TWI818242B - Control device of laser processing device, laser processing device and laser processing method - Google Patents

Abstract

[Problem] The present invention provides a control device for a laser processing device that can shorten processing time. [Solution] The control device controls processing based on the laser beam scanned by the beam scanner. This control device has a function of performing stationary processing by scanning the laser beam while fixing the relative position of the beam scanner and the substrate, and moving the incident position of the laser beam on a part of the substrate surface. It also has the function of moving the substrate toward the beam scanner so that the laser beam can be incident on the area to be processed next on the surface of the substrate. The laser beam is scanned while the substrate is moved to the beam scanner, and the incident position of the laser beam is moved to at least one of a region where stationary processing is performed before starting the movement or a region where stationary processing is performed after the movement. The function of mobile processing.

Description

Control device of laser processing device, laser processing device and laser processing method

The invention relates to a control device of a laser processing device, a laser processing device and a laser processing method.

There is known a laser processing apparatus that injects a laser beam into a printed circuit board or the like to perform drilling processing (for example, see Patent Document 1). The laser processing apparatus disclosed in Patent Document 1 uses a galvanometer mirror to scan a laser beam while moving a stage holding the substrate at a constant speed, and causes the scanned laser beam to enter a predetermined position on the surface of the substrate to form a hole.

Furthermore, there is also known a processing technology in which a laser beam is scanned while the substrate is kept stationary, and the laser beam is injected into a predetermined position to form a hole. In this technology, the entire area of the substrate surface is processed by alternately repeating a process of processing the substrate while stationary and a process of moving the substrate. This processing method is called the step-and-repeat method.

[Prior technical literature]

[Patent Document 1] Japanese Patent Application Publication No. 2004-66300

In the step-and-repeat mode, since the substrate does not move Therefore, it is difficult to shorten the time required to process the entire area of the substrate. In the processing method disclosed in Patent Document 1, the moving speed of the substrate is limited to the moving speed when processing the area where the holes to be processed are most densely distributed. Therefore, when processing an area with a high distribution density of holes, the movement of the substrate cannot catch up with the scanning of the laser beam, and a situation may occur where the substrate is waiting for the output of the laser beam. Therefore, the processing time sometimes becomes longer than with the step-and-repeat method.

An object of the present invention is to provide a control device for a laser processing device, a laser processing device, and a laser processing method that can shorten the processing time.

According to one aspect of the present invention, there is provided a control device that controls processing based on a laser beam scanned by a beam scanner. The control device has: by fixing the relative position of the beam scanner and the substrate. The function of scanning the laser beam and moving the incident position of the laser beam in a part of the surface of the substrate to perform stationary processing in such a way that the moving distance is the shortest; moving the substrate to the beam scanner enables subsequent processing of the surface of the substrate The function of projecting a laser beam into an area; and By scanning the laser beam while the substrate is moved to the beam scanner, the area where the stationary processing was performed before starting the movement, the area that overlaps with the processable range and expands with the passage of time, or the area where the stationary processing is performed after the movement is performed. The function of moving at least one area in the area to be processed by moving the incident position of the laser beam to perform movable processing. The area to be processed is set as a variable area according to the distribution of the points to be processed, and is set so that it can be connected to the adjacent area to be processed. The regions partially overlap, and while the substrate is being moved during processing, processing of the processed points within the subsequent processing region to be processed can be performed.

According to another aspect of the present invention, a laser processing device is provided, which has: a beam scanner to scan a laser beam; and a moving mechanism to move the beam at a position where the laser beam scanned by the beam scanner is incident. The scanner moves the substrate; and a control device that controls the beam scanner and the moving mechanism. The control device has the following features: scanning the laser beam in a state where the relative position of the beam scanner and the substrate is fixed, and scanning the laser beam on the substrate. The function of performing stationary processing by moving a part of the surface so that the moving distance of the incident position of the laser beam is minimized; moving the substrate toward the beam scanner so that the laser beam can be injected into the area to be processed next on the surface of the substrate Function; and by operating the beam scanner while the substrate is moved to the beam scanner, the stationary processing is performed before starting the movement. The function of moving the incident position of the laser beam to perform moving processing by moving at least one of the areas, the area that overlaps with the processable range and expands with the passage of time, or the area where the aforementioned stationary processing is performed after movement, and the area to be processed, It is set as a variable area according to the distribution of the processed points, and is set so that it can partially overlap with the adjacent processed area, and while the substrate is being moved during processing, the processed points in the processed area to be processed can be followed. processing.

According to another aspect of the present invention, a laser processing method is provided, which alternately performs the following processes: scanning with the beam scanner while fixing the position of the substrate relative to the beam scanner that scans the laser beam. The laser beam is injected into the substrate to perform stationary processing; and while the substrate is relatively moved toward the beam scanner, the beam scanner is used to minimize the moving distance of the laser beam. The substrate is scanned and irradiated with a laser beam to perform moving processing. The area to be processed is set variable according to the distribution of the points to be processed, and is set to partially overlap with the adjacent area to be processed. In order to perform processing, While the substrate is being moved, the processed points within the processing area to be processed can be processed.

By performing moving processing while the substrate is moving between stationary processing and the next stationary processing, the processing time can be shortened.

10:Laser optical system

11:Laser oscillator

12:Light guide optical system

13:Aperture

14:Acousto-optical components (AOD)

15A: 1st path

15B: 2nd path

16A, 16B: Beam scanner

17A, 17B: condenser lens

18: folding mirror

19: Beam damper

20:Control device

30:Mobile mechanism

31:Movable workbench

40:Substrate

41: Processed point

42: Alignment mark

45: Scanning area

45A: Processed scan area

45B: The unprocessed scan area to be processed next

46: Processable range

[Fig. 1] is a schematic diagram of the laser processing apparatus according to the embodiment.

In FIG. 2 , FIG. 2A is a diagram showing an example of the distribution of a plurality of points to be processed defined on the surface of the substrate, and FIG. 2B is a diagram showing an example of a processing sequence of the plurality of points to be processed.

[Fig. 3] is a flowchart showing the procedure of the laser processing method according to the embodiment.

In [Fig. 4], Figs. 4A to 4D are diagrams showing the relative positional relationship between the machinable range and the scan area from the start time point to the end time point of the movement processing.

[Fig. 5], Fig. 5A is a timing chart showing the time relationship between substrate movement and laser processing when the laser processing method according to the present embodiment is used, and Fig. 5B and Fig. 5C show the laser processing according to the modification. Timing chart showing the relationship between substrate movement and laser processing during the method.

The laser processing device and laser processing method according to the embodiment will be described with reference to FIGS. 1 to 5C .

FIG. 1 is a schematic diagram of the laser processing apparatus according to the embodiment. The laser processing apparatus according to the embodiment includes a laser optical system 10, a moving mechanism 30 that holds and moves the substrate 40, and a control device 20 that controls the laser optical system 10 and the moving mechanism 30.

Hereinafter, the structure of the laser optical system 10 will be described. The laser oscillator 11 outputs a pulsed laser beam according to instructions from the control device 20 . The pulse laser beam output from the laser oscillator 11 passes through the light guide optical system 12 and the aperture 13 and enters the acousto-optical element (AOD) 14 . The light guide optical system 12 includes, for example, a beam expander or the like. The acousto-optical element 14 diverts the incident pulse laser beam to any one of the first path 15A, the second path 15B, and the path toward the beam damper 19 in accordance with instructions from the control device 20 .

The pulse laser beam turned to the first path 15A passes through the beam scanner 16A and the condenser lens 17A, and is incident on the substrate 40 as the object to be processed. The pulse laser beam turned to the second path 15B is reflected by the folding mirror 18 , passes through the beam scanner 16B and the condenser lens 17B, and is incident on the other substrate 40 as the object to be processed. Pulse laser beams are injected into the two substrates 40 respectively to perform drilling processing. The two substrates 40 are, for example, printed wiring boards.

As the beam scanners 16A and 16B, for example, a Galvano scanner including a pair of swing mirrors is used. The beam scanners 16A and 16B scan the laser beam according to instructions from the control device 20 and move the incident positions of the pulse laser beams on the surfaces of the two substrates 40 respectively. As the condenser lenses 17A and 17B, for example, fθ lenses are used.

The two substrates 40 are supported on the horizontal support surface of the movable table 31 of the moving mechanism 30 . The moving mechanism 30 moves the two substrates 40 toward the beam scanners 16A and 16B in a two-dimensional direction parallel to the support surface in accordance with instructions from the control device 20 . Moving the substrate 40 toward the beam scanners 16A and 16B means moving the substrate 40 toward the beam path (beam path before scanning) at the incident site on the beam scanners 16A and 16B.

FIG. 2A is a diagram showing an example of the distribution of a plurality of points to be processed 41 defined on the surface of the substrate 40 . Only a part of the plurality of processed points 41 is shown in FIG. 2A . The distribution of the plurality of processed points 41 defined by the two substrates 40 supported on the moving mechanism 30 (Fig. 1) is the same. The outer shape of the substrate 40 is, for example, a rectangle.

Alignment marks 42 are respectively provided at four corners of the rectangular substrate 40 . A plurality of processed points 41 are defined on the surface of the substrate 40 . In FIG. 2A , the processed points 41 are represented by circular marks, but in fact, no marks are marked on the surface of the substrate 40 . Instead, position data defining the positions of a plurality of processed points 41 is stored in the control device 20 .

A plurality of scanning areas 45 are defined on the surface of the substrate 40 . The shape of each scanning area 45 is a square, and its size is almost the same as the size of the range into which the pulse laser beam can be injected by scanning the pulse laser beam by operating the beam scanners 16A and 16B (FIG. 1) respectively. The plurality of scanning areas 45 are arranged so that all the processed points 41 on the substrate 40 are included in any scanning area 45 . Some of the plurality of scanning areas 45 may partially overlap, and there may be cases where no scanning area 45 is arranged in an area where the points to be processed 41 are not distributed.

A scanning area 45 is moved to just below one of the focusing lenses 17A and 17B (Fig. 1), and a pulsed laser beam is sequentially injected into a plurality of processed points 41 in the scanning area 45. , thereby processing the scanning area 45. When the processing of one scanning area 45 is completed, the moving mechanism 30 ( FIG. 1 ) is operated to move the scanning area 45 to be processed next to directly below one of the condensing lenses 17A and 17B. Figure 2A , the processing sequence of the scan area 45 is indicated by an arrow.

FIG. 2B is a diagram showing an example of the processing sequence of a plurality of points to be processed 41 . The plurality of processed points 41 are marked with numbers. The beam scanners 16A and 16B (Fig. 1) are operated to irradiate the plurality of processing points 41 with pulse laser beams in numerical order, thereby processing one scanning area 45. In FIG. 2B , arrows indicate the processing sequence of a plurality of processed points 41 . The processing order of the points to be processed 41 is determined, for example, so that the movement path of the incident position of the pulse laser beam becomes the shortest. For example, an algorithm for solving the traveling salesman problem can be applied to the determination of the processing order.

A set of a plurality of processed points 41 existing in one scanning area 45 and processed under the same conditions is called a "partition". The plurality of processed points 41 are assigned the above numbers by division. The process of sequentially irradiating a pulse laser beam once to all the processed points 41 in one partition under the same irradiation conditions is called "scanning". The number of irradiation conditions when processing the processed points 41 of one division is called the "number of cycles".

All of the plurality of processed points 41 processed under the same conditions may be included in one partition, or any part of the plurality of processed points 41 processed under the same conditions may be included in one partition.

For example, in the process of performing one scan under one irradiation condition, a pulsed laser beam is injected into each processed point 41 once. When scanning is performed twice under the same irradiation conditions, a total of two laser pulses are injected into one processed point 41 . In the processing with the number of cycles being two, scanning under the first irradiation conditions and scanning under the second irradiation conditions different from the first irradiation conditions are performed. The pulse width of the pulse laser beam used is different under the first irradiation condition and the second irradiation condition. For example, in a process in which two scans are performed in the first cycle and one scan is performed in the second cycle, a pulsed laser beam is injected into each processed point 41 twice under the first irradiation condition, and the pulse laser beam is injected into each processed point 41 under the second irradiation condition. Conditionally, a pulsed laser beam is injected.

When a part of the plurality of processed points 41 included in the scan area 45 is included in one partition, the other plurality of processed points 41 not included in the partition are processed by other scanning. The combination of the plurality of processed points 41 included in one partition may be the same in the plurality of substrates 40 ( FIG. 4A ), or may be different for each substrate 40 .

FIG. 3 is a flowchart showing the procedure of the laser processing method according to the embodiment. Hereinafter, the case of performing processing using the pulse laser beam propagating in the first path 15A (FIG. 1) will be described. The processing sequence using the pulse laser beam propagating in the second path 15B is also the same as the processing sequence using the pulse laser beam propagating in the first path 15A.

The substrate 40 is supported on the moving mechanism 30 ( FIG. 1 ), and the movement of the substrate 40 is started in order to arrange the unprocessed scanning area 45 to be processed first at a processable position directly below the condenser lens 17A (step S1 ). During this movement, the control device 20 moves the substrate 40 toward the beam scanner 16A of the laser optical system 10 to arrange the unprocessed scanning area 45 in a processable position. When the processing of at least one scan area 45 is completed, the movement of the substrate 40 is started in order to place the unprocessed scan area 45 to be processed next at a processable position directly below the condenser lens 17A.

While the control device 20 moves the substrate 40, the laser oscillator The oscillator 11 outputs a pulsed laser beam, and the beam scanner 16A is controlled to scan the pulsed laser beam to process the processed point 41 in the unprocessed scanning area 45 (FIG. 2A) to be processed next (step S2). In this specification, processing in which a pulse laser beam is scanned while moving the substrate 40 is called "moving processing".

Next, the control of the beam scanner 16A during movement processing will be described. The origin (reference point) is set in the processable range in which the pulse laser beam can be scanned and processed by the beam scanner 16A. The origin is fixed relative to the beam scanner 16A (more specifically, the beam path in the incident position of the pulsed laser beam on the beam scanner 16A) or the condenser lens 17A. The control device 20 can control the beam scanner 16A to radiate the pulse laser beam to a designated position in the processable range.

The position of the processed point 41 in the scanning area 45 is defined as the relative position relative to the alignment mark 42 ( FIG. 2A ) provided on the substrate 40 . The control device 20 acquires the relative position information of the substrate 40 with respect to the movable table 31 by detecting the position of the alignment mark 42 ( FIG. 2A ) while the substrate 40 is mounted and fixed on the movable table 31 . The control device 20 determines the processed point 41 relative to the movable worktable 31 based on the relative position information of the substrate 40 relative to the movable worktable 31 and the position information of the processed point 41 defined relative to the alignment mark 42 of the substrate 40 relative position.

During the moving processing, the movable table 31 and the substrate 40 move relative to the origin of the processable range. The control device 20 determines the position of the movable table 31 relative to the origin of the processable range and the position of the processed point 41 relative to the movable table 31 when the pulse laser beam is injected into the substrate 40 . The relative position information calculates the relative position of the point to be processed 41 relative to the origin of the machinable range. Based on the calculation result, the control device 20 controls the beam scanner 16A so that the pulse laser beam can be injected into the processing point 41 to be processed. In addition, while one pulse of the pulse laser beam is injected, the substrate 40 also moves. Therefore, the control device 20 also controls the beam scanner 16A to move the incident position of the pulse laser beam according to the position change of the point to be processed 41 during the injection period of one pulse.

As described above, during the moving processing, the control device 20 considers the movement of the substrate 40 by the moving mechanism 30 and determines the incident position of the pulse laser beam by the beam scanner 16A. Control that takes the movement of the substrate 40 into consideration when determining the incident position of the pulse laser beam can be referred to as control that synchronizes the movement of the substrate 40 with the scanning of the pulse laser beam. In the movement processing, one scan area 45 is processed for one scan.

When the unprocessed scan area 45 to be processed next moves to the processable range, the control device 20 stops the movement of the substrate 40 (step S3). After stopping the movement of the substrate 40, the control device 20 outputs the pulse laser beam from the laser oscillator 11 while the substrate 40 is stationary, and controls the beam scanner 16A to scan the pulse laser beam, thereby disposing the position on the substrate 40. Processing of a plurality of points to be processed 41 within the scan area 45 of the machinable range (step S4). In this specification, processing performed with the substrate 40 in a stationary state is called "stationary processing." The processing order of the plurality of points to be processed 41 during stationary processing is determined so that the movement distance of the incident position of the pulse laser beam is minimized using, for example, an algorithm for solving the traveling salesman problem.

The control device 20 repeats the sequence from step S1 to step S4 until the processing of all scanning areas 45 is completed (step S5).

Next, the sequence of the processed point 41 processed during the movement processing will be described with reference to FIGS. 4A to 4D . The processing order of the plurality of workpiece points 41 in moving processing is different from the processing sequence in stationary processing.

4A to 4D are diagrams showing the relative positional relationship between the machinable range 46 and the scan areas 45A and 45B from the start time to the end time of the movement processing. As shown in FIG. 4A , one scan area 45A is arranged within the processable range 46 , and an unprocessed scan area 45B to be processed next is arranged outside the processable range 46 . When the processing of the scanning area 45A arranged in the processable range 46 is completed, the movement processing is started. In addition, when moving the scanning area 45 whose processing order is the first, it is uncertain which scanning area 45 is arranged within the processable range 46 . At this time, after the alignment of the substrate 40 is completed, the moving processing of the scanning area 45 in the first processing sequence is started.

As shown in FIG. 4B , the control device 20 relatively moves the processable range 46 to the scanning area 45B to be processed next. In addition, the processable range 46 is actually fixed, and by moving the substrate 40 ( FIG. 2A ) to the processable range 46 , the scan area 45B is moved to the processable range 46 . In FIG. 4B , the position of the machinable range before movement is indicated by a dotted line.

When a certain time passes from the start of the movement, a part of the scanning area 45B to be processed next overlaps with the processable range 46 . The control device 20 sequentially injects the pulse laser beam into the processed points 41 in the area overlapping the processable range 46 among the plurality of processed points 41 in the scanning area 45B. As time passes further, as shown in FIGS. 4C and 4D , the area in the scanning area 45B that overlaps the processable range 46 expands as time passes. The control device 20 sequentially injects the pulse laser beam into the processed point 41 that newly enters the processable range 46 among the plurality of processed points 41 in the scanning area 45B. In FIGS. 4C and 4D , the processed points 41 that have been processed are represented by solid black dot marks, and the newly processed points 41 that have entered the machinable range 46 are represented by hollow circle marks.

The plurality of workpiece points 41 that have newly entered the machinable range 46 are detected at a certain time scale, for example. Alternatively, it is also possible to detect a plurality of newly entered plurality of processed points 41 after the processing of all the processed points 41 detected within the machinable range 46 at the current time point is completed.

Next, the time relationship between substrate movement and laser processing when the laser processing method according to this embodiment is adopted will be described with reference to FIG. 5A .

FIG. 5A is a timing chart showing the time relationship between substrate movement and laser processing when the laser processing method according to this embodiment is adopted. In the example shown in FIG. 5A , in one scanning area 45 , one scan is performed under the first processing condition (first cycle), and two scans are performed under the second processing condition (second cycle).

When performing the first scan of the first cycle of the i-th scan area 45(i) while moving the substrate 40 (FIG. 2A), the scan area 45(i) is moved. The time required for one scan is almost equal to the movement time of the substrate 40 . The first and second scans in the second cycle are performed with the substrate 40 stationary. When the second scan of the second cycle of the scan area 45(i) is completed, the scan area 45(i+1) to be processed next is moved and processed.

When the number or distribution of the processed points 41 is different in the scanning area 45(i) and the scanning area 45(i+1), the time required for the first scan of the first cycle of the scanning area 45(i) is equal to The time required for the first scan of the first cycle of the scan area 45(i+1) is different. The control device 20 changes the time from the start to the end of the movement of the substrate 40 based on the time required for one scan during the movement processing. For example, by adjusting the moving speed of the substrate 40, the time from the start to the end of the movement of the substrate 40 can be made almost equal to the time required for one scan in the movement processing.

Next, the excellent effects of the above embodiment will be described.

In the above-described embodiment, in addition to the stationary processing adopted in a step-and-repeat method, processing is performed while the substrate 40 is moving (moving processing). Therefore, the processing time can be shortened. In addition, the scanning area 45 is not arranged in an area where the points to be processed 41 are not distributed. Therefore, the processing time can also be shortened in the area where the point to be processed 41 is not arranged compared with the range 46 ( FIG. 4A to FIG. 4D ) that can be processed at a constant speed.

Next, modifications of the above-described embodiment will be described with reference to FIGS. 5B and 5C .

5B and 5C are timing charts showing the time relationship between substrate movement and laser processing in the ink coating method according to the modified example.

In the modification shown in FIG. 5B , the moving speed of the substrate 40 is made the same for all scanning areas 45 . For example, the moving speed is set to correspond to the shortest time among the times required for one scan of each of the plurality of scanning areas 45 . For example, it corresponds to the time required for one scan of the scan area 45(i) The moving speed of the substrate 40 is set accordingly. At this time, in the scanning area 45(i+1) and the like other than the scanning area 45(i), the movement time of the substrate 40 is shorter than the time required for one scan. As a result, even if the movement of the substrate 40 is completed, scanning during the movement processing will not be completed. At this time, during the period T after the time point at which the movement of the substrate 40 is completed, the unprocessed target point 41 is processed while the substrate 40 is stationary.

In the modification shown in FIG. 5C , when one scan area 45 is processed by a plurality of scans, movement processing is applied to the last scan. For example, in the processing of scan areas 45(i-1) and 45(i), movement processing is used in the second scan of the second cycle. As described above, regarding the moving processing, it is sufficient to move the incident position of the laser beam and perform processing on at least one of the scanning area 45 where stationary processing was performed before starting movement or the scanning area 45 where stationary processing was performed after movement.

Next, other modifications of the above-described embodiment will be described.

In FIGS. 5A to 5C , one scan area 45 is scanned once under the conditions of the first cycle and twice under the conditions of the second cycle. However, it is possible to scan the one scan area 45 at least twice. The above embodiment applies. For example, at least one scan may be performed during stationary processing of the scan area 45, and one scan may be performed during moving processing.

In the above embodiment, moving processing is applied to the first scan when processing the scanning area 45 whose processing order is first. However, stationary processing may be applied to all scans of the scanning area 45 whose processing order is first. processing. As long as the processing order is every scanning area after the second Just apply mobile processing to the first scan of 45.

In the above embodiment, the laser beam is injected into the plurality of processed points 41 (FIG. 2A, FIG. 2B) once in one scan. However, the laser beam can also be injected into the plurality of processed points 41 multiple times. Shoot the beam, say 2 or 3 times. At this time, while a plurality of laser pulses are injected into one workpiece point 41, the laser beam is not scanned and the beam path is fixed. In this way, it suffices to inject the laser beam into each of the plurality of processed points 41 (FIG. 2A, FIG. 2B) at least once in one scan.

The above-described embodiments and modifications are merely examples, and it is natural that part of the structures shown in the embodiments and modifications can be replaced or combined. The same functions and effects brought about by the same structures of the embodiments and modifications are not mentioned one by one for each embodiment and modification. Furthermore, the present invention is not limited to the above-described embodiments and modifications. For example, it will be obvious to those skilled in the art that various changes, improvements, combinations, etc. can be made.

Claims (10)

A control device that controls processing based on a laser beam scanned by a beam scanner, the control device having: by scanning the laser beam in a state where the relative position of the beam scanner and the substrate is fixed, the substrate is The function of performing stationary processing by moving a part of the surface so that the moving distance of the incident position of the laser beam is minimized; moving the substrate toward the beam scanner so that the laser beam can be injected into the area to be processed next on the surface of the substrate function; and by scanning the laser beam while moving the substrate to the beam scanner, the area where the aforementioned stationary processing was performed before starting the movement, the area that overlaps with the processable range and expands as time passes, or the movement Then at least one area in the aforementioned stationary processing area is moved to move the incident position of the laser beam to perform movable processing. The area to be processed is set as a variable area according to the distribution of the points to be processed, and is set to be compatible with Adjacent areas to be processed partially overlap, and while the substrate is being moved during processing, processing of the points to be processed in the subsequent processing area can be performed. The control device according to claim 1, wherein the control device stores the positions of a plurality of processed points on the surface of the substrate where holes are to be formed. The laser beam is injected into the processing point for drilling processing. A laser processing device having: A beam scanner that scans the laser beam; a moving mechanism that moves the substrate toward the beam scanner at a position where the laser beam scanned by the beam scanner is incident; and a control device that controls the beam scanner and the moving mechanism, The control device scans the laser beam while fixing the relative position of the beam scanner and the substrate, and moves the incident position of the laser beam in a part of the surface of the substrate in such a manner that the movement distance is minimized. The function of stationary processing; the function of moving the aforementioned substrate to the aforementioned beam scanner so that a laser beam can be injected into the area to be processed next on the surface of the aforementioned substrate; and by moving the aforementioned substrate to the aforementioned beam scanner. The beam scanner operates to move the laser in at least one of the areas where the aforementioned stationary processing was performed before the movement was started, the area which overlapped with the processable range and expanded as time passed, or the area where the aforementioned stationary processing was performed after the movement. The function of moving the processing based on the incident position of the beam. The area to be processed is set as a variable area according to the distribution of the points to be processed, and is set to partially overlap with the adjacent area to be processed. During the processing, the substrate is moved. , the processed point in the processing area to be processed can be processed. The laser processing device according to claim 3, wherein the control device stores the positions of a plurality of processed points on the surface of the substrate where holes are to be formed, and the control device performs the processing according to the static processing and the moving processing. Laser beams are incident on the plurality of processed points sequentially to perform drilling processing. The laser processing device according to Claim 4, wherein the range of the substrate surface processed by one of the stationary processes is defined as a scanning area, and the control device performs a plurality of scans as follows for each scanning area: Sequentially irradiate the laser beam at least once to each of the plurality of processed points included in one scanning area. The laser processing apparatus according to claim 5, wherein the control device changes the time from the start to the end of the movement of the substrate with respect to the beam scanner based on the time required for one scan in the movement processing. A laser processing method that alternately performs the following processes: by using the beam scanner to scan the laser beam and injecting it into the substrate while the position of the substrate is fixed relative to the beam scanner that scans the laser beam. The laser beam is used to perform stationary processing; and while the substrate is relatively moved toward the beam scanner, the beam scanner is used to scan in a manner that minimizes the moving distance of the laser beam and the laser is injected into the substrate. The beam is used to perform moving processing. The area to be processed is set as a variable area according to the distribution of the points to be processed, and is set to partially overlap with the adjacent area to be processed. During the processing and moving of the substrate, subsequent applications can be performed. processing Processing of the processed point within the processing area. The laser processing method as described in Claim 7, wherein the positions of a plurality of processed points where holes are to be formed are defined on the surface of the substrate, and during the aforementioned stationary processing and the aforementioned moving processing, the plurality of processed points are sequentially injected. Laser beam for drilling. The laser processing method according to claim 8, wherein when the range of the substrate surface processed by the static processing once is defined as a scanning area, the following scanning is performed a plurality of times for each scanning area: sequentially toward 1 Each of the plurality of processed points included in each scanning area is injected with a laser beam at least once. The laser processing method according to Claim 9, wherein the time from the start to the end of moving the substrate to the beam scanner differs depending on the time required for one scan in the moving processing.

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