CN104942430A - Laser processing device and laser processing method - Google Patents
Laser processing device and laser processing method Download PDFInfo
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- CN104942430A CN104942430A CN201510141679.0A CN201510141679A CN104942430A CN 104942430 A CN104942430 A CN 104942430A CN 201510141679 A CN201510141679 A CN 201510141679A CN 104942430 A CN104942430 A CN 104942430A
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- 238000012545 processing Methods 0.000 title claims abstract description 76
- 238000003672 processing method Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 22
- 230000003287 optical effect Effects 0.000 claims description 28
- 230000008569 process Effects 0.000 claims description 17
- 230000000630 rising effect Effects 0.000 claims description 13
- 230000000644 propagated effect Effects 0.000 claims description 12
- 238000009826 distribution Methods 0.000 claims description 10
- 238000012360 testing method Methods 0.000 claims description 6
- 230000033228 biological regulation Effects 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 description 14
- 238000003754 machining Methods 0.000 description 10
- 238000003860 storage Methods 0.000 description 7
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 239000007799 cork Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
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- Mechanical Engineering (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a laser processing device and method capable of accurately determining good and bad of a laser pulse even if a frequency changes; a light beam scanner enables a pulse laser beam to enter a processed object, and a surface enter position changes; a light detector detects physical quantity of the laser pulse based on pulse energy; a path switcher can switch a laser beam path between a first path entering the processed object and a second path (does not enter the processed object); a controller controls the light beam scanner, so the pulse laser beam can enter a processed point position according to a processing order, and the physical quantity based on pulse energy can be detected, and a physical quantity allow scope can be determined according to the physical quantity; in a processing step, the controller allows at least part of the detected physical quantity in the allow scope to transmit in the first path, and the laser pulse exceeding the allow scope can transmit along the second path.
Description
The application advocates the priority of No. 2014-064974th, the Japanese patent application based on application on March 27th, 2014.The full content of this Japanese publication is by reference to being applied in this description.
Technical field
The present invention relates to a kind of pulse laser beam that makes in order incide the multiple processed point in the delimitation of workpiece surface and carry out laser processing device and the laser processing of Laser Processing.
Background technology
The technology using pulse laser beam to carry out perforate processing on wiring substrate is disclosed in following patent document 1.In the method disclosed in patent document 1, when the laser pulse with the pulse energy being less than feasible value incides wiring substrate, by the laser pulse incident extra to this position, can compensated pulse energy in shortage.
In the method disclosed in following patent document 2, the energy of the rising part of detection laser pulse.If testing result is in permissible range, then the further part of this laser pulse is made to incide workpiece and process.If testing result exceeds permissible range, then this laser pulse is not made to incide workpiece.Thereby, it is possible to prevent the bad laser pulse of energy shortage or energy surplus from inciding workpiece.
Patent document 1: Japan Patent No. 2858236 publication
Patent document 2: Japanese Unexamined Patent Publication 2009-148812 publication
In order to the permissible range of the energy of the rising part of the permissible range or laser pulse of determining the pulse energy of laser pulse exactly, need to carry out various evaluation test with different pulse energies.The deviation of pulse energy when also normally can work according to LASER Light Source determines the permissible range of pulse energy.Permissible range can be determined like a cork by the method.
Pulse energy depends on the repetition rate (hereinafter referred to as " frequency ") of pulse.Therefore, if frequency during Laser Processing produces deviation, then the deviation of pulse energy can become large.If the deviation of pulse energy becomes large, even if then LASER Light Source normally works, pulse energy also likely exceeds the permissible range determined at first.If with the permissible range determined at first for benchmark is to judge the good and bad of laser pulse, then the laser pulse exported in normal work sometimes can be judged as bad.
Summary of the invention
Even if the object of the present invention is to provide a kind of frequency change also can judge good and bad laser processing device and the laser processing of laser pulse exactly.
According to a kind of viewpoint of the present invention, provide a kind of laser processing device, it has:
LASER Light Source, exports pulse laser beam;
Objective table, keeps workpiece;
Optical beam scanner, makes the described pulse laser beam exported from described LASER Light Source incide described workpiece, and the incoming position on described workpiece surface is moved;
Photodetector, detects the physical quantity depending on pulse energy of each laser pulse of the described pulse laser beam exported from described LASER Light Source;
Path switch, switches the path of the described pulse laser beam exported from described LASER Light Source inciding between the 1st path of described workpiece and the 2nd path not inciding described workpiece; And
Control device, store position and the processing sequence of the multiple processed point on described workpiece surface, and control described optical beam scanner and described path switch according to the testing result of the position of described processed point, described processing sequence and described photodetector
Described control device performs the front preparatory process of processing, described optical beam scanner is controlled in preparatory process before described processing, the position of described processed point is incided according to described processing sequence to make described pulse laser beam, detected the described physical quantity depending on pulse energy of each laser pulse by described photodetector simultaneously, and the permissible range of described physical quantity is determined according to the distribution of described physical quantity
Before described processing after preparatory process, described control device make in the process of described workpiece the laser pulse of described physical quantity in described permissible range detected by described photodetector at least partially along described 1st propagated, make the laser pulse exceeding described permissible range along described 2nd propagated.
According to another viewpoint of the present invention, provide a kind of laser processing, it has following operation:
Control optical beam scanner, to make pulse laser beam incide the position of the processed point of regulation according to the processing sequence of regulation, measure the physical quantity depending on pulse energy of each laser pulse simultaneously;
The permissible range of described physical quantity is determined according to the distribution of the described physical quantity measured; And
Make pulse laser beam incide the position of the described processed point on workpiece according to described processing sequence, thus carry out Laser Processing,
Carry out in the operation of Laser Processing described, measure the described physical quantity of each laser pulse of described pulse laser beam, what make this laser pulse when measurement result is in described permissible range incides described workpiece at least partially, does not make this laser pulse incide described workpiece when measurement result exceeds described permissible range.
Owing in fact exporting pulse laser beam while control optical beam scanner, and measure and depend on the physical quantity of pulse energy, therefore, the deviation of pulse energy of deviation of frequency based on the pulse laser beam adding man-hour is embodied in the determination of permissible range.Therefore, it is possible to judge the good and bad of laser pulse exactly.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the laser processing device of embodiment.
Fig. 2 be represent triggering signal trg, incide the laser pulse Lp1 of path switch, the chart of the control signal con of the laser pulse Lp2 propagated in machining path, the laser pulse Lp3 propagated in collector path, controllability path switch and the sequential chart of detection signal det sent from photodetector to control device and an example of waveform.
Fig. 3 A is from LASER Light Source with sequential chart during constant frequency output laser pulse, and Fig. 3 B is with the histogram of judgement energy during constant frequency output laser pulse.
Fig. 4 A is the diagrammatic top view of workpiece, and Fig. 4 B is the sequential chart of the laser pulse in process, and Fig. 4 C is the histogram of the judgement energy of laser pulse in process.
Fig. 5 is the flow chart of the laser processing of embodiment.
Fig. 6 A is in step sl from the sequential chart of the laser pulse of LASER Light Source output, and Fig. 6 B is the histogram of the judgement energy of the laser pulse that the moment shown in Fig. 6 A exports.
Fig. 7 is the chart of the corresponding relation represented between the configuration pattern of processed point and permissible range.
In figure: 10-LASER Light Source, 11-illuminating optical system, 13-aperture, 15-path switch, 16-machining path, 17-collector path, 18-retroreflector, 20-optical beam scanner, 21-object lens, 23-objective table, 24-travel mechanism, 30-partially reflecting mirror, 31-beam dump, 32-photodetector, 40-workpiece, the processed point of 41-, 50-control device, 51-storage device, Lp1, Lp2, Lp3-laser pulse, con-control signal, det-detection signal, trg-triggering signal, R0-normal range (NR), R1-permissible range.
Detailed description of the invention
The schematic diagram of the laser processing device of embodiment shown in Fig. 1.The laser processing device of embodiment is such as carrying out the laser drill of perforate processing to wiring substrate.LASER Light Source 10 receives triggering signal trg from control device 50, thus exports pulse laser beam.LASER Light Source 10 such as uses carbon dioxide laser.
The pulse laser beam exported from LASER Light Source 10 incides illuminating optical system 11.Illuminating optical system 11 changes at least 1 in the beam divergence angle of pulse laser beam and beam diameter.Pulse laser beam through illuminating optical system 11 incides aperture 13.Illuminating optical system 11 has the function of the beam distribution homogenising made on aperture 13 position.Aperture 13 pairs of beam cross sections carry out shaping.
Pulse laser beam through aperture 13 incides path switch 15.Path switch 15 passes through the path of the switch pulse laser beam between machining path 16 and collector path 17 from control device 50 reception control signal con.Path switch 15 such as uses acousto-optic element (AOD).The path of the laser pulse Lp1 straight ahead be transfused to is equivalent to collector path 17, and the path of laser pulse diffraction is equivalent to machining path 16.
The laser pulse Lp2 propagated along machining path 16 is partial to by retroreflector 18, thus incides optical beam scanner 20.Optical beam scanner 20 controlled device 50 controls, and changes the direct of travel of pulse laser beam in the two-dimensional direction.Optical beam scanner 20 such as uses a pair galvanometer scanning galvanometer.
The pulse laser beam that have passed optical beam scanner 20 incides workpiece 40 through object lens 21.Object lens 21 such as use f θ lens.Workpiece 40 is such as carrying out the wiring substrate of perforate processing.Workpiece 40 is held in objective table 23.Objective table 23 passes through travel mechanism 24 along the moving in two dimensional directions parallel with the surface of workpiece 40.Travel mechanism 24 is controlled by control device 50.
By object lens 21, the opening portion reduced projection of aperture 13 is to workpiece 40 surface.Changed the direct of travel of pulse laser beam by optical beam scanner 20, the incoming position of pulse laser beam can be made thus to move on the surface at workpiece 40.
The laser pulse Lp3 propagated along collector path 17 incides partially reflecting mirror 30.The laser pulse of permeation parts speculum 30 incides beam dump 31.The laser pulse reflected by partially reflecting mirror 30 incides photodetector 32.Photodetector 32 such as uses the energy meter wavelength region of the pulse laser beam exported from LASER Light Source 10 to sensitivity.Detection signal det based on photodetector 32 is input to control device 50.
Control device 50 comprises storage device 51.The positional information of the multiple processed point of workpiece 40, processing sequence and the various information needed for control are stored in storage device 51.
The control signal con of triggering signal trg shown in Fig. 2, the laser pulse Lp1 inciding path switch 15, the laser pulse Lp2 propagated in machining path 16, the laser pulse Lp3 propagated in collector path 17, controllability path switch 15 and the sequential chart of detection signal det sent from photodetector 32 to control device 50 and waveform one routine.
At moment t1, if triggering signal trg rises, then laser pulse Lp1 rises at moment t2 a little later.In this moment, the outgoing route of path switch 15 switches to collector path 17.Therefore, the laser pulse Lp3 propagated in collector path 17 rises.
Photodetector 32 detects laser pulse Lp3, and detection signal det is sent to control device 50.The size of detection signal det and the power of laser pulse Lp3 substantially proportional.Control device 50, till moment t3 after a predetermined time from rising time t2, carries out integration to detection signal det.And integral result is stored in storage device 51.
At moment t4, control device 50 sends the control signal con switching to machining path 16 to path switch 15.The outgoing route of path switch 15 switches to machining path 16 by collector path 17, thus laser pulse Lp3 decline and laser pulse Lp2 rises.Because laser pulse Lp3 declines, thus the detection signal det of photodetector 32 also becomes 0.
At moment t5, control device 50 sends the control signal con switching to collector path 17 to path switch 15.The outgoing route of path switch 15 switches to collector path 17 by machining path 16, thus laser pulse Lp3 rise and laser pulse Lp2 declines.Because laser pulse Lp3 rises, thus the detection signal det of photodetector 32 also rises.
Decline at moment t6, triggering signal trg.Thus, laser pulse Lp1 and laser pulse Lp3 declines.Because laser pulse Lp3 declines, thus the detection signal det of photodetector 32 also declines.
The detection signal det of photodetector 32 is carried out from moment t2 to t3 the energy that principal value of integral (area with dash area Fig. 2) is equivalent to the rising part of laser pulse Lp1.If as processing with and the pulse width of laser pulse Lp2 that cuts from laser pulse Lp1 is constant, then the energy of the pulse energy of laser pulse Lp2 and the rising part of laser pulse Lp1 has dependency relation.Therefore, it is possible to judge that whether the pulse energy of laser pulse Lp2 is normal by the energy of the rising part of laser pulse Lp1.The energy of the rising part of laser pulse Lp1 is called " judgement energy ".Judge that energy is as the physical quantity depending on pulse energy.
Determine from the time of moment t2 to moment t3 according to the average rise time of laser pulse Lp1.As from the time of moment t2 to moment t3, the average time till the power of laser pulse Lp1 can be adopted to reach stable state, the power of laser pulse Lp2 also can be adopted to reach average time till 90% of steady state power.
As the physical quantity depending on pulse energy, the power of the rising part of laser pulse Lp1 also can be adopted to replace the energy of rising part.If adopted as the physical quantity depending on pulse energy by the only power of 1 on the time shaft in rising part, then inferred by power that the reliability of the pulse energy reduces.By being adopted as the physical quantity depending on pulse energy by the power at the multiple positions on the time shaft in rising part, the reliability being inferred the pulse energy by power can be improved.
Shown in Fig. 3 A from LASER Light Source 10 with sequential chart during constant frequency output laser pulse Lp1.
With the histogram of judgement energy during constant frequency output laser pulse Lp1 shown in Fig. 3 B.Transverse axis represents judgement energy, and the longitudinal axis represents the number of degrees.When LASER Light Source 10 normally works, judge that the distribution of energy is substantially according to normal distribution.If represent the mean value judging energy with m, represent standard deviation with σ, then the judgement energy (hereinafter referred to as normal range (NR) R0) within the scope of the σ of m ± 3 of the laser pulse Lp1 of the overwhelming majority.
The diagrammatic top view of workpiece 40 shown in Fig. 4 A.Delimit on workpiece 40 surface and have multiple processed point 41.By making laser pulse Lp2 incide processed point 41 (Fig. 1), carry out perforate processing.The processing sequence of processed point 41 is pre-determined.In Figure 4 A, an example of processing sequence is represented with arrow.As shown in Figure 4 A, non-constant from the distance till the processed point 41 that processed processed point 41 to the next one should be processed, but there is deviation.If the displacement of the incoming position of pulse laser beam is elongated, then the stabilization time of optical beam scanner 20 is also elongated.Therefore, in the process of workpiece 40, the frequency of pulse laser beam is also non-constant, but changes according to the displacement of the incoming position of pulse laser beam.
One example of the sequential chart shown in Fig. 4 B from the pulse laser beam of LASER Light Source 10 output is between processing period.As shown in Figure 4 B, there is deviation in the frequency of pulse laser beam.
The histogram of the judgement energy when frequency of pulse laser beam shown in Fig. 4 C exists deviation.Conveniently compare, the histogram of the judgement energy when frequency of pulse laser beam represented by dashed line is constant.Usually, frequency is depended on from the pulse energy of the pulse laser beam of LASER Light Source 10 output.Such as, in carbon dioxide laser, if frequency gets higher, then pulse energy has the tendency of decline.
In the deviation of the judgement energy when frequency exists deviation, the deviation of judgement energy when overlap has a frequency-invariant and the deviation of judgement energy caused because frequency there is deviation.Therefore, if frequency exists deviation, then judge that the deviation of energy increases.When frequency and non-constant time, even if LASER Light Source 10 normally works, also can occur to judge that energy exceeds the situation of normal range (NR) R0.
When carrying out only the laser pulse of judgement energy in normal range (NR) R0 being used for the control of Laser Processing, even if LASER Light Source 10 regular event, the laser pulse with the judgement energy exceeding normal range (NR) R0 also cannot be used for processing.Therefore, the utilization ratio of laser energy can reduce.In the embodiment below illustrated, can suppress under the condition of the normal work of LASER Light Source 10 because judging the reduction of the utilization ratio of the laser energy that the deviation of energy causes.
The flow chart of the laser processing of embodiment shown in Fig. 5.In step sl, control LASER Light Source 10 and optical beam scanner 20 according to the position of the processed point 41 (Fig. 4 A) of workpiece 40 and processing sequence, export pulse laser from LASER Light Source 10 thus.Now, path switch 15 maintains the state that outgoing route switches to collector path 17.Therefore, can not incident pulse laser beam on objective table 23.But, owing to control optical beam scanner 20, in the frequency of therefore pulse laser beam, embody the deviation of the stabilization time of optical beam scanner 20.
In step sl from the sequential chart of the laser pulse Lp1 of LASER Light Source 10 output shown in Fig. 6 A.Identical with the frequency of pulse laser beam between the processing period shown in Fig. 4 B, also there is deviation in the frequency of the pulse laser beam in step S1.Optical beam scanner 20 is controlled according to the position of the processed point 41 of reality and processing sequence, and the extent of deviation of the frequency of the pulse laser beam therefore in step S1 is identical with the extent of deviation of frequency of the pulse laser beam adding man-hour.
The testing result of photodetector 32 is input to control device 50.The judgement energy of each laser pulse Lp1 obtained by control device 50, and by the judgement stored energy obtained in storage device 51.
In step s 2, according to judging that the distribution of energy determines to judge the permissible range R1 of energy.
With reference to figure 6B, the defining method of the permissible range R1 judging energy is described.The histogram of energy is judged shown in Fig. 6 B.Conveniently compare, the distribution of the judgement energy during frequency-invariant of pulse laser beam represented by dashed line.Represent the mean value of the distribution of the judgement energy obtained in step sl with m1, represent standard deviation with σ 1.As an example, the higher limit of permissible range R1 is set to m1+3 σ 1, and lower limit is set to m1-3 σ 1.Owing to judging the deviation of energy, compared with normal range (NR) R0 during frequency-invariant, permissible range R1 when frequency exists deviation becomes wider.
In step S3 (Fig. 5), workpiece 40 is placed in objective table 23 (Fig. 1).In step s 4 which, make optical beam scanner 20 action, and till waiting until that the optical beam scanner 20 of pulse laser beam is stable.After optical beam scanner 20 is stable, in step s 5, export 1 laser pulse Lp1 from LASER Light Source 10.In the output start time of laser pulse Lp1, the outgoing route of path switch 15 switches to collector path 17.Therefore, the detection signal det based on the luminous intensity of photodetector 32 is input to control device 50.Control device 50 calculates judgement energy according to the detection signal det inputted from photodetector 32.
In step s 6, judge that energy is whether in permissible range R1.If judge, energy exceeds permissible range R1, then, after laser pulse Lp1 declines, turn back to step S5, export lower 1 laser pulse Lp1.If judge, energy is in permissible range R1, then enter step S7, by controllability path switch 15, cut laser pulse Lp2 (Fig. 2) from laser pulse Lp1, laser pulse LP2 is propagated along machining path 16.Laser pulse Lp2 incides workpiece 40 and carries out perforate processing.
In step s 8, judge whether the processing of all processed points 41 terminates.If also leave unprocessed processed point 41, then turn back to step S4, carry out the processing of next processed point 41.Man-hour is added to every 1 incident multiple laser pulse of processed point 41, can the processing of application cycle pattern or pulse mode processing.
In circulation pattern processing, after 1 incident 1 laser pulse of processed point 41, incoming position is made to move to lower 1 processed point 41.Be set to 1 circulation by the order of incident 1 laser pulse of all processed points 41, by repeatedly this circulation, the laser pulse of desired emitting times can be made to incide processed point 41.Add man-hour carrying out circulation pattern, in step s 8, if be repeated the circulation of desired number of times, be then judged to be process finishing.
In burst mode processing, after the laser pulse to the emitting times of 1 processed point 41 continuously desired by incidence, carry out the processing of the processed point 41 that the next one should be processed.Add man-hour carrying out burst mode, when on making once laser pulse and on once laser pulse incides identical processed point 41, without the need to making optical beam scanner 20 action in step s 4 which.
When the process finishing of all processed points 41, in step s 9, determine whether to leave the unprocessed workpiece 40 that the configuration pattern of processed point 41 is identical.If leave unprocessed workpiece 40, then turn back to step S3, the workpiece 40 should processed by the next one is placed in objective table 23.If there is no unprocessed workpiece 40, then terminate manufacturing procedure.
Process have from the workpiece 40 of the configuration pattern of the processed point 41 of workpiece 40 once processed different configuration pattern time, perform preparatory process before the processing of step S1 ~ step S2, redefine permissible range R1.
In above-described embodiment, even have the laser pulse Lp1 of the judgement energy exceeding the normal range (NR) R0 shown in Fig. 6 B, judge that the laser pulse of energy in permissible range R1 also can be used for processing.Therefore, it is possible to suppress the reduction of the utilization ratio of laser energy.Further, when LASER Light Source 10 job insecurity causes judging that energy exceeds permissible range R1, this laser pulse Lp1 is not used in processing.Therefore, it is possible to prevent the decline of the processing quality caused because of incident pulse energy shortage or too much laser pulse Lp2.
In above-described embodiment, before the processing starting the identical multiple workpieces 40 of the configuration pattern of processed point 41, operation before the processing of implementation step S1 ~ step S2 (Fig. 5), determines permissible range R1.Also the corresponding relation be associated with the configuration pattern of processed point 41 to determined permissible range R1 can be stored in storage device 51.
One example of this corresponding relation shown in Fig. 7.According to the configuration pattern of every 1 processed point 41, store lower limit and the higher limit of permissible range R1.When the configuration pattern of the processed point 41 of the workpiece 40 that the next one should be processed is stored in the correspondence table of Fig. 7, step S1 ~ step S2 (Fig. 2) can be omitted.In step s 6, as long as judge whether energy is being stored within the permissible range R1 in storage device 51.
Above, describe the present invention according to embodiment, but the present invention is not limited thereto.Such as, can carry out various change, improvement and combination etc., this is apparent to those skilled in the art.
Claims (7)
1. a laser processing device, it has:
LASER Light Source, exports pulse laser beam;
Objective table, keeps workpiece;
Optical beam scanner, makes the described pulse laser beam exported from described LASER Light Source incide described workpiece, and the incoming position on described workpiece surface is moved;
Photodetector, detects the physical quantity depending on pulse energy of each laser pulse of the described pulse laser beam exported from described LASER Light Source;
Path switch, switches the path of the described pulse laser beam exported from described LASER Light Source inciding between the 1st path of described workpiece and the 2nd path not inciding described workpiece; And
Control device, store position and the processing sequence of the multiple processed point on described workpiece surface, and control described optical beam scanner and described path switch according to the testing result of the position of described processed point, described processing sequence and described photodetector
Described control device performs the front preparatory process of processing, described optical beam scanner is controlled in preparatory process before described processing, the position of described processed point is incided according to described processing sequence to make described pulse laser beam, detected the described physical quantity depending on pulse energy of each laser pulse by described photodetector simultaneously, and the permissible range of described physical quantity is determined according to the distribution of described physical quantity
Before described processing after preparatory process, described control device make in the process of described workpiece the laser pulse of described physical quantity in described permissible range detected by described photodetector at least partially along described 1st propagated, make the laser pulse exceeding described permissible range along described 2nd propagated.
2. laser processing device according to claim 1, wherein,
Described control device determines higher limit and the lower limit of described permissible range according to the standard deviation of described physical quantity.
3. laser processing device according to claim 1 and 2, wherein,
Described control device the processed point of the workpiece that the next one should be processed configuration pattern from the configuration pattern of the processed point of workpiece once processed different time, before the processing carrying out the workpiece that the next one should be processed, perform preparatory process before described processing, redefine described permissible range.
4. laser processing device according to any one of claim 1 to 3, wherein,
Described physical quantity is the energy of the rising part of described laser pulse.
5. a laser processing, it has following operation:
Control optical beam scanner, to make pulse laser beam incide the position of the processed point of regulation according to the processing sequence of regulation, measure the physical quantity depending on pulse energy of each laser pulse simultaneously;
The permissible range of described physical quantity is determined according to the distribution of the described physical quantity measured; And
Make pulse laser beam incide the position of the described processed point on workpiece according to described processing sequence, thus carry out Laser Processing,
Carry out in the operation of Laser Processing described, measure the described physical quantity of each laser pulse of described pulse laser beam, what make this laser pulse when measurement result is in described permissible range incides described workpiece at least partially, does not make this laser pulse incide described workpiece when measurement result exceeds described permissible range.
6. laser processing according to claim 5, wherein,
Higher limit and the lower limit of described permissible range is determined according to the standard deviation of described physical quantity.
7. the laser processing according to claim 5 or 6, wherein,
Described physical quantity is the energy of the rising part of described laser pulse.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014064974A JP6234296B2 (en) | 2014-03-27 | 2014-03-27 | Laser processing apparatus and laser processing method |
| JP2014-064974 | 2014-03-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104942430A true CN104942430A (en) | 2015-09-30 |
| CN104942430B CN104942430B (en) | 2017-06-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510141679.0A Expired - Fee Related CN104942430B (en) | 2014-03-27 | 2015-03-27 | Laser processing device and laser processing |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6234296B2 (en) |
| KR (1) | KR102002200B1 (en) |
| CN (1) | CN104942430B (en) |
| TW (1) | TWI577482B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109323761A (en) * | 2018-10-31 | 2019-02-12 | 中国科学院西安光学精密机械研究所 | A kind of laser power on-line monitoring method and apparatus |
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| CN111707359A (en) * | 2020-05-12 | 2020-09-25 | 固高科技(深圳)有限公司 | Laser processing detection system and method |
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| CN114799572A (en) * | 2022-06-14 | 2022-07-29 | 广东宏石激光技术股份有限公司 | Laser cutting machining method based on scanning path control energy distribution |
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| JP6732613B2 (en) | 2016-09-07 | 2020-07-29 | 住友重機械工業株式会社 | Laser light source and laser processing apparatus using the same |
| JP2022063595A (en) * | 2020-10-12 | 2022-04-22 | 住友重機械工業株式会社 | Control device of laser processing machine, laser processing machine, and laser processing method |
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| CN110035864A (en) * | 2016-12-12 | 2019-07-19 | 住友重机械工业株式会社 | Laser pulse cuts out device and laser processing |
| CN109693035A (en) * | 2017-10-24 | 2019-04-30 | 住友重机械工业株式会社 | Control device, laser processing and the laser machine of laser machine |
| CN109759694A (en) * | 2017-11-08 | 2019-05-17 | 住友重机械工业株式会社 | Laser processing device |
| CN109323761A (en) * | 2018-10-31 | 2019-02-12 | 中国科学院西安光学精密机械研究所 | A kind of laser power on-line monitoring method and apparatus |
| CN109323761B (en) * | 2018-10-31 | 2020-12-25 | 中国科学院西安光学精密机械研究所 | Laser power online monitoring method and device |
| CN113385809A (en) * | 2020-03-11 | 2021-09-14 | 住友重机械工业株式会社 | Machining order determining device, laser machining device, and laser machining method |
| CN113385809B (en) * | 2020-03-11 | 2022-09-27 | 住友重机械工业株式会社 | Machining order determining device, laser machining device, and laser machining method |
| CN111707359A (en) * | 2020-05-12 | 2020-09-25 | 固高科技(深圳)有限公司 | Laser processing detection system and method |
| CN112108775A (en) * | 2020-09-09 | 2020-12-22 | 湖南鼎一致远科技发展有限公司 | Device and method for controlling lasers in parallel and laser marking machine |
| CN114799572A (en) * | 2022-06-14 | 2022-07-29 | 广东宏石激光技术股份有限公司 | Laser cutting machining method based on scanning path control energy distribution |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150112814A (en) | 2015-10-07 |
| TWI577482B (en) | 2017-04-11 |
| KR102002200B1 (en) | 2019-07-19 |
| JP6234296B2 (en) | 2017-11-22 |
| JP2015186818A (en) | 2015-10-29 |
| CN104942430B (en) | 2017-06-27 |
| TW201540406A (en) | 2015-11-01 |
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