CN113412320A - 一种改性环氧丙烯酸树脂导电胶及其制备方法和应用 - Google Patents

一种改性环氧丙烯酸树脂导电胶及其制备方法和应用 Download PDF

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CN113412320A
CN113412320A CN202080000039.7A CN202080000039A CN113412320A CN 113412320 A CN113412320 A CN 113412320A CN 202080000039 A CN202080000039 A CN 202080000039A CN 113412320 A CN113412320 A CN 113412320A
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particles
silver
modified epoxy
conductive
dimensional dendritic
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石文
孙丰振
李德林
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Soltrium Advanced Materials Technology Ltd Shenzhen
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Soltrium Advanced Materials Technology Ltd Shenzhen
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

本发明公开了一种改性环氧丙烯酸树脂导电胶，按总质量份数为100份计，包括如下组分：包括以下原料组分：导电颗粒30.0～90.0份、改性的环氧丙稀酸酯树脂18.0～45.0份、硅烷偶联剂0.5～2.5份、引发剂0.5～3.0份；其中，所述导电颗粒包括具有三维树枝状微观结构的导电颗粒；本发明还公开了该导电胶的制备方法和应用。本发明导电胶具有导电性好、固化时间短、附着力高、可以在室温下长时间操作使用的特点。

Description

PCT国内申请，说明书已公开。

Claims (17)

  1. PCT国内申请，权利要求书已公开。
CN202080000039.7A 2020-01-17 2020-01-17 一种改性环氧丙烯酸树脂导电胶及其制备方法和应用 Pending CN113412320A (zh)

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PCT/CN2020/072634 WO2021142750A1 (zh) 2020-01-17 2020-01-17 一种改性环氧丙烯酸树脂导电胶及其制备方法和应用

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CN113412320A true CN113412320A (zh) 2021-09-17

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US (1) US20220340794A1 (zh)
CN (1) CN113412320A (zh)
WO (1) WO2021142750A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115340835A (zh) * 2022-08-16 2022-11-15 东莞理工学院 一种高剥离导电聚丙烯酸酯压敏胶及其制备方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024149457A1 (en) * 2023-01-11 2024-07-18 Wacker Chemie Ag Silicone based resin composition, and semiconductor device comprising the same
CN116515196A (zh) * 2023-06-05 2023-08-01 东莞市安高瑞新材料科技有限公司 一种无卤低烟阻燃交联聚乙烯材料及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103400637A (zh) * 2013-08-05 2013-11-20 清华大学深圳研究生院 一种导电浆料及其制备方法以及印刷线路材料
JP2016003306A (ja) * 2014-06-18 2016-01-12 セメダイン株式会社 導電性接着剤
CN106457386A (zh) * 2014-06-25 2017-02-22 住友金属矿山株式会社 铜粉及使用其的铜膏、导电性涂料、导电性片材
CN106573303A (zh) * 2014-08-26 2017-04-19 住友金属矿山株式会社 银包覆铜粉及使用银包覆铜粉的导电膏、导电涂料、导电片
CN106604794A (zh) * 2014-09-12 2017-04-26 住友金属矿山株式会社 银包覆铜粉及使用银包覆铜粉的导电膏、导电涂料、导电片
CN107427912A (zh) * 2015-03-26 2017-12-01 住友金属矿山株式会社 覆银铜粉及使用该覆银铜粉的导电性膏、导电性涂料、导电性片

Family Cites Families (2)

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Publication number Priority date Publication date Assignee Title
CN106459392A (zh) * 2014-06-04 2017-02-22 陶氏环球技术有限责任公司 固体聚合物电解质和用于其的化合物
CN108893078B (zh) * 2018-05-25 2019-10-25 安徽工业大学 一种用于叠瓦组件的柔性自修复导电粘合剂的制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103400637A (zh) * 2013-08-05 2013-11-20 清华大学深圳研究生院 一种导电浆料及其制备方法以及印刷线路材料
JP2016003306A (ja) * 2014-06-18 2016-01-12 セメダイン株式会社 導電性接着剤
CN106457386A (zh) * 2014-06-25 2017-02-22 住友金属矿山株式会社 铜粉及使用其的铜膏、导电性涂料、导电性片材
CN106573303A (zh) * 2014-08-26 2017-04-19 住友金属矿山株式会社 银包覆铜粉及使用银包覆铜粉的导电膏、导电涂料、导电片
CN106604794A (zh) * 2014-09-12 2017-04-26 住友金属矿山株式会社 银包覆铜粉及使用银包覆铜粉的导电膏、导电涂料、导电片
CN107427912A (zh) * 2015-03-26 2017-12-01 住友金属矿山株式会社 覆银铜粉及使用该覆银铜粉的导电性膏、导电性涂料、导电性片

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115340835A (zh) * 2022-08-16 2022-11-15 东莞理工学院 一种高剥离导电聚丙烯酸酯压敏胶及其制备方法

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WO2021142750A1 (zh) 2021-07-22

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