CN113614153A - 干膜、固化物和电子部件 - Google Patents

干膜、固化物和电子部件 Download PDF

Info

Publication number
CN113614153A
CN113614153A CN202080024320.4A CN202080024320A CN113614153A CN 113614153 A CN113614153 A CN 113614153A CN 202080024320 A CN202080024320 A CN 202080024320A CN 113614153 A CN113614153 A CN 113614153A
Authority
CN
China
Prior art keywords
curable resin
light
dry film
inorganic filler
colorant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080024320.4A
Other languages
English (en)
Chinese (zh)
Inventor
远藤新
仲田和贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of CN113614153A publication Critical patent/CN113614153A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN202080024320.4A 2019-03-26 2020-03-11 干膜、固化物和电子部件 Pending CN113614153A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019059068 2019-03-26
JP2019-059068 2019-03-26
PCT/JP2020/010575 WO2020195843A1 (ja) 2019-03-26 2020-03-11 ドライフィルム、硬化物、および、電子部品

Publications (1)

Publication Number Publication Date
CN113614153A true CN113614153A (zh) 2021-11-05

Family

ID=72611373

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080024320.4A Pending CN113614153A (zh) 2019-03-26 2020-03-11 干膜、固化物和电子部件

Country Status (5)

Country Link
JP (1) JPWO2020195843A1 (ja)
KR (1) KR20210145772A (ja)
CN (1) CN113614153A (ja)
TW (1) TWI846846B (ja)
WO (1) WO2020195843A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115926576A (zh) * 2022-12-13 2023-04-07 东莞市毅联电子科技有限公司 一种挠性电路板遮光涂料及其制备方法和使用方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013161756A1 (ja) * 2012-04-23 2013-10-31 日立化成株式会社 感光性樹脂組成物、感光性フィルム、永久マスクレジスト及び永久マスクレジストの製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005238469A (ja) * 2004-02-24 2005-09-08 Tosoh Corp 積層体
JP5624184B1 (ja) 2013-06-28 2014-11-12 太陽インキ製造株式会社 ドライフィルムおよびプリント配線板
JP6289311B2 (ja) * 2014-08-29 2018-03-07 積水化成品工業株式会社 粘接着剤組成物、粘接着シート、被着体の接着方法及び複合材
JP6665627B2 (ja) * 2016-03-28 2020-03-13 日本ゼオン株式会社 樹脂組成物及び電子部品

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013161756A1 (ja) * 2012-04-23 2013-10-31 日立化成株式会社 感光性樹脂組成物、感光性フィルム、永久マスクレジスト及び永久マスクレジストの製造方法

Also Published As

Publication number Publication date
KR20210145772A (ko) 2021-12-02
TW202108362A (zh) 2021-03-01
JPWO2020195843A1 (ja) 2020-10-01
WO2020195843A1 (ja) 2020-10-01
TWI846846B (zh) 2024-07-01

Similar Documents

Publication Publication Date Title
JP7169076B2 (ja) 熱硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
JP6999459B2 (ja) ドライフィルム、硬化物、および、電子部品
WO2018142827A1 (ja) ドライフィルム、硬化物、プリント配線板、および、硬化物の製造方法
JP7505527B2 (ja) 樹脂組成物
JPWO2019073763A1 (ja) 硬化体及びその製造方法、樹脂シート及び樹脂組成物
CN107434945A (zh) 氟系树脂的非水系分散体、使用其的含氟系树脂的热固化树脂组合物和其固化物
JP7133955B2 (ja) 熱硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
JPWO2020158202A1 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
CN113614153A (zh) 干膜、固化物和电子部件
JP7300601B2 (ja) 熱硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
KR102313172B1 (ko) 드라이 필름, 경화물 및 전자 부품
JP7511399B2 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、電子部品
TWI844644B (zh) 中空裝置用乾式薄膜、硬化物及電子零件
JP2020105399A (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
WO2022202427A1 (ja) 熱硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板および電気電子部品
WO2024204710A1 (ja) マルチチップモジュール基板
TWI851551B (zh) 乾膜、硬化物及電子零件
JP7454394B2 (ja) ドライフィルム、硬化物、電子部品、および、ドライフィルムの製造方法
JP7509162B2 (ja) プリント配線板の製造方法
JP2024124852A (ja) プリント配線板の製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20230705

Address after: Saitama Prefecture, Japan

Applicant after: TAIYO HOLDINGS Co.,Ltd.

Address before: Saitama Prefecture, Japan

Applicant before: TAIYO INK MFG. Co.,Ltd.

TA01 Transfer of patent application right