CN113539911A - 晶片生成装置 - Google Patents

晶片生成装置 Download PDF

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CN113539911A
CN113539911A CN202110387862.4A CN202110387862A CN113539911A CN 113539911 A CN113539911 A CN 113539911A CN 202110387862 A CN202110387862 A CN 202110387862A CN 113539911 A CN113539911 A CN 113539911A
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饭塚健太吕
山本凉兵
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Disco Corp
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Abstract

本发明提供一种晶片生成装置，即使发生停电或故障，半导体锭与晶片的父子关系也不会被破坏而始终明确。晶片生成装置包含：搬送托盘，其具有收纳半导体锭的锭收纳部和收纳从半导体锭生成的晶片的晶片收纳部；带式搬送机单元，其将搬送托盘搬送至各加工机；盒架，其与搬送托盘对应地载置收纳晶片的盒；以及转移单元，其将晶片从搬送托盘的晶片收纳部转移至载置在盒架上的盒中。在搬送托盘上施加有识别标记。在与搬送托盘对应的盒架或盒上施加有与搬送托盘上所施加的识别标记相同的识别标记。

Description

晶片生成装置
技术领域
本发明涉及从半导体锭生成晶片的晶片生成装置。
背景技术
IC、LSI、LED等器件是在以Si(硅)或Al2O3(蓝宝石)等为原材料的晶片的正面上层叠功能层并通过分割预定线进行划分而形成的。另外，功率器件、LED等器件是在以单晶SiC(碳化硅)为原材料的晶片的正面上层叠功能层并通过分割预定线进行划分而形成的。形成有器件的晶片通过切削装置、激光加工装置对分割预定线实施加工而被分割成一个个的器件芯片，分割得到的各器件芯片被利用于便携电话、个人计算机等电子设备。
关于形成器件的晶片，一般是通过利用线切割机将圆柱形状的半导体锭薄薄地切断而生成的。通过对切断得到的晶片的正面和背面进行研磨而精加工成镜面(例如参照专利文献1)。然而，当利用线切割机将半导体锭切断并对切断的晶片的正面和背面进行研磨时，半导体锭的大部分(70％～80％)被舍弃，存在不经济的问题。特别是在单晶SiC锭中，硬度高因而利用线切割机进行切断很困难，需要相当长的时间，所以生产性较差，并且半导体锭的单价高，在高效地生成晶片方面存在课题。
因此，有人提出了下述技术：将对于单晶SiC具有透过性的波长的激光光线的聚光点定位在单晶SiC锭的内部而对单晶SiC锭照射激光光线，在切断预定面上形成剥离层，沿着形成有剥离层的切断预定面将晶片从单晶SiC锭剥离(例如参照专利文献2)。
另外，在下述专利文献2公开的晶片生成装置中，始终在带式搬送机单元上载置几个(例如4个)收纳了半导体锭的搬送托盘，能够高效地实施下述的一系列作业：利用带式搬送机单元将半导体锭搬送到各加工机而从半导体锭生成晶片，将晶片收纳在与生成了晶片的半导体锭相同的搬送托盘上，在晶片搬出区域中将晶片收纳在与半导体锭相关联的盒中。
专利文献1：日本特开2000-94221号公报
专利文献1：日本特开2019-106458号公报
但是，当晶片生成装置的运转由于停电或故障而停止，进行将搬送托盘从带式搬送机单元搬出等操作然后再次运转时，有时无法将晶片收纳到与半导体锭相关联的盒中，存在半导体锭与晶片的父子关系变得不明确的问题。
发明内容
因此，本发明的目的在于提供晶片生成装置，即使发生停电或故障，半导体锭与晶片的父子关系也不会被破坏而始终明确。
根据本发明，提供晶片生成装置，其从半导体锭生成晶片，其中，该晶片生成装置具有：搬送托盘，其具有收纳该半导体锭的锭收纳部和收纳从该半导体锭生成的晶片的晶片收纳部；带式搬送机单元，其将该搬送托盘搬送至各加工机；盒架，其与该搬送托盘对应地载置收纳晶片的盒；以及转移单元，其将晶片从该搬送托盘的该晶片收纳部转移至该盒架所载置的该盒中，在该搬送托盘上施加有识别标记，在与该搬送托盘对应的该盒架或该盒上施加有与该搬送托盘上所施加的识别标记相同的识别标记。
优选该识别标记是色彩、记号、文字、图形、花纹、图画中的任意标记或组合。
根据本发明，即使在发生停电或故障，晶片生成装置的运转停止的情况下，也能够将晶片可靠地收纳在与半导体锭相关联的盒中，半导体锭与晶片的父子关系不会被破坏而始终明确。
附图说明
图1是本发明实施方式的晶片生成装置的立体图。
图2是图1所示的搬送托盘的立体图。
图3是图1所示的晶片生成装置的局部立体图。
标号说明
2：晶片生成装置；4：搬送托盘；6：带式搬送机单元；8：盒；10：盒架；12：转移单元；22：锭收纳部；22a：第一锭收纳部；22b：第二锭收纳部；28：晶片收纳部；28a：第一晶片收纳部；28b：第二晶片收纳部；34：搬送托盘的识别标记；34’：盒架的识别标记；34”：盒的识别标记。
具体实施方式
下面，参照附图对本发明实施方式的晶片生成装置进行说明。
图1中所示的晶片生成装置2包含：搬送托盘4，其对半导体锭(以下简称为“锭”)和晶片进行收纳；带式搬送机单元6，其将搬送托盘4搬送至各加工机；盒架10，其将收纳晶片的盒8按照与搬送托盘4对应的方式进行载置；以及转移单元12，其将晶片从搬送托盘4转移到载置于盒架10的盒8中。
参照图2进行说明，搬送托盘4包含：矩形的上壁14；矩形的下壁16，其配置在上壁14的下方；矩形的一对侧壁18，它们将上壁14和下壁16连结；以及通道20，其由上壁14、下壁16和一对侧壁18形成。
在上壁14的上表面上形成有收纳锭的锭收纳部22。本实施方式的锭收纳部22具有：环状的第一锭收纳部22a，其从上壁14的上表面向下方凹陷；以及圆形的第二锭收纳部22b，其直径比第一锭收纳部22a小，比第一锭收纳部22a更向下方凹陷。第一锭收纳部22a和第二锭收纳部22b形成为同心状。
第一锭收纳部22a的直径比直径较大的大直径(例如直径为6英寸)的圆柱状锭24略大(几mm左右)，在第一锭收纳部22a中收纳直径较大的锭24。第一锭收纳部22b的直径比直径较小的小直径(例如直径为4英寸)的圆柱状锭26略大，在第二锭收纳部22b中收纳直径较小的锭26。
这样，本实施方式的锭收纳部22具有与两种大小的锭24、26对应的同心状的第一、第二锭收纳部22a、22b。另外，锭收纳部22也可以是与一种大小的锭对应的单一的圆形收纳凹部，或者，锭收纳部22也可以具有与3种以上的大小的锭对应的同心状的多个收纳凹部。
如图2所示，在下壁16的上表面上形成有收纳由锭生成的晶片的晶片收纳部28。本实施方式的晶片收纳部28具有：环状的第一晶片收纳部28a，其从下壁16的上表面向下方凹陷；以及圆形的第二晶片收纳部28b，其直径比第一晶片收纳部28a小，比第一晶片收纳部28a更向下方凹陷。第一晶片收纳部28a和第二晶片收纳部28b形成为同心状。
第一晶片收纳部28a的直径比直径较大的大直径(例如直径为6英寸)的圆板状晶片30略大，在第一晶片收纳部28a中收纳直径较大的晶片30。第二晶片收纳部28b的直径比直径较小的小直径(例如直径为4英寸)的圆板状晶片32略大，在第二晶片收纳部28b中收纳直径较小的晶片32。
这样，本实施方式的晶片收纳部28具有与两种大小的晶片30、32对应的同心状的第一、第二晶片收纳部28a、28b。另外，晶片收纳部28也可以是与一种大小的晶片对应的单一的圆形收纳凹部，或者，晶片收纳部28也可以具有与3种以上的大小的晶片对应的同心状的多个收纳凹部。另外，也可以与本实施方式相反，在上壁14的上表面上形成晶片收纳部28，在下壁16的上表面上形成锭收纳部22。
如图1和图2所示，在搬送托盘4上施加有识别标记34。在本实施方式中，识别标记34可以是色彩、记号、文字、图形、花纹、图画中的任意识别标记，或者也可以是色彩、记号、文字、图形、花纹、图画的2个以上的组合。在本实施方式中，在搬送托盘4的侧壁18的外表面上作为识别标记34而施加有文字A、B、C、D，但也可以作为识别标记34而施加红色、蓝色、绿色、黄色等色彩，还可以施加○、△、□、☆等图形，或者还可以描绘有图画。
如图1所示，收纳了锭(在本实施方式中，是直径较大的锭24)的搬送托盘4被收纳在搬送托盘架36中。本实施方式的搬送托盘架36具有在图1中箭头X所示的X轴方向上贯通的4个收纳部38。在搬送托盘架36中，能够从图1中的X轴方向近前侧将搬送托盘4收纳在收纳部38中，并且能够从图1中的X轴方向里侧将收纳部38内的搬送托盘4搬出。另外，图1中箭头Y所示的Y轴方向是与X轴方向垂直的方向，图1中箭头Z所示的Z轴方向是与X轴方向和Y轴方向垂直的上下方向。由X轴方向和Y轴方向限定的XY平面实质上是水平的。
参照图1以及图2，对各加工机进行说明，收纳锭的搬送托盘4被搬送至各加工机。本实施方式的晶片生成装置2具有锭磨削单元40、激光照射单元42以及晶片剥离单元44作为加工机。
如图3所示，锭磨削单元40包含：保持工作台46，其能够旋转，对锭进行吸引保持；以及磨削单元48，其对吸引保持在保持工作台46上的锭的上表面进行磨削而平坦化。磨削单元48具有能够旋转的磨削磨轮50，该磨削磨轮50具有磨削磨具(未图示)。而且，锭磨削单元40一边使吸引保持了锭的保持工作台46旋转并且使磨轮磨轮50旋转，一边使磨削磨轮与锭的上表面接触，由此对锭的上表面进行磨削而平坦化。
激光照射单元42包含：保持工作台52，其能够沿X轴方向移动并且能够旋转，对锭进行吸引保持；激光照射单元54，其对吸引保持在保持工作台52上的锭照射激光光线。激光照射单元54具有聚光器56，该聚光器56将从激光振荡器(未图示)射出的脉冲激光光线进行聚光而向锭照射，并且能够沿Y轴方向移动。
激光照射单元42一边使吸引保持着锭的保持工作台52在X轴方向上移动或者使聚光器56在Y轴方向上移动，一边将对于锭具有透过性的波长的激光光线的聚光点定位于距离锭的上表面为相当于要生成的晶片的厚度的深度而向锭照射激光光线，由此在锭的内部形成强度降低的剥离层。
晶片剥离单元44包含：保持工作台58，其能够沿X轴方向移动，对锭进行吸引保持；液槽体60，其与保持工作台58协作而形成液体收纳空间；以及超声波振动生成部件62，其对吸引保持在保持工作台58上的锭赋予超声波振动，并且对从锭剥离的晶片进行吸引保持。
晶片剥离单元44在由吸引保持着锭的保持工作台58和液槽体60形成的液体收纳空间中收纳液体，然后使超声波振动生成部件62进行动作而对锭赋予超声波振动，由此以剥离层为起点将晶片从锭剥离。
在本实施方式中，带式搬送机单元6将搬送托盘4搬送至锭磨削单元40、激光照射单元42和晶片剥离单元44。
带式搬送机单元6包含：往路带式搬送机64，其沿Y1方向搬送搬送托盘4；返路带式搬送机66，其沿Y2方向(Y1方向的相反方向)搬送搬送托盘4；第一搬送单元68，其将搬送托盘4从往路带式搬送机64的终点搬送至返路带式搬送机66的起点，并且使由往路带式搬送机6搬送的搬送托盘4停止在与晶片剥离单元44面对的位置上；以及第二搬送单元70，其将搬送托盘4从返路带式搬送机66的终点搬送至往路带式搬送机64的起点。
另外，带式搬送机单元6包含：能够升降的第一搬送托盘止挡件72，其使由往路带式搬送机64搬送的搬送托盘4停止在与锭磨削单元40面对的位置上；以及能够升降的第二搬送托盘止挡件74，其使由往路带式搬送机64搬送的搬送托盘4停止在与激光照射单元42面对的位置上。
而且，带式搬送机单元6包含：第一移动机构76，其使锭在借助第一搬送托盘止挡件72而停止的搬送托盘4与锭磨削单元40之间移动；第二移动机构78，其使锭在借助第二搬送托盘止挡件74而停止的搬送托盘4与激光照射单元42之间移动；以及第三移动机构80，其使锭在借助第一搬送单元68而停止的搬送托盘4与晶片剥离单元44之间移动，并且使从锭剥离的晶片从晶片剥离单元44移动至搬送托盘4。
可以是共同的结构的第一、第二、第三移动机构76、78、80各自包含：多关节臂82，其能够在X轴方向、Y轴方向以及Z轴方向上移动；以及吸附片84，其按照上下反转自如的方式安装在多关节臂82的前端。在吸附片84的一个面上形成有与吸引单元(未图示)连接的多个吸引孔(未图示)。
如图1所示，本实施方式的盒架10具有沿Y轴方向贯通的16个收纳部86。将盒8收纳在各收纳部86中，该盒8收纳从锭剥离的晶片。在盒架10中，能够从图1中的Y轴方向近前侧将盒8收纳在收纳部86中，并且能够从图1中的Y轴方向里侧将晶片收纳在收纳部86内的盒8中。
重要的是，对与搬送托盘4对应的盒架10施加与对搬送托盘4施加的识别标记34相同的识别标记34’，或者对与搬送托盘4对应的盒8施加与对搬送托盘4施加的识别标记34相同的识别标记34”。在本实施方式中，与搬送托盘4的识别标记34相同的文字A、B、C、D作为识别标记34’被施加在盒架10的收容部86上，并且与搬送托盘4的识别标记34相同的文字A、B、C、D作为识别标记34”被施加在盒8的外表面上。在盒架10的收纳部86上载置施加了与各收纳部86的识别标记34’相同的识别标记34”的盒8。需要说明的是，在图1中，仅对盒架10的最上层的收容部86施加了识别标记34’，但也可以对其他收容部86施加识别标记34’。
参照图3进行说明，转移单元12包括：能够沿X轴方向、Y轴方向以及Z轴方向移动的多关节臂88；以及按照上下反转自如的方式安装于多关节臂88的前端的吸附片90。在吸附片90的一个面上形成有与吸引单元(未图示)连接的多个吸引孔(未图示)。转移单元12将搬送托盘架36内的搬送托盘4搬送至带式搬送机单元6，并且将晶片从搬送托盘4的晶片收纳部28转移至载置于盒架10上的盒8中。
在利用晶片生成装置2从锭生成晶片时，如图1所示，首先，准备1个以上的锭(在本实施方式中为4个大直径的锭24)。接着，将各个锭24收纳于搬送托盘4的第一锭收纳部22a，将收纳有锭24的搬送托盘4收纳于搬送托盘架36。
接着，实施将锭24从搬送托盘架36搬送至激光照射单元42的第一搬送工序。通常，锭的端面被平坦化至不妨碍后述的剥离层形成工序中的激光光线的入射的程度，因此，在本实施方式中，对在第一搬送工序中将锭24从搬送托盘架36搬送至激光照射单元42的例子进行说明，但在锭24的端面未被平坦化至不妨碍剥离层形成工序中的激光光线的入射的程度的情况下，也可以在第一搬送工序中将锭24从搬送托盘架36搬送至锭磨削单元40。
在第一搬送工序中，首先，驱动转移单元12的多关节臂88，将吸引孔朝上的吸附片90插入搬送托盘4的通道20。接着，在通道20内使吸附片90稍微上升而利用吸附片90对搬送托盘4的上壁14的下表面进行吸引保持。接着，将由吸附片90吸引保持的搬送托盘4从搬送托盘架36搬送到往路带式搬送机64。
在将搬送托盘4载置于往路带式搬送机64之后，利用往路带式搬送机64沿Y1方向将搬送托盘4搬送至与激光照射单元42面对的位置。此时，通过使第一搬送托盘止挡件72下降，并且使第二搬送托盘止挡件74上升，从而使搬送托盘4停止在与激光照射单元42面对的位置。接着，驱动第二移动机构78的多关节臂82，利用吸附片84对搬送托盘4上的锭24进行吸引保持。接着，使由吸附片84吸引保持的锭24从搬送托盘4移动到激光照射单元42的保持工作台52上。
在实施了第一搬送工序之后，在激光照射单元42中如下的实施剥离层形成工序：利用保持工作台52对锭24进行吸引保持，并且将对于锭24具有透过性的波长的激光光线的聚光点定位于距离保持工作台52所吸引保持的锭24的上表面为相当于要生成的晶片的厚度的深度，对锭24照射激光光线而形成剥离层。
在实施了剥离层形成工序之后，实施第二搬送工序，将形成有剥离层的锭24从激光照射单元42搬送至晶片剥离单元44。
在第二搬送工序中，首先，驱动第二移动机构78的多关节臂82，利用吸附片84对保持工作台52上的锭24进行吸引保持，并且解除保持工作台52的吸引力。接着，使由吸附片84吸引保持的锭24从保持工作台52移动到搬送托盘4的第一锭收纳部22a中。
接着，利用往路带式搬送机64将搬送托盘4沿Y1方向搬送至与晶片剥离单元44面对的位置。此时，通过第一搬送单元68使搬送托盘4在与晶片剥离单元44面对的位置停止。接着，驱动第三移动机构80的多关节臂82，利用吸附片84对搬送托盘4上的锭24进行吸引保持。接着，使由吸附片84吸引保持的锭24从搬送托盘4移动到晶片剥离单元44的保持工作台58上。
在实施了第二搬送工序之后，在晶片剥离单元44中实施如下的晶片剥离工序：利用保持工作台58对形成有剥离层的锭24进行吸引保持，并且对由保持工作台58吸引保持的锭24的上表面进行保持，以剥离层为起点将晶片30从锭24剥离。
在实施了晶片剥离工序之后，实施如下的第三搬送工序：将从锭24剥离的晶片30(参照图2)从晶片剥离单元44搬送到盒架10的盒8中，并且将剥离了晶片30的锭24从晶片剥离单元44搬送到锭磨削单元40。
在第三搬送工序中，首先，驱动第三移动机构80的多关节臂82，利用吸附片84对从锭24剥离的晶片30进行吸引保持。接着，使由吸附片84吸引保持的晶片30从晶片剥离单元44移动到搬送托盘4的第一晶片收纳部28a中。
接着，驱动第三移动机构80的多关节臂82，利用吸附片84对保持工作台58上的锭24进行吸引保持，并且解除保持工作台58的吸引力。接着，使由吸附片84吸引保持的锭24从保持工作台58移动到搬送托盘4的第一锭收纳部22a中。
接着，利用第一搬送单元68将收纳有锭24和晶片30的搬送托盘4从往路带式搬送机64搬送到返路带式搬送机66。接着，利用返路带式搬送机66将搬送托盘4向Y2方向搬送，将搬送托盘4交至第二搬送单元70。接着，利用第二搬送单元70将搬送托盘4朝向往路带式搬送机64搬送。
在从第二搬送单元70向往路带式搬送机64交出搬送托盘4之前，使第二搬送单元70暂时停止。接着，驱动转移单元12的多关节臂88，利用吸附片90对收纳于第二搬送单元70上的搬送托盘4的晶片30进行吸引保持。然后，将由吸附片90吸引保持的晶片30从搬送托盘4搬出，将晶片30转移到盒架10的盒8内。此时，将晶片30转移到施加了与搬送托盘4的识别标记34相同的识别标记34”的盒8中。
接着，使第二搬送单元70进行动作，在将搬送托盘4从第二搬送单元70交至往路带式搬送机64之后，利用往路带式搬送机64将搬送托盘4沿Y1方向搬送至与锭磨削单元40面对的位置。此时，通过使第一搬送托盘止挡件72上升，使搬送托盘4停止在与锭磨削单元40面对的位置。接着，驱动第一移动机构76的多关节臂82，利用吸附片84对搬送托盘4上的锭24进行吸引保持。接着，使由吸附片84吸引保持的锭24从搬送托盘4移动至锭磨削单元40的保持工作台46上。
在实施了第三搬送工序之后，在锭磨削单元40中实施如下的锭磨削工序：利用保持工作台46对剥离了晶片30的锭24进行吸引保持，并且对由保持工作台46吸引保持的锭24的上表面(剥离面)进行磨削而平坦化。
在实施了锭磨削工序之后，实施第四搬送工序，将上表面平坦化的锭24从锭磨削单元40搬送至激光照射单元42。
在第四搬送工序中，首先，驱动第一移动机构76的多关节臂82，利用吸附片84对保持工作台46上的锭24进行吸引保持，并且解除保持工作台46的吸引力。接着，使由吸附片84吸引保持的锭24从保持工作台46移动到搬送托盘4的第一锭收纳部22a中。
接着，利用往路带式搬送机64将搬送托盘4沿Y1方向搬送至与激光照射单元42面对的位置。接着，驱动第二移动机构78的多关节臂82，利用吸附片84对搬送托盘4上的锭24进行吸引保持。接着，使由吸附片84吸引保持的锭24从搬送托盘4移动到激光照射单元42的保持工作台52上。
在实施了第四搬送工序之后，在激光照射单元42中实施上述的剥离层形成工序。并且，通过反复实施剥离层形成工序、晶片剥离工序、锭磨削工序以及第二至第四搬送工序，从锭24生成能够生成的数量的晶片30，将晶片30收纳在施加了与搬送托盘4上所施加的识别标记34相同的识别标记34”的盒8中。
在本实施方式中，着眼于1个锭24而对由晶片生成装置2实施的各工序进行了说明，但在实施了将锭24从搬送托盘架36搬送至激光照射单元42的第一搬送工序之后，隔着适当的间隔反复实施第一搬送工序，并且并行地对多个锭24反复实施剥离层形成工序、晶片剥离工序、锭磨削工序以及第二至第四搬送工序，由此能够生成能够从多个锭24生成的数量的晶片30。
并且，在晶片生成装置2中，在搬送托盘4上施加有识别标记34，在与搬送托盘4对应的盒架10或盒8上施加有与搬送托盘4的识别标记34相同的识别标记34’、34”，因此，即使在发生停电或故障而使晶片生成装置2的运转停止的情况下，也能够将晶片30可靠地收纳在与锭24相关联的盒8中，锭24与晶片30的父子关系不会破坏而始终明确。

Claims (2)

1.一种晶片生成装置，其从半导体锭生成晶片，其中，
该晶片生成装置具有：
搬送托盘，其具有收纳该半导体锭的锭收纳部和收纳从该半导体锭生成的晶片的晶片收纳部；
带式搬送机单元，其将该搬送托盘搬送至各加工机；
盒架，其与该搬送托盘对应地载置收纳晶片的盒；以及
转移单元，其将晶片从该搬送托盘的该晶片收纳部转移至该盒架所载置的该盒中，
在该搬送托盘上施加有识别标记，在与该搬送托盘对应的该盒架或该盒上施加有与该搬送托盘上所施加的识别标记相同的识别标记。
2.根据权利要求1所述的晶片生成装置，其中，
该识别标记是色彩、记号、文字、图形、花纹、图画中的任意标记或组合。
CN202110387862.4A 2020-04-16 2021-04-12 晶片生成装置 Pending CN113539911A (zh)

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