CN108698165A - Laser processing device - Google Patents
Laser processing device Download PDFInfo
- Publication number
- CN108698165A CN108698165A CN201780011198.5A CN201780011198A CN108698165A CN 108698165 A CN108698165 A CN 108698165A CN 201780011198 A CN201780011198 A CN 201780011198A CN 108698165 A CN108698165 A CN 108698165A
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- China
- Prior art keywords
- laser
- machining path
- pulse
- laser pulse
- light source
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
Abstract
The present invention provides a kind of laser processing device.Laser beam is turned to any one path in choking device path, the 1st machining path and the 2nd machining path by acousto-optic deflection device.Beam deflector is arranged respectively on the 1st machining path and the 2nd machining path.Control device repeats following steps:The step of making beam deflector act and control acousto-optic deflection device to from original laser pulse to the 1st machining path cut laser pulse, backward 2nd machining path the step of cutting laser pulse.It is constant by the time until at the time of cutting laser pulse to the 1st machining path at the time of oscillation since indicating laser light source during repeating the step.Even if the pulse width of the laser pulse cut to the 1st machining path is made to change, to acousto-optic deflection device send to the 1st machining path cut signal to send to the 2nd machining path cut signal until will not change by the time.
Description
Technical field
The present invention relates to a kind of at least two laser pulses being cut from a laser pulse and at least two on a timeline
The laser processing device laser machined on a axis.
Background technology
The following patent document 1 discloses, utilize laser beam carry out drilling processing laser processing device.The laser adds
Tooling is set including laser light source and acousto-optic element (acousto-optic deflection device).The pulse laser beam that acousto-optic element will be exported from laser light source
It turns to towards the path of beam cut-off device, towards any one road in the 1st machining path of workpiece and the 2nd machining path
Diameter.The pulse laser beam of the 1st machining path or the 2nd machining path is turned to by after the deflection of jar (unit of capacitance) watt promise scanner, is incident on
The target location of workpiece.
A certain period laser beam in the pulse width of a laser pulse turns to the 1st machining path, and at other certain
The 2nd machining path is turned to during one, and choking device path is turned in the remaining period.Thereby, it is possible to cut two from a laser pulse
A laser pulse, and laser machined on both axes.
Conventional art document
Patent document
Patent document 1:Japanese Unexamined Patent Publication 2015-186822 bulletins
Invention content
The invention technical task to be solved
From the luminous intensity of the laser pulses of the outputs such as carbon dioxide laser with the time usually since rising time
By and decline.In the case that a laser pulse cuts multiple laser pulses, relativity is cut rearward on the time laser
The luminous intensity of pulse is weaker than the luminous intensity of the time forward laser pulse cut of upper relativity.Accordingly, it is difficult to make each processing axis
On processing quality it is impartial.
The purpose of the present invention is to provide one kind can make in the case where being laser machined on multiple processing axis it is each
Process the consistent laser processing device of processing quality on axis.
Means for solving technical task
A kind of viewpoint according to the present invention, provides a kind of laser processing device, has:
Laser light source, outgoing laser beam;
Acousto-optic deflection device is configured at from the path for the laser beam that the laser light source exports, and by incident laser
Beam is turned to towards any one path in the choking device path of beam cut-off device, the 1st machining path and the 2nd machining path;
Workbench, by workpiece be maintained at the 1st laser pulse incidence for turning to the 1st machining path position and
Turn to the position of the 2nd laser pulse incidence of the 2nd machining path;
1st beam deflector and the 2nd beam deflector are respectively arranged at the 1st machining path and the 2nd processing
On path, and change the incoming position towards the workpiece for being maintained at the workbench;And
Control device controls the laser light source, the acousto-optic deflection device, the 1st beam deflector and the described 2nd
Beam deflector,
The control device repeats following steps:
The 1st beam deflector and the 2nd beam deflector is set to act, to make the 1st laser pulse and institute
State the step of incoming position of the 2nd laser pulse is moved to target location;
Indicate the step of laser light source starts oscillation;
The acousto-optic deflection device is controlled, the original laser pulse to be exported from the laser light source adds to the described 1st
Work path cuts the 1st laser pulse, cuts described from identical original laser pulse to the 2nd machining path later
The step of 2 laser pulse;And
Indicate the step of laser light source stops oscillation,
During repeating said steps,
To the original laser pulse exported from the laser light source at the time of oscillation since indicating the laser light source
It is constant by the time until at the time of cutting 1 laser pulse to the 1st machining path,
The pulse width variation of the 1st laser pulse cut to the 1st machining path, to the acousto-optic deflection device
It sends and cuts the signal that cuts of the 1st laser pulse to the 1st machining path and cut to the 2nd machining path to sending
2nd laser pulse cut signal until by the time it is constant.
Invention effect
Even if the pulse width of the 1st laser pulse changes, from cutting to the 2nd laser pulse for the 1st laser pulse
Will not be changed by the time until cutting.Therefore, the luminous intensity of the original laser pulse for cutting the moment of the 1st laser pulse
Almost become with the ratio between the luminous intensity of original laser pulse for cutting the moment of the 2nd laser pulse constant.Even if the 1st laser pulse
Pulse width change, by adjusting the diffraction efficiency to the 1st machining path and diffraction efficiency to the 2nd machining path,
Also the luminous intensity of the 1st laser pulse and the luminous intensity of the 2nd laser pulse can be made almost equal.As a result, it is possible to make to be based on the 1st
The quality of processing with the processing based on the 2nd laser pulse of laser pulse is impartial.
Description of the drawings
Fig. 1 is based on the embodiment of the present invention and the schematic diagram of the laser processing device of reference example.
(A) is the approximate vertical view of the printed circuit board of an example as workpiece in Fig. 2, and (B) is printing in Fig. 2
The partial sectional view of circuit board, (C) is in hole forming process when indicating irradiated with pulse laser beam and carrying out drilling processing in Fig. 2
Hole shape sectional view.
Fig. 3 is the action state of beam deflector, vibrates command signal, path select signal and cut signal at the 1st time
A part of sequence diagram in irradiation and the 2nd irradiation.
(A) is when indicating to cut the 1st laser pulse when being processed with the laser processing device based on reference example in Fig. 4
Oscillation command signal, path select signal, the sequence diagram for cutting signal and laser pulse waveform chart, (B) is in Fig. 4
Indicate to cut the 2nd time and oscillation command signal when the 3rd laser pulse, path select signal, the sequence diagram for cutting signal and
The chart of the waveform of laser pulse.
(A) is to indicate with cutting the 1st laser pulse when being processed in the laser processing device based on embodiment in Fig. 5
When oscillation command signal, path select signal, the sequence diagram for cutting signal and laser pulse waveform chart, in Fig. 5 (B)
It is to indicate to cut the 2nd time and oscillation command signal when the 3rd laser pulse, path select signal, the sequence diagram for cutting signal
And the chart of the waveform of laser pulse.
(A)~(C) is oscillation command signal in the laser processing device based on another embodiment, light beam deflection in Fig. 6
Action state, path select signal and the sequence diagram for cutting signal of device.
Fig. 7 be oscillation command signal in the laser processing device based on another embodiment, beam deflector action shape
State, path select signal and the sequence diagram for cutting signal.
Specific implementation mode
It is shown in Fig. 1 based on the embodiment of the present invention and the schematic diagram of the laser processing device of reference example.Laser light source
10 receive oscillation command signal S0 from control device 55 and carry out laser generation, to export pulse laser beam PLB.Laser light source
10 can be used for example carbon dioxide laser.For example, the rising of oscillation command signal S0 shows that instruction starts to vibrate, oscillation refers to
The decline of signal S0 is enabled to show that instruction stops oscillation.
Configuration acousto-optic is inclined on from the path of the output of laser light source 10 and the pulse laser beam PLB after optical system 11
Turn device (AOD) 20.Optical system 11 is such as including optical beam expander and aperture.Incident laser beam is turned to direction by AOD20
Choking device path P D, the 1st machining path MP1 of beam cut-off device (beam dump) 13 and any in the 2nd machining path MP2
A path.AOD20 includes acousto-optic crsytal 21, energy converter (Transducers) 22 and driver 23.Energy converter 22 is by driver 23
Driving, to generate elastic wave in acousto-optic crsytal 21.
Driver 23 be provided with path switched terminal 24, cut terminal 25, the 1st diffraction efficiency adjustment knob 26 and the 2nd spread out
Penetrate efficiency adjustment knob 27.Path select signal S1 is input to path switched terminal 24 from control device 55.Based on Path selection
Signal S1 selects a path in the 1st machining path MP1 and the 2nd machining path MP2.Signal S2 is cut from control device 55
It is input to and cuts terminal 25.Do not inputted cut signal S2 during, incident laser beam is turned to choking device path by AOD20
PD.During input cuts signal S2, AOD20 turns to laser beam in the 1st machining path MP1 and the 2nd machining path MP2
The selected path based on path select signal S1.
Knob 26 is adjusted by the 1st diffraction efficiency, when can adjust laser beam the 1st machining path MP1 of steering by input
Diffraction efficiency.Knob 27 is adjusted by the 2nd diffraction efficiency, can adjust and the laser beam of input is turned into the 2nd machining path MP2
When diffraction efficiency.It independently is adjusted to the diffraction efficiency of the 1st machining path MP1 and to the 2nd machining path in this way, AOD20 has
The function of the diffraction efficiency of MP2.By adjusting diffraction efficiency, it can adjust and turn to the 1st machining path MP1 and the 2nd machining path
The luminous intensity of the laser beam of MP2.It can also replace adjusting knob using the 1st diffraction efficiency adjustment knob 26 and the 2nd diffraction efficiency
27 adjustment diffraction efficiencies method and from control device 55 to driver 23 input diffraction efficiency command value.
It exports to the laser beam of the 1st machining path MP1 and is reflected by speculum 30 and be incident on beam deflector 31.Light beam is inclined
Turning device 31 makes the direction of travel of laser beam be changed into two-dimensional directional.Beam deflector 31 can be used for example a pair of of jar (unit of capacitance) watt promise and sweep
Retouch instrument.The laser beam deflected by beam deflector 31 is incident on workpiece 33 by after 32 pack of f θ lens.Equally
Ground, export to the 2nd machining path MP2 laser beam via speculum 40, beam deflector 41, f θ lens 42 and be incident on processing
Object 43.Workpiece 33,43 is maintained on workbench 50.
Beam deflector 31,41 receives control signal G1, G2 from control device 55 respectively and is acted, so that laser beam
It is incident on indicated target location.If the incoming position of laser beam is stablized in indicated target location, to control device
55 notice stabilizations terminate.
(A) shows the approximate vertical view of the printed circuit board 60 of an example as workpiece 33,43 in fig. 2.
The surface of printed circuit board 60 is divided into multiple pieces 61.Each piece 61 of size is set as based on (the figure of beam deflector 31,41
1) action and the moveable size of beam landing position.
Multiple target locations 62 in hole should be formed by being defined on the surface of printed circuit board 60.The seat of multiple target locations 62
Mark and processing sequence are pre-stored within control device 55 (Fig. 1).Hole is formd on all target locations 62 in a block 61
Later, control device 55 makes workbench 50 move, to be configured at beam deflector 31,41 (Fig. 1) energy by unprocessed piece 61
The region enough scanned.Later, unprocessed piece 61 is processed with identical step.
(B) shows the partial sectional view of printed circuit board 60 in fig. 2.There is leading for internal layer in the surface configuration of core plate 65
Body pattern 66.It is configured with insulating layer 67 on core plate 65 and conductive pattern 66, and has conductive pattern 68 in its surface configuration.Core
The resins such as epoxy can be used for example in plate 65 and insulating layer 67.Copper can be used for example in conductive pattern 66,68.
The shape in the hole in the forming process of hole when (C) shows irradiated with pulse laser beam and carry out drilling processing in fig. 2
Shape.(C) shows that 3 laser pulses of irradiation complete the example of a drilling processing in Fig. 2.By irradiating the 1st laser pulse,
Conductive pattern 68 on surface forms hole 68A.At this point, the surface section of the insulating layer 67 of the bottom surface of hole 68A is also removed, to shape
At recess portion 67A.
By irradiating the 2nd laser pulse, the recess portion 67A for being formed in insulating layer 67 is deepened, and recess portion 67B is consequently formed.It is logical
The 3rd laser pulse of irradiation is crossed, recess portion 67B is further deepened, to form the hole until reaching the conductive pattern 66 of internal layer
67C.The preferred pulse width of laser pulse is different according to the material of workpiece.For example, the 2nd time and the 3rd time
The pulse width of laser pulse is shorter than the pulse width of the 1st laser pulse.
Then, to being processed in a block 61 ((A) in Fig. 2) the step of, illustrates.To a target location 62
It irradiates after the 1st laser pulse, the incoming position of laser beam is moved to next target location 62, and to new target position
Set the 1st laser pulse of 62 irradiations.If the 1st laser pulse has been irradiated in all target locations 62 into a block 61, right
The 2nd laser pulse is irradiated in all target locations 62 successively.Later, all target locations 62 are irradiated with the 3rd laser arteries and veins successively
Punching.
Alternatively, it is also possible to the incoming position without mobile laser beam between a target location 62 across the small time
Every the 2nd laser pulse of Continuous irradiation and the 3rd laser pulse.
The action state, oscillation command signal S0, Path selection letter of beam deflector 31,41 (Fig. 1) is shown in FIG. 3
Number S1 and cut signal S2 irradiated at the 1st time and the 2nd irradiation in a part of sequence diagram.In figure, with separated two up and down
During line indicates that beam deflector 31,41 is acted, during indicating its stabilization with single line.
If having irradiated the 1st laser pulse to a target location 62 ((A) in Fig. 2), control device 55 keeps light beam inclined
Turn device 31,41 to be acted, the incoming position of laser beam is made to be moved to next target location 62 that should be processed.If two light beams
The action of deflector 31,41 terminates, in other words, if the incidence of the laser beam of the 1st machining path MP1 and the 2nd machining path MP2
(moment t1) is stablized in position, then control device 55 starts to send oscillation command signal S0 (moment t2) to laser light source 10.By
This, starts the laser pulse for exporting the pulse laser beam PLB exported from laser light source 10.It vibrates the rising of command signal S0 and swashs
The starting of oscillation instruction of radiant 10 is corresponding.At this point, having selected the 1st machining path MP1 based on path select signal S1.
Under the 1st selected states of machining path MP1, control device 55 sends predetermined pulse width PW1's
Cut signal S2 (moment t3).As a result, a laser pulse is cut to the 1st machining path MP1.Later, control device 55 is sent
Select the path select signal S1 (moment t4) of the 2nd machining path MP2.Under the 2nd selected states of machining path MP2, control
What device 55 processed sent predetermined pulse width PW1 cuts signal S2 (moment t5).It is cut as a result, to the 2nd machining path MP2
Take a laser pulse.
Later, control device 55 stops oscillation the transmission of command signal S0, and makes to be chosen based on path select signal S1
The path selected returns to the 1st machining path MP1 (moment t7).The decline and the oscillation of laser light source 10 of oscillation command signal S0 stops
It only instructs corresponding.Moreover, sending control signal G1, G2 to beam deflector 31,41, the incoming position of laser beam is made to be moved to
Next target location 62 ((A) in Fig. 2).It irradiates the 2nd time and when the 3rd laser pulse, also repeats with irradiation the 1st time and swash
Essentially identical step when light pulse.Show that the pulse width for cutting signal S2 when cutting the 2nd laser pulse is short in Fig. 3
The example of the pulse width for cutting signal S2 when cutting the 1st laser pulse.
Before being illustrated to the laser processing device based on embodiment, with reference to (A) in figure 4 and (B), to being based on reference example
Laser processing device illustrate.
(A) shows oscillation command signal S0 when cutting the 1st laser pulse, path select signal S1, cuts in Fig. 4
The sequence diagram of the number of winning the confidence S2 and the waveform of laser pulse.If vibrating command signal S0 rises (moment t2), from laser light source 10
(Fig. 1) exports original laser pulse LP0.Luminous intensity of the laser light source 10 with original laser pulse LP0 is with time going by
And the characteristic reduced.If vibrating command signal S0 declines (moment t6), original laser pulse LP0 can also decline.
In the state of having selected the 1st machining path MP1 based on path select signal S1, cut signal S2's if sending
Pulse (moment t3) then cuts the 1st laser pulse LP1 from original laser pulse LP0 to the 1st machining path MP1.Based on path
Selection signal S1 and in the state of having selected the 2nd machining path MP2, if sending the pulse (moment t5) for cutting signal S2, from
Original laser pulse LP0 cuts the 2nd laser pulse LP2 to the 2nd machining path MP2.The pulse width of 1st laser pulse LP1 with
The pulse width of 2nd laser pulse LP2 is identical.
The luminous intensity of 1st laser pulse LP1 passes through the 1st diffraction efficiency tune with the ratio between the luminous intensity of original laser pulse LP0
The setting of whole knob 26 determines.Similarly, the luminous intensity of the luminous intensity of the 2nd laser pulse LP2 and original laser pulse LP0 it
It is determined than adjusting the setting of knob 27 by the 2nd diffraction efficiency.The 1st machining path has been selected based on path select signal S1
The luminous intensity of original laser pulse LP0 when MP1 is better than based on path select signal S1 and when having selected the 2nd machining path MP2
Original laser pulse LP0 luminous intensity.In order to eliminate the difference of the intensity, spread out using the 1st diffraction efficiency adjustment knob 26 and the 2nd
It penetrates efficiency adjustment knob 27 and sets diffraction efficiency, so as to be less than to the diffraction efficiency of the 1st machining path MP1 to the 2nd machining path
The diffraction efficiency of MP2.
Therefore, the attenuation of luminous intensity when cutting the 1st laser pulse LP1 from original laser pulse LP0 is more than from original
The attenuation of luminous intensity when laser pulse LP0 cuts the 2nd laser pulse LP2.As a result, the pulse energy of the 1st laser pulse LP1
Measure becomes almost equal with the pulse energy of the 2nd laser pulse LP2.In other words, it adjusts and is imitated to the diffraction of the 1st machining path MP1
Rate and the diffraction efficiency to the 2nd machining path MP2, so that the pulse energy of the 1st laser pulse LP1 is with the 2nd laser pulse LP2's
Pulse energy becomes almost equal.
(B) shows oscillation command signal S0 when cutting the 2nd laser pulse, path select signal S1, cuts in Fig. 4
The sequence diagram of the number of winning the confidence S2 and the waveform of laser pulse.In addition, the opportunity that cuts of the 3rd laser pulse sends out laser pulse with the 2nd
To cut opportunity identical.The pulse width PW2 for cutting signal S2 when cutting the 2nd laser pulse shorter than cuts the 1st laser
The pulse width PW1 for cutting signal S2 when pulse.Correspondingly, the pulse width of the original laser pulse LP0 of the 2nd irradiation
The pulse width of the original laser pulse LP0 of shorter than the 1st time irradiation.
Even if short its of the pulse width of original laser pulse LP0 is irradiated with the 1st time if rise to the waveform fallen to only
The waveform of the corresponding portion of original laser pulse LP0 is almost the same.About from (moment at the time of cutting the 1st laser pulse LP1
T3) until (moment t5) at the time of cutting the 2nd laser pulse LP2 pass through the time, the 2nd time irradiation when shorter than the 1st time irradiation
When.Accordingly, with respect to from the light for cutting original laser pulse LP0s of the 1st laser pulse LP1 until cutting the 2nd laser pulse LP2
The reduction amount of intensity, the 2nd time irradiation when be less than the 1st time irradiation when.
But about the diffraction efficiency to the 1st machining path MP1 and the diffraction efficiency to the 2nd machining path MP2, the 2nd
It is identical when secondary irradiation with the 1st irradiation.As a result, the pulse energy of the 1st laser pulse LP1 when the 2nd irradiation becomes small
In the pulse energy of the 2nd laser pulse LP2.
It is difficult in irradiation, the 2nd irradiation and the 3rd irradiation at the 1st time in Fig. 4 in reference example shown in (A) and (B)
So as to be output to the pulse energy of the 1st laser pulse LP1 of the 1st machining path MP1 and be output to the 2nd of the 2nd machining path MP2
The pulse energy of laser pulse LP2 is almost the same.
Then, with reference to (A) in figure 5 and (B), the laser processing device based on embodiment is illustrated.Hereinafter, pair with figure
The difference of reference example shown in (A) and (B) illustrates in 4, and omits to mutually isostructural explanation.
(A) shows oscillation command signal S0 when cutting the 1st laser pulse, path select signal S1, cuts in Figure 5
The sequence diagram of the number of winning the confidence S2 and the waveform of laser pulse.The sequence diagram is identical as the sequence diagram of reference example shown in (A) in Fig. 4.
Shown in (B) in Figure 5 oscillation command signal S0 when cutting the 2nd laser pulse, path select signal S1,
Cut the sequence diagram of signal S2 and the waveform of laser pulse.In addition, the 3rd laser pulse cuts opportunity and the 2nd laser arteries and veins
Punching to cut opportunity identical.The case where with reference example, is identical, and laser light source 10 is controlled so as to be exported it since control device 55
(moment t2) arrives (moment at the time of exporting the 1st laser pulse LP1 to the 1st machining path MP1 at the time of original laser pulse LP0
Being irradiated at the 1st time by the time until t3) is constant in the 3rd irradiation.
After the process finishing of 1st irradiation, when carrying out the processing of the 2nd irradiation, make output to the 1st machining path MP1
The 1st laser pulse LP1 pulse width PW2 be different from the 1st time irradiation when pulse width PW1.Specifically, keeping pulse wide
Degree PW2 is shorter than pulse width PW1.Even if in the case of chopped pulse width, will not make to cut the 1st laser pulse from instruction
At the time of LP1 until (moment t3) to (moment t5) at the time of instruction cuts the 2nd laser pulse LP2 to the 2nd machining path MP2
It changes when being irradiated at the 1st time by the time and when the 2nd irradiation.
The case where with reference example, is identical, the diffraction efficiency to the 1st machining path MP1 and the diffraction to the 2nd machining path MP2
Efficiency is set to make the pulse energy of the 1st laser pulse LP1 ((A) in Fig. 5) of the 1st irradiation and the 2nd laser pulse LP2 (Fig. 5
In (A)) pulse energy it is almost equal.In embodiment, in the pulse width of original laser pulse LP0 road is processed to the 2nd
It is identical when the position that diameter MP2 cuts the 2nd laser pulse LP2 being irradiated at the 1st time with the 2nd irradiation.Therefore, with reference example phase
Than, when being irradiated at the 2nd time, can reduce the pulse energy of the 1st laser pulse LP1 and the 2nd laser pulse LP2 pulse energy it
Difference.
Due to the pulse energy of the 1st laser pulse LP1 that is cut to the 1st machining path MP1 with to the 2nd machining path MP2
The difference of the pulse energy of the 2nd laser pulse LP2 cut becomes smaller, therefore can make the processing quality and of the 1st machining path MP1
The processing quality of 2 machining path MP2 is consistent.In order to improve the pulse energy and the 2nd laser pulse that reduce the 1st laser pulse LP1
The pulse width of original laser pulse LP0 is preferably set as constant by the effect of the difference of the pulse energy of LP2.In other words, preferably will
It is set as constant by the time until sending starting of oscillation instruction to transmission oscillation halt instruction to laser light source 10.
In the above-described embodiments, 3 laser pulses have been irradiated to a processing stand, still, has irradiated the number of laser pulse
It is not limited to 3 times.The number for irradiating the laser pulse of a processing stand can be 2 times, can also be 4 times or more.In irradiation 4
The secondary above laser pulse and in the case of being processed, as long as by the laser pulse after the 3rd time cut opportunity be set as with
2nd laser pulse to cut opportunity identical.
Then, with reference to (A) in figure 6~(C), the laser processing device based on another embodiment is illustrated.Hereinafter, right
It illustrates, and is omitted to mutually isostructural explanation with the difference of embodiment shown in (A) in Fig. 1~Fig. 3, Fig. 5 and (B).
In Fig. 1~Fig. 3, Fig. 5 in embodiment shown in (A) and (B), beam deflector 31,41 (Fig. 1) stablize at the time of (Fig. 3 when
Carve t1) after, and then control device 55 starts to send oscillation command signal S0 (moment t2).In embodiment explained below
In, control device 55 starts to limit within a certain range at the time of sending oscillation command signal S0.
(A) shows that oscillation command signal S0, light beam in the laser processing device based on the present embodiment deflect in figure 6
Action state, path select signal S1 and the sequence diagram for cutting signal S2 of device 31,41.In figure 6 in (A), overlapping is shown
The action state of two beam deflectors 31,41.
In the present embodiment, from laser light source 10 (Fig. 1) export laser pulse repetition period lower limiting value RPL with it is upper
Limit value RPU is stored in control device 55.Control device 55 sends oscillation command signal S0, so that the repetition period of laser pulse falls
Between lower limiting value RPL and upper limit value RPU.
As shown in (A) in Fig. 6, (moment t10) arrives light at the time of sending starting of oscillation instruction to laser light source 10 (Fig. 1)
At the time of the action of beam-deflector 31,41 terminates until (moment t11) by the time lower limiting value RPL and upper limit value RPU it
Between in the range of when, at the time of the action of beam deflector 31,41 terminates after (moment t11), and then control device 55
Start to send oscillation command signal S0 (moment t12).It path select signal S1 and cuts in the sequence diagram and Fig. 5 of signal S2 (A)
And embodiment shown in (B) is identical.
As shown in (B) in Fig. 6, beam deflector 31,41 is arrived in the rising time (moment t10) of oscillation command signal S0
Pass through the time in short-term than lower limiting value RPL until (moment t13) at the time of action terminates, control device 55 is not sent out to lasing light emitter 10
Send oscillation command signal S0 until the time by being equivalent to lower limiting value RPL.Control device 55 is in shaking from previous cycle
It swings at the time of the rising time (moment t10) of command signal S0 have passed through the time for being equivalent to lower limiting value RPL (moment t14) and starts
Send oscillation command signal S0.
As shown in (C) in Fig. 6, if since the rising time (moment t10) of the oscillation command signal S0 of previous cycle
By the time reach upper limit value RPU at the time of (moment t15) beam deflector 31,41 action not yet terminate, then control dress
55 are set to start to send oscillation command signal S0 to laser light source 10 at the moment.But control device 55 will not send and cut letter
The pulse of number S2.Therefore, all periods of the original laser pulse exported from laser light source 10 in its pulse width turn
To choking device path P D (Fig. 1).
If beam deflector 31,41 stablizes (moment t16), with from when the rising of the oscillation command signal S0 of previous cycle
The mode fallen between lower limiting value RPL and upper limit value RPU by the time that quarter (moment t15) starts determines next
Vibrate the transmission opportunity of command signal S0.If for example, at the rising time (moment of the oscillation command signal S0 from previous cycle
T15 (moment t17) beam deflector 31,41 has been stablized at the time of) have passed through the time for being equivalent to lower limiting value RPL, then at the moment
T17, control device 55 start to send oscillation command signal S0.
Then, the excellent effect of embodiment shown in (A) in Fig. 6~(C) is illustrated.Even if defeated from laser light source 10
The pulse width of the pulse laser beam gone out is constant, if the repetition rate (repetition period) of pulse changes, luminous intensity can become
It moves and pulse energy can be caused also to change.In figure 6 in embodiment shown in (A)~(C), the change of the repetition period of pulse
Change is fallen between lower limiting value RPL and upper limit value RPU.Therefore, it is possible to inhibit original laser pulse LP0 ((A) in Fig. 5,
(B)) variation of pulse energy.As a result, it is possible to inhibit the turn to the 1st machining path MP1 and the 2nd machining path MP2 the 1st to swash
The variation of the pulse energy of light pulse LP1 and the 2nd laser pulse LP2.
Then, with reference to figure 7, the laser processing device based on another embodiment is illustrated.Hereinafter, pair with Fig. 6 in (A)
The difference of embodiment shown in~(C) illustrates, and omits to mutually isostructural explanation.
In the embodiment shown in fig. 7, in Fig. 6 the repetition period of the pulse of embodiment shown in (A)~(C) lower limiting value
RPL and upper limit value RPU is set to identical value.Therefore, the action of laser light source 10 and beam deflector 31,41 independently with
Constant repetition rate output original laser pulse LP0 ((A), (B) in Fig. 5).
If beam deflector 31,41 has been stablized (moment t21) at the time of original laser pulse LP0 rises, send from
Original laser pulse LP0 cuts the 1st laser pulse LP1 and the 2nd to the 1st machining path MP1 and the 2nd machining path MP2 respectively
The pulse (moment t22, t23) for cutting signal S2 of laser pulse LP2.If light beam at the time of original laser pulse LP0 rises
Deflector 31,41 not yet stablizes (moment t24), then does not send from the original laser pulse LP0 to the 1st machining path MP1 and the 2nd
Machining path MP2 cuts the pulse for cutting signal S2 of laser pulse.Therefore, original laser pulse LP0 turns to choking device road
Diameter PD (Fig. 1).
In the embodiment shown in fig. 7, the repetition rate of the pulse of the pulse laser beam exported from laser light source 10 is constant,
Therefore the stability of the pulse energy of original laser pulse LP0 can be further increased.As a result, turning to the 1st machining path MP1
And the 2nd the pulse energy of the 1st laser pulse LP1 and the 2nd laser pulse LP2 of machining path MP2 also become stable.
More than, according to embodiment, the present invention is described, but the present invention is not limited to these.For example, can be into
The various changes of row, improvement and combination etc., this is apparent to those skilled in the art.
Symbol description
10- laser light sources, 11- optical systems, 13- beam cut-off devices, 20- acousto-optic deflection devices (AOD), 21- acousto-optic crsytals,
22- energy converters, 23- drivers, the paths 24- switched terminal, 25- cut terminal, and the 1st diffraction efficiencies of 26- adjust knob, 27- the 2nd
Diffraction efficiency adjustment knob, 30- speculums, 31- beam deflectors, 32-f θ lens, 33- workpieces, 40- speculums,
41- beam deflectors, 42-f θ lens, 43- workpieces, 50- workbench, 55- control devices, 60- printed circuit boards, 61-
Block, the target locations 62-, 65- core plates, the conductive pattern of 66- internal layers, 67- insulating layers, 67A, 67B- recess portion, the holes 67C-, 68- tables
The conductive pattern in face, the holes 68A-, G1, G2- control signal, LP0- original laser pulses, the 1st laser pulses of LP1-, LP2- the 2nd swash
Light pulse, the 1st machining paths of MP1-, the 2nd machining paths of MP2-, PD- choking devices path, PLB- pulse laser beams, PW1, PW2-
Pulse width, the lower limiting value of RPL- repetition periods, the upper limit value of RPU- repetition periods, S0- vibrate command signal, the choosing of the paths S1-
Signal is selected, S2- cuts signal.
Claims (5)
1. a kind of laser processing device, which is characterized in that have:
Laser light source, outgoing laser beam;
Acousto-optic deflection device is configured at from the path for the laser beam that the laser light source exports, and incident laser beam is turned
To towards any one path in the choking device path of beam cut-off device, the 1st machining path and the 2nd machining path;
Workpiece is maintained at position and the steering of the 1st laser pulse incidence for turning to the 1st machining path by workbench
The position of 2nd laser pulse incidence of the 2nd machining path;
1st beam deflector and the 2nd beam deflector are respectively arranged at the 1st machining path and the 2nd machining path
On, and change the incoming position towards the workpiece for being maintained at the workbench;And
Control device controls the laser light source, the acousto-optic deflection device, the 1st beam deflector and the 2nd light beam
Deflector,
The control device repeats following steps:
The 1st beam deflector and the 2nd beam deflector is set to act, to make the 1st laser pulse and the described 2nd
The step of incoming position of laser pulse is moved to target location;
Indicate the step of laser light source starts oscillation;
The acousto-optic deflection device is controlled, the original laser pulse to be exported from the laser light source processes road to the described 1st
Diameter cuts the 1st laser pulse, and cutting the described 2nd to the 2nd machining path from identical original laser pulse later swashs
The step of light pulse;And
Indicate the step of laser light source stops oscillation,
During repeating said steps,
To the original laser pulse exported from the laser light source to institute at the time of oscillation since indicating the laser light source
It is constant by the time until stating at the time of the 1st machining path cuts 1 laser pulse,
The pulse width variation of the 1st laser pulse cut to the 1st machining path is sent to the acousto-optic deflection device
To the 1st machining path cut the 1st laser pulse cut signal to send cut to the 2nd machining path it is described
2nd laser pulse cut signal until by the time it is constant.
2. laser processing device according to claim 1, which is characterized in that
The laser light source have exported an original laser pulse in luminous intensity with time going by and decline
Characteristic,
The acousto-optic deflection device, which has, independently to be adjusted to the diffraction efficiency of the 1st machining path and to the 2nd machining path
Diffraction efficiency function, and to be got lower than to the diffraction efficiency of the 1st machining path to the 2nd machining path
The mode of diffraction efficiency is adjusted.
3. laser processing device according to claim 1 or 2, which is characterized in that
During repeating said steps, the control device makes the instruction for starting oscillation to laser light source transmission stop to transmission
It is constant by the time until the instruction only vibrated.
4. laser processing device according to any one of claim 1 to 3, which is characterized in that
The control device stores the lower limiting value and upper limit value of the repetition period of the pulse of the laser light source,
To the 1st beam deflector and the 2nd light beam at the time of sending the instruction for starting oscillation to the laser light source
When the process time until at the time of deflector tenth skill is shorter than the lower limiting value, the control device is not to the laser light
Source sends the instruction for starting oscillation until the time by being equivalent to the lower limiting value,
If sent to the lasing light emitter start that the instruction of oscillation starts by the time in the 1st beam deflector and described the
The upper limit value is reached before 2 beam deflector tenth skills, then the control device starts to laser light source transmission
The instruction of oscillation, and the acousto-optic deflection device is controlled so that the original laser pulse of output turns to the choking device path.
5. laser processing device according to claim 4, which is characterized in that
The lower limiting value of repetition period is identical as the upper limit value.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-045341 | 2016-03-09 | ||
| JP2016045341A JP2017159317A (en) | 2016-03-09 | 2016-03-09 | Laser beam machining device |
| PCT/JP2017/008647 WO2017154800A1 (en) | 2016-03-09 | 2017-03-06 | Laser machining device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108698165A true CN108698165A (en) | 2018-10-23 |
| CN108698165B CN108698165B (en) | 2020-06-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201780011198.5A Active CN108698165B (en) | 2016-03-09 | 2017-03-06 | Laser processing apparatus |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2017159317A (en) |
| KR (1) | KR20180122605A (en) |
| CN (1) | CN108698165B (en) |
| TW (1) | TWI658892B (en) |
| WO (1) | WO2017154800A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111715996A (en) * | 2019-03-19 | 2020-09-29 | 住友重机械工业株式会社 | Laser control device and pulse laser output device |
| CN113385809A (en) * | 2020-03-11 | 2021-09-14 | 住友重机械工业株式会社 | Machining order determining device, laser machining device, and laser machining method |
| CN115519243A (en) * | 2022-11-25 | 2022-12-27 | 武汉铱科赛科技有限公司 | Laser pulse space-time correlation positioning scanning method, device and system |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7125254B2 (en) | 2017-10-12 | 2022-08-24 | ビアメカニクス株式会社 | LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD |
| JP7190808B2 (en) * | 2017-11-08 | 2022-12-16 | 住友重機械工業株式会社 | LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD |
| JP7043128B2 (en) * | 2018-01-31 | 2022-03-29 | 住友重機械工業株式会社 | Laser control device and laser processing method |
| JP2023007738A (en) | 2021-07-02 | 2023-01-19 | 住友重機械工業株式会社 | Laser control device and laser pulse cutting-out method |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2017159317A (en) | 2017-09-14 |
| WO2017154800A1 (en) | 2017-09-14 |
| TWI658892B (en) | 2019-05-11 |
| KR20180122605A (en) | 2018-11-13 |
| CN108698165B (en) | 2020-06-26 |
| TW201731617A (en) | 2017-09-16 |
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