CN113467191A - 光源装置、照明装置以及曝光装置 - Google Patents

光源装置、照明装置以及曝光装置 Download PDF

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Publication number
CN113467191A
CN113467191A CN202110233730.6A CN202110233730A CN113467191A CN 113467191 A CN113467191 A CN 113467191A CN 202110233730 A CN202110233730 A CN 202110233730A CN 113467191 A CN113467191 A CN 113467191A
Authority
CN
China
Prior art keywords
led
light source
chip
source device
led chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110233730.6A
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English (en)
Chinese (zh)
Inventor
安永大辅
昼间健太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN113467191A publication Critical patent/CN113467191A/zh
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/58—Cooling arrangements using liquid coolants characterised by the coolants
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/7005—Production of exposure light, i.e. light sources by multiple sources, e.g. light-emitting diodes [LED] or light source arrays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H05B45/14—Controlling the intensity of the light using electrical feedback from LEDs or from LED modules
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Led Device Packages (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN202110233730.6A 2020-03-30 2021-03-03 光源装置、照明装置以及曝光装置 Pending CN113467191A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020060987A JP7458853B2 (ja) 2020-03-30 2020-03-30 光源装置、照明装置、及び露光装置。
JP2020-060987 2020-03-30

Publications (1)

Publication Number Publication Date
CN113467191A true CN113467191A (zh) 2021-10-01

Family

ID=77868225

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110233730.6A Pending CN113467191A (zh) 2020-03-30 2021-03-03 光源装置、照明装置以及曝光装置

Country Status (3)

Country Link
JP (1) JP7458853B2 (https=)
KR (1) KR102700446B1 (https=)
CN (1) CN113467191A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2026046013A (ja) * 2024-08-30 2026-03-13 キヤノン株式会社 光源装置、露光装置、および、物品製造方法

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1827293A (zh) * 2005-03-01 2006-09-06 精工爱普生株式会社 冷却组件、其制造方法、光学装置及投影机
JP2007073984A (ja) * 2003-01-16 2007-03-22 Nikon Corp 照明光源装置、露光装置及び露光方法
US20080101065A1 (en) * 2006-10-30 2008-05-01 Coretronic Corporation Backlight module
JP2010098204A (ja) * 2008-10-20 2010-04-30 Stanley Electric Co Ltd 光源の冷却構造
JP2010278130A (ja) * 2009-05-27 2010-12-09 Toyota Motor Corp パワーデバイスの冷却装置及び燃料電池システム
US20110037390A1 (en) * 2009-07-30 2011-02-17 Young Kook Ko Multi-chip package LED lighting device
CN104350621A (zh) * 2012-06-07 2015-02-11 四国计测工业株式会社 Led照明模块及led照明装置
CN104896330A (zh) * 2015-06-03 2015-09-09 中国科学院半导体研究所 Led光源模组
US20160163531A1 (en) * 2014-12-09 2016-06-09 Canon Kabushiki Kaisha Cooling apparatus, illumination optical system, exposure apparatus, and method of manufacturing article
CN107765496A (zh) * 2016-08-23 2018-03-06 株式会社理光 光源装置、图像投影装置、光源装置的设置方法
CN107883360A (zh) * 2016-09-30 2018-04-06 惠普赛天使公司 发光二极管散热器
CN109244824A (zh) * 2017-07-11 2019-01-18 发那科株式会社 Ld模块冷却装置和激光装置
CN109844970A (zh) * 2016-07-28 2019-06-04 亮锐有限责任公司 具有反射侧覆层的发光器件封装
EP3495050A1 (en) * 2017-12-07 2019-06-12 Syddansk Universitet Fluid based cooling system
CN110095929A (zh) * 2018-01-29 2019-08-06 精工爱普生株式会社 投影仪

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004274011A (ja) * 2003-01-16 2004-09-30 Nikon Corp 照明光源装置、照明装置、露光装置、及び露光方法
JP2005316441A (ja) * 2004-03-30 2005-11-10 Sanyo Electric Co Ltd 照明装置及び投写型映像表示装置
JP2005339881A (ja) * 2004-05-25 2005-12-08 Hitachi Displays Ltd 照明装置、照明モジュール及び液晶表示装置
JP2006019412A (ja) * 2004-06-30 2006-01-19 Canon Inc 露光装置及びデバイスの製造方法
JP5344809B2 (ja) 2007-11-21 2013-11-20 アルパイン株式会社 バックライト装置
US8592830B2 (en) * 2009-04-13 2013-11-26 Panasonic Corporation LED unit
WO2015064470A1 (ja) * 2013-10-30 2015-05-07 オリンパスメディカルシステムズ株式会社 光源装置及び内視鏡装置
JP2017045002A (ja) * 2015-08-28 2017-03-02 キヤノン株式会社 光源装置及び投射型表示装置

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007073984A (ja) * 2003-01-16 2007-03-22 Nikon Corp 照明光源装置、露光装置及び露光方法
CN1827293A (zh) * 2005-03-01 2006-09-06 精工爱普生株式会社 冷却组件、其制造方法、光学装置及投影机
US20080101065A1 (en) * 2006-10-30 2008-05-01 Coretronic Corporation Backlight module
JP2010098204A (ja) * 2008-10-20 2010-04-30 Stanley Electric Co Ltd 光源の冷却構造
JP2010278130A (ja) * 2009-05-27 2010-12-09 Toyota Motor Corp パワーデバイスの冷却装置及び燃料電池システム
US20110037390A1 (en) * 2009-07-30 2011-02-17 Young Kook Ko Multi-chip package LED lighting device
CN104350621A (zh) * 2012-06-07 2015-02-11 四国计测工业株式会社 Led照明模块及led照明装置
US20160163531A1 (en) * 2014-12-09 2016-06-09 Canon Kabushiki Kaisha Cooling apparatus, illumination optical system, exposure apparatus, and method of manufacturing article
CN104896330A (zh) * 2015-06-03 2015-09-09 中国科学院半导体研究所 Led光源模组
CN109844970A (zh) * 2016-07-28 2019-06-04 亮锐有限责任公司 具有反射侧覆层的发光器件封装
CN107765496A (zh) * 2016-08-23 2018-03-06 株式会社理光 光源装置、图像投影装置、光源装置的设置方法
CN107883360A (zh) * 2016-09-30 2018-04-06 惠普赛天使公司 发光二极管散热器
CN109244824A (zh) * 2017-07-11 2019-01-18 发那科株式会社 Ld模块冷却装置和激光装置
EP3495050A1 (en) * 2017-12-07 2019-06-12 Syddansk Universitet Fluid based cooling system
CN110095929A (zh) * 2018-01-29 2019-08-06 精工爱普生株式会社 投影仪

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KR102700446B1 (ko) 2024-08-30
JP2021162613A (ja) 2021-10-11
KR20210122109A (ko) 2021-10-08
JP7458853B2 (ja) 2024-04-01

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