip 303 and the second IC chip 304; the control switch 302 switches the conducting direction according to the control signal provided by the MCU301, so that the first IC chip 303 and the second IC chip 304 of the MCU301 hung under the same group of I2C wires of the MCU301 can perform I2C communication with the first IC chip 303, or the MCU301 and the second IC chip 304 perform I2C communication.

Therefore, in the optical module provided in the embodiment of the present application, the control switch 302 is provided between the MCU301 and the first and

second IC chips

303 and 304, so that the first and

second IC chips

303 and 304 are controlled to perform I2C communication with the MCU 301. Therefore, in the optical module provided by the embodiment of the application, even if the first IC chip 303 and the second IC chip 304 have the same device address, the first IC chip 303 and the second IC chip 304 can communicate with the MCU301 through the normal I2C, so that the problem that the first IC chip 303 and the second IC chip 304 cannot be hooked under the same group I2C of the MCU301 because the first IC chip 303 and the second IC chip 304 have the same device address is solved. Therefore, in some embodiments, it is ensured that two IC chips with the same device address respectively correspond to a driver and are limited to be used in an optical module, and can normally communicate with the MCU, so as to meet the requirement of upgrading the Combo optical transceiver module from GPON to XGSPON.

In some embodiments of the present application, the control switch 302 includes a control pin, and the MCU301 may send an instruction to the control switch 302 to establish I2C communication with the first IC chip 303 or send an instruction to the control switch 302 to establish I2C communication with the second IC chip 304.

In some embodiments of the present application, the MCU301 may send a first control signal and a second control signal to a control pin of the control switch 302, and when the control switch 302 receives the first control signal through the control pin, the control switch 302 turns on the MCU301 to communicate with the I2C of the first IC chip 303; when the control switch 302 receives a second control signal through the control pin, the control switch 302 turns on the MCU301 to communicate with I2C of the second IC chip 304.

In some embodiments of the present application, the MCU301 may poll the control switch 302 to send the first control signal and the second control signal according to the requirement of I2C communication between the first IC chip 303 and the second IC chip 304. Such as: when the MCU301 needs to read an error state of the first IC chip 303, write a bias current, a modulation current, or an eye pattern intersection, etc., the MCU301 sends a first control signal to the control switch 302; when the MCU301 needs to write an LOS threshold or the like to the second IC chip 304, the MCU301 transmits a second control signal to the control switch 302.

In some embodiments of the present application, when the MCU301 writes data to the first IC chip 303, the MCU301 may be adopted to issue start +0x48 (the device address of the first IC chip 303) +0XX (XX is the register address in the first IC chip 303) +0xYY (YY is the data to be written) + stop; and a write data operation is completed, i.e., YY data is written to the XX register of the first IC chip 303.

In some embodiments of the present application, when the MCU301 reads the data in the first IC chip 303, the MCU301 may be adopted to send out start +0x48 (the device address of the first IC chip 303) +0XX (XX is the register address in the first IC chip 303) + restart +0x49 (the device address of the MCU 301) +0xYY (YY is the read data) + stop; and a read data operation is completed once, YY data is read out from the XX register of the first IC chip 303.

In some embodiments of the present application, when the MCU301 writes data to the second IC chip 304, the MCU301 may be adopted to issue start +0x48 (the device address of the second IC chip 304) +0XX (XX is the register address in the second IC chip 303) +0xYY (YY is the data to be written) + stop; and a write data operation is completed, that is, YY data is written to the XX register of the second IC chip 304.

In some embodiments of the present application, the control signal sent by the MCU301 to the control switch may be a high level signal and a low level signal. If the first control signal is at a high level and the second control signal is at a low level, when the control switch 302 receives the high level through the control pin, the control switch 302 turns on the MCU301 to communicate with the I2C of the first IC chip 303; when the control switch 302 receives a low level through the control pin, the control switch 302 turns on the MCU301 to communicate with I2C of the second IC chip 304. Of course, in some embodiments of the present application, the first control signal may also be low, and the second control signal may also be high.

In some embodiments of the present application, the MCU301 sets a corresponding first instruction and a second instruction in the MCU301 according to the requirement of I2C communication between the MCU301 and the first IC chip 303 and the second IC chip 304, and sends a first control signal to the control switch 302 according to the first instruction and sends a second control signal to the control switch 302 according to the second instruction.

Fig. 7 is a schematic diagram of a circuit structure on a circuit board according to some embodiments. As shown in fig. 7, the control Switch (SW)302 includes a control pin, a first SCL pin (SCL1), a first SDA pin (SDA1), a second SCL pin (SCL2), a second SDA pin (SDA2), a third SCL pin (SCL3), and a third SDA pin (SDA 3); a control pin of the control switch 302 is electrically connected with a GPIO pin of the MCU301, and the MCU301 sends a control signal to the control switch 302 through the GPIO pin; the first SCL pin and the first SDA pin of the control switch 302 are correspondingly connected to the SCL pin and the SDA pin of the MCU301, the second SCL pin and the second SDA pin are correspondingly connected to the SCL pin and the SDA pin of the first IC chip (IC1)303, and the third SCL pin and the third SDA pin are correspondingly connected to the SCL pin and the SDA pin of the second IC chip (IC2) 304. The control switch 302 switches on directions of the switches according to the control signal received by the control pin, so that the SCL pin and the SDA pin of the first IC chip 303 and the SCL pin and SDA pin of the MCU301 are correspondingly turned on, so that the first IC chip 303 and the MCU301 establish I2C communication; alternatively, the SCL pin and the SDA pin of the second IC chip 304 are made to be correspondingly turned on with the SCL pin and the SDA pin of the MCU301, so that the second IC chip 304 establishes I2C communication with the MCU 301.

In some embodiments of the present application, when the MCU301 needs to establish I2C communication with the first IC chip 303, the MCU301 sets the GPIO pin to high level, the control switch 302 internally turns on the second SCL pin and the second SDA pin of the control switch 302 and the SCL pin and the SDA pin of the MCU301 correspondingly, so that the SCL pin and the SDA pin of the MCU301 and the SCL pin and the SDA pin of the first IC chip 303 correspondingly turn on, thereby implementing I2C communication between the MCU301 and the first IC chip 303.

In some embodiments of the present application, when the MCU301 needs to establish I2C communication with the second IC chip 304, the MCU301 sets the GPIO pin to low level, and the control switch 302 correspondingly turns on the third SCL pin and the third SDA pin of the control switch 302 and the SCL pin and the SDA pin of the MCU301 inside, so that the SCL pin and the SDA pin of the MCU301 and the SCL pin and the SDA pin of the second IC chip 304 are correspondingly turned on, thereby implementing I2C communication between the MCU301 and the second IC chip 304.

As shown in fig. 7, a first SCL pin and a first SDA pin of the control switch 302 are correspondingly connected to a pull-up resistor respectively disposed between the SCL pin and the SDA pin of the MCU 301; pull-up resistors are respectively arranged between the second SCL pin and the second SDA pin of the control switch 302 and the SCL pin and the SDA pin of the first IC chip 303; pull-up resistors are respectively provided between the third SCL pin and the third SDA pin of the control switch 302 and the SCL pin and the SDA pin of the second IC chip 304.

Based on the optical module provided by the embodiments of the present application, the embodiments of the present application further provide a communication method for the optical module provided by some embodiments of the present application.

The communication method provided by the embodiment of the application comprises the following steps: the MCU sends a command of conducting communication with the first IC chip I2C or a command of communicating with the second IC chip I2C to the control switch;

In some embodiments, the present application provides a communication method, wherein the first IC chip is used for laser driving, and the second IC chip is used for amplitude-limiting amplification; the method further comprises the following steps:

if the MCU establishes I2C communication with the first IC chip, the MCU reads error state data in the first IC chip and writes bias current, modulation current or eye pattern intersection points into the first IC chip;

and if the MCU establishes I2C communication with the second IC chip, the MCU writes an LOS threshold value into the second IC chip.

In some embodiments, the communication method provided herein, the MCU sends the instruction to the control switch to communicate with the first IC chip I2C or the second IC chip I2C, and the method comprises:

the MCU sends a first control signal or a second control signal to the control switch;

when the control switch receives a first control signal, the control switch conducts the MCU to communicate with the I2C of the first IC chip;

when the control switch receives a second control signal, the control switch conducts the MCU to communicate with the I2C of the second IC chip.

In some embodiments, the communication method provided by the present application, the MCU sends to the control switch an instruction to turn on communication with the first IC chip I2C or an instruction to communicate with the second IC chip I2C, including:

the MCU sends a level signal to a control pin of the control switch;

when the control switch receives a high level through a control pin, the control switch conducts the MCU to communicate with the I2C of the first IC chip;

when the control switch receives a low level through a control pin, the control switch conducts the MCU to communicate with the I2C of the second IC chip.

In some embodiments, the communication method provided by the present application, where the MCU transmits the first control signal or the second control signal to the control switch, includes:

the MCU sends a first control signal to the control switch according to a first instruction;

and the MCU sends a second control signal to the control switch according to a second instruction. For a detailed description of the communication method provided in the embodiments of the present application, reference may be made to the description in the optical module provided in the embodiments of the present application.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present application.

Claims

1. A light module, comprising:

a first IC chip;

a second IC chip;

the MCU is in communication connection with the input end of the control switch and is in control connection with the control switch;

the control switch is connected in series with an SCL line and an SDA line of an I2C communication path of the MCU and the first IC chip and the second IC chip at the same time, and the MCU controls the control switch to enable the control switch to switch on the MCU to communicate with the I2C of the first IC chip or the second IC chip, so that the I2C communication of the MCU and the first IC chip or the second IC chip is realized in a time-sharing mode.

2. The optical module according to claim 1, wherein the device address of the first IC chip and the device address of the second IC chip are the same;

the control switch comprises a control pin, a first SCL pin, a first SDA pin, a second SCL pin, a second SDA pin, a third SCL pin and a third SDA pin;

the control pin is connected with a GPIO pin of the MCU, the first SCL pin and the first SDA pin are connected with an SCL pin and an SDA pin of the MCU, the second SCL pin and the second SDA pin are connected with the first IC chip, and the third SCL pin and the third SDA pin are connected with the second IC chip;

and the control switch switches on the MCU to communicate with the I2C of the first IC chip or the second IC chip according to the control signal received by the control pin.

3. The optical module according to claim 2, wherein the control switch switches on the MCU to communicate with I2C of the first IC chip or the second IC chip according to the control signal received by the control pin, and comprises:

when the control switch receives a first control signal through the control pin, the control switch conducts the MCU to communicate with the I2C of the first IC chip;

when the control switch receives a second control signal through the control pin, the control switch conducts the MCU to communicate with the I2C of the second IC chip.

4. The optical module according to claim 2, wherein the control switch switches on the MCU and the first IC chip or the second IC chip according to a control signal received by the control pin, and comprises:

when the control switch receives a high level through the control pin, the control switch conducts the MCU to communicate with the I2C of the first IC chip;

when the control switch receives a low level through the control pin, the control switch conducts the MCU to communicate with the I2C of the second IC chip.

5. The light module of claim 3, wherein the MCU sends a first control signal or a second control signal to the control switch, comprising:

and the MCU sends a second control signal to the control switch according to a second instruction.

6. A communication method for the optical module of claim 1, the method comprising:

the MCU sends a command of conducting communication with the first IC chip I2C or a command of communicating with the second IC chip I2C to the control switch;

7. The communication method according to claim 6, wherein the first IC chip is used for laser driving, and the second IC chip is used for clip amplification; the method further comprises the following steps:

8. The communication method of claim 6, wherein the MCU sends the control switch an instruction to communicate with the first IC chip I2C or an instruction to communicate with the second IC chip I2C, comprising:

9. The communication method of claim 6, wherein the MCU sends the control switch an instruction to turn on communication with the first IC chip I2C or an instruction to communicate with the second IC chip I2C, comprising:

the MCU sends a level signal to a control pin of the control switch;

10. The communication method of claim 8, wherein the MCU sends the first control signal or the second control signal to the control switch, comprising: