JP2021144406A - Machining order determination device, laser machining device, and laser machining method - Google Patents

Abstract

To provide a machining order determination device capable of shortening machining time while maintaining the stabilization of pulse energy.SOLUTION: A machining order determination device determines the machining order of a plurality of machining points by making pulsed laser beam incident thereon. Based on position information of the plurality of machining points, the tentative machining order is firstly determined under the condition that a total moving distance between two machining points having continuous machining orders is the shortest. After that, the longest distance that the incident position of the pulsed laser beam can be moved within a time from output of one laser pulse to output of the next laser pulse is defined as the longest movable distance. A quotient obtained by dividing each of the moving distances between the machining points by the longest movable distance is integerized by round up. The tentative machining order is modified so that the total value of the integerized values for the moving distances between all the machining points becomes smaller, and the actual machining order is obtained.SELECTED DRAWING: Figure 4

Description

The present invention relates to a machining order determining device that determines a machining order in a laser machining method in which a pulsed laser beam is sequentially incident to be machined, a laser machining device that performs laser machining in this machining order, and a laser machining method.

A laser processing apparatus is known that performs processing such as drilling by moving the incident position of a pulsed laser beam with a beam scanner. When pulse oscillation is performed by a laser oscillator, the pulse energy changes depending on the repetition frequency of the pulse. In order to make the machining conditions the same at a plurality of work points, pulse oscillation is performed at a constant repetition frequency.

However, when the distance from the work point where the pulse laser beam has finished incident to the work point to be incident next is long, the movement of the beam incident position by the beam scanner causes the next laser pulse according to the repetition frequency. It may not be in time for the output of. In this case, the propagation optical system is controlled so that the laser pulse is not incident on the object to be processed, and dummy laser oscillation that does not contribute to processing is executed (see, for example, Patent Document 1).

Patent No. 4873578

When the dummy laser oscillation is executed, the interval between the two pulse oscillations immediately before and after the dummy laser oscillation spreads at intervals of two cycles. If the movement time of the beam incident position by the beam scanner is shorter than two cycles, an unnecessary waiting time will occur before the next laser oscillation is performed. By accumulating this waiting time, the processing time for one processing object becomes long. If the pulse repetition frequency is changed according to the beam movement time in order to shorten the processing time, the pulse energy becomes unstable.

An object of the present invention is to provide a machining order determination device, a laser machining device, and a laser machining method capable of shortening the machining time while maintaining the stabilization of pulse energy.

According to one aspect of the invention
It is a machining order determination device that determines the machining order of a plurality of work points to be machined by injecting a pulsed laser beam.
Based on the position information of the plurality of work points, the temporary work order is determined under the condition that the total moving distance between two work points having continuous work orders is the shortest.
When the longest distance that the incident position of the pulsed laser beam can be moved between the output of one laser pulse and the output of the next laser pulse is defined as the longest movable distance,
The quotient obtained by dividing each of the moving distances between the work points by the longest movable distance is rounded up to an integer.
Provided is a machining order determining device that modifies the provisional machining order so that the total value of the integerized values for the moving distances between all the machining points becomes smaller to obtain the actual machining order.

According to another aspect of the invention
A laser optical system that has the function of moving the incident position of the pulsed laser beam on the substrate by scanning and outputting the pulsed laser beam.
It has a control device that controls the laser optical system to cause a pulsed laser beam to enter the substrate and move the incident position.
The control device includes the above-mentioned machining order determining device, and is provided by a laser machining device that causes a pulsed laser beam to be incident on a work point of a substrate based on the actual machining order determined by the machining order determining device. Will be done.

According to another aspect of the invention
Based on the position information of a plurality of work points distributed on the substrate, the temporary work order is determined under the condition that the total moving distance between two work work points in which the work order is continuous is the shortest.
When the longest distance that the incident position of the pulsed laser beam can be moved between the output of one pulse and the output of the next pulse is defined as the longest movable distance,
The quotient obtained by dividing each of the travel distances by the minimum travel distance is rounded up to an integer.
The tentative machining order was modified so that the integerized values would be smaller than the total value for all the travel distances, and the actual machining order was used.
Provided is a laser machining method in which a pulsed laser beam is incident on a plurality of workpieces in the actual machining order to perform machining.

If the moving distance between the work points is longer than the longest movable distance, dummy laser oscillation is performed during the moving. The value obtained by rounding up the value after the decimal point of the quotient obtained by dividing each of the moving distances between the work points by the maximum movable distance is added up for the moving distances between all the work points is the number of times dummy laser oscillation is performed. equal. If the total value is reduced, the number of times of dummy laser oscillation is reduced, and the machining time can be shortened. The stability of the pulse energy can be maintained by performing dummy laser oscillation at a point where the moving distance between the work points is longer than the maximum movable distance.

FIG. 1 is a schematic view of a laser processing apparatus according to an embodiment. FIG. 2A is a diagram showing an example of the distribution of a plurality of work points defined on the surface of the substrate, and FIG. 2B is a diagram showing an example of the processing order of the plurality of work points. FIG. 3 is a timing chart showing the temporal relationship between the output of the pulsed laser beam from the laser oscillator and the operating period of the beam scanner. FIG. 4 is a flowchart showing a procedure for determining the machining order of the machining order determining device according to the present embodiment and controlling the laser machining by the control device. FIG. 5A is a histogram showing an example of the distribution of the movement distance between the work points, and FIG. 5B is a histogram showing the frequency of the movement distance between the work points with respect to the movement path in the actual processing order. FIG. 6 is a schematic view showing the machining order of the work points in the temporary machining order and the actual machining order.

The laser processing apparatus according to the embodiment will be described with reference to FIGS. 1 to 6.
FIG. 1 is a schematic view of a laser processing apparatus according to an embodiment. The laser machining apparatus according to the embodiment includes a laser optical system 10, a moving mechanism 30 that holds and moves the substrate 40, a control device 20 that controls the laser optical system 10 and the moving mechanism 30, and a machining order determining device 25.

Hereinafter, the configuration of the laser optical system 10 will be described. The laser oscillator 11 outputs a pulsed laser beam in response to a command from the control device 20. The pulsed laser beam output from the laser oscillator 11 passes through the light guide optical system 12 and the aperture 13, and enters the acoustic optical element (AOD) 14. The light guide optical system 12 includes, for example, a beam expander and the like. The acoustic optical element 14 directs the incident pulsed laser beam to any one of the first path 15A, the second path 15B, and the path toward the beam damper 19 by a command from the control device 20.

The pulsed laser beam directed to the first path 15A passes through the beam scanner 16A and the condenser lens 17A and is incident on the substrate 40 which is the object to be processed. The pulsed laser beam directed to the second path 15B is reflected by the folded mirror 18, passes through the beam scanner 16B and the condenser lens 17B, and is incident on the other substrate 40 to be processed. The two boards 40 are, for example, printed wiring boards.

Drilling is performed by injecting a pulsed laser beam onto each of the two substrates 40. On the surface of the substrate 40, the positions of a plurality of work points to be formed are predetermined. The machining order determination device 25 determines the machining order of a plurality of work points.

As the beam scanners 16A and 16B, for example, a galvano scanner including a pair of swing mirrors is used. The beam scanners 16A and 16B scan the laser beam in response to a command from the control device 20, and move the incident position of the pulsed laser beam on the surfaces of the two substrates 40, respectively. As the condenser lenses 17A and 17B, for example, an fθ lens is used.

The two substrates 40 are supported by the horizontal support surface of the movable table 31 of the moving mechanism 30. The moving mechanism 30 moves the two substrates 40 in a two-dimensional direction parallel to the support surface by a command from the control device 20.

FIG. 2A is a diagram showing an example of the distribution of a plurality of work points 41 defined on the surface of the substrate 40. A plurality of work points 41 are defined on the surface of the substrate 40. In FIG. 2A, the work point 41 is indicated by a circular symbol, but in reality, the surface of the substrate 40 is not marked in any way, and the positions that define the positions of the plurality of work points 41 are defined. The data is stored in the control device 20. FIG. 2A shows only a part of the plurality of work points 41. The distribution of the plurality of work points 41 defined on the two substrates 40 supported by the moving mechanism 30 (FIG. 1) is the same. The outer shape of the substrate 40 is, for example, a rectangle. Alignment marks 42 are provided at the four corners of the substrate 40, respectively.

A plurality of scan areas 45 are defined on the surface of the substrate 40. The shape of each of the scan areas 45 is square, and the size of the scan area 45 is such that the pulse laser beam can be incident by operating the beam scanners 16A and 16B (FIG. 1) to scan the pulsed laser beam. It is almost equal to the size of the possible range. A plurality of scan areas 45 are arranged so that all the work points 41 on the substrate 40 are included in any of the scan areas 45. The plurality of scan areas 45 may partially overlap, and the scan areas 45 may not be arranged in an area where the work points 41 are not distributed.

By moving one scan area 45 directly under one of the condenser lenses 17A and 17B (FIG. 1) and sequentially injecting a pulsed laser beam into a plurality of work points 41 in the scan area 45, the same scan area 45 is formed. The scan area 45 is processed. When the processing of one scan area 45 is completed, the moving mechanism 30 (FIG. 1) is operated to move the scan area 45 to be processed next directly under one of the condenser lenses 17A and 17B. In FIG. 2A, the processing order of the scan area 45 is indicated by an arrow.

FIG. 2B is a diagram showing an example of the processing order of the plurality of work points 41. A plurality of work points 41 are numbered serially in the order of processing. One scan area 45 is processed by operating the beam scanners 16A and 16B (FIG. 1) and injecting a pulsed laser beam into a plurality of processing points 41 in the order of serial numbers. In FIG. 2B, the machining order of the plurality of work points 41 is indicated by arrows. The machining order of the plurality of work points 41 is determined by the machining order determination device 25. In the present specification, the length of the linear path from one work point 41 to the work point 41 to which the next serial number is assigned is simply referred to as "moving distance between work points".

FIG. 3 is a timing chart showing the temporal relationship between the output of the pulsed laser beam from the laser oscillator 11 (FIG. 1) and the operating period of the beam scanners 16A and 16B (FIG. 1). Here, the "operating period of the beam scanners 16A and 16B" means the time from the start of the movement of the position where the pulsed laser beam is incident to the completion of the movement.

The repetition frequency of the pulse of the pulsed laser beam output from the laser oscillator 11 is constant. After the falling edge of the laser pulse, the control device 20 operates the beam scanners 16A and 16B to move the incident position of the pulsed laser beam. Here, the "pulse laser beam" means a light beam radiated in a pulsed manner by light amplification by stimulated emission, and the "laser pulse" means each pulse of the pulsed laser beam. When the incident position is set to the command position from the control device 20, the beam scanners 16A and 16B notify the control device 20 of the completion of the movement. The operating time of the beam scanners 16A and 16B (the time from the start of movement of the incident position to the completion of movement) depends on the movement distance between the work points. Therefore, the operating times of the beam scanners 16A and 16B have a distribution spread within a certain range.

When the pulse repetition frequency of the pulsed laser beam is set according to the maximum operating time of the beam scanners 16A and 16B, the laser pulse is incident from the completion of the movement of the incident position of the pulsed laser beam at most of the work points 41. Waiting time will be long. As a result, the processing time becomes long.

When the pulse repetition frequency of the pulsed laser beam is set according to a value in the middle of the variation in the operating time of the beam scanners 16A and 16B, the operation of the beam scanners 16A and 16B is completed at the time when the laser pulse is output. There are cases where there is no such thing. If the operations of the beam scanners 16A and 16B are not completed at the time of outputting the laser pulse, the control device 20 controls the acoustic optical element 14 (FIG. 1) to send the laser pulse to the beam damper 19 (FIG. 1). Turn around. Therefore, the laser pulse does not enter the substrate 40 when the operations of the beam scanners 16A and 16B are not completed. In the present specification, the laser pulse directed to the beam damper 19 is referred to as a throw-away pulse LPd. The laser pulse incident on the substrate 40 is referred to as an effective pulse PDe in order to distinguish it from the discard pulse LPd. In FIG. 3, the effective pulse PDe is provided with relatively dark hatching, and the discarded pulse LPd is provided with relatively light hatching.

In order to shorten the processing time, it is preferable to shorten the waiting time Tw from the completion of the operation of the beam scanners 16A and 16B to the output of the laser pulse, and to reduce the number of discarded pulse LPds.

FIG. 4 is a flowchart showing a procedure in which the machining order determining device 25 according to the present embodiment determines the machining order and the control device 20 controls laser machining.

First, the machining order determination device 25 determines the arrangement of the plurality of scan areas 45 based on the position information of the plurality of workpiece points 41 (step S1). At this time, a plurality of scan areas 45 are arranged so that each of all the work points 41 is included in at least one scan area 45 and the number of scan areas 45 is minimized. The work point 41 located in the area where the plurality of scan areas 45 overlap is allocated to one of the plurality of scan areas 45.

Next, the machining order determination device 25 determines the visit order of the plurality of scan areas 45 so that the moving distance of the movable table 31 (FIG. 1) is minimized (step S2). Various algorithms for solving the traveling salesman problem can be applied to determine the order of visits in the scan area 45, for example.

After determining the visit order of the scan area 45, the processing order of the plurality of work points 41 belonging to the scan area 45 is determined by executing steps S3, S4, and S5 for each scan area 45.

First, based on the position information of a plurality of work points 41, a temporary work order is determined under the condition that the total movement distance between two work points 41 having a continuous work order is the shortest (the work order is determined). Step S3). Hereinafter, a method of determining the temporary processing order will be described.

The shortest circulation path is determined under the condition that the length of the circulation path that starts from any one work point 41, passes through all the work points 41 once, and returns to the start point is the shortest. .. For the determination of the shortest circulation path, for example, a known algorithm for solving the traveling salesman problem can be used. As applicable algorithms, for example, Nearest Neighbor Method, Multiple Fragment Method, 2 Opto Method, 3 Opto Method, Linand Kernighan Method (LK Method), ITERATRD-LK Method, CHAINED-LK Method, ITERRATED-3 Opto Method, CHAINED -3 Opto method and the like can be mentioned. Here, the "shortest circular path" does not mean the optimum solution obtained by evaluating all combinations, and it is possible to obtain a solution close to the optimum solution at a certain level, for example, a local search algorithm. It may be a circulation path obtained by using an algorithm that can be used.

Of all the paths to be processed in the circulation path, the path having the longest movement distance is cut, and one of the workpiece points 41 at both ends of the cut path is set as a start point and the other is set as an end point. The order of the work points 41 that pass from the work point 41 at the start point to the end point along the circulation path is set as a temporary work order.

Next, the repetition frequency of the pulse of the pulsed laser beam is determined based on the distribution of the moving distance between the work points in the temporary machining order (step S4). A method for determining the pulse repetition frequency of the pulsed laser beam will be described with reference to FIG. 5A.

FIG. 5A is a histogram showing an example of the distribution of the moving distance between the work points. The horizontal axis represents the moving distance between the work points, and the vertical axis represents the frequency. The frequency of travel distance with a length of L1 or more and less than L2 is the highest. The frequency decreases as the moving distance increases and decreases from the range of L1 or more and less than L2. The control device 20 determines the repetition frequency of the pulse based on the range corresponding to the mode value of the travel distance. For example, the pulse repetition frequency is determined so that the maximum length that the incident position can move during one cycle of laser oscillation is equal to the length L2, which is the maximum value in the range corresponding to the mode value.

After determining the pulse repetition frequency, the temporary machining order is modified so that the number of discarded pulse LPds is the smallest, and the actual machining order is determined (step S5).

Hereinafter, how to obtain the number of discarded pulse LPds will be described. The longest distance at which the incident position of the pulsed laser beam can be moved between the output of one laser pulse and the output of the next laser pulse is referred to as the "longest movable distance". The value obtained by rounding up the decimal point of the quotient obtained by dividing each of the moving distances between the work points by the maximum movable distance is equal to the number of discarded shot pulses LPd output when moving between the work points. The quotient obtained by dividing each of the moving distances between the work points by the longest movable distance is rounded up to an integer. The sum of the integerized values for the moving distances between all the work points is equal to the total number of discarded pulse LPd.

Next, a method of modifying the temporary machining order will be described. As the first evaluation function, an evaluation function is used in which the evaluation value becomes smaller as the total movement distance between the work points becomes shorter. As the second evaluation function, the evaluation value becomes smaller as the total value for all the movement distances is reduced by rounding up the value after the decimal point of the quotient obtained by dividing each of the movement distances between the work points by the maximum movable distance. Use a function. For the machining order in which the order of the provisional machining order is modified, the weighted average value of the evaluation values of the first evaluation function and the second evaluation function is calculated. The procedure of changing the machining order so that the weighted average value of the evaluation value becomes small is repeated, and when the weighted average value of the evaluation value converges to the minimum value, the machining order at that time is adopted as the actual machining order. The weighting when obtaining the weighted average value may be determined based on the results of various evaluation experiments under different weighting conditions.

FIG. 5B is a histogram showing the frequency of the movement distance between the work points obtained for the movement path in the actual processing order. In FIG. 5B, the frequency of the movement distance between the work points obtained for the movement path in the temporary processing order is shown by a broken line. The frequency of the movement distance longer than the mode of the movement distance is less than that in the tentative processing order. As a result, the number of discarded pulse LPd is reduced.

In the actual machining order, a portion where the moving distance becomes longer occurs in response to the fact that the frequency of the moving distance longer than the mode value of the moving distance becomes smaller. The occurrence of the part where the movement distance is long is reflected in the histogram, and the frequency of the mode is increasing. Further, in the range where the travel distance is less than the mode, the frequency of the relatively short travel distance decreases, and the frequency of the relatively long travel distance increases. Even if the moving distance becomes longer in the range below the mode, the number of discarded pulse LPd does not increase as long as the moving distance is less than the maximum movable distance. Therefore, the moving path from the start point to the ending point in the actual machining order is longer than the moving path in the tentative machining order, but the number of discarded pulse LPd is small.

After the actual processing order is determined, the substrate 40 is processed by moving the incident position of the pulse laser beam based on the actual processing order under the condition that the pulse repetition frequency is constant (step S6). At this time, the pulse repetition frequency of the pulsed laser beam is set to a value determined from the mode value of the moving distance.

Next, with reference to FIG. 6, an example of a temporary machining order movement path and an example of a modified actual machining order movement path will be described.

FIG. 6 is a schematic view showing a temporary machining order and a machining order of some work points in the actual machining order. In the tentative processing order, for example, the processing points are processed in the order of A, B, C ... I, J, K. This processing order is an example in which the moving distance is determined to be the shortest as a whole including not only the six processed points 41 shown in FIG. 6 but also all the other processed points 41.

Since the moving distances from the work points A to B and from the work points I to J are shorter than the longest movable distance, the discard pulse LPd is not output during the movement. Since the moving distances from the work points B to C and from the work points J to K are longer than the longest movable distance, the discard pulse LPd is output during the movement. The incident positions X and Y of the pulsed laser beam at the time when the discarded pulse LPd is output are indicated by solid black circle symbols.

In the actual machining order, the moving path ABC in the temporary machining order is modified to the moving path AJC, and the moving path IJK in the temporary machining order is modified to the moving path IBK. The total length of the moving path AJC and the moving path IBK in the actual machining order is longer than the total length of the moving path ABC and the moving path IJK in the temporary machining order. The moving distance from the work point A to J, the work point J to C, and the work point B to K is shorter than the longest movable distance. The moving distance from the work point I to B is longer than the longest movable distance. Therefore, during this movement, the discard pulse LPd is output. The incident position Z at the time when the discard pulse LPd is output is indicated by a solid black circle symbol.

In the example shown in FIG. 6, the number of throw-away pulses LPd is 2 in the temporary machining order, whereas the number of throw-away pulses LPd is 1 in the actual machining order. As described above, in the actual processing order, the total length of the moving paths of the incident positions is longer than that in the temporary processing order, but the number of throw-away pulses LPd is reduced.

Next, the excellent effect of the above embodiment will be described.
In the above embodiment, the number of discarded shot pulses is smaller than the number of discarded shot pulses when processing is performed in the temporary processing order determined on the condition that the length of the moving path of the incident position of the pulsed laser beam is minimized. be able to. The machining time in one scan area 45 is equal to the sum of the number of laser pulses incident on the work point 41 and the number of discarding pulses multiplied by the repetition period of the laser pulses. Since the number of laser pulses incident on the work point 41 does not change, the processing time in the scan area 45 becomes shorter as the number of discarded shot pulses decreases.

In the above embodiment, the number of discarded shot pulses can be reduced, so that the machining time can be shortened. Further, in the above embodiment, since the processing is performed with the pulse repetition frequency of the pulsed laser beam constant, the variation in the pulse energy for each laser pulse can be reduced, and as a result, the processing quality can be improved.

Next, a modified example of the above embodiment will be described.
In the above embodiment, the pulse repetition frequency is determined based on the mode of the moving distance between the work points (FIG. 5A), but the pulse repetition frequency may be determined by another method. For example, the repetition frequency of the pulse may be determined based on the average value, the median value, or the like of the moving distance between the work points. In addition, the pulse repetition frequency may be determined based on the characteristics of the laser oscillator 11 (FIG. 1) and the like.

Further, in the above embodiment, when laser machining is performed (step S6 in FIG. 4), the pulse repetition frequency is kept constant, but the pulse repetition frequency is within a range in which sufficient uniformity of pulse energy is maintained. May be changed. In this case, the longest movable distance may be determined based on the highest frequency in the range in which the repetition frequency of the pulse is changed.

In the above embodiment, the control device 20 and the machining order determination device 25 are shown separately in FIG. 1, but the function of the machining order determination device 25 may be incorporated into the control device 20.

The above-mentioned examples are examples, and the present invention is not limited to the above-mentioned examples. For example, it will be obvious to those skilled in the art that various changes, improvements, combinations, etc. are possible.

10 Laser optical system 11 Laser oscillator 12 Light guide optical system 13 Aperture 14 Acoustic optical element 15A 1st path 15B 2nd path 16A, 16B Beam scanner 17A, 17B Condensing lens 18 Folded mirror 19 Beam damper 20 Control device 25 Machining order determination Device 30 Moving mechanism 31 Movable table 40 Substrate 41 Machining point 42 Alignment mark 45 Scan area

According to one aspect of the invention
It is a machining order determination device that determines the machining order of a plurality of work points to be machined by injecting a pulsed laser beam.
Based on the position information of the plurality of work points, the temporary work order is determined under the condition that the total moving distance between two work points having continuous work orders is the shortest.
When the longest distance that the incident position of the pulsed laser beam can be moved between the output of one laser pulse and the output of the next laser pulse is defined as the longest movable distance,
The quotient obtained by dividing each of the moving distances between the work points by the longest movable distance is rounded down to an integer.
Provided is a machining order determining device that modifies the provisional machining order so that the total value of the integerized values for the moving distances between all the machining points becomes smaller to obtain the actual machining order.

According to another aspect of the invention
Based on the position information of a plurality of work points distributed on the substrate, the temporary work order is determined under the condition that the total moving distance between two work work points in which the work order is continuous is the shortest.
When the longest distance that the incident position of the pulsed laser beam can be moved between the output of one pulse and the output of the next pulse is defined as the longest movable distance,
The quotient obtained by dividing each of the travel distances by the minimum travel distance is rounded down to an integer.
The tentative machining order was modified so that the integerized values would be smaller than the total value for all the travel distances, and the actual machining order was used.
Provided is a laser machining method in which a pulsed laser beam is incident on a plurality of workpieces in the actual machining order to perform machining.

If the moving distance between the work points is longer than the longest movable distance, dummy laser oscillation is performed during the moving. The value obtained by rounding down the decimal point of the quotient obtained by dividing each of the moving distances between the work points by the maximum movable distance is the sum of the moving distances between all the work points is the number of times dummy laser oscillation is performed. equal. If the total value is reduced, the number of times of dummy laser oscillation is reduced, and the machining time can be shortened. The stability of the pulse energy can be maintained by performing dummy laser oscillation at a point where the moving distance between the work points is longer than the maximum movable distance.

Hereinafter, how to obtain the number of discarded pulse LPds will be described. The longest distance at which the incident position of the pulsed laser beam can be moved between the output of one laser pulse and the output of the next laser pulse is referred to as the "longest movable distance". The value obtained by rounding down the decimal point of the quotient obtained by dividing each of the moving distances between the work points by the maximum movable distance is equal to the number of throw-away pulses LPd output when moving between the work points. The quotient obtained by dividing each of the moving distances between the work points by the longest movable distance is rounded down to an integer. The sum of the integerized values for the moving distances between all the work points is equal to the total number of discarded pulse LPd.

Next, a method of modifying the temporary machining order will be described. As the first evaluation function, an evaluation function is used in which the evaluation value becomes smaller as the total movement distance between the work points becomes shorter. As the second evaluation function, the evaluation value becomes smaller as the total value for all the movement distances is smaller than the value obtained by dividing each of the movement distances between the work points by the maximum movable distance and rounding down after the decimal point. Use a function. For the machining order in which the order of the provisional machining order is modified, the weighted average value of the evaluation values of the first evaluation function and the second evaluation function is calculated. The procedure of changing the machining order so that the weighted average value of the evaluation value becomes small is repeated, and when the weighted average value of the evaluation value converges to the minimum value, the machining order at that time is adopted as the actual machining order. The weighting when obtaining the weighted average value may be determined based on the results of various evaluation experiments under different weighting conditions.

Claims (6)

It is a machining order determination device that determines the machining order of a plurality of work points to be machined by injecting a pulsed laser beam.
Based on the position information of the plurality of work points, the temporary work order is determined under the condition that the total moving distance between two work points having continuous work orders is the shortest.
When the longest distance that the incident position of the pulsed laser beam can be moved between the output of one laser pulse and the output of the next laser pulse is defined as the longest movable distance,
The quotient obtained by dividing each of the moving distances between the work points by the longest movable distance is rounded up to an integer.
A machining order determining device that modifies the provisional machining order so that the total value of the integerized values for the moving distances between all the machining points becomes smaller, and sets the temporary machining order as the actual machining order. Further, the machining order determining apparatus according to claim 1, wherein the longest movable distance is determined based on the distribution of the moving distance between the workpieces in the provisional machining order. The evaluation function whose evaluation value becomes smaller as the total length of the travel distance is shorter is defined as the first evaluation function.
The second evaluation function is an evaluation function in which the smaller the total value of the integerized values for all the travel distances, the smaller the evaluation value.
Claim to change the machining order so that the weighted average value of the evaluation values of the first evaluation function and the second evaluation function becomes smaller when the temporary machining order is modified to obtain the actual machining order. The processing order determination device according to 1 or 2. A laser optical system that has the function of moving the incident position of the pulsed laser beam on the substrate by scanning and outputting the pulsed laser beam.
It has a control device that controls the laser optical system to cause a pulsed laser beam to enter the substrate and move the incident position.
The control device includes the machining order determining device according to any one of claims 1 to 3, and the machining point of the substrate is determined based on the actual machining order determined by the machining order determining device. A laser processing device that incidents a pulsed laser beam. Based on the position information of a plurality of work points distributed on the substrate, the temporary work order is determined under the condition that the total moving distance between two work work points in which the work order is continuous is the shortest.
When the longest distance that the incident position of the pulsed laser beam can be moved between the output of one pulse and the output of the next pulse is defined as the longest movable distance,
The quotient obtained by dividing each of the travel distances by the maximum travel distance is rounded up to an integer.
The tentative machining order was modified so that the integerized values would be smaller than the total value for all the travel distances, and the actual machining order was used.
A laser machining method in which a pulsed laser beam is incident on a plurality of workpieces in the actual machining order to perform machining. Further, the laser machining method according to claim 5, wherein the longest movable distance is determined based on the distribution of the moving distance between the machining points in the provisional machining order.

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