TWI755109B - Laser processing system and laser processing method thereof - Google Patents

Abstract

A laser processing system includes a light source module, a moving mechanism and a control unit. The control unit is coupled to the moving mechanism and the light source module, and the light source module is moved relatively along a processing path controlled by the control unit. The light source module is fixed on the moving mechanism and a processing pattern is formed by a light beam emitted from the light source module when the light source module is relatively moved along the processing path. The processing path includes a first processing section and a second processing section, and the processing pattern includes a first pattern and a second pattern, wherein a pattern-neighboring region is located between the first pattern and the second pattern, and the pattern-neighboring region includes at least parts of the first pattern and at least parts of the second pattern. The first pattern further includes a plurality of first line segments within the pattern-neighboring region and the second pattern further includes a plurality of second line segments within the pattern-neighboring region, wherein a total length of each of the first line segment and the adjacent second ling segment is equal to a pitch between two of the pattern-neighboring region’s edges.

Description

Laser processing system and laser processing method thereof

The present invention relates to a laser processing system, in particular to a laser processing system for making patterns on the surface of a workpiece through laser light.

Laser processing technology is to use the modulated laser light on the workpiece to achieve processing purposes such as marking or engraving after the laser light is transmitted and processed by an optical component composed of multiple lenses to achieve a high degree of focus. When using the existing laser processing device or system to process the pattern on the workpiece, it is often encountered that the pattern to be processed is too large to be processed at one time. Therefore, the pattern that is too large must be divided into several area segments. Laser processing of the pattern can only be completed by processing. However, this method of dividing the pattern by splicing will greatly lengthen the processing time, and it will also be seen on the final processed pattern that there are multiple dividing line segments due to splitting. The type of seam affects the quality of the pattern.

In view of the problems encountered by the above-mentioned laser processing technology, the current prior art provides some processing methods to improve the pattern quality. One of the methods is to combine the optical components in the existing laser processing system with a high-speed scanning galvanometer (gavanometer scanner). This high-speed scanning galvanometer can rotate at high speed in a short time to continuously change the irradiation direction of the laser light, so Expand the scope of laser processing. However, although this method can reduce the number of split patterns, there is no way to eliminate the seams between the split patterns after processing. In addition, in the process that the pattern is divided into multiple areas and processed area by area, when the After one area is processed, the entire laser processing module must be moved to another area in order to perform operations in the next area. When moving the laser processing module, it will often encounter the situation of continuous acceleration or deceleration. The situation will not only prolong the operation time, but also easily cause the deviation of the machine, so that the graphics of each area will be distorted or overlapped to another area after processing, and even the joints of the graphics in each area need to be compensated for correction. Therefore, there is still a need to provide a laser processing system to solve the above-mentioned problems encountered in the prior art.

The prior art paragraphs are only used to help understand the content of the present invention, so the content disclosed in the prior art paragraphs may contain some that do not constitute conventional techniques known to those with ordinary knowledge in the art. The content disclosed in the prior art paragraph does not represent the content or the problem to be solved by one or more embodiments of the present invention, and has been known or recognized by those with ordinary knowledge in the technical field before the application of the present invention.

According to the shortcomings of the prior art, the object of the present invention is to provide a laser processing system, which can reduce the visibility of the split positions between the split patterns by controlling the split manner of the processing patterns.

Another object of the present invention is to provide a laser processing system, which can effectively shorten the overall laser processing time by controlling the movement method of the light source module and the splitting method of the processing pattern.

In order to achieve the above object, the present invention provides a laser processing system for laser processing a surface to be processed of a workpiece to form a processing pattern, the surface to be processed includes a first processing area and a second processing area adjacent to the first processing area , the processing pattern spans the first processing area and the second processing area. The laser processing system includes a light source module, a moving mechanism and a control unit. The light source module provides light to illuminate the surface to be processed, and the light source module is located along the processing path on the surface to be processed. Provided when making relative moves The light is used to form a processing pattern. The processing path includes a first processing section located in the first processing area and a second processing section located in the second processing area. The moving mechanism is used to change the relative position between the workpiece and the light source module. The control unit is coupled to The moving mechanism and the light source module are connected, and the control unit controls the moving mechanism and the light source module to make the light source module relatively move on the processing path and provide light, and the processing pattern includes a first pattern and a second pattern adjacent to the first pattern, The control unit controls the light source module to provide light when the first processing section relatively moves to form a first pattern on the surface to be processed, and the control unit controls the light source module to provide light to form the surface to be processed when the second processing section relatively moves a second pattern, wherein the pattern adjacent area is located between the first pattern and the second pattern and includes at least part of the first pattern and at least part of the second pattern, and the first pattern further includes a plurality of first patterns in the pattern adjacent area Line segment, the second pattern further includes a plurality of second line segments in the adjacent area of the pattern, the lengths of every two adjacent first line segments are different from each other, and the lengths of every two adjacent second line segments are different from each other , the end of each first line segment away from the second pattern constitutes the first boundary of the adjacent area of the pattern, the end of each second line segment away from the first pattern constitutes the second boundary of the adjacent area of the pattern, and the length of each first line segment The sum of the lengths of the second line segment adjacent to the first line segment is equal to the distance between the first boundary and the second boundary.

In a preferred embodiment, the first boundary is parallel to the first processing section, the second boundary is parallel to the second processing section, and the distance between the first boundary and the second boundary is not greater than that of the first pattern along the first processing area. 50% of the length in the direction perpendicular to the first processing section, and the distance between the first boundary and the second boundary is not greater than 50% of the length of the second pattern in the direction perpendicular to the second processing section in the second processing area.

In a preferred embodiment, the light source module is fixed to the moving mechanism, and the control unit controls the moving mechanism to drive the light source module so that the light source module relatively moves along the processing path and provides light.

In a preferred embodiment, the moving mechanism includes a movable workpiece carrying platform, the workpiece is disposed on the movable workpiece carrying platform, the control unit is coupled to the movable workpiece carrying platform, and the control unit is connected to the movable workpiece carrying platform. The manufacturing unit controls the movable workpiece carrying platform to drive the workpiece, so that the light source module moves relatively on the processing path and provides light.

In a preferred embodiment, the light source module further includes a laser light source, a first galvanometer, a second galvanometer and a focusing lens, and the light source module provides laser light through the laser light source and sequentially passes through the first galvanometer, Modulation of the second galvanometer and the focusing lens to provide light.

In a preferred embodiment, the processing path further includes connecting sections, the connecting sections respectively connect the first processing section and the second processing section, the first processing section is parallel to the second processing section, the connecting sections are respectively perpendicular to the first processing section and The second processing section and the control unit control the light source module to not provide light when the connecting section moves relatively.

In a preferred embodiment, the control unit controls the time during which the light source module provides light to adjust the lengths of each first line segment and each second line segment.

The present invention also discloses a laser processing method applied to the above-mentioned laser processing system, which is used for laser processing a surface to be processed of a workpiece to form a processing pattern, the to-be-processed surface includes a first processing area and a surface adjacent to the first processing area The second processing area, the processing pattern spans the first processing area and the second processing area, the laser processing method includes the following steps: providing a light source module to provide light to illuminate the surface to be processed, wherein the light source module is located along the surface to be processed. When the processing path moves relatively, light is provided to form a processing pattern, the processing path includes a first processing section located in the first processing area and a second processing section located in the second processing area, and the processing pattern includes the first pattern and the adjacent A second pattern of a pattern; controlling the light source module to move relatively in the first processing section and providing light to form a first pattern on the surface to be processed; controlling the light source module to follow the connecting section connecting the first processing section and the second processing section Carry out relative movement to relatively move the light source module to the second processing section, and control the light source module to not provide light when the connecting section is relatively moved; control the light source module to relatively move in the second processing section and raise the supplying light to form a second pattern on the surface to be processed; wherein the pattern adjacent area is located between the first pattern and the second pattern and includes at least part of the first pattern and at least part of the second pattern, and the first pattern is adjacent to the pattern The region also includes a plurality of first line segments, the second pattern also includes a plurality of second line segments in the pattern adjacent region, and the lengths of every two adjacent first line segments are different from each other, and every two adjacent first line segments have different lengths. The lengths of the second line segments are different from each other, one end of each first line segment away from the second pattern constitutes the first boundary of the adjacent area of the pattern, and one end of each second line segment away from the first pattern constitutes the second boundary of the adjacent area of the pattern, And the sum of the length of each first line segment and the length of the second line segment adjacent to the first line segment is equal to the distance between the first boundary and the second boundary.

According to the above, the embodiment of the present invention forms the first pattern and the second pattern by controlling the light source module to move relatively along the first processing section and the second processing section respectively, and in addition, two processing patterns are formed in the adjacent areas of the patterns. The lengths of the adjacent first line segments and each of the two adjacent second line segments are not equal, and the sum of the lengths of the first line segments and the lengths of the second line segments adjacent to the first line segment is controlled to be equal to the first boundary and the second boundary In this way, the visibility of the split position between the first pattern and the second pattern can be reduced after the processing pattern is made, the processing efficiency of the overall laser processing system can be increased, and the laser processing time can be shortened.

10. 10A: Laser processing system

11: Light source module

111: Light

112: Laser light source

113: The first galvanometer

114: The second galvanometer

115: Focusing Lens

12: Mobile Mechanism

13: Control unit

14: Movable workpiece carrying platform

15: Clamping tool

20: Surface to be processed

200: Workpiece

21: The first processing area

22: Second processing area

23: The third processing area

24: Processing path

241: The first processing section

242: Second processing section

243, 245: connection segment

244: The third processing section

30: Processing pattern

31: The first pattern

311: first line segment

312: First Frontier

32: Second pattern

321: Second line segment

322: Second Frontier

33, 33': pattern adjacent area

34: The adjoining point of the first line segment and the second line segment

35: The third pattern

D: Spacing

L1, L2, L311, L321: Length

S101~S104: Steps

Fig. 1 is a schematic diagram showing the operation of a laser processing system according to an embodiment of the present invention; Fig. 2 is a schematic diagram showing the structure of a light source module according to the embodiment of Fig. 1; Fig. 3 is an embodiment according to Fig. 1, showing a pattern a top view of an adjacent area; FIG. 4 is a schematic diagram showing the operation of a laser processing system according to another embodiment of the present invention; and FIG. 5 is a flowchart showing a laser processing method of a laser processing system according to still another embodiment of the present invention.

The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front or rear, etc., are only for referring to the directions of the attached drawings. Accordingly, the directional terms used are illustrative and not limiting of the present invention.

FIG. 1 is a schematic diagram showing the operation of a laser processing system according to an embodiment of the present invention, wherein the XYZ coordinate axes are only used to illustrate the present embodiment, but not to limit the scope of the present invention. Please refer to FIG. 1 , the laser processing system 10 is used for laser processing the surface 20 to be processed of the workpiece to form the processing pattern 30 . The laser processing system 10 includes a light source module 11 , a moving mechanism 12 and a control unit 13 , wherein the light source The module 11 provides light 111 to illuminate the surface to be processed 20 . The light 111 is a laser light of appropriate power, and the light source module moves relatively along the processing path 24 located on the surface to be processed 20 while providing the light 111 to the surface to be processed 20 . The processing pattern 30 is formed. In detail, the surface to be processed 20 includes a first processing area 21 and a second processing area 22 , and the processing path 24 includes a first processing section 241 and a second processing section 242 , wherein the first processing section 241 is located in the first processing area 21 , The second processing section 242 is located in the second processing area 22 , and the processing pattern 30 formed through the light 111 spans the first processing area 21 and the second processing area 22 at the same time. In addition, the surface to be processed 20 in this embodiment is flat, but not limited thereto, the surface to be processed 20 may also have a plurality of depressions or protrusions.

Please continue to refer to FIG. 1 , the moving mechanism 12 is used to change the relative position between the workpiece and the light source module 11 , and the control unit 13 is respectively coupled to the moving mechanism 12 and the light source module 11 to control the moving mechanism 12 and the light source module 11 , so that the light source module 11 relatively moves on the processing path 24 , and controls the light source module 11 to provide light 111 at the same time. In detail, the workpiece in this embodiment is fixed and does not move, the light source module 11 is fixed on the moving mechanism 12 , and the control unit 13 controls the moving mechanism 12 to drive the light source module 11 to move on the surface 20 to be processed of the workpiece, so as to present the light source module 12. The above-mentioned relative movement is performed on the processing path 24 and the light 111 is provided, wherein the moving mechanism 12 is, for example, a mechanical arm or a sliding rail mechanism, etc. suitable for moving in a direction parallel to the surface 20 to be processed. Or equipment, the light source mold The group 11 is fixed to the moving mechanism 12 by, for example, screws, tenons or other suitable means. The control unit 13 is, for example, wired or wirelessly coupled to the moving mechanism 12 and the light source module 13, and the control unit 13 is, for example, a central processing unit (Central Processing Unit, CPU), or other programmable general-purpose or special-purpose microprocessors (Microprocessors), digital signal processors (Digital Signal Processors, DSPs), programmable controllers, special application integrated circuits A circuit (Application Specific Integrated Circuit, ASIC) or other similar components or a combination of the above components, can also be a personal computer (Personal Computer, PC), tablet computer (Tablet PC), mobile phone or other electronic devices that can be remotely connected and controlled equipment, the present invention does not limit the fixing method of the light source module 12 and the implementation elements and methods of the control unit 13 .

In an embodiment of the present invention, the processing pattern 30 formed by the light 111 includes a first pattern 31 and a second pattern 32 adjacent to the first pattern 31. When the control unit 13 controls the mobile device 12 to make the light source module 11 in the When the first processing section 241 of the processing path 24 moves relatively, the control unit 13 controls the light source module 11 to provide the light 111 to form the first pattern 31 , and when the control unit 13 controls the moving device 12 to make the light source module 11 move on the processing path 24 . When the second processing section 242 moves relatively, the control unit 13 controls the light source module 11 to provide the light 111 to form the second pattern 32 . As shown in FIG. 1 , the processing pattern 30 in this embodiment is, for example, a strip-shaped pattern, but the processing pattern 30 may be any pattern or shape that can be formed by laser processing.

FIG. 2 is a schematic diagram showing the structure of a light source module according to the embodiment of FIG. 1 . Please refer to FIGS. 1 and 2 , the light source module 11 includes a laser light source 112 , a first galvanometer 113 , a second galvanometer 114 and a focusing lens 115 , wherein the laser light source 112 is, for example, a fiber laser light source or an ultraviolet laser light source Or other laser light sources capable of providing sufficient power, the first galvanometer 113 and the second galvanometer 114 are high-speed scanning galvanometers, and the focusing lens 115 may be an F-theta lens (F-theta lens, also known as a flat field lens). In this embodiment, the light source module 11 provides the initial laser light through the laser light source 112 , the first galvanometer 113 and the second galvanometer 114 are used to adjust the deflection direction of the initial laser light, for example, the first galvanometer 113 controls the light 111 Deflection in the X-axis direction, the second galvanometer 114 controls the deflection of the light 111 in the Y-axis direction, and then the focusing lens 115 converges the deflected initial laser light, so that the initial laser light passes through the first galvanometer 113, The deflection of the second galvanometer 114 and the modulation of the focusing lens 115 form a light ray 111 , and a processing pattern 30 formed by a plurality of mutually parallel laser scanning line segments can be formed on the surface to be processed 20 through the light 111 .

FIG. 3 is a top view showing a pattern adjacent region according to the embodiment of FIG. 1 . Please refer to FIG. 1 , FIG. 2 and FIG. 3 , wherein the XYZ coordinate axes are only used to illustrate the present embodiment, and are not used to limit the scope of the patent application of the present invention. Since the size of the processing pattern 30 exceeds the deflection limit of the light angle of the first galvanometer 113 and the second galvanometer 114 in the light source module 11 , the processing pattern 30 is divided into the first pattern 31 and the second pattern in this embodiment. 32. The splitting of the processing pattern 30 is, for example, input to the control unit 13 through the existing CAD/CAM software planning pattern splitting method, wherein the pattern adjacent area 33 is located between the first pattern 31 and the second pattern 32 and includes at least Part of the first pattern 31 and at least part of the second pattern 32 . The processing pattern 30 is composed of a plurality of mutually parallel laser scanning line segments, so the first pattern 31 includes a plurality of first line segments 311 in the pattern adjacent area 33 , and the second pattern 32 in the pattern adjacent area 33 A plurality of second line segments 321 are also included, wherein the lengths of every two adjacent first line segments 311 are different from each other, and the lengths of every two adjacent second line segments 321 are different from each other. As a result, in the pattern adjacent area 33, the edge of the first pattern 31 will be caused by two The lengths of the adjacent first line segments 311 are different, and the edges of the second pattern 32 are also irregular. When viewing the entire finished processing pattern 30, the first pattern 31 and the second pattern 32 are visually spliced without seams, and no obvious seams or overlaps are observed, even if the laser Even if the machining system 10 produces a small deviation of the machining angle during machining, the visual effect of the machining pattern 30 will not be affected.

In the pattern adjacent region 33 , one end of each first line segment 311 adjacent to the first pattern 31 constitutes the first boundary 312 of the pattern adjacent region 33 , and one end of each second line segment 321 adjacent to the second pattern 32 constitutes the pattern adjacent region 33 The second boundary 322 of , wherein each first line segment 311 and each second line segment 321 are straight line segments. In addition, the pattern adjacent area 33 also includes a plurality of abutment points 34 , one end of each first line segment 311 away from the first pattern 31 is adjacent to the end of another adjacent second line segment 321 away from the second pattern 32 at the abutment point 34, and the sum of the length L311 of each first line segment 311 and the length L321 of the second line segment 321 adjacent to the first line segment 311 is equal to the distance D between the first boundary 312 and the second boundary 322, so that The irregular split position between the first pattern 31 and the second pattern 32, that is, each adjoining point 34 will be limited to the pattern adjacent area 33, so the irregular split position of the pattern will not cause the viewer to It is too obvious visually, which can reduce the visibility of the split position of the first pattern 31 and the second pattern 32 in the visually processed pattern 30 .

Please continue to refer to FIG. 1 and FIG. 3 , the first boundary 312 and the second boundary 321 of the pattern adjacent area 33 are not line segments that actually exist in the processing pattern 30 , but are used to plan and control the first boundary in the pattern adjacent area 33 . The length of the line segment 311 and the second line segment 321 . The first boundary 312 is parallel to the first processing section 241 of the processing path 24, and the second boundary 322 is parallel to the second processing section 242 of the processing path 24. In this embodiment, the first processing section 241 and the second processing section 242 are planned is parallel to the X-axis. In addition, the length of the first pattern 31 in the direction perpendicular to the first processing section 241 in the first processing area 21 is L1, and the length of the second pattern 32 in the direction perpendicular to the second processing section 242 in the second processing area 22 is L2, wherein the first side of the pattern adjacent area 33 The distance D between the boundary 312 and the second boundary 322 is not greater than 50% of the length L1, and the distance D is not greater than 50% of the length L2. In this embodiment, the distance D and the lengths L1 and L2 are parallel to the Y-axis direction. Since the distance D is less than 50% of the length L1 and 50% of the length L2, respectively, the first pattern 31 and the second pattern can be controlled. The split position between 32 is adjacent to the junction of the first processing area 21 and the second processing area 22, so as not to make it difficult for the light 111 emitted by the light source module 11 to make the first line segment 311 or the first line segment 311 of the adjacent area 33 of the pattern. Second line segment 321. In addition, the first line segment 311 and the second line segment 321 are planned to be line segments parallel to the Y-axis direction, since the processing pattern 30 is split into the first pattern 31 and the second pattern 32 and the light source module is respectively arranged along the first processing area 21 The first processing section 241 above and the second processing section 242 on the second processing area 22 provide the light 111 for processing, so this processing method combined with the size design of the pattern adjacent area 33 can make the processing pattern 30 as a whole split The number of positions is greatly reduced, thereby effectively shortening the overall laser processing time.

Please continue to refer to FIG. 1 and FIG. 3 , the processing path 24 further includes a connecting section 243 , and the connecting section 243 connects the first processing section 241 and the second processing section 242 respectively, wherein the first processing section 241 is parallel to the second processing section 242 . In the embodiment, the control unit 13 controls the light source module 11 and the moving mechanism 12 to make the light source module 11 relatively move along the first processing section 241 , the connecting section 243 and the second processing section 242 in sequence. Since the first processing section 241 is parallel to the second processing section 242 , it is possible to reduce the difficulty of planning the splitting method of the processing pattern 30 and the difficulty of designing the processing path 24 . In addition, the connecting segment 243 is a straight line segment, for example, a straight line segment parallel to the Y-axis direction in this embodiment, and the control unit 13 controls the light source module 11 to not provide the light 111 when the connecting segment 243 relatively moves to avoid extra light The pattern 111 interferes with the adjacent regions 33 of the pattern, so that the light source module 11 can relatively move to the second processing section 242 in the shortest time, which can shorten the operation time of the overall processing process. In addition, this embodiment does not limit the light source module 11 to move relatively along the first processing section 241 , the connecting section 243 and the second processing section 242 in sequence, and the light source module 11 can also be controlled to move relative to each other. The mechanism 12 makes the light source module 11 relatively move along the sequence of the second processing section 242 , the connecting section 243 , and the first processing section 241 to manufacture the processing pattern 30 , and the invention is not limited thereto.

Please continue to refer to FIG. 1 , FIG. 2 and FIG. 3 , when the control unit 13 controls the light source module 11 to move relative to the first processing section 241 and the second processing section 242 , the control unit 13 simultaneously controls the light source module 11 to provide light 111 to adjust the length of each first line segment 311 and each second line segment 321 , so that the split design of the processing pattern 30 into the first pattern 31 and the second pattern 32 can be achieved. Specifically, in this embodiment, the lengths of every two adjacent first line segments 311 are different from each other, and the lengths of every two adjacent second line segments 321 are also different from each other. The control unit 13 can preset each The lengths of the line segment 311 and each second line segment 321 can be precisely controlled by controlling the illuminating time of the laser light source 112 when the first galvanometer 113 and the second galvanometer 114 rotate. 311 and each second line segment 321 reach a predetermined length.

The first processing section 241 , the second processing section 242 and the connecting section 243 in the foregoing embodiment are straight line segments, wherein the first processing section 241 and the second processing section 242 are planned to be parallel to the X-axis direction, and the first line segment 311 and the The second line segment 321 is planned to be parallel to the Y-axis direction. However, the first process segment 241 , the second process segment 242 and the connection segment 243 can also be planned as non-linear line segments according to the shape of the process pattern 30 , and the first process segment 241 can be planned as The first line segment 311 is not perpendicular to each other, and the second processing segment 242 can be designed to be not perpendicular to the second line segment 321 to increase the flexibility of pattern splitting planning. In addition, in the aforementioned embodiment, the processing pattern 30 is planned and divided into the first pattern 31 and the second pattern 32 , and the processing pattern 30 spans the first processing area 21 and the second processing area 22 , and extends along the first processing section 241 and the second processing area respectively. The second processing section 242 produces the first pattern 31 and the second pattern 32. However, in the present invention, a larger number of processing can also be planned depending on the size of the processing pattern and the deflection angle of the first galvanometer and the second galvanometer in the light source module. area and processing path, and plan the processing pattern with the existing software and divide it into a corresponding number of sub-patterns to reduce the difficulty of making the processing pattern. The pattern is similar to the first or second pattern in the previous embodiment and is located between two adjacent processing areas, wherein the splitting method and processing method of each sub-pattern are roughly the same as the technical effect that can be achieved in the previous embodiment, which is not repeated here. Repeat.

Please continue to refer to FIG. 1 , in another embodiment, the surface to be processed 30 further includes a third processing area 23 , and the processing path 24 further includes a third processing section 244 and a connecting section 245 , and both ends of the connecting section 245 are respectively connected to the third processing section 244 In the second processing section 242 and the third processing section 244 , the processing pattern 30 formed through the light 111 also spans the third processing area 23 , that is, the processing pattern 30 is divided into the first pattern 31 , the second pattern 32 and the third pattern 35 , and the number of pattern adjacent regions 33 is two, which are located between the first pattern 31 and the second pattern 32 and between the second pattern 32 and the third pattern 35 respectively. That is to say, the manufacturing and pattern splitting methods of the processing pattern 30 can flexibly correspond to the configuration of the laser processing system 10 or the deflection limit of each galvanometer in the light source module 11 to the light angle, and the existing CAD/CAM can pass through the existing CAD/CAM. The software plan divides the processing pattern 30 into three or more pieces, and the control unit 13 can also be set to control the light source module 11 to move relative to the second processing section 242 and simultaneously provide the light 111 to complete the production of the second pattern 32 Afterwards, the light source module 11 is controlled to relatively move along the connecting section 245 to the third processing section 244 to continue providing the light 111 to continue the production of the third pattern 35 , thereby completing the production of the processing pattern 30 . In addition, in this embodiment, the control unit 13 controls the light source module 11 and the moving mechanism 12 to make the light source module 11 sequentially process the first processing section 241 , the connecting section 243 , the second processing section 242 , the connecting section 245 , and the third processing section However, the control unit 13 can also control the light source module 11 and the moving mechanism 12 to make the light source module 11 move along the third processing section 244, the connecting section 245, the second processing section 242, the connecting section 243, and the first processing section 244. The sequence of the segments 241 is relatively moved to create the processing pattern 30, but the present invention is not limited to this. In addition, in this embodiment, the pattern adjacent area 33 is located between the first pattern 31 and the second pattern 32 and includes at least part of the first pattern 31 and at least part of the second pattern 32, and the pattern adjacent area 33' is located in the first pattern 31 and the second pattern 32. Between the second pattern 32 and the third pattern 35 and including at least part of the second pattern 32 and the In at least part of the third pattern 35, the pattern and manufacturing method of the pattern adjacent region 33' are substantially the same as those of the aforementioned pattern adjacent region 33, which will not be repeated here.

FIG. 4 is a schematic diagram showing the operation of the laser processing system according to another embodiment of the present invention, wherein the XYZ coordinate axes are only used to illustrate the present embodiment, but not to limit the scope of the present invention. The laser processing system 10A of the present embodiment is similar to the laser processing system 10 , and the same components or devices are denoted by the same reference numerals, which will not be repeated here. The difference between the laser processing system 10A and the laser processing system 10 is that the moving mechanism of the laser processing system 10A includes a movable workpiece carrier platform 14 , and the light source module 11 keeps its position fixed by holding the tool 15 , wherein the workpiece 200 The light source module 11 is disposed on the movable workpiece carrying platform 14 , so that the light source module 11 provides the light 111 to the surface to be processed 20 to manufacture the processing pattern 30 . In this embodiment, the control unit 13 is also coupled to the movable workpiece carrier platform 14 , and the control unit 13 drives the workpiece 200 by controlling the movable workpiece carrier platform 14 to make the light source module 11 in the processing path (not shown in the figure). 4) to perform relative movement and provide light 111. For example, the movable workpiece carrier platform 14 has a plurality of slide rails and can be driven by a motor system to move parallel to the XY plane, and the workpiece 200 is kept from the workpiece carrier platform by a clamp or a clamping member. 14 moves, and the clamping tool 15 is, for example, a fixed cantilever to keep the position of the light source module 11 still, so that the workpiece 200 can be driven through the movable workpiece carrier platform 14 so that the light source module 11 can move relatively along the processing path. In order to implement the production of the processing pattern 30 . Since the position of the light source module 11 is fixed and the workpiece 200 is moved by the movable workpiece carrier platform 14 in this embodiment, the relative movement of the light source module 11 on the surface to be processed 20 is displayed. Therefore, when the light source module 11 provides the light 111 It can have better output stability, thereby improving the final production quality of the processing pattern 30 .

In addition, in another embodiment, the laser processing system 10A can also be equipped with the moving mechanism 12 in the laser processing system 10 at the same time, so that the movable workpiece carrying platform 14 can be simultaneously matched. The relative movement of the light source module 11 on the processing path is achieved by the movement of the light source module 11. Since the light source module 11 and the workpiece 200 can move in the direction parallel to the XY plane at the same time, the production efficiency of the processing pattern 30 on the surface to be processed 20 can be improved. .

5 is a flowchart showing a laser processing method of a laser processing system according to still another embodiment of the present invention. The laser processing method in this embodiment can be implemented in conjunction with the laser processing system 10 or 10A of the previous The processing method includes the following steps. Please refer to FIG. 5 in conjunction with FIG. 1 , wherein the surface to be processed 20 includes a first processing area 21 and a second processing area 22 adjacent to the first processing area 21 , and the predetermined processing pattern 30 spans the first processing area 21 and the second processing area 22 . Processing area 22 . Step S101 : providing a light source module for providing light to illuminate the surface to be processed, wherein the light source module provides light to form a processing pattern when relatively moving along a processing path of the surface to be processed, and the processing path includes a first processing pattern located in a first processing area The segment and the second processing segment located in the second processing region, and the processing pattern includes a first pattern and a second pattern adjacent to the first pattern. In this step, the control unit 13 controls the light source module 11 to provide light 111 to illuminate the surface 20 to be processed.

Please continue to refer to FIG. 5 in conjunction with FIG. 1 or FIG. 4 , step S102 : control the light source module to relatively move along the first processing section, and provide light to form a first pattern on the surface to be processed. In this step, the light source module 11 in the laser processing system 10 is fixed to the moving mechanism 12, and the moving mechanism 12 drives the light source module 11 to move relatively along the first processing section 241 without moving the surface 20 to be processed. In the laser processing system 10A, the workpiece 200 is disposed on the moving mechanism, that is, the movable workpiece carrier platform 14 , and the control unit 13 controls the movable workpiece carrier platform 14 to move, so that the light source module 11 moves along the first processing section relative movement. The light source module 11 also provides light 111 to form the first pattern 31 on the first processing area 21 .

Please continue to refer to FIG. 5 in conjunction with FIG. 1 or FIG. 4 , step S103 : control the light source module to relatively move along the connecting section connecting the first processing section and the second processing section, so that the light source module is relatively moved to the second processing section, And control the light source module not to provide light when the connecting segment moves relatively. In this step, the light source module 11 of the laser processing system 10 changes the moving direction through the moving mechanism 12 after completing the processing operation on the first processing section 241, and moves relatively along the connecting section 243, while the laser processing system 10A Among them, the movable workpiece carrying platform 14 changes the moving direction after the light source module 11 completes the processing operation of the first processing section, so that the light source module 11 relatively moves along the connecting section. The control unit 13 also controls the light source module 11 not to provide the light 111 when the light source module 11 relatively moves along the connecting section 243 to the second processing section 242 .

Please continue to refer to FIG. 5 in conjunction with FIG. 1 , FIG. 3 and FIG. 4 , step S104 : control the light source module to move relatively along the second processing section, and provide light to form a second pattern on the surface to be processed to complete the processing pattern. In this step, the moving mechanism 12 of the laser processing system 10 drives the light source module 11 to move relatively along the second processing section 242 without moving the surface 20 to be processed. In the laser processing system 10A, the control unit 13 The movable workpiece carrying platform 14 is controlled to move, so that the light source module 11 relatively moves along the second processing section. The control unit 13 also controls the light source module 11 to provide light 111 to form the second pattern 32 on the second processing area 22 , so that the processing pattern 30 can be completed.

In the processing pattern 30 produced in steps S101 to S104 according to the present invention, the pattern adjacent region 33 is located between the first pattern 31 and the second pattern 32 and includes at least part of the first pattern 31 and part of the second pattern 32 , the first pattern 31 includes a plurality of first line segments 311 in the pattern adjacent area 33, the second pattern includes a plurality of second line segments 321 in the pattern adjacent area 33, and every two adjacent first line segments 311 The lengths of each two adjacent second line segments 321 are different from each other, wherein the end of each first line segment 311 away from the second pattern 32 constitutes the first boundary 312 of the pattern adjacent area 33, and each first line segment 311 is far from the second pattern 32. One end of the two line segments 321 away from the first pattern 31 constitutes the second boundary 322 of the pattern adjacent area 33 , and the second boundary 322 of each first line segment 311 The sum of the length L311 and the length L321 of the second line segment 321 adjacent to the first line segment 311 is equal to the distance D. The technical effects that can be achieved by the laser processing method of this embodiment are substantially the same as those of the foregoing embodiments, and are not repeated here.

To sum up, in the laser processing system disclosed in the present invention, the processing pattern includes a first pattern and a second pattern adjacent to the first pattern, and the light source module moves relatively in the first processing section and the second processing section respectively. At the same time, light is provided to form the first pattern and the second pattern in the processing pattern respectively, and the lengths of each two adjacent first line segments and each two adjacent second line segments in the pattern adjacent area of the processing pattern are not equal, so First, the visibility of the split position between the first pattern and the second pattern can be reduced after the processing pattern is produced, the processing efficiency of the overall laser processing system can be increased, and the laser processing time can be shortened.

However, the above are only preferred embodiments of the present invention, and should not limit the scope of the present invention, that is, any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the invention are all It still falls within the scope of the patent of the present invention. In addition, terms such as "first" and "second" mentioned in this specification or the scope of the patent application are only used to name the names of elements or to distinguish different embodiments or ranges, rather than to limit the upper or lower limit of the number of elements .

10: Laser processing system

11: Light source module

111: Light

12: Mobile Mechanism

13: Control unit

20: Surface to be processed

21: The first processing area

22: Second processing area

23: The third processing area

24: Processing path

241: The first processing section

242: Second processing section

243, 245: connection segment

244: The third processing section

30: Processing pattern

31: The first pattern

312: First Frontier

32: Second pattern

322: Second Frontier

33, 33': pattern adjacent area

35: The third pattern

L1, L2: length

Claims (8)

A laser processing system for laser processing a surface to be processed of a workpiece to form a processing pattern, the surface to be processed includes a first processing area and a second processing area adjacent to the first processing area , the processing pattern spans the first processing area and the second processing area, the laser processing system includes: a light source module, which provides a light to illuminate the surface to be processed, the light source module is located along a surface located on the surface to be processed. When a processing path moves relatively, the light is provided to form the processing pattern, wherein the processing path includes a first processing section located in the first processing area and a second processing section located in the second processing area; a moving mechanism , used to change the relative position between the workpiece and the light source module; and a control unit, the control unit is coupled to the moving mechanism and the light source module, the control unit controls the moving mechanism and the light source module to make The light source module moves relative to the processing path and provides the light, wherein the processing pattern includes a first pattern and a second pattern adjacent to the first pattern, and the control unit controls the light source module to operate on the first pattern. When a processing section moves relatively, the light is provided to form the first pattern on the surface to be processed, and the control unit controls the light source module to provide the light to the surface to be processed when the second processing section is relatively moved forming the second pattern; wherein a pattern adjacent area is located between the first pattern and the second pattern and includes at least a part of the first pattern and at least a part of the second pattern, the first pattern is opposite to the pattern The adjacent area also includes a plurality of first line segments, the second pattern further includes a plurality of second line segments in the adjacent area of the pattern, and the lengths of every two adjacent first line segments are different from each other, and every two adjacent first line segments have different lengths. The lengths of each of the adjacent second line segments are different from each other, one end of each of the first line segments away from the second pattern constitutes a first boundary of the adjacent area of the pattern, and each of the second line segments away from the first pattern One end forms a second boundary of the pattern adjacent area, the pattern adjacent area Also includes a plurality of adjoining points, one end of each of the first line segments away from the first pattern is connected to one of the adjoining points with another adjacent end of the second line segment away from the second pattern, and each of the The sum of the length of the first line segment and the length of the second line segment adjacent to the first line segment is equal to a distance between the first boundary and the second boundary. The laser processing system of claim 1, wherein the first boundary is parallel to the first processing section, the second boundary is parallel to the second processing section, and the distance between the first boundary and the second boundary Not more than 50% of the length of the first pattern in the first processing area along the direction perpendicular to the first processing section, and the distance between the first boundary and the second boundary is not greater than the second pattern at 50% of the length in the second processing zone in the direction perpendicular to the second processing section. The laser processing system according to claim 1, wherein the light source module is fixed to the moving mechanism, and the control unit controls the moving mechanism to drive the light source module so that the light source module relatively moves on the processing path and provide this light. The laser processing system according to claim 1, wherein the moving mechanism comprises a movable workpiece carrying platform, the workpiece is disposed on the movable workpiece carrying platform, and the control unit is coupled to the movable workpiece carrying platform, and the control unit controls the movable workpiece carrying platform to drive the workpiece so that the light source module moves relatively on the processing path and provides the light. The laser processing system according to claim 1, wherein the light source module further comprises a laser light source, a first galvanometer, a second galvanometer and a focusing lens, and the light source module transmits the laser light source A laser light is provided and sequentially modulated by the first galvanometer, the second galvanometer and the focusing lens to provide the light. The laser processing system according to claim 1, wherein the processing path further comprises a connecting section, wherein the connecting section connects the first processing section and the second processing section respectively, and the first processing section is parallel In the second processing section, the connecting section is a straight line segment, and the control unit controls the light source module not to provide the light when the connecting section moves relatively. The laser processing system of claim 1, wherein the control unit controls the time during which the light source module provides the light to adjust the lengths of each of the first line segments and each of the second line segments. A laser processing method using the laser processing system as claimed in claim 1, for performing laser processing on a surface to be processed of a workpiece to form a processing pattern, the surface to be processed includes a first processing area and a A second processing area adjacent to the first processing area, the processing pattern spans the first processing area and the second processing area, the laser processing method includes the following steps: providing the light source module for providing the light irradiation The surface to be processed, wherein the light source module provides the light to form the processing pattern when the light source module moves relatively along a processing path located on the surface to be processed, and the processing path includes a first processing section located in the first processing area and a second processing section located in the second processing area, and the processing pattern includes a first pattern and a second pattern adjacent to the first pattern; controlling the light source module to be opposite to the first processing section moving and providing the light to form the first pattern on the surface to be processed; controlling the light source module to move relatively along a connecting section connecting the first processing section and the second processing section to make the light source module move relatively to the second processing section, and control the light source module to not provide the light when the connecting section moves relatively; and control the light source module to relatively move in the second processing section and provide the light to the to-be-processed The second pattern is formed on the surface to complete the processing pattern; wherein a pattern adjacent area is located between the first pattern and the second pattern and includes at least part of the first pattern and at least part of the second pattern, the first pattern A pattern also includes a plurality of The first line segment, the second pattern further includes a plurality of second line segments in the adjacent area of the pattern, the lengths of every two adjacent first line segments are different from each other, and every two adjacent second line segments are different from each other. The lengths of the line segments are different from each other, one end of each of the first line segments away from the second pattern constitutes a first boundary of the adjacent area of the pattern, and one end of each of the second line segments away from the first pattern constitutes the adjacent area of the pattern A second boundary of the , and the sum of the lengths of the first line segment and the second line segment adjacent to the first line segment is equal to a distance between the first boundary and the second boundary.

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