CN113539815B - Semiconductor plate groove etching method - Google Patents
Semiconductor plate groove etching method Download PDFInfo
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- CN113539815B CN113539815B CN202110821564.1A CN202110821564A CN113539815B CN 113539815 B CN113539815 B CN 113539815B CN 202110821564 A CN202110821564 A CN 202110821564A CN 113539815 B CN113539815 B CN 113539815B
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- 238000005530 etching Methods 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 238000004140 cleaning Methods 0.000 claims abstract description 32
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 27
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 238000005192 partition Methods 0.000 claims description 17
- 230000001360 synchronised effect Effects 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000009423 ventilation Methods 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a semiconductor plate groove etching method, which relates to the technical field of semiconductor processing and comprises the following steps: covering the surface of the non-etched area with photoresist to obtain a processed plate; step two: mounting the processed plate to a plate chuck in an etching device, and lowering the processed plate into an etching groove for etching; step three: etching to obtain an etched plate, and moving the etched plate into a cleaning tank for cleaning; step four: and after the cleaning processing is finished, obtaining a finished plate, cleaning the surface of the finished plate, and airing. The invention processes the groove of the semiconductor plate by the etching process, can improve the processing quality of the groove of the plate, and the adhesive is adopted to connect the photoresist in the non-etching area of the plate, thereby improving the bonding quality of the photoresist and the plate, and the finer photoresist line body is arranged at the boundary of different areas of the plate, thereby improving the etching fineness of the groove.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a semiconductor plate groove etching method.
Background
The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, and a semiconductor plate is one of commonly used components in semiconductor processing, and mainly serves as a base material of the semiconductor material.
Through searching, chinese patent discloses a printed circuit board and a processing technology (publication number: CN 111477604A) thereof, and the specific processing technology steps of the patent are as follows: step one: mechanically polishing a prepared silicon wafer substrate, and manually assisting in polishing a corner hidden part; step two: putting the silicon wafer substrate subjected to grinding and trimming in the step I into an ultrasonic cleaner, adding clear water and sodium hydroxide solution, and rapidly cleaning by utilizing ultrasonic waves; step three: etching an insulation groove on one side of the silicon wafer, filling a first insulation layer in the insulation groove, and filling a conductive layer in contact with the P-type substrate on the outer side of the first insulation layer; step four: implanting large-area ions into the P-type layer corresponding to the device groove region and the N-type layer of the source region on the surface of the silicon wafer on the basis of the third step; step five: the plate was replicated on a silicon wafer with a carbon paper.
When the groove of the existing semiconductor plate is processed, the processing steps are single, so that the processing quality of the groove is poor, and after the groove of the plate is processed, etching liquid is easy to remain in the groove, so that the groove is easy to excessively etch.
Disclosure of Invention
The invention aims to provide a semiconductor plate groove etching method which solves the following technical problems:
(1) The existing plate has single etching step, and the processing quality of the etched groove on the surface of the plate is poor;
(2) The existing etching device has a single structure, so that the processing quality is lower, the processing quality is poorer, and meanwhile, after the etching is finished, etching liquid is easy to remain in the groove of the plate, so that the groove is easy to excessively etch.
The aim of the invention can be achieved by the following technical scheme:
a semiconductor plate groove etching method comprises the following steps:
step one: dividing the surface of the plate surface into a region to be etched and a non-etched region, and covering photoresist on the surface of the non-etched region to obtain a processed plate;
step two: mounting the processed plate into a plate chuck in an etching device, starting a first cylinder, and lowering the first cylinder into an etching groove for etching;
step three: after the etching processing is finished, an etched plate is obtained, and the etched plate is moved into a cleaning tank for cleaning processing;
step four: and after the cleaning processing is finished, obtaining a finished plate, taking out the cost plate from the plate chuck, cleaning the surface of the finished plate, and finally airing the finished plate.
As a further scheme of the invention: the photoresist covering method in the first step comprises the following steps:
a1: coating photoresist in a linear shape on the edge of a region to be etched of the plate;
a2: after the photoresist in the A1 is solidified, coating an adhesive on a non-etched area of the plate;
a3: and covering the surface of the non-etched area with the residual photoresist.
As a further scheme of the invention: the diameter of the linear photoresist in the step A1 is 1.5-2.5mm.
As a further scheme of the invention: the cleaning procedure in the fourth step comprises removing photoresist and adhesive on the surface of the non-etched area.
As a further scheme of the invention: the temperature in the etching processing in the second step is 22-27 ℃.
As a further scheme of the invention: this etching device includes the processing case, processing storehouse has been seted up to the inside of processing case, the internally mounted in processing storehouse has movable partition, movable partition is divided into etching tank and washing tank with processing storehouse inside, the inside upside fixedly connected with a plurality of first cylinder that is close to processing storehouse of processing case, a plurality of the output of first cylinder is downwards and fixedly connected with apron, the side-mounting of apron has the lifting support, the internally mounted of lifting support has a plurality of plate chuck that is used for centre gripping plate.
As a further scheme of the invention: the fan and the air outlet pipe are fixedly connected to the outer side of the processing box and two sides close to the processing bin respectively and are used for controlling air circulation inside the processing bin.
As a further scheme of the invention: the movable partition plate comprises a fixed plate fixedly connected with the processing bin, an electric push rod is fixedly connected to the inside of the fixed plate, and the output end of the electric push rod faces upwards and is fixedly connected with a sliding plate.
As a further scheme of the invention: the lifting support comprises a sliding plate and a driving motor, wherein the sliding plate is attached to the upper side of the cover plate, the driving motor is fixedly connected with a driving sliding tube on the lower surface of the driving motor, the driving sliding tube extends to the lower side of the cover plate, one side of the driving sliding tube is provided with a driven sliding tube, a fixing frame is fixedly connected between the driving sliding tube and the driven sliding tube, the side faces of the driving sliding tube and the driven sliding tube are fixedly connected with second cylinders, the two groups of the second cylinders are fixedly connected with the cover plate, the output end of the driving motor is connected with a synchronous belt in a meshed mode, and the synchronous belt extends to the inside of the driving sliding tube.
As a further scheme of the invention: a movable gap is arranged between the top of the driven sliding tube and the lower surface of the cover plate, and the length of the movable gap is larger than the length of the working distance of the two groups of second cylinders, so that the driven sliding tube is prevented from affecting the movement of the second cylinders.
As a further scheme of the invention: a horizontal third cylinder is fixedly connected between the side surface of the sliding plate and the cover plate and used for controlling the movement of the lifting support.
As a further scheme of the invention: the plate chuck comprises a driving disc and a driven disc, wherein the side surface of the driving disc is fixedly connected with a driving shaft, one end of the driving shaft penetrates through the fixing frame and extends to the inside of the driving sliding tube, and one end of the driving shaft is connected with the synchronous belt in a meshed mode.
As a further scheme of the invention: the side of driven plate and the fixed frame are connected with the spring post in a rotating way, the spring post is composed of two cylinder components which are connected in a sliding way, and a reset spring is fixedly connected between the two cylinder components, so that the movement of the driven plate is controlled, and a plate is installed by a user conveniently.
As a further scheme of the invention: the using method of the etching device comprises the following steps:
s1: the plate is arranged in a plate chuck, a first cylinder is started, a cover plate is covered on the upper side of a processing bin, and the plate chuck is embedded into etching liquid in an etching groove for etching;
s2: after the etching processing is finished, starting a second air cylinder, lifting the plate chuck from the etching groove, starting a third air cylinder, moving the plate chuck into the cleaning groove beyond the movable partition plate, starting the second air cylinder again, and descending the plate chuck into cleaning liquid in the cleaning groove;
s3: starting an electric push rod in the movable partition plate to lift the sliding plate;
s4: and starting the driving motor, driving the plate chuck to rotate through the synchronous belt, and cleaning the plate inside the plate chuck.
As a further scheme of the invention: in the step S4, the rotating speed of the plate chuck is 70-85r/min.
The invention has the beneficial effects that:
according to the invention, the groove of the semiconductor plate is processed through the etching process, so that the processing quality of the groove of the semiconductor plate can be improved, in the processing groove, the non-etching area of the plate is connected with the photoresist by adopting the adhesive, so that the bonding quality of the photoresist and the plate can be improved, and before the photoresist is covered, the finer photoresist line body is arranged at the boundary of different areas of the plate, so that the etching fineness of the groove can be improved;
on the other hand, the scheme can improve automation and mechanization during plate processing through the etching device, through the plate chuck, can make things convenient for the staff to assemble the plate into the device, simultaneously through lifting support and its inside third cylinder, can drive the plate and remove in the washing tank in the etching groove, and still be provided with hold-in range driven revolution mechanic in the lifting support, be used for driving when the plate washs and play the rotation, thereby can improve cleaning quality, further, still be provided with movable partition in the processing storehouse, can rise when rotatory washing, thereby can prevent the problem that splash splashes when rotatory.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a perspective view of an etching apparatus according to the present invention;
FIG. 2 is a cross-sectional view of a process cartridge of the present invention;
FIG. 3 is a cross-sectional view of the lifting bracket and the panel chuck of the present invention;
fig. 4 is an enlarged view of the structure of the portion a in fig. 1 according to the present invention.
In the figure: 1. a processing box; 2. a processing bin; 3. etching a groove; 4. a cleaning tank; 5. a movable partition; 6. a first cylinder; 7. a cover plate; 8. an air outlet pipe; 9. a lifting bracket; 10. a fixing frame; 11. a plate chuck; 12. a blower; 51. a fixing plate; 52. an electric push rod; 53. a slide plate; 91. a driving motor; 92. an active sliding tube; 93. a driven sliding tube; 94. a second cylinder; 95. a synchronous belt; 96. a sliding plate; 97. a third cylinder; 111. a drive plate; 112. a drive shaft; 113. a driven plate; 114. and a spring column.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-4, the present invention is a method for etching a trench of a semiconductor plate, comprising the steps of:
step one: dividing the surface of the plate into a region to be etched and a non-etched region, covering photoresist on the surface of the non-etched region, smearing the photoresist on the edge of the region to be etched of the plate in a linear shape with the diameter of 1.5mm, smearing an adhesive on the non-etched region of the plate after the photoresist to be smeared is solidified, and covering the surface of the non-etched region with the rest photoresist to obtain a processed plate;
step two: mounting the processed plate into a plate chuck 11 in an etching device, starting a first cylinder 6, and lowering the plate into an etching groove 3 for etching, wherein the temperature during etching is 25 ℃;
step three: after the etching processing is completed, an etched plate is obtained, and the etched plate is moved into a cleaning tank 4 for cleaning processing;
step four: after the cleaning process is completed, a finished plate is obtained, the finished plate is taken out of the plate chuck 11, photoresist and adhesive on the surface of the non-etched area are removed from the surface of the finished plate, and finally the finished plate is dried.
This etching device includes processing case 1, processing storehouse 2 has been seted up to the inside of processing case 1, the internally mounted of processing storehouse 2 has movable partition 5, movable partition 5 is divided into etching tank 3 and washing tank 4 with processing storehouse 2 inside, the upside fixedly connected with a plurality of first cylinder 6 that is close to processing storehouse 2 in processing case 1 is inside, the output of a plurality of first cylinder 6 is down and fixedly connected with apron 7, elevating bracket 9 is installed to apron 7's side, elevating bracket 9's internally mounted has a plurality of plate chuck 11 that is used for centre gripping plate.
The outside of the processing box 1 and two sides close to the processing bin 2 are respectively fixedly connected with a fan 12 and an air outlet pipe 8 for controlling the air circulation inside the processing bin 2.
The movable partition plate 5 comprises a fixed plate 51 fixedly connected with the processing bin 2, an electric push rod 52 is fixedly connected inside the fixed plate 51, and the output end of the electric push rod 52 faces upwards and is fixedly connected with a sliding plate 53.
The lifting support 9 comprises a sliding plate 96 attached to the upper side of the cover plate 7 and a driving motor 91 arranged on the upper side of the sliding plate 96, wherein a driving sliding tube 92 is fixedly connected to the lower surface of the driving motor 91, the driving sliding tube 92 extends to the lower side of the cover plate 7, a driven sliding tube 93 is arranged on one side of the driving sliding tube 92, a fixing frame 10 is fixedly connected between the driving sliding tube 92 and the driven sliding tube 93, second air cylinders 94 are fixedly connected to the sides of the driving sliding tube 92 and the driven sliding tube 93, two groups of second air cylinders 94 are fixedly connected with the cover plate 7, a synchronous belt 95 is connected to the output end of the driving motor 91 in a meshed mode, and the synchronous belt 95 extends to the inside of the driving sliding tube 92.
A movable gap is arranged between the top of the driven sliding tube 93 and the lower surface of the cover plate 7, and the length of the movable gap is larger than the length of the working distance of the two groups of second air cylinders 94, so that the driven sliding tube 93 is prevented from affecting the movement of the second air cylinders 94.
A horizontal third cylinder 97 is fixedly connected between the side surface of the sliding plate 96 and the cover plate 7, and the third cylinder 97 is used for controlling the movement of the lifting bracket 9.
The plate chuck 11 includes a driving plate 111 and a driven plate 113, a driving shaft 112 is fixedly connected to a side surface of the driving plate 111, one end of the driving shaft 112 penetrates through the fixing frame 10 and extends to the inside of the driving sliding tube 92, and one end of the driving shaft 112 is engaged with the timing belt 95.
A spring column 114 is rotatably connected between the side surface of the driven plate 113 and the fixing frame 10, the spring column 114 is composed of two column members which are in sliding connection, and a reset spring is fixedly connected between the two column members, so that the movement of the driven plate 113 is controlled, and a plate is convenient to install by a user.
The working principle of the invention is as follows:
the plate is installed in the plate chuck 11, the driven plate 113 is driven to move through a reset spring in the spring column 114 during installation, the plate is placed between the driving plate 111 and the driven plate 113, the plate is clamped, the first cylinder 6 is started, the cover plate 7 is covered on the upper side of the processing bin 2, the plate chuck 11 is embedded into etching liquid in the etching groove 3 for etching processing, and the fan 12 is started to circulate air in the processing bin 2 during processing;
after the etching process is completed, starting the second air cylinder 94, lifting the plate chuck 11 from the etching tank 3, starting the third air cylinder 97, moving the plate chuck 11 into the cleaning tank 4 beyond the movable partition plate 5, starting the second air cylinder 94 again, and lowering the plate chuck 11 into cleaning liquid in the cleaning tank 4;
starting an electric push rod 52 in the movable partition plate 5, lifting a slide plate 53, and shielding the etching tank 3 and the cleaning tank 4;
the driving motor 91 is started, and the driving shaft 112 in the plate chuck 11 is driven to rotate through the synchronous belt 95, so that the driving disc 111 and the driven disc 113 are driven to rotate, the rotating speed is 75r/min, and the plates in the plate chuck 11 are cleaned.
In the description of the present invention, it should be understood that the terms "upper," "lower," "left," "right," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience of description and for simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, as well as a specific orientation configuration and operation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The foregoing describes one embodiment of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.
Claims (6)
1. The method for etching the groove of the semiconductor plate is characterized by comprising the following steps:
step one: dividing the surface of the plate surface into a region to be etched and a non-etched region, and covering photoresist on the surface of the non-etched region to obtain a processed plate;
step two: mounting the processed plate into a plate chuck (11) in an etching device, starting a first cylinder (6), and lowering the processed plate into an etching groove (3) for etching;
step three: after the etching processing is finished, an etched plate is obtained, and the etched plate is moved into a cleaning tank (4) for cleaning processing;
step four: after the cleaning processing is finished, a finished plate is obtained, the cost plate is taken out of the plate chuck (11), the surface of the finished plate is cleaned, and finally the finished plate is dried;
the etching device comprises a processing box (1), a processing bin (2) is arranged in the processing box (1), a movable partition plate (5) is arranged in the processing bin (2), the interior of the processing bin (2) is divided into an etching groove (3) and a cleaning groove (4) by the movable partition plate (5), a plurality of first air cylinders (6) are fixedly connected to the upper side, close to the processing bin (2), of the processing box (1), the output ends of the plurality of first air cylinders (6) face downwards and are fixedly connected with a cover plate (7), a lifting support (9) is arranged on the side face of the cover plate (7), and a plurality of plate chucks (11) used for clamping plates are arranged in the lifting support (9);
the two sides of the outer side of the processing box (1) close to the processing bin (2) are fixedly connected with a fan (12) and an air outlet pipe (8) respectively and are used for controlling the ventilation in the processing bin (2);
the movable partition plate (5) comprises a fixed plate (51) fixedly connected with the processing bin (2), an electric push rod (52) is fixedly connected inside the fixed plate (51), and the output end of the electric push rod (52) faces upwards and is fixedly connected with a sliding plate (53);
the lifting bracket (9) comprises a sliding plate (96) attached to the upper side of the cover plate (7) and a driving motor (91) arranged on the upper side of the sliding plate (96), wherein the lower surface of the driving motor (91) is fixedly connected with a driving sliding tube (92), the driving sliding tube (92) extends to the lower side of the cover plate (7), one side of the driving sliding tube (92) is provided with a driven sliding tube (93), a fixing frame (10) is fixedly connected between the driving sliding tube (92) and the driven sliding tube (93), the side surfaces of the driving sliding tube (92) and the driven sliding tube (93) are fixedly connected with second cylinders (94), the two groups of second cylinders (94) are fixedly connected with the cover plate (7), the output end of the driving motor (91) is connected with a synchronous belt (95) in a meshed mode, and the synchronous belt (95) extends to the inside of the driving sliding tube (92).
A movable gap is arranged between the top of the driven sliding tube (93) and the lower surface of the cover plate (7), and the length of the movable gap is longer than the length of the working distance of the two groups of second air cylinders (94), so that the driven sliding tube (93) is prevented from influencing the movement of the second air cylinders (94);
a horizontal third cylinder (97) is fixedly connected between the side surface of the sliding plate (96) and the cover plate (7), and the third cylinder (97) is used for controlling the movement of the lifting bracket (9);
the plate chuck (11) comprises a driving disc (111) and a driven disc (113), a driving shaft (112) is fixedly connected to the side face of the driving disc (111), one end of the driving shaft (112) penetrates through the fixing frame (10) and extends into the driving sliding tube (92), and one end of the driving shaft (112) is in meshed connection with the synchronous belt (95);
a spring column (114) is rotationally connected between the side surface of the driven disc (113) and the fixed frame (10), the spring column (114) consists of two column members which are connected in a sliding manner, and a reset spring is fixedly connected between the two column members;
the photoresist covering method in the first step comprises the following steps:
a1: coating photoresist in a linear shape on the edge of a region to be etched of the plate;
a2: after the photoresist in the A1 is solidified, coating an adhesive on a non-etched area of the plate;
a3: and covering the surface of the non-etched area with the residual photoresist.
2. The method of claim 1, wherein the diameter of the line photoresist in the step A1 is 1.5-2.5mm.
3. The method of claim 2, wherein the cleaning step in step four includes removing photoresist and adhesive from the surface of the non-etched region.
4. The method according to claim 1, wherein the etching process in the second step is performed at a temperature of 22-27 ℃.
5. The method for etching a trench in a semiconductor substrate according to claim 1, wherein the method for using the etching device comprises the steps of:
s1: the plate is arranged in a plate chuck (11), a first air cylinder (6) is started, a cover plate (7) is covered on the upper side of a processing bin (2), and the plate chuck (11) is embedded into etching liquid in an etching groove (3) for etching;
s2: after the etching processing is finished, starting a second air cylinder (94), lifting the plate chuck (11) from the etching groove (3), starting a third air cylinder (97), moving the plate chuck (11) into the cleaning groove (4) beyond the movable partition plate (5), starting the second air cylinder (94) again, and descending the plate chuck (11) into cleaning liquid in the cleaning groove (4);
s3: starting an electric push rod (52) in the movable partition plate (5) to lift the sliding plate (53);
s4: and starting the driving motor (91), driving the plate chuck (11) to rotate through the synchronous belt (95), and cleaning the plate inside the plate chuck (11).
6. The method according to claim 5, wherein in the step S4, the rotation speed of the panel chuck (11) is 70-85r/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110821564.1A CN113539815B (en) | 2021-07-20 | 2021-07-20 | Semiconductor plate groove etching method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110821564.1A CN113539815B (en) | 2021-07-20 | 2021-07-20 | Semiconductor plate groove etching method |
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| Publication Number | Publication Date |
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| CN113539815A CN113539815A (en) | 2021-10-22 |
| CN113539815B true CN113539815B (en) | 2023-12-15 |
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| CN202110821564.1A Active CN113539815B (en) | 2021-07-20 | 2021-07-20 | Semiconductor plate groove etching method |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0714809A (en) * | 1993-06-22 | 1995-01-17 | Hitachi Ltd | Wafer cleaning device and method |
| JPH08264407A (en) * | 1995-03-20 | 1996-10-11 | Sony Corp | Pattern forming method |
| JP2000243807A (en) * | 1999-02-19 | 2000-09-08 | Dainippon Screen Mfg Co Ltd | Substrate processing device |
| JP2001196342A (en) * | 2000-01-13 | 2001-07-19 | Dainippon Screen Mfg Co Ltd | Substrate dipping equipment |
| JP2013045964A (en) * | 2011-08-25 | 2013-03-04 | Sharp Corp | Immersion processing method of substrate to be processed and immersion processing device |
| JP2017011212A (en) * | 2015-06-25 | 2017-01-12 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing method and apparatus |
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2021
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0714809A (en) * | 1993-06-22 | 1995-01-17 | Hitachi Ltd | Wafer cleaning device and method |
| JPH08264407A (en) * | 1995-03-20 | 1996-10-11 | Sony Corp | Pattern forming method |
| JP2000243807A (en) * | 1999-02-19 | 2000-09-08 | Dainippon Screen Mfg Co Ltd | Substrate processing device |
| JP2001196342A (en) * | 2000-01-13 | 2001-07-19 | Dainippon Screen Mfg Co Ltd | Substrate dipping equipment |
| JP2013045964A (en) * | 2011-08-25 | 2013-03-04 | Sharp Corp | Immersion processing method of substrate to be processed and immersion processing device |
| JP2017011212A (en) * | 2015-06-25 | 2017-01-12 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing method and apparatus |
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