TWM510208U - Laser processing apparatus - Google Patents

Description

Laser processing device

This creation relates to a laser processing apparatus, and more particularly to a laser processing apparatus that can improve the deformation and focus of a laser beam.

Laser is the light generated by the light amplification of the excitation radiation. The types of lasers vary with the luminescent material, and can be applied to different applications depending on the power and characteristics of different types of laser light. Laser processing is a common processing method that produces various processes such as marking of marks, welding of workpieces, cutting or surface treatment with a laser beam at a specific position of a workpiece.

Please refer to FIG. 3A to FIG. 3C. In the conventional laser light-increasing device, due to the characteristics of the optical lens, the processing region of the laser beam is distorted and deformed. For example, as shown in FIG. 3A, the original laser processing pattern should be a square lattice pattern, and the processing pattern 30 is deformed into a non-square lattice pattern due to the characteristics of the optical lens. Alternatively, as shown in FIG. 3B, due to the characteristics of the optical lens, the laser beam 31 is focused on a curved surface instead of the plane 32, resulting in a laser processing pattern on the plane 32 (as indicated by the letter A in FIG. 3B). Not on the same line) Distortion or distortion. In addition, as shown in FIG. 3C, if the focus position 33 of the laser beam 31 is changed, the original imaging width M1 of the laser beam 31 on the workpiece is also changed to the width M2, and the position, size or thickness of the width M2 is both the width and the width. M1 is very different.

Please refer to FIG. 4A to FIG. 4E. 4A is a schematic illustration of a focused spot of a prior art laser processing apparatus. As shown in FIG. 4A, in the conventional laser processing apparatus, in the process of focusing, the laser beam 40 is transmitted to the convex lens 42 through the reflecting lens 41, because the light emitting surface 421 of the convex lens 42 is an arc convex surface, and thus the laser beam 40 is focused on a curved surface 43 by the convex lens 42. At this time, please refer to FIG. 4B, the mine The focused spot of the beam 40 on the curved surface 43 is a fixed size dot 44. However, when a workpiece is located on the plane 45, the focused spot produced by the existing laser processing apparatus naturally cannot focus on the plane 45.

Figure 4C is a schematic illustration of a focused spot of another prior art laser processing apparatus. As shown in FIG. 4C, in this laser processing apparatus, a flat-field scanning lens 46 is used in place of the existing convex lens to improve the problem that the light beam can only be focused on the curved surface. However, by designing the mirror curvature in the flat field laser focusing lens module 46, with the lens group, although the tilted optical axis can be focused on a plane 45, please refer to FIG. 4D, the laser beam 40 is on the plane 45. The focused spot forms an elliptical spot 47, rather than a dot, causing distortion in the area. If used in higher precision laser processing, errors will inevitably occur.

Figure 4E is a schematic illustration of a focused spot of still another prior art laser processing apparatus. As shown in FIG. 4E, in the laser processing apparatus, the f-thera lens group 48 is utilized to improve the disadvantages of using the aforementioned flat field laser focusing lens module, except that the laser beam 40 is focused on the plane 45 and formed on a plane. The focused spot on 45 is a dot (as shown in Figure 4B). However, the use of the f-thera mirror group 48 can improve the problem of spot deformation, but causes a problem that the width and distance of the beam focus change as the distance between the workpiece and the laser processing device changes. As shown in FIG. 4F, if the laser source 50 needs to be processed at a different height to face the workpiece 49, for example, the workpiece 49 needs to be processed at a height L1, a height L2 or a height L3, if not Moving the focusing lens 51, the beam focusing at different heights will have different widths (such as the width N1 and the width N2 of FIG. 4F), and it is necessary to move or replace the focusing lens 51 to improve the problem of the width and distance of the beam focusing, which causes inconvenience in use. .

Therefore, there is a need to design a laser adding device to improve the problem of spot forming an elliptical spot without changing or moving the lens so that the width and distance of the laser beam are not changed.

The purpose of this creation is to provide a laser processing apparatus that can improve laser beam distortion and focus problems.

In accordance with the above objects, the present invention provides a laser processing apparatus comprising: a laser source for providing a laser beam; an autofocus module disposed after the laser source to receive the laser And adjusting a diameter of the focused spot of the laser beam; a telecentric lens set disposed behind the autofocus module to receive the laser beam adjusted by the autofocus module, and adjusting the laser beam The focus spot size.

Through the above-mentioned optical device of the laser adding device, the problem of forming the elliptical spot by the spot is improved by the autofocus module, and by the telecentric lens group, the laser processing device of the present invention does not need to replace or move the lens, so that the thunder The width and distance of the beam focus are unchanged.

10‧‧‧ Laser processing equipment

11‧‧‧Laser light source

111‧‧‧Laser beam

12‧‧‧ lenses

13‧‧‧Auto Focus Module

14‧‧‧Scanning galvanometer group

15‧‧‧The telecentric group

16‧‧‧Light channel

17‧‧‧Processing

W1‧‧‧ first distance

W2‧‧‧Second distance

W3‧‧‧ third distance

H1‧‧‧ first height

H2‧‧‧second height

H3‧‧‧ third height

F‧‧‧Focus

30‧‧‧Processing patterns

31‧‧‧Laser beam

33‧‧‧ Focus position

M1‧‧‧Width

M2‧‧‧Width

40‧‧‧Laser beam

41‧‧‧Reflective lenses

42‧‧‧ convex lens

421‧‧‧Glossy

43‧‧‧ Surface

44‧‧‧ dots

45‧‧‧ plane

46‧‧‧ flat field laser focusing lens module

47‧‧‧Elliptical spot

48‧‧‧f-thera mirror

49‧‧‧Processing

50‧‧‧Laser light source

51‧‧‧focus lens

N1‧‧‧Width

N2‧‧‧Width

FIG. 1 is a schematic diagram of the optical path of the laser processing apparatus of the present invention.

2A to 2C are schematic views of the light beam transmission path of the present invention.

FIG. 3A is a schematic diagram of a non-square lattice pattern in which the processing pattern of the conventional laser processing apparatus is distorted. FIG.

FIG. 3B is a schematic view showing the out-of-focus of the processing pattern of the conventional laser processing apparatus.

Fig. 3C is a schematic view showing a change in the width of a processing pattern of the conventional laser processing apparatus.

4A is a schematic view showing a laser beam focused by a reflecting lens and a lens in a conventional laser processing apparatus.

Figure 4B is a schematic illustration of the focused spot of a prior art laser processing apparatus.

4C is a schematic view of a conventional laser processing apparatus in which a laser beam is focused by a reflecting lens and a flat field laser focusing lens module.

Figure 4D is a schematic illustration of the focused spot of a prior art laser processing apparatus.

4E is a schematic view of a laser beam in a conventional laser processing apparatus focused by a reflecting mirror and an f-thera mirror.

4F is a schematic view showing the laser beam focused by a reflecting lens and a focusing lens in the conventional laser processing apparatus.

The technical means adopted by the present invention for achieving the intended purpose are further explained below in conjunction with the drawings and the preferred embodiment of the present invention.

FIG. 1 is a schematic diagram of the optical path of the laser processing apparatus of the present invention. As shown in FIG. 1, the laser processing apparatus 10 of the present invention comprises a laser light source 11, at least one lens 12, an autofocus module 13 and a telecentricity lens 15, or further comprising a scanning galvanometer. Scanning mirror 14.

The laser source 11 is used to generate a laser beam 111. The plurality of lenses 12 can be disposed on the transmission path of the laser beam 111, and the laser beam 111 is guided through the lens 12 to the autofocus module 13. Depending on the laser beam 111 and the application, a different number of lenses 12 may be used to deliver the laser beam 111, so the number of lenses 12 is not limited in this creation. The laser beam 111 is transmitted through the at least one lens 12 to the focal shifter 13 in the optical channel 16, and the autofocus module 13 is utilized to solve the problem of having different spot diameters in the same plane. When the working distance of the laser processing apparatus 10 is changed, the autofocus module 13 can automatically adjust the spot diameter of the laser beam 111 when the position of the autofocus module 13 is moved. In addition, it should be noted here that the working principle of the autofocus module 13 (see http://www.raylase.de/products/3-achsensubmodule) is well known to those of ordinary skill in the art. No longer.

In a preferred embodiment of the present invention, the laser processing apparatus 10 further includes a scanning galvanometer group 14 disposed behind the autofocus module 13, however, in various embodiments, the laser processing apparatus 10 There is no setting of the scanning galvanometer group 14, which is not limited here. The laser beam 111 exits the autofocus module 13 and enters the scanning galvanometer group 14. The scanning galvanometer group 14 is mainly composed of a mirror and a driving galvanometer, and is formed by combining two galvanometers whose axes are perpendicular to each other. One responsible for the horizontal direction sweep Trace, one is responsible for vertical scanning. The laser beam 111 is quickly deflected to a desired position by the scanning galvanometer group 14 in a short time, and the quality of the output beam is high, and the optical path sealing performance is good, which can prevent the laser beam 111 from being distorted during transmission. After the telecentric lens set 15 is disposed in the autofocus module 13 and the scanning galvanometer group 14, after the laser beam 111 passes through the autofocus module 13 and the scanning galvanometer group 14, the laser beam 111 enters the telecentric lens group 15 and passes through The telecentric lens set 15 can improve the problem that the laser beam 111 will change the processing range at different working distances. The telecentric lens set 15 is a machine vision lens whose purpose is to eliminate inconsistencies in the distance between the workpieces 17 and the lens, resulting in different magnifications. By the above-mentioned design of the autofocus module 13, the scanning galvanometer group 14 and the telecentric lens group 15, the focused spot generated by the laser beam 111 output from the laser processing device 10 in the workpiece 17 is a circular spot. It does not deform into an elliptical spot, and when the machining distance between the laser processing apparatus 10 and the workpiece 17 is changed, the processing range of the laser beam 111 does not change. Through the laser processing device 10 of the present invention, the spot diameter of the laser beam 111 can be automatically adjusted, no manual fine adjustment is required, and the focusing distance does not need to be changed, and the working efficiency of the laser processing can be improved in response to the multiple processing requirements.

2A-2C are schematic diagrams of the beam path of the present invention, showing different spot heights having the same spot diameter. The autofocus module 13 of FIG. 2A and the lens 12 have a first distance W1, and the laser beam 111 forms a focus point F at a position below the telecentric group 15 from the third height H3; the autofocus module 13 of FIG. 2B and There is a second distance W2 between the lenses 12, and the laser beam forms a focus point F at a distance from the second height H2 below the telecentric lens group 15; a third distance W3 between the autofocus module 13 and the lens 12 of FIG. 2C, The laser beam forms a focus point F at a position below the first height H1 below the telecentric lens set 15. As shown in FIG. 2A to FIG. 2C, the working distance of the laser processing apparatus 10 of the present invention may vary depending on the working environment or the use, and the autofocus module 13 can adjust the spot diameter of the laser beam 111 and pass through the telecentric mirror. Group 15 allows the laser beam 111 to have the same processing range at different working distances, improving the problem of spot forming an elliptical spot and changing the processing range of the laser beam at different distances, thereby improving the efficiency of laser processing. The effect.

Through the above-mentioned laser processing device, the diameter of the laser beam can be automatically adjusted to improve the problem that the spot forms an elliptical spot, and the problem that the laser beam changes the processing range at different working distances without changing or moving the lens is required. In order to improve the efficiency of laser processing in response to diverse processing needs.

Although the technical content of the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. Anyone who is familiar with the art, and some modifications and refinements that do not depart from the spirit of the present invention should be included in the creation. Therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application.

10‧‧‧ Laser processing equipment

11‧‧‧Laser light source

111‧‧‧Laser beam

12‧‧‧ lenses

13‧‧‧Auto Focus Module

14‧‧‧Scanning galvanometer group

15‧‧‧The telecentric group

16‧‧‧Light channel

17‧‧‧Processing

Claims (6)

A laser processing apparatus comprising: a laser light source for providing a laser beam; an autofocus module disposed after the laser light source to adjust a diameter of the focused spot of the laser beam; The telecentric lens set is disposed behind the autofocus module to adjust the size of the focused spot of the laser beam. The laser processing apparatus of claim 1, further comprising at least one lens disposed on a transmission path of the laser beam. The laser processing apparatus of claim 1, further comprising a scanning galvanometer group disposed behind the autofocus module. The laser processing apparatus of claim 3, wherein the scanning galvanometer group is for improving distortion of the laser beam when it is transmitted. A laser processing apparatus according to claim 4, wherein the scanning galvanometer group is used to deflect the laser beam to a desired position. A laser processing apparatus according to claim 1, wherein a processing system for the laser processing apparatus is disposed behind the telecentric lens set.