TW202133980A - Processing sequence determination device, laser processing device and laser processing method capable of shortening a processing time while maintaining a stable pulse energy - Google Patents

Abstract

The subject of the present invention is to provide a processing sequence determination device that can maintain the stabilization of pulse energy and shorten the processing time. The solution of the present invention is that the processing sequence determination device determines the processing sequence of a plurality of processed points to be processed by incident pulse laser beam. At this time, according to the position information of the plurality of processed points, the temporary processing sequence is determined under the condition that the sum of the travel distances between the two consecutive processed points in the processing sequence becomes the shortest. Then, the longest distance that can be moved during the period when the incident position of the pulse laser beam is changed from the output of one laser pulse to the output of the next laser pulse is defined as the longest movable distance. The decimal point of the quotient obtained by dividing each travel distance between the processed points by the longest movable distance is rounded to an integer. The temporary processing sequence is corrected as the actual processing sequence in such a way that the value obtained by the integerized sum of the travel distances between all processed points becomes smaller. The present invention also provides a laser processing device comprising a laser optical system having a function of moving the incident position of the pulse laser beam toward the substrate by scanning and outputting the pulse laser beam; and a control device for controlling the laser optical system so that the pulse laser beam is incident on the substrate and the incident position is moved, wherein the control device includes the above-described processing sequence determination device. According to the actual processing sequence determined by the processing sequence determination device, the pulse laser beam is incident on the processed point of the substrate.

Description

Processing sequence determining device, laser processing device and laser processing method

The present invention relates to a processing sequence determining device for determining the processing sequence in a laser processing method in which pulsed laser beams are sequentially injected for processing, and a laser processing device and laser processing method for performing laser processing in the processing sequence .

Known is a laser processing device that uses a beam scanner to move the incident position of a pulsed laser beam to perform drilling and other processing. When a laser oscillator is used for pulse oscillation, the pulse energy changes according to the repetition frequency of the pulse. In order to make the processing conditions of multiple processed points the same, pulse oscillation is performed at a certain repetition frequency.

However, when the distance from the point to be processed where the pulse laser beam has been injected to the point to be processed next is far, the movement of the beam incident position by the beam scanner may not keep up with the repetition frequency. Laser pulse output. In this case, the propagation optical system is controlled so that the laser pulse does not impinge on the object to be processed, and virtual laser oscillation that is useless for processing is performed (for example, refer to Patent Document 1). [Prior Technical Literature]

[Patent Document 1] Japanese Patent No. 4873578

[The problem to be solved by the invention]

When the virtual laser oscillation is performed, the interval between two pulse oscillations immediately before and after the virtual laser oscillation is extended to an interval of two cycles. If the movement time of the beam incident position of the beam scanner is shorter than two cycles, unnecessary waiting time will occur before the next laser oscillation. As this waiting time accumulates, the processing time of one object to be processed becomes longer. In addition, if the pulse repetition frequency is changed in accordance with the beam movement time in order to shorten the processing time, the pulse energy will become unstable.

The object of the present invention is to provide a processing sequence determining device, a laser processing device, and a laser processing method that can maintain the pulse energy stabilization and can shorten the processing time. [Technical means to solve the problem]

According to an aspect of the present invention, a processing sequence determining device is provided, which is a processing sequence determining device that determines the processing sequence of a plurality of processed points to be processed by injecting a pulsed laser beam, wherein, According to the position information of the plurality of processed points mentioned above, the temporary processing sequence is determined under the condition that the sum of the moving distances between the two continuous processing points becomes the shortest. When the longest distance that the pulsed laser beam can move from the output of one laser pulse to the output of the next laser pulse is defined as the longest moveable distance, The decimal point of the quotient obtained by dividing each of the moving distances between the points to be processed by the longest movable distance mentioned above is rounded to an integer, The temporary processing sequence is corrected so as to reduce the value obtained by the sum of the moving distances between all the processing points to be integerized, and the processing sequence is used as the actual processing sequence.

According to another aspect of the present invention, a laser processing device is provided, which has: The laser optical system has the function of moving the incident position of the pulsed laser beam to the substrate by scanning and outputting the pulsed laser beam; and The control device controls the aforementioned laser optical system to inject the pulsed laser beam into the substrate and move the incident position, The control device is provided with the processing sequence determining device described above, and according to the actual processing sequence determined by the processing sequence determining device, the pulse laser beam is incident on the processed point of the substrate.

According to another aspect of the present invention, a laser processing method is provided, wherein: According to the position information of the multiple processed points distributed on the substrate, the temporary processing sequence is determined under the condition that the total moving distance between the two processed points in the processing sequence becomes the shortest. When the longest distance that the pulsed laser beam can move from the output of one laser pulse to the output of the next laser pulse is defined as the longest moveable distance, The decimal point of the quotient obtained by dividing each of the aforementioned moving distances by the aforementioned minimum movable distance is rounded to an integer, Correct the aforementioned temporary processing sequence as the actual processing sequence so that the value obtained by the sum of all the aforementioned moving distances being integerized becomes smaller. In the foregoing actual processing sequence, a pulsed laser beam is injected into the plurality of processed points to perform processing. [Effects of Invention]

When the moving distance between the processed points is longer than the longest distance that can be moved, virtual laser oscillation will be performed during the movement. The value obtained by adding up the moving distances between all processed points is equal to the number of virtual laser oscillations. The value obtained by this totalization is the value obtained by dividing each of the moving distances between the processed points by the longest movable distance and rounding off the decimal point of the quotient. If the total value is reduced, the number of virtual laser oscillations is reduced, and the processing time can be shortened. By performing virtual laser oscillation at a position where the moving distance between the processed points is greater than the longest distance that can be moved, the stability of the pulse energy can be maintained.

1 to 6, the laser processing device according to the embodiment will be described. Fig. 1 is a schematic diagram of a laser processing apparatus based on the embodiment. The laser processing device based on the embodiment includes a laser optical system 10, a moving mechanism 30 that holds and moves the substrate 40, a control device 20 that controls the laser optical system 10 and the moving mechanism 30, and a processing sequence determining device 25.

Hereinafter, the structure of the laser optical system 10 will be described. The laser oscillator 11 outputs a pulsed laser beam according to an instruction from the control device 20. The pulsed laser beam output from the laser oscillator 11 enters the acousto-optic element (AOD) 14 through the light guiding optical system 12 and the aperture 13. The light guiding optical system 12 includes, for example, a beam expander and the like. The acousto-optic element 14 steers the incident pulsed laser beam to any one of the first path 15A, the second path 15B, and the path toward the beam damper 19 according to an instruction from the control device 20.

The pulsed laser beam turned to the first path 15A passes through the beam scanner 16A and the condenser lens 17A and enters the substrate 40 as the object to be processed. The pulsed laser beam turned to the second path 15B is reflected by the folding mirror 18, and is incident on another substrate 40 as the object to be processed through the beam scanner 16B and the condenser lens 17B. The two substrates 40 are, for example, printed wiring substrates.

A pulsed laser beam is incident on the two substrates 40 to drill holes. The positions of the plurality of processed points where holes should be formed on the surface of the substrate 40 are determined in advance. The processing order determining device 25 determines the processing order of a plurality of points to be processed.

As the beam scanners 16A and 16B, for example, a Galvano scanner including a pair of swinging mirrors is used. The beam scanners 16A, 16B scan the laser beams according to instructions from the control device 20, and move the incident positions of the pulsed laser beams on the surfaces of the two substrates 40, respectively. As the condenser lenses 17A and 17B, for example, fθ lenses are used.

The two substrates 40 are supported by the horizontal supporting surface of the movable table 31 of the moving mechanism 30. The moving mechanism 30 moves the two substrates 40 in a two-dimensional direction parallel to the supporting surface in accordance with an instruction from the control device 20.

FIG. 2A is a diagram showing an example of the distribution of a plurality of processed points 41 defined on the surface of the substrate 40. A plurality of processed points 41 are defined on the surface of the substrate 40. In FIG. 2A, the processed point 41 is represented by a circular mark, but in fact, there is no mark on the surface of the substrate 40, and the control device 20 stores position data defining the positions of a plurality of working points 41 . In FIG. 2A, only a part of the plurality of processed points 41 is shown. The distribution of the plurality of processed points 41 defined on the two substrates 40 supported by the moving mechanism 30 (FIG. 1) is the same. The outer shape of the substrate 40 is, for example, a rectangle. Alignment marks 42 are respectively provided on the four corners of the substrate 40.

A plurality of scanning areas 45 are defined on the surface of the substrate 40. The shape of each scanning area 45 is square, and its size is approximately equal to the range that can be injected by the pulse laser beam by operating each beam scanner 16A, 16B (Figure 1) and scanning the pulse laser beam. size. A plurality of scanning areas 45 are arranged in such a way that all the processed points 41 on the substrate 40 are included in any scanning area 45. A plurality of scanning areas 45 may partially overlap, and there are cases where the scanning area 45 is not arranged in an area where the processed points 41 are not distributed.

By moving a scanning area 45 directly below one of the condenser lenses 17A, 17B (FIG. 1), and making the pulsed laser beam incident on a plurality of processed points 41 in the scanning area 45 in sequence, The scanning area 45 is processed. When the processing of one scanning area 45 is completed, the moving mechanism 30 (FIG. 1) is operated to move the scanning area 45 to be processed next to just below one of the condenser lenses 17A and 17B. In FIG. 2A, the processing sequence of the scanning area 45 is shown by arrows.

FIG. 2B is a diagram showing an example of the processing sequence of a plurality of to-be-processed points 41. The processing sequence of a plurality of processed points 41 is marked with a number. By operating the beam scanners 16A and 16B (FIG. 1) and making the pulse laser beam incident on a plurality of processed points 41 in the order of the numbers, one scanning area 45 is processed. In FIG. 2B, the processing sequence of a plurality of processed points 41 is indicated by arrows. The processing sequence of the plurality of processed points 41 is determined by the processing sequence determining device 25. In this specification, the length of the linear path from one work point 41 to the work point 41 assigned the next number is simply referred to as the "movement distance between work points".

3 is a timing chart showing the time relationship between the output of the pulsed laser beam from the laser oscillator 11 (FIG. 1) and the operation period of the beam scanners 16A and 16B (FIG. 1). Here, the "operation period of the beam scanners 16A and 16B" refers to the time from the start of the movement of the position where the pulsed laser beam is incident to the end of the movement.

The pulse repetition frequency of the pulsed laser beam output from the laser oscillator 11 is constant. After the laser pulse falls, the control device 20 operates the beam scanners 16A and 16B to move the incident position of the pulsed laser beam. Here, "pulsed laser beam" refers to a beam irradiated by pulses based on light amplification based on induced emission, and "laser pulse" refers to each pulse of a pulsed laser beam. When the incident position stabilizes at the commanded position from the control device 20, the beam scanners 16A and 16B notify the control device 20 that the movement is completed. The operation time of the beam scanners 16A and 16B (the time from the start of the movement of the incident position to the end of the movement) depends on the movement distance between the points to be processed. Therefore, the operating time of the beam scanners 16A and 16B has a distribution that spreads within a certain range.

If the pulse repetition frequency of the pulsed laser beam is set to correspond to the maximum value of the operating time of the beam scanners 16A and 16B, it will result in the movement from the incident position of the pulsed laser beam to the end of the movement of the pulsed laser beam on most points 41 to be processed. The waiting time until the laser pulse is injected becomes longer. As a result, the processing time becomes longer.

If the pulse repetition frequency of the pulsed laser beam is set to correspond to the intermediate value of the deviation of the operating time of the beam scanners 16A, 16B, it will occur when the laser pulses are output that the operation of the spot beam scanners 16A, 16B has not ended. Condition. When the action of the spot beam scanners 16A, 16B is not finished when the laser pulse is output, the control device 20 controls the acousto-optic element 14 (FIG. 1) to turn the laser pulse to the beam damper 19 (FIG. 1). Therefore, in a state where the operation of the beam scanners 16A and 16B is not completed, the laser pulses will not enter the substrate 40. In this specification, the laser pulse turned to the beam damper 19 is referred to as an invalid pulse LPd. In order to distinguish it from the invalid pulse LPd, the laser pulse incident on the substrate 40 is referred to as an effective pulse PDe. In FIG. 3, the effective pulse Pde is marked with a relatively darker hatching, and the ineffective pulse LPd is marked with a relatively lighter hatching.

In order to shorten the processing time, it is preferable to shorten the waiting time Tw from the end of the operation of the beam scanners 16A and 16B to the output of the laser pulse, and to reduce the number of invalid pulses LPd.

4 is a flowchart showing the processing sequence determined by the processing sequence determining device 25 based on the present embodiment, and the laser processing sequence is controlled by the control device 20.

First, the processing order determining device 25 determines the arrangement of the plurality of scanning areas 45 based on the position information of the plurality of processed points 41 (step S1). At this time, a plurality of scanning areas 45 are arranged so that each of all the processed points 41 is included in at least one scanning area 45 and the number of scanning areas 45 becomes the smallest. The processed point 41 located in the area where the plurality of scan areas 45 overlap is allocated to the scan area 45 of one of the plurality of scan areas 45.

Next, the processing order determining device 25 determines the visiting order of the plurality of scanning areas 45 so as to minimize the moving distance of the movable table 31 (FIG. 1) (step S2). When determining the order of visits in the scanning area 45, for example, various algorithms for solving the problem of traveling salesmen can be applied.

After determining the visit order of the scan area 45, the processing order of the plurality of processed points 41 belonging to the scan area 45 is determined by executing steps S3, S4, and S5 for each scan area 45.

First, based on the position information of a plurality of to-be-processed points 41, the temporary processing order is determined under the condition that the sum of the moving distances between the two to-be-processed points 41 that are consecutive in the processing order becomes the shortest (step S3). Hereinafter, the method of determining the temporary processing order will be described.

Under the condition that any one to-be-processed point 41 is taken as the starting point and the length of the cycle path that passes through each of all the to-be-processed points 41 once and returns to the starting point becomes the shortest condition, the shortest cycle path is determined. When determining the shortest cycle path, for example, a known algorithm used to solve the itinerant salesman problem can be used. As the applicable algorithm, for example, the nearest neighbor method, multi-stage method, 2-selection method, 3-selection method, Lin-Kernighan method (LK method), ITERATRD-LK method, CHAINED-LK method, ITERATED-3 selection method, CHAINED-3 selection method, etc. Here, the "shortest cycle path" does not mean the best solution obtained by evaluating all combinations, for example, it can be obtained by an algorithm that can use a local search algorithm to obtain a solution close to the optimal solution to some extent The cycle path.

The path with the longest movement distance among the paths between all the processed points of the cut cycle path, one of the processed points 41 at both ends of the cut path is set as the starting point, and the other is set as the end point. The order in which the processed point 41 passes from the starting point 41 to the end point along the cycle path is set as the temporary processing order.

Next, the repetition frequency of the pulse of the pulsed laser beam is determined according to the distribution of the movement distance between the processed points in the temporary processing sequence (step S4). Referring to FIG. 5A, the method for determining the pulse repetition frequency of the pulsed laser beam will be described.

FIG. 5A is a histogram showing an example of the distribution of the movement distance between the points to be processed. The horizontal axis represents the movement distance between the processed points, and the vertical axis represents the frequency. The movement distance with a length of L1 or more and less than L2 has the most frequency. As the moving distance moves away from the range greater than L1 and less than L2 to the direction of lengthening and the direction of shortening, the frequency decreases . The control device 20 determines the pulse repetition frequency based on the range corresponding to the mode value of the moving distance. For example, the maximum length of the incident position that can be moved during one cycle of the laser oscillation is equal to the maximum value of the range corresponding to the maximum frequency, that is, the length L2, to determine the pulse repetition frequency.

After the pulse repetition frequency is determined, the temporary processing sequence is corrected to minimize the number of invalid pulses LPd, and the actual processing sequence is determined (step S5).

Hereinafter, the method of obtaining the number of invalid pulses LPd will be described. The longest distance that can be moved from the output of one laser pulse to the output of the next laser pulse at the incident position of the pulsed laser beam is set as the "longest movable distance". The decimal point of the quotient obtained by dividing the moving distance between the processed points by the maximum movable distance is rounded to the integer value and the number of invalid pulses LPd output when moving between the processed points is equal . The decimal point of the quotient obtained by dividing each movement distance between the processed points by the longest movable distance is rounded to an integer. The sum of the moving distances between all processed points is integerized and the value obtained is equal to the total number of invalid pulses LPd.

Hereinafter, the method of correcting the temporary processing sequence will be described. As the first evaluation function, an evaluation function is used in which the shorter the total of the movement distances between the points to be processed, the smaller the evaluation value becomes. As the second evaluation function, an evaluation function is used in which the value obtained by adding up all the moving distances becomes smaller as the value becomes smaller, and the value obtained by this totaling is divided by each of the moving distances between the points to be processed The decimal point of the quotient obtained by the longest movement can be rounded to the integer value. Regarding the processing sequence in which the sequence in the temporary processing sequence is corrected, the weighted average value of the evaluation values of the first evaluation function and the second evaluation function is calculated. The order of changing the processing order is repeated in such a way that the weighted average value of the evaluation value becomes smaller, and after the weighted average value of the evaluation value converges to the minimum value, the processing order at this time is adopted as the actual processing order. The weighting when calculating the weight average value can be carried out various evaluation experiments under different weighting conditions, and determined according to the results.

FIG. 5B is a histogram showing the frequency of the movement distance between the points to be processed obtained for the movement path of the actual processing sequence. In FIG. 5B, the frequency of the movement distance between the points to be processed calculated for the movement distance of the temporary processing sequence is indicated by a broken line. The frequency of the moving distance longer than the mode value of the moving distance is smaller than the frequency in the temporary machining sequence. This reduces the number of invalid pulses LPd.

Corresponding to the decrease in the frequency of the movement distance longer than the mode value of the movement distance in the actual processing sequence, the portion where the movement distance becomes longer occurs. The occurrence of the part where the moving distance becomes longer is reflected on the histogram, and the frequency of the most frequent value increases. In addition, in the range where the moving distance is below the mode value, the frequency of the relatively short moving distance decreases, and the frequency of the relatively long moving distance increases. Even if the moving distance becomes longer in the range below the mode value, if the moving distance is below the maximum movable distance, the number of invalid pulses LPd will not increase. Therefore, the movement path from the start point to the end point in the actual processing sequence is longer than the movement path in the temporary processing sequence, but the number of invalid pulses LPd is reduced.

After the actual processing sequence is determined, the pulse repetition frequency is set to a certain condition, and the incident position of the pulsed laser beam is moved according to the actual processing sequence to perform laser processing on the substrate 40 (step S6). At this time, the pulse repetition frequency of the pulsed laser beam is set to a value determined by the mode value of the moving distance.

Next, referring to FIG. 6, an example of the movement path of the temporary processing sequence and the movement path of the actual processing sequence to be corrected will be described.

FIG. 6 is a schematic diagram showing the processing sequence of the partial processed points in the temporary processing sequence and the actual processing sequence. In the temporary processing sequence, for example, the processed points are processed in the order of A, B, C...I, J, and K. This processing sequence is an example determined in the following manner: Not only the six processed points 41 shown in FIG. 6 but also all other processed points 41 are included, the overall moving distance becomes the shortest.

Since the movement distance from the processed point A to B and from the processed point I to J is shorter than the longest movable distance, the invalid pulse LPd is not output during this movement. Since the movement distance from the processed point B to C and from the processed point J to K is longer than the longest movable distance, the invalid pulse LPd is output during this movement. The solid black dots indicate the incident positions X and Y of the pulsed laser beam at the time when the invalid pulse LPd is output.

In the actual processing sequence, the movement path ABC in the temporary processing sequence is corrected to the movement path AJC, and the movement path IJK in the temporary processing sequence is corrected to the movement path IBK. The total length of the moving path AJC and the moving path IBK in the actual processing sequence is longer than the total length of the moving path ABC and the moving path IJK in the temporary processing sequence. The movement distance from the processed point A to J, the processed point J to C, and the processed point B to K is shorter than the longest movable distance. The moving distance from the processed point I to B is longer than the longest distance that can be moved. Therefore, during this movement, an invalid pulse LPd is output. The incident position Z at the time point when the invalid pulse LPd is output is shown with a solid black dot mark.

In the example shown in FIG. 6, the number of invalid pulses LPd is 2 in the provisional processing sequence, and the number of invalid pulses LPd is 1 in the actual processing sequence. In this way, in the actual processing sequence, the total length of the movement path of the incident position is longer than that of the temporary processing sequence, but the number of invalid pulses LPd is reduced.

Next, the excellent effects of the above-mentioned embodiment will be described. In the above-mentioned embodiment, the number of invalid pulses can be reduced compared with the number of invalid pulses when processing is performed in a temporary processing sequence determined under the condition that the length of the movement path of the incident position of the pulsed laser beam is minimized. number. The processing time in a scanning area 45 is equal to the value obtained by multiplying the sum of the number of laser pulses incident on the processed point 41 and the number of invalid pulses by the repetition period of the laser pulse. Since the number of laser pulses incident on the processed point 41 does not change, as the number of invalid pulses decreases, the processing time in the scanning area 45 becomes shorter.

In the above-mentioned embodiment, since the number of invalid pulses can be reduced, the processing time can be shortened thereby. In addition, in the above-mentioned embodiment, since the pulse repetition frequency of the pulsed laser beam is set to be constant for processing, the variation of pulse energy per laser pulse can be reduced, and as a result, the processing quality can be improved.

Next, a modification of the above-mentioned embodiment will be described. In the above embodiment, the pulse repetition frequency is determined according to the mode of the movement distance between the processed points (FIG. 5A), but the pulse repetition frequency can also be determined by other methods. For example, the pulse repetition frequency can also be determined based on the average value, median value, etc. of the movement distance between the processed points. In addition, the pulse repetition frequency can also be determined based on the characteristics of the laser oscillator 11 (FIG. 1).

Furthermore, in the above-mentioned embodiment, when performing laser processing (step S6 in FIG. 4), the pulse repetition frequency is set to be constant, but it is also possible to change the pulse repetition frequency while maintaining sufficient uniformity of pulse energy. repeat frequency. In this case, the longest movable distance may be determined based on the highest frequency in the range of changing the pulse repetition frequency.

In the above embodiment, the control device 20 and the processing sequence determining device 25 are shown in FIG. 1 respectively, but the functions of the processing sequence determining device 25 may also be incorporated into the control device 20.

The above-mentioned embodiments are only examples, and the present invention is not limited to the above-mentioned embodiments. For example, it is obvious to those skilled in the art that various changes, improvements, combinations, etc. can be made.

10: Laser optical system 11: Laser oscillator 12: Light guide optical system 13: Aperture 14: Acousto-optic components 15A: 1st path 15B: 2nd path 16A, 16B: beam scanner 17A, 17B: Condenser lens 18: Folding mirror 19: beam damper 20: control device 25: Processing sequence determining device 30: mobile agency 31: Movable table 40: substrate 41: processed point 42: Alignment mark 45: Scanning area

[Fig. 1] is a schematic diagram of a laser processing apparatus based on an embodiment. In [FIG. 2], FIG. 2A is a diagram showing an example of a distribution of a plurality of processed points defined on the surface of a substrate, and FIG. 2B is a diagram showing an example of a processing sequence of a plurality of processed points. Fig. 3 is a timing chart showing the time relationship between the output of the pulsed laser beam from the laser oscillator and the operation period of the beam scanner. [Fig. 4] is a flowchart showing the processing sequence is determined by the processing sequence determining device based on this embodiment, and the laser processing sequence is controlled by the control device. In [FIG. 5], FIG. 5A is a histogram showing an example of the distribution of the movement distance between the processed points, and FIG. 5B is a histogram showing the frequency of the movement distance between the processed points on the movement path of the actual processing sequence picture. [Fig. 6] is a schematic diagram showing the processing sequence of the point to be processed in the temporary processing sequence and the actual processing sequence.

Claims (6)

A processing sequence determining device is a processing sequence determining device that determines the processing sequence of a plurality of processed points to be processed by injecting a pulsed laser beam, which is characterized by: According to the position information of the plurality of processed points mentioned above, the temporary processing sequence is determined under the condition that the sum of the moving distances between the two continuous processing points becomes the shortest. When the longest distance that the pulsed laser beam can move from the output of one laser pulse to the output of the next laser pulse is defined as the longest moveable distance, The decimal point of the quotient obtained by dividing each of the moving distances between the points to be processed by the longest movable distance mentioned above is rounded to an integer, The temporary processing sequence is corrected so as to reduce the value obtained by the sum of the moving distances between all the processing points to be integerized, and the processing sequence is used as the actual processing sequence. Such as the processing sequence determination device described in claim 1, where The longest movable distance is determined according to the distribution of the movement distance between the processed points in the temporary processing sequence. Such as the processing sequence determination device described in claim 1 or claim 2, where Let the evaluation function in which the total length of the aforementioned travel distances become shorter as the evaluation value becomes smaller as the first evaluation function, The second evaluation function is set as the evaluation function in which the value obtained by adding up the aforementioned integerized values to all the aforementioned movement distances becomes smaller and the evaluation value becomes smaller. When the provisional processing sequence is corrected to obtain the actual processing sequence, the processing sequence is changed so that the weighted average value of the evaluation values of the first evaluation function and the second evaluation function becomes smaller. A laser processing device with: The laser optical system has the function of moving the incident position of the pulsed laser beam to the substrate by scanning and outputting the pulsed laser beam; and The control device controls the aforementioned laser optical system so that the pulsed laser beam is incident on the substrate and the incident position is moved, The aforementioned control device is equipped with the processing sequence determination device described in any one of claim 1 to claim 3, and according to the actual processing sequence determined by the processing sequence determination device, the pulse laser beam is incident on the processed point of the substrate . A laser processing method, which is characterized by: According to the position information of the multiple processed points distributed on the substrate, the temporary processing sequence is determined under the condition that the total moving distance between the two processed points in the processing sequence becomes the shortest. When the longest distance that the pulsed laser beam can move from the output of one laser pulse to the output of the next laser pulse is defined as the longest moveable distance, The decimal point of the quotient obtained by dividing each of the aforementioned movement distances by the aforementioned longest movement distance is rounded to an integer, Correct the aforementioned temporary processing sequence as the actual processing sequence so that the value obtained by the sum of all the aforementioned moving distances being integerized becomes smaller. In the foregoing actual processing sequence, a pulsed laser beam is injected into the plurality of processed points to perform processing. Such as the laser processing method described in claim 5, where The longest movable distance is determined according to the distribution of the movement distance between the processed points in the temporary processing sequence.

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