KR20210114874A - Apparatus for determination of processing sequence, Laser Processing Apparatus, and Laser Processing Method - Google Patents

Abstract

Provided is a processing sequence determination device capable of maintaining stabilization of pulse energy and shortening the processing time. The processing sequence determination device determines the processing sequence of a plurality of processing target points by making a pulsed laser beam incident thereon. At this time, firstly, based on position information of the plurality of processing target points, a temporary processing sequence is determined under the condition that the total movement distance between two processing target points having continuous processing sequences is the shortest. Then, the longest distance at which the incident position of the pulse laser beam can move during the period from the output of one laser pulse to the output of the next laser pulse is defined as a movable longest distance. A quotient obtained by dividing the movement distance between the processing target points by the movable longest distance is not more than a decimal point, and is rounded to be integers. The temporary processing sequence is modified as an actual processing sequence so that the total value of the integers for the movement distances between the processing target points becomes small.

Description

Processing sequence determination apparatus, laser processing apparatus, and laser processing method {Apparatus for determination of processing sequence, Laser Processing Apparatus, and Laser Processing Method}

This application claims priority based on Japanese Patent Application No. 2020-041934 filed on March 11, 2020. The entire contents of the application are incorporated herein by reference.

The present invention relates to a processing sequence determining device for determining a processing sequence in a laser processing method in which a pulsed laser beam is sequentially incident and processing, a laser processing apparatus for performing laser processing in this processing sequence, and a laser processing method.

A laser processing apparatus is known which moves an incident position of a pulsed laser beam with a beam scanner to perform processing such as punching. In the case of performing pulse oscillation with a laser oscillator, the pulse energy changes depending on the repetition frequency of the pulse. Pulse oscillation is performed at a constant repetition frequency in order to make the machining conditions the same at a plurality of machining points.

However, when the distance from the processing point where the incident of the pulsed laser beam is finished to the processing point where the pulsed laser beam is applied to the next is long, the movement of the beam incidence position by the beam scanner causes the output of the next laser pulse according to the repetition frequency. may be late for In this case, the propagation optical system is controlled so that the laser pulse is not incident on the object to be processed, and laser oscillation of the dummy that does not contribute to processing is performed (see, for example, Patent Document 1).

Patent Document 1: Japanese Patent Publication No. 4873578

When the laser oscillation of the dummy is executed, the interval between the two pulse oscillations immediately before and immediately after the laser oscillation of the dummy is spread at an interval of two cycles. When the movement time of the beam incident position by the beam scanner is shorter than two periods, an unnecessary waiting time is generated until the next laser oscillation is performed. By accumulating this waiting time, the processing time for one processing object becomes long. However, in order to shorten the processing time, if the repetition frequency of the pulse is changed according to the beam movement time, the pulse energy becomes unstable.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a processing sequence determining apparatus, a laser processing apparatus, and a laser processing method capable of reducing the processing time while maintaining the stabilization of pulse energy.

According to one aspect of the present invention,

A processing sequence determining device for determining the processing sequence of a plurality of processing points processed by inputting a pulsed laser beam, the processing sequence determining device comprising:

Based on the positional information of the plurality of processing points, a temporary processing sequence is determined under the condition that the sum of the movement distances between two processing points in which the processing sequence is continuous is the shortest;

When the longest distance that can move the incident position of the pulsed laser beam between the output of one laser pulse and the output of the next laser pulse is defined as the longest movable distance,

Each of the moving distances between the processing points is rounded up to an integer by rounding up the decimal point of the quotient divided by the longest movable distance,

There is provided a machining order determining device that corrects the temporary machining order so that the integerized value for the movement distances between all the machining points becomes smaller and becomes the actual machining order.

According to another aspect of the present invention,

A laser optical system having a function of moving the incident position of the pulsed laser beam onto the substrate by scanning and outputting the pulsed laser beam;

and a control device for controlling the laser optical system to make the pulsed laser beam incident on the substrate and move the incident position;

The control device is provided with the above-described processing sequence determining device, and a laser processing device for injecting a pulsed laser beam onto the processing target point of the substrate based on the actual processing sequence determined by the processing sequence determining device. do.

According to another aspect of the present invention,

Based on the positional information of a plurality of processing points distributed on the substrate, a temporary processing sequence is determined under the condition that the sum of the movement distances between two processing points in which the processing sequence is continuous is the shortest;

When the longest distance that can move the incident position of the pulsed laser beam between the output of one laser pulse and the output of the next laser pulse is defined as the longest movable distance,

Each of the movement distances is rounded up to an integer by rounding up the decimal point of the quotient divided by the minimum movable distance,

The temporary processing order is modified so that the sum of the integer values for all the moving distances becomes small, and the actual processing order is made,

A laser processing method is provided in which a pulsed laser beam is incident on the plurality of processing target points in the actual processing sequence to perform processing.

When the movement distance between the processing target points is longer than the longest possible movement distance, laser oscillation of the dummy is performed during movement. The value obtained by rounding up the decimal point of the quotient obtained by dividing each of the movement distances between the processing points by the longest possible movement distance, and the sum of the movement distances between all the processing points, is the same as the number of laser oscillations of the dummy. When the value of this sum is made small, the number of laser oscillations of the dummy is reduced, and it becomes possible to shorten the processing time. By oscillating the dummy laser at a location where the moving distance between the processing points is longer than the longest possible move, the stability of the pulse energy can be maintained.

1 is a schematic diagram of a laser processing apparatus according to an embodiment.
2A of FIG. 2 is a figure which shows an example of the distribution of the some to-be-processed point defined on the surface of a board|substrate, and 2B of FIG. 2 is a figure which shows an example of the processing procedure of a some to-be-processed point.
Fig. 3 is a timing chart showing the temporal relationship between the output of a pulsed laser beam from the laser oscillator and the operation period of the beam scanner.
Fig. 4 is a flowchart showing a procedure in which the processing sequence determining device according to the present embodiment determines the processing sequence and the control device controls the laser processing.
Fig. 5A is a histogram showing an example of the distribution of the movement distance between the processing points, and Fig. 5B is the frequency of the movement distance between the processing points with respect to the movement path of the actual processing procedure. is a histogram.
Fig. 6 is a schematic diagram showing a processing procedure of a processing target point in a temporary processing procedure and an actual processing procedure.

A laser processing apparatus according to an embodiment will be described with reference to FIGS. 1 to 6 .

1 is a schematic diagram of a laser processing apparatus according to an embodiment. The laser processing apparatus according to the embodiment includes a laser optical system 10, a moving mechanism 30 for supporting and moving the substrate 40, a control device 20 for controlling the laser optical system 10 and the moving mechanism 30, and a processing order determining device 25 .

Hereinafter, the configuration of the laser optical system 10 will be described. The laser oscillator 11 outputs a pulsed laser beam according to a command from the control device 20 . The pulsed laser beam output from the laser oscillator 11 passes through the light guide optical system 12 and the aperture 13 and is incident on an acoustooptical device (AOD) 14 . The light guide optical system 12 includes, for example, a beam expander or the like. The acousto-optical device 14 transmits the incident pulsed laser beam according to a command from the control device 20 to any one of the path toward the first path 15A, the second path 15B, and the beam damper 19 . towards one

The pulsed laser beam directed to the first path 15A passes through the beam scanner 16A and the condensing lens 17A, and is incident on the substrate 40 as a processing object. The pulsed laser beam directed to the second path 15B is reflected by the fold mirror 18, passes through the beam scanner 16B and the condensing lens 17B, and is incident on another substrate 40 as a processing object. The two boards 40 are, for example, printed wiring boards.

When a pulsed laser beam is incident on the two substrates 40, respectively, punching is performed. On the surface of the substrate 40, positions of a plurality of processing points where holes are to be formed are determined in advance. The machining order determining device 25 determines the machining order of the plurality of machining points.

As the beam scanners 16A and 16B, for example, a galvanoscanner including a pair of oscillating mirrors is used. The beam scanners 16A and 16B scan a laser beam according to a command from the control device 20, and move the incident positions of the pulsed laser beams on the surfaces of the two substrates 40, respectively. As the condensing lenses 17A and 17B, for example, an f? lens is used.

The two boards 40 are supported on the horizontal support surface of the movable table 31 of the moving mechanism 30 . The moving mechanism 30 moves the two board|substrates 40 in the two-dimensional direction parallel to a support surface in response to the instruction|command from the control apparatus 20. As shown in FIG.

2A of FIG. 2 is a figure which shows an example of the distribution of the some to-be-processed point 41 defined on the surface of the board|substrate 40. As shown in FIG. A plurality of processing target points 41 are defined on the surface of the substrate 40 . In 2A of FIG. 2, the to-be-processed point 41 is shown by the circular symbol, but in reality, no mark is provided on the surface of the board|substrate 40, and the position of the plurality of to-be-processed points 41 is shown. Position data to be defined is stored in the control device 20 . In 2A of FIG. 2, only a part of the some to-be-processed point 41 is shown. The distribution of the plurality of to-be-processed points 41 defined on the two board|substrates 40 supported by the moving mechanism 30 (FIG. 1) is the same. The outer shape of the substrate 40 is, for example, a rectangle. Alignment marks 42 are provided at each of the four corners of the substrate 40 .

A plurality of scan areas 45 are defined on the surface of the substrate 40 . Each shape of the scan area 45 is square, and its size is within a range in which a pulsed laser beam can be incident by operating each of the beam scanners 16A and 16B (FIG. 1) to scan the pulsed laser beam. about the same size A plurality of scan areas 45 are arranged so that all the processing points 41 on the substrate 40 are included in any one scan area 45 . The plurality of scan areas 45 may partially overlap each other, and the scan areas 45 may not be arranged in a region where the processing target points 41 are not distributed.

One scan area 45 is moved directly below one of the condensing lenses 17A and 17B (Fig. 1), and a pulsed laser beam is sequentially incident on a plurality of processing points 41 in the scan area 45. By doing so, the scan area 45 is processed. When the processing of one scan area 45 is finished, the moving mechanism 30 (FIG. 1) is operated to move the scan area 45 to be processed next, just below one of the condensing lenses 17A and 17B. move to In 2A of FIG. 2, the process sequence of the scan area 45 is shown with an arrow.

2B of FIG. 2 is a figure which shows an example of the processing procedure of the some to-be-processed point 41. As shown in FIG. Serial numbers are assigned to the plurality of processing target points 41 in the processing order. One scan area 45 is machined by operating the beam scanners 16A and 16B (FIG. 1) to make the pulsed laser beams incident on the plurality of processing target points 41 in the order of the serial numbers. In 2B of FIG. 2, the processing order of the some to-be-processed point 41 is shown with the arrow. The processing sequence of the plurality of processing target points 41 is determined by the processing sequence determining device 25 . In the present specification, the length of the straight line from one processing point 41 to the processing target point 41 to which the next serial number is assigned is simply referred to as "movement distance between processing points".

Fig. 3 is a timing chart showing the temporal relationship between the output of the pulsed laser beam from the laser oscillator 11 (Fig. 1) and the operation period of the beam scanners 16A and 16B (Fig. 1). Here, the "operation period of the beam scanners 16A and 16B" means the time from the start of the movement of the position at which the pulsed laser beam is incident to the completion of the movement.

The repetition frequency of the pulses of the pulsed laser beam output from the laser oscillator 11 is constant. After the fall of the laser pulse, the control device 20 operates the beam scanners 16A and 16B to move the incident position of the pulsed laser beam. Here, "pulse laser beam" means a light beam emitted in pulses by optical amplification by stimulated emission, and "laser pulse" means each pulse of the pulsed laser beam. When the incident position is corrected to the commanded position from the control device 20 , the beam scanners 16A and 16B notify the control device 20 of completion of the movement. The operation time of the beam scanners 16A and 16B (the time from the start of movement of the incident position to the completion of movement) depends on the movement distance between the processing target points. For this reason, the operating times of the beam scanners 16A and 16B have a spread distribution within a predetermined range.

When the repetition frequency of the pulse of the pulsed laser beam is set to match the maximum value of the operation time of the beam scanners 16A and 16B, in most of the processing points 41, from the completion of movement of the incident position of the pulsed laser beam, the laser pulse The waiting time until the entrance of As a result, the processing time becomes long.

If the repetition frequency of the pulse of the pulsed laser beam is set according to the middle value of the deviation of the operation time of the beam scanners 16A and 16B, the operation of the beam scanners 16A and 16B is completed at the point of outputting the laser pulse, There are cases where it does not exist. When the operation of the beam scanners 16A and 16B is not completed at the time of outputting the laser pulse, the control device 20 controls the acoustooptical device 14 (FIG. 1) to convert the laser pulse to the beam damper ( 19) (Fig. 1). For this reason, in a state in which the operation of the beam scanners 16A and 16B is not completed, the laser pulse is not incident on the substrate 40 . In this specification, the laser pulse directed to the beam damper 19 is referred to as an invalid pulse LPd. In order to distinguish it from the ineffective pulse LPd, the laser pulse incident on the substrate 40 is referred to as an effective pulse PDe. In Fig. 3, relatively thick hatching is given to the effective pulse PDe, and relatively light hatching is given to the invalid pulse LPd.

In order to shorten the processing time, it is preferable to shorten the waiting time Tw from the completion of the operation of the beam scanners 16A and 16B to the output of the laser pulse, and also to reduce the number of ineffective pulses LPd.

Fig. 4 is a flowchart showing a procedure in which the processing order determining device 25 determines the processing order and the control device 20 controls the laser processing according to the present embodiment.

First, the processing order determining device 25 determines the arrangement of the plurality of scan areas 45 based on the positional information of the plurality of processing target points 41 (step S1). At this time, a plurality of scan areas 45 are arranged so that each of all the processing target points 41 is included in at least one scan area 45 and the number of scan areas 45 is minimized. The to-be-processed point 41 located in the area|region where the several scan area 45 overlaps is distributed to the one scan area 45 of the some scan area 45. As shown in FIG.

Next, the processing order determining device 25 determines the visit order of the plurality of scan areas 45 so that the moving distance of the movable table 31 (FIG. 1) is minimized (step S2). Various algorithms for solving the traveling salesman problem can be applied, for example, to the determination of the order of visits to the scan area 45 .

When the visit order of the scan area 45 is determined, steps S3, S4, and S5 are executed for each scan area 45 to determine the processing order of the plurality of processing target points 41 belonging to the scan area 45 .

First, on the basis of the positional information of the plurality of processing points 41, a temporary processing sequence is determined under the condition that the sum of the movement distances between two processing points 41 in which the processing sequence is continuous is the shortest. do (step S3). Hereinafter, a method for determining the temporary processing order will be described.

Under the condition that any one to-be-processed point 41 is the starting point, and the length of the circulation path passing through all the processing points 41 once and returning to the starting point is the shortest, the shortest circulation path decide For the determination of the shortest circular path, for example, a known algorithm for solving the traveling salesman problem can be used. As the algorithm to be applied, for example, the near list naaver method, the multiple fragment method, the 2-opto method, the 3-opto method, the Lean and Kernihan method (LK method), the ITERATRD-LK method, the CHAINED-LK method, the ITERATED-3 opto method, The CHAINED-3 opto method etc. are mentioned. Here, the "shortest circular path" does not mean an optimal solution obtained by evaluating all combinations, for example, a solution close to the optimal solution can be obtained at a certain level, such as a local search algorithm. It may be a circular path obtained using an algorithm.

The path with the longest moving distance among the paths between all the processing points of the circulation path is cut, and one of the processing points 41 at both ends of the cut path is taken as a starting point, and the other is taken as an end point. Let the order of the to-be-processed points 41 which pass when going from the to-be-processed point 41 of a starting point to an end point along a circulation path|route as a temporary processing order.

Next, the repetition frequency of the pulses of the pulsed laser beam is determined based on the distribution of the movement distances between the processing target points in the temporary processing procedure (step S4). With reference to 5A of FIG. 5, the determination method of the repetition frequency of the pulse of a pulsed laser beam is demonstrated.

5A of FIG. 5 is a histogram showing an example of the distribution of the movement distance between the processing target points. The horizontal axis represents the moving distance between the processing target points, and the vertical axis represents the frequency. The frequency of movement distances with a length of L1 or more and less than L2 is the highest. The frequency decreases as the moving distance increases in the lengthening direction and in the shortening direction from the range of L1 or more and less than L2. The control device 20 determines the repetition frequency of the pulse based on the range corresponding to the mode value of the movement distance. For example, the repetition frequency of the pulse is determined so that the maximum length by which the incident position can be moved during one cycle of laser oscillation is equal to the length L2, which is the maximum value of the range corresponding to the mode.

When the repetition frequency of the pulses is determined, the actual processing sequence is determined by correcting the temporary processing sequence so that the number of invalid pulses LPd is the smallest (step S5).

Hereinafter, a method of calculating the number of invalid pulses LPd will be described. The longest distance at which the incident position of the pulsed laser beam can be moved between the output of one laser pulse and the output of the next laser pulse is referred to as the "movable longest distance". A value obtained by rounding up the decimal point of the quotient obtained by dividing each of the movement distances between the processing points by the longest possible movement distance is the same as the number of invalid pulses LPd output during movement between the processing points. Each of the movement distances between the processing points is rounded up to the decimal point of the quotient divided by the longest possible movement distance and converted to an integer. The sum of these integer values for the movement distances between all the processing points is equal to the total number of invalid pulses LPd.

Next, a method for correcting the temporary processing order will be described. As the first evaluation function, an evaluation function in which the evaluation value becomes smaller as the sum of the moving distances between the processing target points is shorter is used. As the second evaluation function, a value obtained by rounding up the decimal point of the quotient obtained by dividing each of the moving distances between the processing points by the longest moving distance, and an evaluation function in which the evaluation value becomes smaller as the sum of all moving distances is smaller use it A weighted average value of the evaluation values of the first evaluation function and the second evaluation function is calculated for the processing sequence in which the order of the temporary processing sequence is corrected. The procedure for changing the processing order is repeated so that the weighted average value of the evaluation value becomes small. When the weighted average value of the evaluation value converges to the minimum value, the processing procedure at that time is adopted as the actual processing procedure. The weighting when obtaining the weighted average value may be determined based on the results of various evaluation experiments conducted under different weighting conditions.

5B in Fig. 5 is a histogram showing the frequency of the movement distance between the processing target points obtained with respect to the movement path of the actual processing procedure. In Fig. 5B, the frequency of the movement distance between the processing target points obtained with respect to the movement path of the temporary processing procedure is indicated by a broken line. The frequency of the movement distance longer than the mode value of the movement distance is decreased compared with the case of the temporary processing procedure. Accordingly, the number of invalid pulses LPd is reduced.

In the actual processing sequence, a portion with a longer movement distance occurs in response to a decrease in the frequency of the movement distance longer than the mode value of the movement distance. The occurrence of a portion with a longer moving distance is reflected in the histogram, and the frequency of the mode is increasing. In addition, in the range in which the moving distance is less than or equal to the mode, the frequency of the relatively short moving distance is decreased and the frequency of the relatively long moving distance is increasing. Even if the movement distance is increased in the range less than the mode value, if the movement distance is less than the maximum possible movement distance, the number of invalid pulses LPd does not increase. For this reason, although the movement path from the start point to the end point in the actual processing procedure is longer than the movement path in the temporary processing procedure, the number of invalid pulses LPd is reduced.

When the actual processing sequence is determined, the laser processing of the substrate 40 is performed by moving the incident position of the pulsed laser beam based on the actual processing sequence on the condition that the repetition frequency of the pulses is constant (step S6). At this time, the repetition frequency of the pulse of the pulsed laser beam is set to a value determined from the mode value of the moving distance.

Next, with reference to FIG. 6, an example of the movement path|route of a temporary processing procedure and the movement path of the actual processing procedure which corrected it is demonstrated.

Fig. 6 is a schematic diagram showing a temporary processing procedure and a processing procedure of some to-be-processed points in an actual processing procedure. In the temporary processing sequence, for example, the processing target points are A, B, C... It is processed in order of I, J, and K. This processing sequence is an example in which the movement distance is determined to be the shortest overall by including not only the six processing points 41 shown in FIG. 6 but also all other processing points 41 .

Since the movement distances from the processing target points A to B and the processing target points I to J are shorter than the longest possible movement distance, the invalid pulse LPd is not output during the movement. Since the movement distances from the processing target points B to C and the processing target points J to K are longer than the longest possible movement distance, an invalid pulse LPd is output during the movement. The incident positions X and Y of the pulsed laser beam at the point in time when the invalid pulse LPd is output are indicated by black circle symbols.

In the actual machining procedure, the movement path ABC of the temporary machining procedure is corrected to the movement path AJC, and the movement path IJK of the temporary processing procedure is corrected to the movement path IBK. The length of the sum of the movement path AJC and the movement path IBK of the actual machining procedure is longer than the length of the sum of the movement path ABC and the movement path IJK of the temporary machining procedure. The moving distances from the processing points A to J, from the processing points J to C, and from the processing points B to K are shorter than the longest possible movement distance. The moving distance from the processing target points I to B is longer than the longest possible moving distance. For this reason, during this movement, the invalid pulse LPd is output. The incident position Z at the point in time when the invalid pulse LPd is output is indicated by a solid black circle symbol.

In the example shown in Fig. 6, the number of invalid pulses LPd is one in the case of the actual processing procedure, whereas the number of invalid pulses LPd is two in the temporary processing procedure. As described above, in the actual machining procedure, compared with the temporary machining procedure, the total length of the movement paths of the incident position is longer, but the number of invalid pulses LPd is reduced.

Next, the excellent effect of the above embodiment will be described.

In the above embodiment, the number of invalid pulses can be made smaller than the number of invalid pulses when processing in the temporary processing sequence determined on the condition that the length of the movement path at the incident position of the pulsed laser beam is minimized. The processing time in one scan area 45 is equal to the value obtained by multiplying the number of laser pulses incident on the processing target 41 and the number of ineffective pulses by the repetition period of the laser pulse. Since the number of laser pulses incident on the processing target point 41 is constant, if the number of invalid pulses decreases, the processing time in the scan area 45 is shortened.

In the above embodiment, since the number of ineffective pulses can be reduced, it becomes possible to shorten the machining time. Further, in the above embodiment, since the processing is performed with a constant repetition frequency of the pulses of the pulsed laser beam, the variation in pulse energy for each laser pulse can be reduced, and as a result, the processing quality can be improved.

Next, a modified example of the above embodiment will be described.

Although the repetition frequency of a pulse is determined based on the mode (5A of FIG. 5) of the movement distance between to-be-processed points in the said embodiment, the repetition frequency of a pulse may be determined by another method. For example, the repetition frequency of a pulse may be determined based on the average value, a median value, etc. of the movement distance between to-be-processed points. Alternatively, the repetition frequency of the pulse may be determined based on the characteristics of the laser oscillator 11 (FIG. 1) and the like.

Further, in the above embodiment, the repetition frequency of the pulse is kept constant when laser processing is performed (step S6 in Fig. 4), but within a range in which sufficient uniformity of the pulse energy is maintained, even if the repetition frequency of the pulse is changed do. In this case, based on the highest frequency of the range in which the repetition frequency of the pulse is changed, the longest distance that can be moved may be determined.

In the above embodiment, although the control device 20 and the processing order determining device 25 are separately indicated in FIG. 1 , the functions of the processing order determining device 25 may be introduced into the control device 20 .

The above-described embodiment is an example, and the present invention is not limited to the above-described embodiment. For example, it will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like are possible.

10 laser optics
11 laser oscillator
12 light guide optical system
13 aperture
14 Acousto-optical device
15A first route
15B second route
16A, 16B beam syringe
17A, 17B condensing lens
18 fold mirror
19 Beam Damper
20 control
25 Machining sequence determining device
30 moving mechanism
31 movable table
40 board
41 processing point
42 alignment mark
45 scan area

Claims (6)

A processing sequence determining device for determining the processing sequence of a plurality of processing points processed by inputting a pulsed laser beam, the processing sequence determining device comprising:
Based on the positional information of the plurality of processing points, a temporary processing sequence is determined under the condition that the sum of the movement distances between two processing points in which the processing sequence is continuous is the shortest;
When the longest distance that can move the incident position of the pulsed laser beam between the output of one laser pulse and the output of the next laser pulse is defined as the longest movable distance,
Each of the moving distances between the processing points is rounded up to an integer by rounding up the decimal point of the quotient divided by the longest movable distance,
A processing sequence determining device for correcting the temporary processing sequence so that the integerized value for the movement distances between all the processing target points becomes smaller and the temporary processing sequence becomes the actual processing sequence. According to claim 1,
A machining order determining device for determining the longest movable distance based on a distribution of moving distances between the points to be machined in the temporary machining order. According to claim 1,
An evaluation function in which the evaluation value becomes smaller as the length of the sum of the moving distances becomes shorter as the first evaluation function,
An evaluation function in which the evaluation value becomes smaller as the sum of the integer values for all the moving distances decreases as a second evaluation function,
a machining order determining device for changing the machining order so that, when the actual machining order is obtained by correcting the temporary machining order, a weighted average value of the evaluation values of the first evaluation function and the second evaluation function becomes smaller. A laser optical system having a function of moving the incident position of the pulsed laser beam onto the substrate by scanning and outputting the pulsed laser beam;
and a control device for controlling the laser optical system to make the pulsed laser beam incident on the substrate and move the incident position;
The control device includes the processing sequence determining device according to any one of claims 1 to 3, and based on the actual processing sequence determined by the processing sequence determining device, A laser processing device that irradiates a pulsed laser beam. Based on the positional information of a plurality of processing points distributed on the substrate, a temporary processing sequence is determined under the condition that the sum of the movement distances between two processing points in which the processing sequence is continuous is the shortest;
When the longest distance that can move the incident position of the pulsed laser beam between the output of one laser pulse and the output of the next laser pulse is defined as the longest movable distance,
Each of the moving distances is rounded up to an integer by rounding up the decimal point of the quotient divided by the longest movable distance,
The temporary processing order is modified so that the sum of the integer values for all the moving distances becomes small, and the actual processing order is made,
A laser processing method in which a pulsed laser beam is incident on the plurality of processing target points in the actual processing sequence to perform processing. 6. The method of claim 5,
Further, a laser processing method for determining the longest possible movement distance based on a distribution of movement distances between the processing target points in the temporary processing procedure.

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