CN217135500U

CN217135500U - Optical module

Info

Publication number: CN217135500U
Application number: CN202220053203.7U
Authority: CN
Inventors: 刘澍; 吴堂猛; 石良; 王玲
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2022-01-10
Filing date: 2022-01-10
Publication date: 2022-08-05
Anticipated expiration: 2032-01-10

Abstract

The application provides an optical module, which comprises a circuit board provided with a golden finger, an MCU (microprogrammed control unit) connected with the golden finger, a laser driving chip electrically connected with the MCU and a laser chip electrically connected with the laser driving chip, wherein the circuit board is used for receiving a scene switching instruction; the MCU comprises a temperature sensor, a first memory and a second memory, wherein the temperature sensor is used for acquiring temperature parameters, the first memory stores first power supply parameters, the second memory stores second power supply parameters, and the MCU is used for acquiring the power supply parameters from the first memory or the second memory according to a scene switching instruction; the laser driving chip is used for acquiring power supply parameters corresponding to the temperature parameters from the acquired power supply parameters; the laser chip is used for receiving power supply parameters from the laser driving chip so as to adjust parameters of the optical module. According to the method and the device, different power supply parameters are stored in the MCU, and the scene switching instruction is sent to the optical module through the upper computer, so that the requirement that the optical module is suitable for different scene applications is met.

Description

Optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

The Optical access Network is a Network using light as a transmission medium, and is composed of an OLT (Optical Line Terminal), an ONU (Optical Network Unit), and an ODN (Optical Distribution Network), where the OLT is a core device of the Optical access Network.

The OLT optical module is used as a core device and bears the functions of electro-optical and electro-optical conversion in an optical network, in the conversion process, the optical device is sensitive to the environmental temperature, and various parameter indexes including optical power, transmission distance, sensitivity and the like need to be debugged in real time according to the temperature change. At present, only one group of temperature debugging tables (Bias debugging optical power, Mod debugging extinction ratio, VOP debugging receiving sensitivity, EAM debugging eye diagram and the like) are stored in all optical modules, and only one application scene is supported. The method can not be applied to mixed application scenes which require different transmission distances and different optical power indexes.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an optical module, and aims to solve the problems that the existing optical module can only support one application scene and cannot be used for mixed application scenes which are required to be suitable for different transmission distances and different optical power indexes.

The application provides an optical module, including:

the circuit board is provided with a golden finger and is used for receiving a scene switching instruction;

the MCU is arranged on the circuit board and is connected with the golden finger; the temperature sensor is used for acquiring temperature parameters, the first storage stores first power supply parameters, and the second storage stores second power supply parameters; the power supply parameter acquisition module is used for acquiring a power supply parameter from the first memory or the second memory according to the scene switching instruction;

the laser driving chip is electrically connected with the MCU and is used for acquiring power supply parameters corresponding to the temperature parameters from the acquired power supply parameters;

and the laser chip is electrically connected with the laser driving chip and is used for receiving power supply parameters from the laser driving chip so as to adjust the parameters of the optical module.

As can be seen from the foregoing embodiments, an optical module is provided in the embodiments of the present application, where the optical module includes a circuit board, an MCU, a laser driver chip, and a laser chip, and a gold finger is disposed on the circuit board and used for receiving a scene switching instruction; the MCU is arranged on the circuit board, is connected with the golden finger and comprises a temperature sensor, a first memory and a second memory, wherein the temperature sensor is used for acquiring temperature parameters, the first memory stores first power supply parameters, the second memory stores second power supply parameters, and the MCU is used for acquiring the power supply parameters from the first memory or the second memory according to a scene switching instruction; the laser driving chip is electrically connected with the MCU and used for acquiring power supply parameters corresponding to the temperature parameters from the acquired power supply parameters; the laser chip is electrically connected with the laser driving chip and used for receiving power supply parameters from the laser driving chip so as to adjust the parameters of the optical module. In the application, the MCU establishes different power supply parameters for mixed application scenes requiring different transmission distances and different optical power indexes, each group of power supply parameters corresponds to one application scene, and the different power supply parameters are stored in different memories in the MCU; the upper computer sends a scene switching instruction to the optical module, the MCU acquires power supply parameters from the corresponding memory according to the scene switching instruction so as to switch the power supply parameters, and adjusts various parameters of devices of the optical module according to the power supply parameters in the corresponding scene, so that a client can perform data switching for different scenes, the requirements of the client on debugging parameters in different scene application environments can be met, and the requirement of the optical module for adapting to different scene applications can be met.

Drawings

In order to more clearly illustrate the technical solutions in the present disclosure, the drawings needed to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art according to the drawings. Furthermore, the drawings in the following description may be regarded as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, the actual timing of signals, and the like, involved in the embodiments of the present disclosure.

FIG. 1 is a connection diagram of an optical communication system according to some embodiments;

FIG. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of a light module according to some embodiments;

FIG. 4 is an exploded view of a light module according to some embodiments;

fig. 5 is a schematic view of a partial structure of a circuit board in an optical module according to an embodiment of the present disclosure;

fig. 6 is a partial structure block diagram of an optical module provided in the embodiment of the present application.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present disclosure belong to the protection scope of the present disclosure.

Unless the context requires otherwise, throughout the description and the claims, the term "comprise" and its other forms, such as the third person's singular form "comprising" and the present participle form "comprising" are to be interpreted in an open, inclusive sense, i.e. as "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the terms used above are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless otherwise specified.

In describing some embodiments, expressions of "coupled" and "connected," along with their derivatives, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, some embodiments may be described using the term "coupled" to indicate that two or more elements are in direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents herein.

"at least one of A, B and C" has the same meaning as "A, B or at least one of C", both including the following combination of A, B and C: a alone, B alone, C alone, a and B in combination, a and C in combination, B and C in combination, and A, B and C in combination.

"A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

The use of "adapted to" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted to or configured to perform additional tasks or steps.

As used herein, "about," "approximately," or "approximately" includes the stated values as well as average values that are within an acceptable range of deviation for the particular value, as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system).

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so as to complete information transmission. Because the optical signal has the passive transmission characteristic when being transmitted through the optical fiber or the optical waveguide, the information transmission with low cost and low loss can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform interconversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electrical signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electrical port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides and the like through the optical port, realizes electrical connection with an optical network terminal (such as an optical modem) through the electrical port, and the electrical connection is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to the computer and other information processing equipment through a network cable or a wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, for example, signal transmission of several kilometers (6 kilometers to 8 kilometers), on the basis of which if a repeater is used, ultra-long-distance transmission can be theoretically achieved. Therefore, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may be several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following apparatuses: router, switch, computer, cell-phone, panel computer, TV set etc..

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be plugged into the optical network terminal 100 so that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. The optical module 200 converts an optical signal and an electrical signal to each other, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 includes a housing (housing) having a substantially rectangular parallelepiped shape, and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103, such that the optical network terminal 100 establishes a bidirectional electrical signal connection with the network cable 103. The optical module 200 is connected to the network cable 103 via the optical network terminal 100. For example, the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103, and transmits a signal from the network cable 103 to the optical module 200, so that the optical network terminal 100 can monitor the operation of the optical module 200 as an upper computer of the optical module 200. The upper computer of the Optical module 200 may include an Optical Line Terminal (OLT) and the like in addition to the Optical network Terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100, and the network cable 103.

Fig. 2 is a structural diagram of an optical network terminal according to some embodiments, and fig. 2 only shows a structure of the optical module 100 related to the optical module 200 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into a cage 106 of the optical network terminal 100, the cage 106 holds the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by a heat sink 107. After the optical module 200 is inserted into the cage 106, an electrical port of the optical module 200 is connected to an electrical connector inside the cage 106, and thus the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. Further, the optical port of the optical module 200 is connected to the optical fiber 101, and the optical module 200 establishes bidirectional electrical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of a light module according to some embodiments, and fig. 4 is an exploded view of a light module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver;

the shell comprises an upper shell 201 and a lower shell 202, wherein the upper shell 201 is covered on the lower shell 202 to form the shell with two

openings

204 and 205; the outer contour of the housing generally appears square.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate and two lower side plates located at two sides of the bottom plate and disposed perpendicular to the bottom plate; the upper housing 201 includes a cover plate, and two upper side plates disposed on two sides of the cover plate and perpendicular to the cover plate, and is combined with the two side plates by two side walls to cover the upper housing 201 on the lower housing 202.

The direction of the connecting line of the two

openings

204 and 205 may be the same as the length direction of the optical module 200, or may not be the same as the length direction of the optical module 200. For example, the opening 204 is located at an end (right end in fig. 3) of the optical module 200, and the opening 205 is also located at an end (left end in fig. 3) of the optical module 200. Alternatively, the opening 204 is located at an end of the optical module 200, and the opening 205 is located at a side of the optical module 200. Wherein, the opening 204 is an electrical port, and the gold finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to receive the external optical fiber 101, so that the optical fiber 101 is connected to an optical transceiver inside the optical module 200.

The upper shell 201 and the lower shell 202 are combined in an assembly mode, so that devices such as the circuit board 300 and the optical transceiver can be conveniently installed in the shells, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In addition, when the devices such as the circuit board 300 are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of the devices are convenient to arrange, and the automatic implementation production is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking component 203 located on an outer wall of a housing thereof, and the unlocking component 203 is configured to realize a fixed connection between the optical module 200 and an upper computer or release the fixed connection between the optical module 200 and the upper computer.

Illustratively, the unlocking members 203 are located on the outer walls of the two lower side plates of the lower housing 202, and include snap-fit members that mate with a cage of an upper computer (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the engaging member of the unlocking member 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, and the connection relationship between the engaging member and the upper computer is changed, so that the engagement relationship between the optical module 200 and the upper computer is released, and the optical module 200 can be drawn out from the cage of the upper computer.

The circuit board 300 includes circuit traces, electronic components, and chips, and the electronic components and the chips are connected together by the circuit traces according to a circuit design to implement functions of power supply, electrical signal transmission, grounding, and the like. The electronic components may include, for example, capacitors, resistors, transistors, Metal-Oxide-Semiconductor Field-Effect transistors (MOSFETs). The chip may include, for example, a Micro Controller Unit (MCU), a Transimpedance Amplifier (TIA), a Clock and Data Recovery (CDR), a power management chip, and a Digital Signal Processing (DSP) chip.

The circuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear a chip; the rigid circuit board can also be inserted into an electric connector in the cage of the upper computer.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector in the cage 106 by gold fingers. The gold fingers may be disposed on only one side surface (e.g., the upper surface shown in fig. 4) of the circuit board 300, or may be disposed on both upper and lower surfaces of the circuit board 300, so as to adapt to the situation with a large demand for the number of pins. The golden finger is configured to establish an electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like. Of course, a flexible circuit board is also used in some optical modules. Flexible circuit boards are commonly used in conjunction with rigid circuit boards to supplement the rigid circuit boards.

The optical transceiver includes an optical transmitter subassembly 400 and an optical receiver subassembly 500, which are respectively used for transmitting and receiving optical signals. The tosa 400 generally includes a light emitter, a lens and a light detector, where the lens and the light detector are respectively located at different sides of the light emitter, the front and back sides of the light emitter respectively emit light beams, and the lens is used to converge the light beams emitted from the front side of the light emitter, so that the light beams emitted from the light emitter are converged light to be conveniently coupled to an external optical fiber; the optical detector is used for receiving the light beam emitted by the reverse side of the optical emitter so as to detect the optical power of the optical emitter. Specifically, light emitted by the light emitter enters the optical fiber after being converged by the lens, and the light detector detects the light emitting power of the light emitter so as to ensure the constancy of the light emitting power of the light emitter.

In the photoelectric conversion process of the optical module, an optical device of the optical module is sensitive to the ambient temperature, and various parameter indexes including optical power, transmission distance, sensitivity and the like need to be debugged in real time according to temperature changes. At present, only one group of power supply parameters are stored in all optical modules, only one application scene is supported, and mixed application scenes with different optical power indexes and different transmission distances are not capable of being applied.

In order to solve the above problems, according to the application requirements of different scenes, multiple groups of different power supply parameters can be established for debugging parameters, each group of power supply parameters corresponds to one application scene, and a control bit is opened to enable a client to perform data switching corresponding to different scenes.

Fig. 5 is a schematic partial structure diagram of a circuit board in an optical module provided in an embodiment of the present application, and fig. 6 is a block diagram of a partial structure of an optical module provided in the embodiment of the present application. As shown in fig. 5 and 6, the optical module provided in the embodiment of the present application includes a circuit board 300, an MCU320, a laser driver chip 330, and a laser chip 340, where a gold finger 310 is disposed on the circuit board 300, and the gold finger 310 is used to receive a scene switching instruction, that is, the circuit board 300 receives the scene switching instruction sent by an upper computer through the gold finger 310.

The MCU320 is disposed on the circuit board 300 and connected to the golden finger 310, such that the scene switching command received by the golden finger 310 is transmitted to the MCU 320. The MCU320 comprises a temperature sensor, a first memory and a second memory, wherein the temperature sensor is used for acquiring temperature parameters, namely the temperature sensor is used for detecting the ambient temperature of the MCU 320; the first memory stores a first power supply parameter, and the second memory stores a second power supply parameter. After the MCU320 receives the scene switching instruction transmitted by the gold finger 310, the MCU320 obtains the power supply parameters from the first memory or the second memory according to the scene switching instruction.

The laser driving chip 330 is disposed on the circuit board 300, electrically connected to the MCU320, and configured to obtain a power supply parameter corresponding to the temperature parameter from the obtained power supply parameter. That is, after the MCU320 obtains the first power supply parameter or the second power supply parameter from the first memory or the second memory according to the scene switching instruction, the laser driver chip 330 obtains the power supply parameter corresponding to the temperature parameter from the first power supply parameter or the second power supply parameter according to the temperature parameter detected by the temperature sensor.

The laser chip 340 is disposed on the circuit board 300, electrically connected to the laser driving chip 330, and configured to receive power supply parameters from the laser driving chip, so as to perform parameter adjustment on the optical module. That is, after the power supply parameter corresponding to the temperature parameter is obtained from the first power supply parameter or the second power supply parameter, the laser chip 340 supplies power according to the power supply parameters, and parameter adjustment can be performed on the optical module through different power supply parameters.

In some embodiments, the optical device of the optical module is sensitive to the ambient temperature, and various parameter indexes include optical power, extinction ratio, receiving sensitivity, eye pattern, and the like, that is, parameters such as optical power, extinction ratio, sensitivity, eye pattern, and the like need to be debugged in real time according to the temperature change. In the MCU, the first power supply parameter comprises the relationship between the temperature and the optical power, the extinction ratio, the receiving sensitivity and the eye pattern in the first application scene, and the second power supply parameter comprises the relationship between the temperature and the optical power, the extinction ratio, the receiving sensitivity and the eye pattern in the second application scene.

For different scene application requirements, the relationship between the temperature and parameters such as the Bias optical power, the Mod extinction ratio, the VOP sensitivity, the EAM eye diagram and the like is different, under one scene application requirement, a first power supply parameter can be established according to the relationship between the temperature and parameters such as the Bias optical power, the Mod extinction ratio, the VOP sensitivity, the EAM eye diagram and the like, and the structure of the first power supply parameter corresponding to the first scene is as follows:

under the application requirement of another scene, a second power supply parameter can be established according to the relationship between the temperature and parameters such as the Bias optical power, the Mod extinction ratio, the VOP sensitivity, the EAM eye diagram and the like, and the structure of the second power supply parameter corresponding to the second scene is as follows:

in some embodiments, for a dual-scene application requirement, two different sets of power supply parameters are established for debugging parameters (Bias optical power, Mod extinction ratio, VOP sensitivity, EAM eye diagram, etc.), each set of power supply parameters corresponds to one application scene, and the established different power supply parameters are stored in the MCU Flash and are one-dimensional arrays.

When the scene application of the optical module is a first scene, the relation between each parameter of the device of the optical module and the temperature is obtained from the first power supply parameter, so that the optical module is debugged according to each debugging parameter at the corresponding temperature in the first power supply parameter. When the scene application of the optical module is a second scene, the relation between each parameter of the device of the optical module and the temperature is obtained from the second power supply parameter, so that the optical module is debugged according to each debugging parameter at the corresponding temperature in the second power supply parameter.

The upper computer can send a scene switching instruction to the optical module through the I2C interface, the scene switching instruction can be data written into a register 0xRR of the MCU, and different data written into the register is used to indicate different scene applications of the optical module.

Specifically, the register OxRR of the MCU represents a 16-system register, such as Ox6E, Ox76, etc., and is located in the MCU, the upper computer communicates with the optical module through an I2C interface, and both follow an I2C communication protocol, and when the upper computer sends: start + Device Address + Register Address + Data + Stop, i.e. completing a write operation, for example, Start + OxA2+ OxRR + Ox01+ Stop indicates that the host computer writes OxA2 a Device Address (optical module Address), and OxRR (Register) writes Data Ox 01. The MCU indicates the scenario that the customer wants to switch based on the data written in the register.

In some embodiments, the MCU analyzes the scene switching instruction to obtain data written by the host computer to the register in the MCU320, and is further configured to detect whether the value written to the register in the MCU320 is 0, if the value written to the register is 0, the default scene in the optical module is a first application scene, all debug parameters in the optical module after power-on operation are valued from the first memory in the MCU320 to obtain values of parameters such as Bias optical power, Mod extinction ratio, VOP sensitivity, and EAM eye diagram at a corresponding temperature in the first application scene, and adjust parameters of the optical module device under the first application scene by the obtained values.

If the value written in the register is not 0, it indicates that the customer needs to switch to the second scene, after the optical module is powered on and operates, all the debugging parameters are taken from the second memory in the MCU320, values of parameters such as Bias optical power, Mod extinction ratio, VOP sensitivity, EAM eye diagram and the like at corresponding temperatures in the second application scene are obtained, and the obtained values are used to adjust parameters of the optical module device in the second application scene.

The optical module provided by the embodiment of the application comprises a circuit board, an MCU, a laser driving chip and a laser chip, wherein the circuit board is provided with a golden finger for receiving a scene switching instruction; the MCU is arranged on the circuit board, is connected with the golden finger and comprises a temperature sensor, a first memory and a second memory, wherein the temperature sensor is used for acquiring temperature parameters, the first memory stores first power supply parameters, the second memory stores second power supply parameters, and the MCU is used for acquiring the power supply parameters from the first memory or the second memory according to a scene switching instruction; the laser driving chip is electrically connected with the MCU and used for acquiring power supply parameters corresponding to the temperature parameters from the acquired power supply parameters; the laser chip is electrically connected with the laser driving chip and used for receiving power supply parameters from the laser driving chip so as to adjust the parameters of the optical module. In the application, the MCU establishes different power supply parameters for mixed application scenes requiring different transmission distances and different optical power indexes, each group of power supply parameters corresponds to one application scene, and the different power supply parameters are stored in different memories in the MCU; the upper computer sends a scene switching instruction to the optical module, the MCU acquires power supply parameters from the corresponding memory according to the scene switching instruction so as to switch the power supply parameters, and adjusts various parameters of devices of the optical module according to the power supply parameters in the corresponding scene, so that a client can perform data switching corresponding to different scenes, the requirements of the client on debugging parameters in different scene application environments are met, and the requirement that the optical module is suitable for different scene applications is met.

Based on the optical module described in the above embodiment, an embodiment of the present application further provides a method for controlling scene switching in an optical module, where for different scene application requirements, multiple groups of different power supply parameters may be established for debugging parameters, each group of power supply parameters corresponds to one application scene, and a control bit is opened to allow a client to perform data switching corresponding to different scenes.

The method for controlling scene switching in the optical module provided by the embodiment of the application comprises the following steps:

s100: and the MCU establishes different power supply parameters according to the relationship between the temperature and the debugging parameters.

For the application requirements of the double scenes, the MCU establishes a first power supply parameter according to the relation between the temperature and parameters such as the Bias optical power, the Mod extinction ratio, the VOP sensitivity, the EAM eye diagram and the like under the first application scene, and stores the first power supply parameter in a first memory in the MCU; and the MCU establishes a second power supply parameter according to the relationship between the temperature and parameters such as the Bias optical power, the Mod extinction ratio, the VOP sensitivity, the EAM eye diagram and the like in a second application scene, and stores the second power supply parameter in a second memory in the MCU.

S200: a scene change instruction is received.

S300: the MCU detects the value of its register according to the scene switching instruction.

S400: and the MCU takes values from corresponding power supply parameters according to the values of the registers.

S500: and the MCU adjusts parameters of the optical module through the obtained values.

The MCU analyzes the scene switching instruction to obtain data written into the register by the upper computer, then the MCU detects whether the value written into the register is 0, if the value written into the register is 0, the scene in the optical module is defaulted to be a first application scene, all debugging parameters of the optical module after power-on operation are taken from the first power supply parameter, the values of parameters such as the Bias optical power, the Mod extinction ratio, the VOP sensitivity, the EAM eye diagram and the like at corresponding temperature in the first application scene are obtained, and the parameters of the optical module device are adjusted under the first application scene through the obtained values.

If the value written in the register is not 0, it indicates that the customer needs to switch to a second application scene, all debugging parameters of the optical module after power-on operation are valued from the second power supply parameter, values of parameters such as Bias optical power, Mod extinction ratio, VOP sensitivity, EAM eye diagram and the like at corresponding temperatures in the second application scene are obtained, and the parameters of the optical module device are adjusted under the second application scene through the obtained values.

In the application, an MCU of an optical module establishes different power supply parameters according to the relationship between temperature and debugging parameters, a scene switching control register OxRR is arranged in the optical module, an upper computer sends a scene switching instruction for rewriting the OxRR register through an I2C interface, then the value of the register is detected, when the value of the OxRR register is 0, the optical module is in a first application scene mode by default, all debugging parameters of the optical module are taken from the first power supply parameter after power-on operation, and all parameters of an optical module device are adjusted according to the taken value; when a client needs to switch to a second application scene, the value of the OxRR register needs to be written to 1, so that all debugging parameters of the optical module take values from the second power supply parameter, and parameters of optical module devices are adjusted according to the obtained values to complete scene switching.

Different power supply parameters are established for mixed application scenes which are required to be suitable for different transmission distances and different optical power indexes, and each group of power supply parameters corresponds to one application scene; the upper computer sends a scene switching instruction to the optical module, the MCU switches power supply parameters according to the scene switching instruction, and adjusts each parameter of the device of the optical module according to the power supply parameters in the corresponding scene, so that a client can perform data switching corresponding to different scenes, the requirements of the client on debugging parameters in different scene application environments are met, and the requirement that the optical module is suitable for different scene applications is met.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A light module, comprising:

2. The optical module according to claim 1, wherein the first power supply parameter includes a relationship between temperature and optical power, an extinction ratio, a reception sensitivity, and an eye pattern in a first application scenario, and the second power supply parameter includes a relationship between temperature and optical power, an extinction ratio, a reception sensitivity, and an eye pattern in a second application scenario.

3. The optical module according to claim 1, wherein the MCU further comprises a register, and the register is configured to store data written by the upper computer to the MCU, which is obtained according to the scene switching instruction.

4. The optical module according to claim 3, wherein the register stores data of 0, and the laser driver chip stores the first power supply parameter.

5. The optical module according to claim 4, wherein the register stores data other than 0, and the laser driver chip stores the second power supply parameter.

6. The optical module according to claim 1, wherein the golden finger is in communication connection with an upper computer through I2C.