CN113385809A - Machining order determining device, laser machining device, and laser machining method - Google Patents

Machining order determining device, laser machining device, and laser machining method Download PDF

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CN113385809A
CN113385809A CN202110261435.1A CN202110261435A CN113385809A CN 113385809 A CN113385809 A CN 113385809A CN 202110261435 A CN202110261435 A CN 202110261435A CN 113385809 A CN113385809 A CN 113385809A
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points
processed
pulse
processing
laser
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CN113385809B (en
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奥平恭之
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Sumitomo Heavy Industries Ltd
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Sumitomo Heavy Industries Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Numerical Control (AREA)

Abstract

The invention provides a processing sequence determining device which can maintain the stabilization of pulse energy and can realize the shortening of processing time. The processing sequence determining device determines a processing sequence of a plurality of points to be processed which are irradiated with the pulse laser beam to perform processing. In this case, first, a provisional processing procedure is determined on the condition that the total of the moving distances between two points to be processed, which are consecutive in the processing procedure, is the shortest, based on the position information of the plurality of points to be processed. Then, the longest distance that the incident position of the pulse laser beam can move during a period from the output of one laser pulse to the output of the next laser pulse is defined as the movable longest distance. The quotient of the moving distance between the points to be processed divided by the longest moving distance is rounded to an integer below a decimal point. The temporary machining order is modified as the actual machining order so that the total value of all the integers becomes smaller.

Description

Machining order determining device, laser machining device, and laser machining method
The present application claims priority based on Japanese patent application No. 2020-. The entire contents of this Japanese application are incorporated by reference into this specification.
Technical Field
The present invention relates to a machining order specifying device that specifies a machining order in a laser machining method in which a pulsed laser beam is sequentially incident to perform machining, and a laser machining device and a laser machining method that perform laser machining in the machining order.
Background
There is known a laser processing apparatus that performs processing such as drilling by moving an incident position of a pulse laser beam by a beam scanner. When pulse oscillation is performed by a laser oscillator, the pulse energy changes according to the repetition frequency of the pulse. In order to make the processing conditions the same in a plurality of points to be processed, pulse oscillation is performed at a constant repetition frequency.
However, if the distance from the point to be processed at which the incidence of the pulse laser beam is completed to the point to be processed at which the pulse laser beam is to be incident next is long, the movement of the beam incidence position by the beam scanner may not catch up with the output of the next laser pulse corresponding to the repetition frequency. At this time, the propagation optical system is controlled so that the laser pulse is not incident on the object to be processed, and ineffective (dummy) laser oscillation which is not useful for processing is performed (for example, refer to patent document 1).
Patent document 1: japanese patent No. 4873578
If the ineffective laser oscillation is performed, the interval between two pulse oscillations immediately before and after the ineffective laser oscillation is expanded to an interval of two periods. If the moving time of the beam incident position by the beam scanner is shorter than two periods, an unnecessary waiting time is generated before the next laser oscillation is performed. As the waiting time is accumulated, the machining time for one machining object becomes longer. In addition, if the repetition frequency of the pulse is changed in accordance with the beam moving time in order to shorten the processing time, the pulse energy becomes unstable.
Disclosure of Invention
The invention aims to provide a processing sequence determining device, a laser processing device and a laser processing method, which can maintain the stabilization of pulse energy and can realize the shortening of processing time.
According to an aspect of the present invention, there is provided a processing order determining apparatus that determines a processing order of a plurality of points to be processed which are processed by irradiating a pulse laser beam, wherein,
determining a temporary processing order on the condition that the sum of the moving distances between two points to be processed which are consecutive in the processing order becomes the shortest on the basis of the position information of the plurality of points to be processed,
when the longest distance that the incident position of the pulse laser beam can move during the period from the output of one laser pulse to the output of the next laser pulse is defined as the movable longest distance,
the quotient of the moving distance between each processed point divided by the longest moving distance is rounded to an integer by eliminating a decimal point,
the temporary processing sequence is modified as an actual processing sequence so that the total value of the integer values of the moving distances between all the points to be processed becomes smaller.
According to another aspect of the present invention, there is provided a laser processing apparatus including:
a laser optical system having a function of outputting a pulse laser beam by scanning to move an incident position of the pulse laser beam toward the substrate; and
a control device that controls the laser optical system to cause the pulse laser beam to be incident on the substrate and to move an incident position,
the control device includes the processing sequence determining device, and causes the pulsed laser beam to be incident on the point to be processed of the substrate in the actual processing sequence determined by the processing sequence determining device.
According to still another aspect of the present invention, there is provided a laser processing method, wherein,
determining a temporary processing order on the basis of the condition that the sum of the moving distances between two points to be processed which are located consecutively in the processing order is shortest based on the positional information of the points to be processed distributed on the substrate,
in the case where the longest distance that the incident position of the pulse laser beam can move during the period from the output of one laser pulse to the output of the next laser pulse is defined as the movable longest distance,
rounding each of the moved distances by the movable minimum distance by a fraction point or less to an integer,
modifying the temporary processing sequence as an actual processing sequence so that a total value of the integer values of all the moving distances becomes smaller,
and making the pulse laser beam incident on the plurality of processed points according to the actual processing sequence so as to process.
If the moving distance between the processed points is longer than the longest movable distance, ineffective laser oscillation is performed during the movement. The sum of the values obtained by rounding up the quotient of the moving distance between the points to be processed divided by the longest moving distance to a decimal point is equal to the number of times of performing the ineffective laser oscillation. When the total value is decreased, the number of ineffective laser oscillations is decreased, and the processing time can be shortened. By performing ineffective laser oscillation at a portion where the moving distance between the points to be processed is longer than the longest movable distance, the stability of the pulse energy can be maintained.
Drawings
Fig. 1 is a schematic view of a laser processing apparatus according to an embodiment.
Fig. 2A is a diagram illustrating an example of a distribution of a plurality of points to be processed defined on the surface of the substrate, and fig. 2B is a diagram illustrating an example of a processing procedure of the plurality of points to be processed.
Fig. 3 is a timing chart showing a time relationship between an output of a pulse laser beam from a laser oscillator and an operation period of a beam scanner.
Fig. 4 is a flowchart showing a procedure of determining a processing sequence by the processing sequence determining means of the present embodiment and controlling laser processing by the control means.
Fig. 5A is a histogram showing an example of the distribution of the movement distances between the points to be processed, and fig. 5B is a histogram showing the frequency of the movement distances between the points to be processed on the movement path in the actual processing order.
Fig. 6 is a schematic diagram showing the processing sequence of the points to be processed in the temporary processing sequence and the actual processing sequence.
In the figure: 10-laser optical system, 11-laser oscillator, 12-light guide optical system, 13-diaphragm, 14-acousto-optic element, 15A-1 st path, 15B-2 nd path, 16A, 16B-beam scanner, 17A, 17B-condenser lens, 18-fold mirror, 19-beam stop, 20-control device, 25-processing sequence determination device, 30-moving mechanism, 31-movable table, 40-substrate, 41-processing point, 42-alignment mark, 45-scanning area.
Detailed Description
A laser processing apparatus according to an embodiment will be described with reference to fig. 1 to 6.
Fig. 1 is a schematic view of a laser processing apparatus according to an embodiment. The laser processing apparatus according to the embodiment includes a laser optical system 10, a moving mechanism 30 that holds and moves a substrate 40, a control device 20 that controls the laser optical system 10 and the moving mechanism 30, and a processing order determination device 25.
The structure of the laser optical system 10 will be described below. The laser oscillator 11 outputs a pulsed laser beam in accordance with an instruction from the control device 20. The pulse laser beam output from the laser oscillator 11 passes through the light guide optical system 12 and the diaphragm 13 and enters the acousto-optic device (AOD) 14. The light guide optical system 12 includes, for example, a beam expander and the like. The acousto-optic element 14 directs the incident pulse laser beam to any one of the 1 st path 15A, the 2 nd path 15B and a path toward the beam stop 19 in accordance with an instruction from the control device 20.
The pulse laser beam guided to the 1 st path 15A passes through the beam scanner 16A and the condenser lens 17A and then enters the object to be processed (i.e., the substrate 40). The pulse laser beam guided to the 2 nd path 15B is reflected by the return mirror 18, passes through the beam scanner 16B and the condenser lens 17B, and enters the object to be processed (i.e., the other substrate 40). The two substrates 40 are, for example, printed circuit boards.
Drilling is performed by causing pulsed laser beams to be incident on the two substrates 40, respectively. The positions of a plurality of points to be processed, at which holes are to be formed, are predetermined on the surface of the substrate 40. The machining order determining device 25 determines the machining order of a plurality of machining points.
As the beam scanners 16A, 16B, for example, a garcinor scanner including a pair of oscillating mirrors is used. The beam scanners 16A and 16B scan the laser beams in accordance with instructions from the control device 20, and move the incident positions of the pulse laser beams on the surfaces of the two substrates 40, respectively. As the condenser lenses 17A and 17B, f θ lenses are used, for example.
The two substrates 40 are supported on a horizontal support surface of the movable table 31 of the moving mechanism 30. The moving mechanism 30 moves the two substrates 40 in a two-dimensional direction parallel to the support surface in accordance with a command from the control device 20.
Fig. 2A is a diagram illustrating an example of the distribution of a plurality of processing points 41 defined on the surface of the substrate 40. A plurality of processed points 41 are defined on the surface of the substrate 40. In fig. 2A, the points 41 to be processed are indicated by circular marks, but actually, no marks are marked on the surface of the substrate 40, and position data defining the positions of the plurality of points 41 to be processed is stored in the control device 20. Only a part of the plurality of processed points 41 is shown in fig. 2A. The distributions of the plurality of processed points 41 defined on the two substrates 40 supported on the moving mechanism 30 (fig. 1) are the same as each other. The substrate 40 has a rectangular outer shape, for example. Alignment marks 42 are provided at four corners of the substrate 40, respectively.
A plurality of scan regions 45 are defined on the surface of the substrate 40. Each scanning region 45 has a square shape, and the size thereof is substantially equal to the size of a range in which the pulse laser beam can be incident when the beam scanners 16A and 16B (fig. 1) are operated to scan the pulse laser beam. The plurality of scanning regions 45 are arranged such that all the points 41 to be processed on the substrate 40 are included in any one of the scanning regions 45. There may be a case where a plurality of scanning regions 45 partially overlap, and there may be a case where the scanning regions 45 are not arranged in regions where the points 41 to be processed are not distributed.
One scanning area 45 is moved to a position directly below the condenser lens of one of the condenser lenses 17A and 17B (fig. 1), and the pulse laser beam is sequentially incident on the plurality of processing points 41 in the scanning area 45, whereby the scanning area 45 is processed. When the processing of one scan region 45 is completed, the moving mechanism 30 (fig. 1) is operated to move the scan region 45 to be processed next to a position directly below one of the condenser lenses 17A and 17B. In fig. 2A, the processing sequence of the scanning area 45 is indicated by an arrow.
Fig. 2B is a diagram showing an example of a processing procedure of a plurality of points 41 to be processed. The machining order of the plurality of machining points 41 is indicated by a reference numeral. The beam scanners 16A and 16B (fig. 1) are operated so that the pulse laser beams are incident on the plurality of processing points 41 in the order of the number, and one scanning region 45 is processed. In fig. 2B, the processing sequence of the plurality of points 41 to be processed is indicated by arrows. The machining order of the plurality of machining points 41 is determined by the machining order determining device 25. In the present specification, the length of the straight path from one machining point 41 to the next machining point 41 is simply referred to as "the distance of movement between the machining points".
Fig. 3 is a timing chart showing a time relationship between the output of the pulse laser beam from the laser oscillator 11 (fig. 1) and the operation period of the beam scanners 16A and 16B (fig. 1). Here, the term "during operation of the beam scanners 16A and 16B" means: the time from the start of the movement of the position where the pulse laser beam is incident to the end of the movement.
The repetition frequency of the pulses of the pulsed laser beam output from the laser oscillator 11 is constant. The control device 20 operates the beam scanners 16A and 16B to move the incident position of the pulse laser beam after the laser pulse falls. Here, the "pulse laser beam" refers to a beam that is emitted in a pulse shape by light amplification by stimulated emission, and the "laser pulse" refers to each pulse of the pulse laser beam. When the incident position is stabilized at the command position from the control device 20, the beam scanners 16A and 16B notify the control device 20 of the end of the movement. The operation time of the beam scanners 16A and 16B (time from the start of the movement of the incident position to the end of the movement) depends on the movement distance between the points to be processed. Therefore, the operation time of the beam scanners 16A and 16B has a distribution spread in a certain range.
If the repetition frequency of the pulses of the pulse laser beam is set to correspond to the maximum value of the operation time of the beam scanners 16A and 16B, the waiting time from the end of the movement of the incident position of the pulse laser beam to the incidence of the laser pulse becomes long at almost all the processing points 41. As a result, the processing time becomes long.
If the repetition frequency of the pulse laser beam is set to correspond to the intermediate value of the deviation of the operation time of the beam scanners 16A and 16B, the operation of the beam scanners 16A and 16B may not be completed at the time of outputting the laser pulse. If the operation of the beam scanners 16A and 16B has not been completed at the time of outputting the laser pulse, the controller 20 controls the acousto-optic device 14 (fig. 1) to direct the laser pulse to the beam stop 19 (fig. 1). Therefore, the laser pulse is not incident on the substrate 40 in a state where the operation of the beam scanners 16A and 16B has not been completed. In this specification, the laser pulse directed to the beam stop 19 is referred to as a null pulse LPd. To distinguish from the ineffective pulse LPd, the laser pulse incident on the substrate 40 is referred to as an effective pulse PDe. In fig. 3, the active pulses Pde are hatched relatively deeply, and the inactive pulses LPd are hatched relatively shallowly.
In order to shorten the processing time, it is preferable to shorten the waiting time Tw from the end of the operation of the beam scanners 16A and 16B to the output of the laser pulses and to reduce the number of the ineffective pulses LPd.
Fig. 4 is a flowchart showing a procedure of determining a processing sequence by the processing sequence determining device 25 of the present embodiment and controlling laser processing by the control device 20.
First, the machining order specifying device 25 specifies the arrangement of the plurality of scanning areas 45 based on the positional information of the plurality of machining points 41 (step S1). At this time, the plurality of scanning regions 45 are arranged so that each of all the points 41 to be processed is included in at least one scanning region 45 and the number of scanning regions 45 is minimized. The processed point 41 located in the area where the plurality of scanning areas 45 overlap each other is assigned to one scanning area 45 of the plurality of scanning areas 45.
Next, the processing procedure determining device 25 determines the access procedure of the plurality of scanning areas 45 so that the moving distance of the movable table 31 (fig. 1) is minimized (step S2). In the determination of the access sequence of the scanning area 45, various algorithms for solving the salesman routing problem may be used, for example.
When the access order of the scanning area 45 is determined, the processing order of the plurality of processing points 41 included in the scanning area 45 is determined by executing steps S3, S4, and S5 for each scanning area 45.
First, a provisional processing procedure is determined on the basis of the condition that the total of the moving distances between two points 41 to be processed, which are consecutive in the processing procedure, is the shortest based on the positional information of the plurality of points 41 to be processed (step S3). Hereinafter, a method of determining the provisional processing procedure will be described.
The shortest circulation path is determined on the condition that the length of the circulation path returning to the starting point after passing through all the processed points 41 once each with any one processed point 41 as the starting point is the shortest. In the determination of the shortest circulation path, for example, a known algorithm that solves the salesman's path problem may be used. Examples of the algorithm to be applied include nearest neighbor interpolation (nearest neighbor interpolation), multistage method, 2-selection method, 3-selection method, Lin-Kernighan method (LK method), ITERATRD-LK method, CHAINED-LK method, ITERATED-3-selection method, CHAINED-3-selection method, and the like. Here, the "shortest cyclic path" does not mean the best solution obtained by evaluating all combinations, and may be a cyclic path obtained by using an algorithm (for example, a local search algorithm or the like) capable of obtaining a solution close to the best solution to some extent. Among all the machined points in the circulation path, the path having the longest movement distance is cut, and one of the machined points 41 at both ends of the cut path is set as a starting point and the other is set as an end point. The sequence of the processed points 41 passing from the start point to the end point along the circulation path is referred to as a temporary processing sequence.
Next, the repetition frequency of the pulse laser beam is determined from the distribution of the moving distances between the processed points in the provisional processing order (step S4). Referring to fig. 5A, a method of determining the repetition frequency of the pulses of the pulsed laser beam is explained.
Fig. 5A is a histogram showing an example of the distribution of the moving distances between points to be processed. The horizontal axis represents the moving distance between the points to be processed, and the vertical axis represents the frequency. The frequency of the movement distance having a length of L1 or more and less than L2 is the greatest. The frequency decreases as the moving distance is increased and decreased from the range of L1 or more and less than L2. The control device 20 determines the pulse repetition frequency from a range corresponding to the mode of the movement distance. For example, the repetition frequency of the pulse is determined in such a manner that the maximum length to which the incident position can be moved during one cycle of laser oscillation is equal to the maximum value of the range equivalent to the mode (i.e., the length L2).
When the pulse repetition frequency is determined, the provisional processing procedure is modified so that the number of ineffective pulses LPd is minimized, and the actual processing procedure is determined (step S5).
A method of determining the number of the ineffective pulses LPd will be described below. The longest distance that the incident position of the pulse laser beam can move during a period from the output of one laser pulse to the output of the next laser pulse is referred to as "the movable longest distance". The number of ineffective pulses LPd outputted when moving between the points to be machined is equal to the number of ineffective pulses LPd, which is obtained by dividing the moving distance between the points to be machined by the maximum movable distance and rounding the sum to a value equal to or smaller than the truncated point. The quotient of the moving distance between the points to be processed divided by the longest moving distance is rounded to an integer below a decimal point. The total value of the integer values of the moving distances between all the points to be processed is equal to the total number of the ineffective pulses LPd.
Next, a method of modifying the provisional processing sequence will be described. As the 1 st evaluation function, an evaluation function in which the evaluation value becomes smaller as the total of the moving distances between the points to be processed becomes shorter is used. As the 2 nd evaluation function, an evaluation function is used in which the smaller the total value of the values obtained by dividing the moving distance between the respective points to be machined by the longest movable distance and rounding the smaller the total value, the smaller the evaluation value becomes. The weighted average of the evaluation values of the 1 st evaluation function and the 2 nd evaluation function is calculated for the machining sequence in which the sequence of the temporary machining sequence is modified. The step of changing the machining order is repeated so that the weighted average value of the evaluation values becomes smaller, and when the weighted average value of the evaluation values becomes the minimum value, the machining order at that time is adopted as the actual machining order. The weight for obtaining the weighted average value can be determined from the results of various evaluation experiments performed under conditions where the weights are different from each other.
Fig. 5B is a histogram showing the frequency of the movement distance between the points to be processed, which is obtained in the movement path of the actual processing procedure. In fig. 5B, the frequency of the movement distance between the points to be processed, which is obtained from the movement distance in the temporary processing sequence, is shown by a broken line. The frequency of the movement distance longer than the mode of the movement distance becomes smaller compared to the provisional processing order. This reduces the number of the ineffective pulses LPd.
In the actual processing sequence, as the frequency of the movement distance longer than the mode of the movement distance becomes smaller, a portion in which the movement distance becomes shorter occurs. The part where the moving distance becomes short is reflected on the histogram, resulting in an increase in the frequency of the mode. In a range where the moving distance is equal to or less than the mode, the frequency of a relatively short moving distance decreases, and the frequency of a relatively long moving distance increases. Even if the moving distance is long in the range of the mode or less, the number of the ineffective pulses LPd does not increase as long as the moving distance is equal to or less than the movable maximum distance. Therefore, the movement path from the start point to the end point in the actual machining sequence is longer than the movement path in the provisional machining sequence, but the number of the ineffective pulses LPd is small.
When the actual processing procedure is determined, the laser processing is performed on the substrate 40 by moving the incident position of the pulse laser beam in accordance with the actual processing procedure under the condition that the repetition frequency of the pulses is constant (step S6). At this time, the repetition frequency of the pulse laser beam is set to a value determined by the mode of the moving distance.
Next, an example of the movement path of the temporary machining procedure and the movement path of the modified actual machining procedure will be described with reference to fig. 6.
Fig. 6 is a schematic diagram showing a machining procedure of a part of the points to be machined in the temporary machining procedure and the actual machining procedure. In the temporary processing sequence, processing is performed on the processing points in the order of A, B, c. This machining procedure is not a machining procedure determined so that only the moving distance of the six points 41 to be machined becomes the shortest as shown in fig. 6, but is an example of a machining procedure determined so that the moving distance of the entire machining sequence including all the other points 41 to be machined becomes the shortest.
Since the moving distance from the points a to B to be machined and the moving distance from the points I to J to be machined are shorter than the longest movable distance, the ineffective pulse LPd is not output during the moving period. Since the moving distance from the points B to C to be machined and the moving distance from the points J to K to be machined are longer than the longest movable distance, the ineffective pulse LPd is output during the moving. The incident position X, Y of the pulse laser beam at the timing of outputting the ineffective pulse LPd is marked with a solid black dot.
In the actual processing sequence, the movement path ABC in the temporary processing sequence is modified to the movement path AJC, and the movement path IJK in the temporary processing sequence is modified to the movement path IBK. The total length of the movement path AJC and the movement path IBK in the actual processing sequence is longer than the total length of the movement path ABC and the movement path IJK in the provisional processing sequence. The moving distance from the point a to the point J to be machined, the moving distance from the point J to the point C to be machined, and the moving distance from the point B to the point K to be machined are shorter than the longest movable distance. The moving distance from the point I to the point B to be processed is longer than the longest moving distance. Therefore, there is an invalid pulse LPd output during this movement. The incident position Z at the time of outputting the ineffective pulse LPd is indicated by a solid black dot.
In the example shown in fig. 6, the number of the ineffective pulses LPd in the provisional machining order is 2, and the number of the ineffective pulses LPd in the actual machining order is 1. In this way, in the actual processing sequence, the total length of the movement path of the incident position is longer than in the provisional processing sequence, but the number of the ineffective pulses LPd is reduced.
Next, the excellent effects of the above-described embodiments will be described.
In the above-described embodiment, the number of ineffective pulses can be made smaller than the number of ineffective pulses at the time of machining in the provisional machining order determined on the condition that the length of the movement path of the incident position of the pulse laser beam is the minimum. The processing time in one scanning area 45 is equal to a value obtained by multiplying the total value of the number of laser pulses incident on the point 41 to be processed and the number of ineffective pulses by the repetition period of the laser pulses. Since the number of laser pulses incident on the point 41 to be processed is not changed, if the number of ineffective pulses is reduced, the processing time in the scanning area 45 is shortened.
In the above embodiment, the number of ineffective pulses can be reduced, and thus the processing time can be shortened. In the above-described embodiment, since the pulse repetition frequency of the pulse laser beam is set to be constant and the processing is performed, the variation in the pulse energy per laser pulse can be reduced, and as a result, the processing quality can be improved.
Next, a modified example of the above embodiment will be explained.
In the above-described embodiment, the repetition frequency of the pulse is determined in accordance with the mode of the moving distance between the points to be processed (fig. 5A), but the repetition frequency of the pulse may be determined by other methods. For example, the repetition frequency of the pulses may be determined based on an average value or a median value of the moving distances between the points to be processed. The repetition frequency of the pulse may be determined according to the characteristics of the laser oscillator 11 (fig. 1) and the like.
In the above-described embodiment, the repetition frequency of the pulse is set to be constant when the laser processing is performed (step S6 in fig. 4), but the repetition frequency of the pulse may be changed within a range in which sufficient uniformity of the pulse energy is maintained. At this time, the movable longest distance may be determined according to the highest frequency of the range of the repetition frequency of the change pulse.
In the above-described embodiment, the control device 20 and the machining order determination device 25 are shown separately in fig. 1, but the functions of the machining order determination device 25 may be combined in the control device 20.
The above embodiments are merely examples, and the present invention is not limited to the above embodiments. For example, various alterations, modifications, combinations, and the like may be made, as will be apparent to those skilled in the art.

Claims (6)

1. A machining order determining device for determining a machining order of a plurality of points to be machined which are irradiated with a pulse laser beam for machining,
determining a temporary processing order on the condition that the sum of the moving distances between two points to be processed which are consecutive in the processing order becomes the shortest on the basis of the position information of the plurality of points to be processed,
when the longest distance that the incident position of the pulse laser beam can move during the period from the output of one laser pulse to the output of the next laser pulse is defined as the movable longest distance,
the quotient of the moving distance between each processed point divided by the longest moving distance is rounded to an integer by eliminating a decimal point,
the temporary processing sequence is modified as an actual processing sequence so that the total value of the integer values of the moving distances between all the points to be processed becomes smaller.
2. The processing sequence determination apparatus according to claim 1,
determining the movable longest distance from a distribution of moving distances between the points to be processed in the temporary processing order.
3. The processing sequence determination apparatus according to claim 1 or 2,
setting an evaluation function having a smaller evaluation value as the total length of the movement distance is shorter as a 1 st evaluation function,
setting an evaluation function as a 2 nd evaluation function, in which the smaller the total value of the integer values of all the movement distances is, the smaller the evaluation value becomes,
when the temporary machining order is modified to obtain the actual machining order, the machining order is changed so that the weighted average of the evaluation values of the 1 st evaluation function and the 2 nd evaluation function is reduced.
4. A laser processing apparatus is characterized by comprising:
a laser optical system having a function of outputting a pulse laser beam by scanning to move an incident position of the pulse laser beam toward the substrate; and
a control device that controls the laser optical system to cause the pulse laser beam to be incident on the substrate and to move an incident position,
the control device includes the processing sequence determining device according to any one of claims 1 to 3, and causes the pulsed laser beam to be incident on the point to be processed of the substrate in the actual processing sequence determined by the processing sequence determining device.
5. A laser processing method is characterized in that,
determining a temporary processing order on the basis of the condition that the sum of the moving distances between two points to be processed which are located consecutively in the processing order is shortest based on the positional information of the points to be processed distributed on the substrate,
when the longest distance that the incident position of the pulse laser beam can move during the period from the output of one laser pulse to the output of the next laser pulse is defined as the movable longest distance,
rounding each of the moving distances divided by the movable longest distance by an integer less than a decimal point,
modifying the temporary processing sequence as an actual processing sequence so that a total value of the integer values of all the moving distances becomes smaller,
and making the pulse laser beam incident on the plurality of processed points according to the actual processing sequence so as to process.
6. The laser processing method according to claim 5,
determining the movable longest distance from a distribution of moving distances between the points to be processed in the temporary processing order.
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