TWM608519U - Laser processing system - Google Patents

Abstract

A laser processing system includes a light source module, a moving mechanism and a control unit. The control unit is coupled to the moving mechanism and the light source module, and the light source module is moved relatively along a processing path controlled by the control unit. The light source module is fixed on the moving mechanism and a processing pattern is formed by a light beam emitted from the light source module when the light source module is relatively moved along the processing path. The processing path includes a first processing section and a second processing section, and the processing pattern includes a first pattern and a second pattern, wherein a pattern-neighboring region is located between the first pattern and the second pattern, and the pattern-neighboring region includes at least parts of the first pattern and at least parts of the second pattern. The first pattern further includes a plurality of first line segments within the pattern-neighboring region and the second pattern further includes a plurality of second line segments within the pattern-neighboring region, wherein a total length of each of the first line segment and the adjacent second ling segment is equal to a pitch between two of the pattern-neighboring region’s edges.

Description

Laser processing system

This creation is about a laser processing system, especially a laser processing system that uses laser light to make patterns on the surface of the workpiece.

Laser processing technology is to pass laser light through optical components composed of multiple lenses to achieve a high degree of focus, and then use modulated laser light on the workpiece to achieve marking or engraving processing purposes. When applying the existing laser processing device or system to pattern processing of the workpiece, it is often encountered that the pattern to be processed is too large to be processed at one time, so this kind of excessive pattern must be divided into several regional segments The laser processing of the pattern can only be completed by processing, but this method of partitioning the pattern by splicing will greatly lengthen the processing time, and the final processed pattern will also see multiple dividing line segments due to splitting. The type of seam affects the quality of the pattern.

In view of the above-mentioned problems encountered by the laser processing technology, the current prior art provides some processing methods to improve the quality of the pattern. One of the methods is to match the optical components in the existing laser processing system with a high-speed scanning galvanometer (gavanometer scanner). This high-speed scanning galvanometer can rotate at a high speed in a short time to continuously change the irradiation direction of the laser light. Expand the scope of laser processing. However, although this method can reduce the number of split patterns, there is no way to eliminate the seams between the split patterns after processing. In addition, when the pattern is divided into multiple areas for processing area by area, when one area is processed, the entire laser processing module must be moved to another area before the next area can be processed. The laser processing module will often encounter constant acceleration or deceleration. Such a situation will not only lengthen the operation time, but also easily cause the deviation of the machine. After processing, the graphics of each zone will be distorted or overlapped. For one subarea, it is even necessary to perform compensation processing on the joints of the graphics in each area for correction. Therefore, there is still a need to provide a laser processing system to solve the above-mentioned problems encountered in the prior art.

The previous technology paragraph is only used to help understand the content of the creation, so the content disclosed in the previous technology paragraph may contain some conventional technologies that do not constitute the knowledge of those with ordinary knowledge in the technical field. The content disclosed in the previous technical paragraph does not represent the content or the problem to be solved by one or more embodiments of this creation, and has been known or recognized by those with ordinary knowledge in the technical field before this creation application.

Based on the shortcomings of the prior art, the purpose of this creation is to provide a laser processing system, which can reduce the visibility of the split positions between the split patterns by controlling the split mode of the processing patterns.

Another purpose of this creation is to provide a laser processing system that can effectively shorten the overall laser processing time by controlling the movement of the light source module and the splitting of the processing pattern.

To achieve the above objective, this creation provides a laser processing system to perform laser processing on a workpiece surface to be processed to form a processing pattern. The surface to be processed includes a first processing area and a second processing area adjacent to the first processing area. , The processing pattern spans the first processing area and the second processing area. The laser processing system includes a light source module, a moving mechanism and a control unit. The light source module provides light to irradiate the surface to be processed, and the light source module follows the processing path located on the surface to be processed During relative movement, light is provided to form a processing pattern. The processing path includes a first processing section located in the first processing area and a second processing section located in the second processing area. The moving mechanism is used to change the relative relationship between the workpiece and the light source module. Position, the control unit is coupled to the moving mechanism and the light source module, the control unit controls the moving mechanism and the light source module to make the light source module move relative to the processing path and provide light, the processing pattern includes a first pattern and adjacent to the first pattern The control unit controls the light source module to provide light during relative movement in the first processing section to form the first pattern on the surface to be processed, and the control unit controls the light source module to provide light when relative movement in the second processing section A second pattern is formed on the surface to be processed, wherein the adjacent area of the pattern is located between the first pattern and the second pattern and includes at least part of the first pattern and at least part of the second pattern. The first pattern is also located in the adjacent area of the pattern. It includes a plurality of first line segments, the second pattern further includes a plurality of second line segments in the adjacent area of the pattern, the lengths of every two adjacent first line segments are different from each other, and every two adjacent second line segments The lengths of each first line segment are different from each other, the end of each first line segment away from the second pattern constitutes the first boundary of the adjacent area of the pattern, the end of each second line segment away from the first pattern constitutes the second boundary of the adjacent area of the pattern, and each first The sum of the length of a line segment and the length of the second line segment adjacent to the first line segment is equal to the distance between the first boundary and the second boundary.

In a preferred embodiment, the first boundary is parallel to the first processing section, the second boundary is parallel to the second processing section, and the distance between the first boundary and the second boundary is not greater than the first pattern in the first processing area. 50% of the length in the direction perpendicular to the first processing section, and the distance between the first boundary and the second boundary is not greater than 50% of the length of the second pattern in the second processing area in the direction perpendicular to the second processing section.

In a preferred embodiment, the light source module is fixed to the moving mechanism, and the control unit controls the moving mechanism to drive the light source module to move the light source module relative to the processing path and provide light.

In a preferred embodiment, the moving mechanism includes a movable workpiece carrying platform, the workpiece is arranged on the movable workpiece carrying platform, the control unit is coupled to the movable workpiece carrying platform, and the control unit controls the movable workpiece carrying platform to drive The workpiece enables the light source module to move relative to the processing path and provide light.

In a preferred embodiment, the light source module further includes a laser light source, a first galvanometer, a second galvanometer, and a focusing lens, and the light source module provides laser light through the laser light source and sequentially passes through the first galvanometer, The second galvanometer and focusing lens are modulated to provide light.

In a preferred embodiment, the processing path further includes a connecting section which connects the first processing section and the second processing section respectively, the first processing section is parallel to the second processing section, and the connecting section is perpendicular to the first processing section and The second processing section and the control unit control the light source module not to provide light when the connecting section is relatively moved.

In a preferred embodiment, the control unit controls the time when the light source module provides light to adjust the length of each first line segment and each second line segment.

According to the above, the embodiment of this creation controls the light source module to form the first pattern and the second pattern when moving relative to each other along the first processing section and the second processing section. In addition, the processing patterns are in two adjacent areas of the pattern. The lengths of the adjacent first line segments and the two adjacent second line segments are not equal, and the sum of the length of each first line segment and the length of the second line segment adjacent to the first line segment is controlled to be equal to the first boundary and the second boundary In this way, the visibility of the split position between the first pattern and the second pattern can be reduced after the processing pattern is made, and the processing efficiency of the overall laser processing system can also be increased, and the laser processing time can be shortened.

The aforementioned and other technical content, features and effects of this creation will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, for example: up, down, left, right, front or back, etc., are only directions for referring to the attached drawings. Therefore, the directional terms used are used to illustrate and not to limit this creation.

Fig. 1 is a schematic diagram showing the operation of the laser processing system according to an embodiment of the present creation, in which the XYZ coordinate axes are only used to illustrate the present embodiment, not to limit the scope of the patent application of the present creation. 1, the laser processing system 10 is used to perform laser processing on the workpiece surface 20 to be processed to form a processing pattern 30. The laser processing system 10 includes a light source module 11, a moving mechanism 12, and a control unit 13, wherein the light source The module 11 provides light 111 to irradiate the surface 20 to be processed. The light 111 is laser light of appropriate power. The light source module moves relative to the processing path 24 on the surface 20 to be processed while providing light 111 to the surface 20 to be processed. The processing pattern 30 is formed. In detail, the surface to be processed 20 includes a first processing area 21 and a second processing area 22, and the processing path 24 includes a first processing section 241 and a second processing section 242, wherein the first processing section 241 is located in the first processing area 21, The second processing section 242 is located in the second processing area 22, and the processing pattern 30 formed by the transmitted light 111 crosses the first processing area 21 and the second processing area 22 at the same time. In addition, the surface 20 to be processed in this embodiment is a plane, but not limited to this, the surface 20 to be processed may also have a plurality of depressions or protrusions.

Please continue to refer to FIG. 1, the moving mechanism 12 is used to change the relative position between the workpiece and the light source module 11, and the control unit 13 is respectively coupled to the moving mechanism 12 and the light source module 11 to control the moving mechanism 12 and the light source module 11. In order to make the light source module 11 relatively move on the processing path 24, and control the light source module 11 to provide light 111 at the same time. In detail, the workpiece in this embodiment is fixed and does not move, the light source module 11 is fixed to the moving mechanism 12, and the control unit 13 controls the moving mechanism 12 to drive the light source module 11 to move on the surface 20 of the workpiece to be processed to show the light source module 12 Perform the above-mentioned relative movement on the processing path 24 and provide light 111, where the moving mechanism 12 is a device or device suitable for moving in a direction parallel to the surface 20 to be processed, such as a robotic arm or a sliding rail mechanism, and a light source model The group 11 is, for example, fixed to the moving mechanism 12 by screws, tenons or other appropriate means. The control unit 13 is, for example, a wired or wireless coupling to the moving mechanism 12 and the light source module 13, and the control unit 13 is, for example, a central processing unit. (Central Processing Unit, CPU), or other programmable general-purpose or special-purpose microprocessors (Microprocessor), digital signal processor (DSP), programmable controller, special application integrated Circuit (Application Specific Integrated Circuit, ASIC) or other similar components or a combination of the above components, or it can be a personal computer (PC), a tablet computer (Tablet PC), a mobile phone or other electronic devices that can be controlled remotely Equipment, this creation does not limit the fixing method of the light source module 12 and the implementation elements and methods of the control unit 13.

In an embodiment of this creation, the processing pattern 30 formed by the light 111 includes a first pattern 31 and a second pattern 32 adjacent to the first pattern 31. When the control unit 13 controls the moving device 12, the light source module 11 is When the first processing section 241 of the processing path 24 moves relatively, the control unit 13 controls the light source module 11 to provide light 111 to form the first pattern 31, and when the control unit 13 controls the moving device 12 to make the light source module 11 in the processing path 24 When the second processing section 242 moves relatively, the control unit 13 controls the light source module 11 to provide light 111 to form the second pattern 32. As shown in FIG. 1, the processing pattern 30 in this embodiment is, for example, a strip pattern, but the processing pattern 30 can be any pattern or aspect that can be formed by laser processing.

FIG. 2 is a schematic diagram showing the structure of the light source module according to the embodiment of FIG. 1. 1 and 2, the light source module 11 includes a laser light source 112, a first galvanometer 113, a second galvanometer 114, and a focusing lens 115, where the laser light source 112 is, for example, a fiber laser light source, an ultraviolet laser light source Or other laser light sources that can provide sufficient power. The first galvanometer 113 and the second galvanometer 114 are high-speed scanning galvanometers, and the focusing lens 115 may be an F-theta lens (also called a flat field lens). In this embodiment, the light source module 11 provides the initial laser light through the laser light source 112. The first galvanometer 113 and the second galvanometer 114 are used to adjust the deflection direction of the initial laser light. For example, the first galvanometer 113 controls the light 111 For the deflection in the X-axis direction, the second galvanometer 114 controls the deflection of the light 111 in the Y-axis direction, and then the focusing lens 115 condenses the deflected initial laser light. In this way, the initial laser light passes through the first galvanometer 113, The deflection of the second galvanometer 114 and the adjustment of the focusing lens 115 to form a light 111, through which the light 111 can form a processing pattern 30 composed of multiple parallel laser scanning line segments on the surface 20 to be processed.

Fig. 3 is a top view showing the adjacent area of the pattern according to the embodiment of Fig. 1. Please refer to Fig. 1, Fig. 2 and Fig. 3, where the XYZ coordinate axis is only used to illustrate this embodiment, not to limit the scope of patent application for this creation. Since the size of the processed pattern 30 exceeds the deflection limit of the first galvanometer 113 and the second galvanometer 114 in the light source module 11, the processing pattern 30 is divided into the first pattern 31 and the second pattern in this embodiment. 32. The processing pattern 30 is split, for example, through the existing CAD/CAM software planning pattern splitting method and then input to the control unit 13, wherein the pattern adjacent area 33 is located between the first pattern 31 and the second pattern 32 and includes at least Part of the first pattern 31 and at least part of the second pattern 32. The processing pattern 30 is composed of a plurality of parallel laser scanning line segments. Therefore, the first pattern 31 includes a plurality of first line segments 311 in the pattern adjacent area 33, and the second pattern 32 is in the pattern adjacent area 33 It also includes a plurality of second line segments 321, wherein the lengths of every two adjacent first line segments 311 are different from each other, and the lengths of every two adjacent second line segments 321 are different from each other. As a result, in the pattern adjacent area 33, the edge of the first pattern 31 will show an irregular shape due to the different lengths of the two adjacent first line segments 311, and the edge of the second pattern 32 will also be irregular due to the two adjacent first line segments 311. The lengths of the adjacent second line segments 321 are different and present an irregular shape. When viewing the completed processing pattern 30, the first pattern 31 will visually appear to be disconnected from the split of the second pattern 32. The stitching of seams without observing obvious seams or overlaps, even if the laser processing system 10 has a small processing angle deviation during processing, the visual effect of the processing pattern 30 will not be affected.

In the pattern adjacent area 33, the end of each first line segment 311 adjacent to the first pattern 31 constitutes the first boundary 312 of the pattern adjacent area 33, and the end of each second line segment 321 adjacent to the second pattern 32 constitutes the pattern adjacent area 33 Each of the first line segment 311 and each second line segment 321 is a straight line segment. In addition, the pattern adjacent area 33 also includes a plurality of adjacent points 34. Each end of the first line segment 311 away from the first pattern 31 is adjacent to the end of another adjacent second line segment 321 away from the second pattern 32. 34, and the sum of the length L311 of each first line segment 311 and the length L321 of the second line segment 321 adjacent to the first line segment 311 is equal to the distance D between the first boundary 312 and the second boundary 322, so that The irregular split position between the first pattern 31 and the second pattern 32, that is, each adjacent point 34 will be limited to the pattern adjacent area 33, so the irregular pattern split position will not make the viewer in It is too obvious visually, which can reduce the visibility of the separation position of the first pattern 31 and the second pattern 32 in the visually processed pattern 30.

Please continue to refer to FIGS. 1 and 3, the first boundary 312 and the second boundary 321 of the pattern adjacent area 33 are not actually line segments in the processing pattern 30, but are used to plan and control the first boundary in the pattern adjacent area 33. The length of the line segment 311 and the second line segment 321. The first boundary 312 is parallel to the first processing section 241 of the processing path 24, and the second boundary 322 is parallel to the second processing section 242 of the processing path 24. In this embodiment, the first processing section 241 and the second processing section 242 are planned It is parallel to the X-axis direction. In addition, the length of the first pattern 31 in the direction perpendicular to the first processing section 241 in the first processing area 21 is L1, and the length of the second pattern 32 in the direction perpendicular to the second processing section 242 in the second processing area 22 It is L2, where the distance D between the first border 312 and the second border 322 in the adjacent pattern area 33 is not more than 50% of the length L1, and the distance D is not more than 50% of the length L2. In this embodiment, the distance D and the lengths L1 and L2 are parallel to the Y-axis direction. Since the distance D is less than 50% of the length L1 and 50% of the length L2, respectively, the first pattern 31 and the second pattern can be controlled. The split position between 32 is adjacent to the junction of the first processing area 21 and the second processing area 22, so as not to make the light 111 emitted by the light source module 11 difficult to pattern the first line segment 311 or the first line segment 311 of the adjacent area 33 Two line segment 321. In addition, the first line segment 311 and the second line segment 321 are planned as line segments parallel to the Y-axis direction, because the processing pattern 30 is split into the first pattern 31 and the second pattern 32, and the light source module is respectively along the first processing area 21 The first processing section 241 on the upper and the second processing section 242 on the second processing area 22 provide the light 111 for processing. Therefore, this processing method combined with the size design of the adjacent area 33 of the pattern can make the entire processing pattern 30 split. The number of positions is greatly reduced, which effectively shortens the overall laser processing time.

1 and 3, the processing path 24 also includes a connecting section 243, which connects the first processing section 241 and the second processing section 242 respectively, wherein the first processing section 241 is parallel to the second processing section 242. In the embodiment, the control unit 13 controls the light source module 11 and the moving mechanism 12 to make the light source module 11 relatively move along the first processing section 241, the connecting section 243 and the second processing section 242 in sequence. Since the first processing section 241 is parallel to the second processing section 242, the difficulty of planning the splitting of the processing pattern 30 and the design difficulty of the processing path 24 can be reduced. In addition, the connecting section 243 is a straight line segment. In this embodiment, for example, it is a straight line segment parallel to the Y-axis direction, and the control unit 13 controls the light source module 11 to not provide light 111 when the connecting section 243 moves relative to avoid additional light. 111 causes interference to the adjacent area 33 of the pattern, so that the light source module 11 can relatively move to the second processing section 242 in the shortest time, which can shorten the operation time of the overall processing flow. In addition, this embodiment does not limit the relative movement of the light source module 11 along the first processing section 241, the connecting section 243, and the second processing section 242 in sequence. The light source module 11 and the moving mechanism 12 can also be controlled to make the light source module 11 The production of the processing pattern 30 is performed by relative movement along the order of the second processing section 242, the connecting section 243, and the first processing section 241, and the creation is not limited to this.

Please continue to refer to Figures 1, 2 and 3, when the control unit 13 controls the light source module 11 to move relative to the first processing section 241 and the second processing section 242, the control unit 13 will also control the light source module 11 to provide light 111 time to adjust the length of each first line segment 311 and each second line segment 321, in this way, a split design in which the processing pattern 30 is divided into the first pattern 31 and the second pattern 32 can be achieved. In detail, in this embodiment, the lengths of every two adjacent first line segments 311 are different from each other, and the lengths of every two adjacent second line segments 321 are also different from each other. The control unit 13 may preset each first line segment 311. The length of a line segment 311 and each second line segment 321, and by controlling the luminous irradiation time of the laser light source 112 when the first galvanometer 113 and the second galvanometer 114 rotate, each first line segment can be precisely controlled 311 and each second line segment 321 reach a predetermined length.

The first processing section 241, the second processing section 242, and the connecting section 243 of the foregoing embodiment are straight line segments. The first processing section 241 and the second processing section 242 are planned to be parallel to the X-axis direction. The second line segment 321 is planned to be parallel to the Y-axis direction. However, the first processing segment 241, the second processing segment 242 and the connecting segment 243 can also be planned as non-straight line segments according to the shape of the processing pattern 30, and the first processing segment 241 can be planned as It is not perpendicular to the first line segment 311, and the second processing section 242 can be planned to be not perpendicular to the second line segment 321 to increase the flexibility of pattern split planning. In addition, in the foregoing embodiment, the processing pattern 30 is planned and divided into the first pattern 31 and the second pattern 32. The processing pattern 30 spans the first processing area 21 and the second processing area 22, and runs along the first processing section 241 and the second processing area 22 respectively. The second processing section 242 produces the first pattern 31 and the second pattern 32. However, this creation can also plan a larger number of processing depending on the size of the processing pattern and the deflection angle of the first galvanometer and the second galvanometer in the light source module. Area and processing path, and the processing pattern is planned with existing software and divided into corresponding number of sub-patterns to reduce the difficulty of making the processing pattern. Each sub-pattern is similar to the first or second pattern of the foregoing embodiment and is located in two adjacent Among the processing areas, the splitting method and processing method of each sub-pattern therein are substantially the same as the achievable technical effects of the previous embodiment, and will not be repeated here.

Please continue to refer to FIG. 1, in another embodiment, the surface to be processed 30 further includes a third processing area 23, and the processing path 24 further includes a third processing section 244 and a connecting section 245. Both ends of the connecting section 245 are respectively connected to the first In the second processing section 242 and the third processing section 244, the processing pattern 30 formed by the transmitted light 111 also spans to the third processing area 23, that is, the processing pattern 30 is split into the first pattern 31, the second pattern 32, and the third pattern 35 , And the number of pattern adjacent regions 33 is two, which are respectively located between the first pattern 31 and the second pattern 32, and between the second pattern 32 and the third pattern 35. That is to say, the method of making the processing pattern 30 and pattern splitting can flexibly correspond to the configuration of the laser processing system 10, or the deflection limit of each galvanometer in the light source module 11 to the angle of light, while passing through the existing CAD/CAM The software plan divides the processing pattern 30 into 3 or more than 3, and the control unit 13 can also be set to control the light source module 11 to move relative to the second processing section 242 and provide light 111 at the same time to complete the production of the second pattern 32 After that, the light source module 11 is controlled to relatively move along the connecting section 245 to the third processing section 244 to continue to provide the light 111 to continue the production of the third pattern 35, and then the production of the processing pattern 30 is completed. In addition, in this embodiment, the control unit 13 controls the light source module 11 and the moving mechanism 12 to make the light source module 11 follow the first processing section 241, the connecting section 243, the second processing section 242, the connecting section 245, and the third processing in sequence. The section 244 performs relative movement, but the control unit 13 can also control the light source module 11 and the moving mechanism 12 to make the light source module 11 move along the third processing section 244, the connecting section 245, the second processing section 242, the connecting section 243, and the first processing section. The sequence of the segments 241 is relatively moved to produce the processing pattern 30, and the creation is not limited to this. In addition, in this embodiment, the pattern adjacent region 33 is located between the first pattern 31 and the second pattern 32 and includes at least part of the first pattern 31 and at least part of the second pattern 32, and the pattern adjacent region 33' is located in the first pattern 31 and the second pattern 32. Between the second pattern 32 and the third pattern 35 and including at least part of the second pattern 32 and at least part of the third pattern 35, the pattern and manufacturing method of the adjacent pattern area 33' are approximately the same as those of the pattern adjacent area 33 described above. The same is not repeated here.

Fig. 4 is a schematic diagram showing the working of the laser processing system according to another embodiment of the present creation, in which the XYZ coordinate axis is only used to illustrate the present embodiment, and is not used to limit the scope of the patent application of the present creation. The laser processing system 10A of this embodiment is similar to the laser processing system 10, and the same components or equipment are denoted by the same reference numerals, which will not be repeated here. The difference between the laser processing system 10A and the laser processing system 10 is that the moving mechanism of the laser processing system 10A includes a movable workpiece carrying platform 14, and the light source module 11 maintains its position through a clamping tool 15, wherein the workpiece 200 It is arranged on the movable workpiece carrying platform 14 so that the light source module 11 provides light 111 to the surface 20 to be processed to produce the processing pattern 30. In this embodiment, the control unit 13 is also coupled to the movable workpiece carrying platform 14, and the control unit 13 drives the workpiece 200 by controlling the movable workpiece carrying platform 14 so that the light source module 11 is in the processing path (not shown in the figure). 4) Perform relative movement on top and provide light 111. For example, the movable workpiece carrying platform 14 has a plurality of slide rails and can be driven by a motor system to move on a plane parallel to the XY plane, and the workpiece 200 is held by a fixture or a fastener to keep the workpiece 200 away from the workpiece carrying platform. 14 to move, the clamping tool 15 is, for example, a fixed cantilever to keep the position of the light source module 11 in place. In this way, the workpiece 200 can be driven by the movable workpiece carrying platform 14 so that the light source module 11 can move relatively along the processing path. To implement the production of the processing pattern 30. Since this embodiment uses the movable workpiece carrying platform 14 to move the workpiece 200 by fixing the position of the light source module 11 to show the relative movement of the light source module 11 on the surface 20 to be processed, when the light source module 11 provides light 111 It can have better output stability, thereby improving the final production quality of the processed pattern 30.

In addition, in another embodiment, the laser processing system 10A can also be equipped with the moving mechanism 12 in the laser processing system 10 at the same time, so that it can simultaneously cooperate with the movement of the movable workpiece carrying platform 14 to achieve a light source model. The group 11 moves relative to the processing path. Since the light source module 11 and the workpiece 20 can move in a direction parallel to the XY plane at the same time, the production efficiency of the processing pattern 30 on the surface 20 to be processed can be improved.

Fig. 5 is a flow chart showing the laser processing method of the laser processing system according to another embodiment of this creation. The laser processing method in this embodiment can be implemented in conjunction with the laser processing system 10 or 10A of the previous embodiment. The processing method includes the following steps. Please refer to FIG. 5 in conjunction with FIG. 1, where the surface to be processed 20 includes a first processing area 21 and a second processing area 22 adjacent to the first processing area 21. The predetermined processing pattern 30 spans the first processing area 21 and the second processing area 21. Processing area 22. Step S101: Provide a light source module to provide light to irradiate the surface to be processed, wherein the light source module provides light to form a processing pattern when relatively moving along the processing path of the surface to be processed. The processing path includes the first processing in the first processing area. The segment and the second processing segment located in the second processing area, and the processing pattern includes a first pattern and a second pattern adjacent to the first pattern. In this step, the control unit 13 controls the light source module 11 to provide light 111 to illuminate the surface 20 to be processed.

Please continue to refer to FIG. 5 in conjunction with FIG. 1 or FIG. 4, step S102: control the light source module to move relatively along the first processing section, and provide light to form a first pattern on the surface to be processed. In this step, the light source module 11 in the laser processing system 10 is fixed to the moving mechanism 12, and the moving mechanism 12 drives the light source module 11 to move relative to the first processing section 241 without moving the surface 20 to be processed. In the laser processing system 10A, the workpiece 200 is set on the moving mechanism, that is, the movable workpiece carrying platform 14. The control unit 13 controls the movable workpiece carrying platform 14 to move so that the light source module 11 is moved along the first processing section Relative movement. The light source module 11 also provides light 111 at the same time to form the first pattern 31 on the first processing area 21.

Please continue to refer to FIG. 5 in conjunction with FIG. 1 or FIG. 4, step S103: control the light source module to move relative to the connecting section connecting the first processing section and the second processing section to move the light source module to the second processing section. And control the light source module to not provide light when the connecting section is relatively moved. In this step, the light source module 11 of the laser processing system 10 changes the direction of movement through the moving mechanism 12 after completing the processing operation on the first processing section 241, and relatively moves along the connecting section 243, and the laser processing system 10A In this case, the movable workpiece carrying platform 14 changes the moving direction after the light source module 11 completes the processing operation of the first processing section, so that the light source module 11 relatively moves along the connecting section. The control unit 13 also controls the light source module 11 to not provide the light 111 when moving relative to the second processing section 242 along the connecting section 243.

Please continue to refer to FIG. 5 in conjunction with FIG. 1, FIG. 3, and FIG. 4. Step S104: Control the light source module to move relative to the second processing section, and provide light to form a second pattern on the surface to be processed to complete the processing pattern. In this step, the moving mechanism 12 of the laser processing system 10 drives the light source module 11 to move relative to the second processing section 242 without moving the surface 20 to be processed. In the laser processing system 10A, the control unit 13 The movable workpiece carrying platform 14 is controlled to move, so that the light source module 11 is relatively moved along the second processing section. The control unit 13 also controls the light source module 11 to provide light 111 at the same time to form the second pattern 32 on the second processing area 22, so that the production of the processing pattern 30 can be completed.

In the processed pattern 30 produced according to the creation steps S101 to S104, the pattern adjacent area 33 is located between the first pattern 31 and the second pattern 32 and includes at least part of the first pattern 31 and part of the second pattern 32 , The first pattern 31 includes a plurality of first line segments 311 in the pattern adjacent area 33, the second pattern includes a plurality of second line segments 321 in the pattern adjacent area 33, and every two adjacent first line segments 311 The lengths of each two adjacent second line segments 321 are different from each other, and the end of each first line segment 311 away from the second pattern 32 constitutes the first boundary 312 of the adjacent area 33 of the pattern. The end of the two line segments 321 away from the first pattern 31 constitutes the second boundary 322 of the adjacent area 33 of the pattern, and the sum of the length L311 of each first line segment 311 and the length L321 of the second line segment 321 adjacent to the first line segment 311 is equal to Spacing D. The technical effect that can be achieved by the laser processing method of this embodiment is substantially the same as that of the foregoing embodiment, and will not be repeated here.

In summary, in the laser processing system disclosed in this creation, the processing pattern includes a first pattern and a second pattern adjacent to the first pattern, and the light source module moves relative to each other in the first processing section and the second processing section. When light is provided to form the first pattern and the second pattern in the processing pattern respectively, in addition, the lengths of each two adjacent first line segments and each two adjacent second line segments in the adjacent area of the processing pattern are not equal, so First, the visibility of the split position between the first pattern and the second pattern can be reduced after the processing pattern is produced, and the processing efficiency of the overall laser processing system can also be increased, and the laser processing time can be shortened.

However, the above are only the preferred embodiments of this creation, and should not be used to limit the scope of implementation of this creation, that is, all simple equivalent changes and modifications made according to the scope of patent application and new content of this creation are all It is still within the scope of this creation patent. In addition, the terms "first" and "second" mentioned in this specification or the scope of the patent application are only used to name the names of elements or to distinguish different embodiments or ranges, and are not used to limit the upper or lower limit of the number of elements .

10.10A: Laser processing system 11: Light source module 111: light 112: Laser light source 113: The first galvanometer 114: second galvanometer 115: focusing lens 12: Mobile agency 13: Control unit 14: Movable workpiece carrying platform 15: Clamping tool 20: Surface to be processed 200: Workpiece 21: The first processing area 22: The second processing area 23: The third processing area 24: Processing path 241: The first processing section 242: The second processing section 243, 245: connection section 244: The third processing section 30: Processing pattern 31: The first pattern 311: first line segment 312: First Boundary 32: The second pattern 321: second line segment 322: second boundary 33, 33’: Pattern adjacent area 34: The adjacent point of the first line segment and the second line segment 35: The third pattern D: spacing L1, L2, L311, L321: length S101~S104: steps

Fig. 1 is a schematic diagram showing the operation of a laser processing system according to an embodiment of the present creation;

2 is a schematic diagram showing the structure of a light source module according to the embodiment of FIG. 1;

FIG. 3 is a top view showing the adjacent area of the pattern according to the embodiment of FIG. 1; FIG.

Figure 4 is a schematic diagram showing the operation of the laser processing system according to another embodiment of the present creation; and

Fig. 5 is a flowchart showing a laser processing method of a laser processing system according to another embodiment of the present creation.

10: Laser processing system

11: Light source module

111: light

12: Mobile agency

13: Control unit

20: Surface to be processed

21: The first processing area

22: The second processing area

23: The third processing area

24: Processing path

241: The first processing section

242: The second processing section

243, 245: connection section

244: The third processing section

30: Processing pattern

31: The first pattern

312: First Boundary

32: The second pattern

322: second boundary

33, 33’: Pattern adjacent area

35: The third pattern

L1, L2: length

Claims (7)

A laser processing system for laser processing a surface to be processed of a workpiece to form a processing pattern. The surface to be processed includes a first processing area and a second processing area adjacent to the first processing area , The processing pattern spans the first processing area and the second processing area, and the laser processing system includes: A light source module provides a light to irradiate the surface to be processed, and when the light source module relatively moves along a processing path on the surface to be processed, provides the light to form the processing pattern, wherein the processing path includes A first processing section in a processing area and a second processing section in the second processing area; A moving mechanism for changing the relative position between the workpiece and the light source module; and A control unit coupled to the moving mechanism and the light source module, the control unit controls the moving mechanism and the light source module to make the light source module move relative to the processing path and provide the light, wherein the The processing pattern includes a first pattern and a second pattern adjacent to the first pattern. The control unit controls the light source module to provide the light when the first processing section moves relatively to form the surface to be processed. A first pattern, and the control unit controls the light source module to provide the light when relative movement of the second processing section is performed to form the second pattern on the surface to be processed; One of the adjacent areas of the pattern is located between the first pattern and the second pattern and includes at least part of the first pattern and at least part of the second pattern. The first pattern further includes a plurality of areas in the adjacent area of the pattern. A first line segment, the second pattern further includes a plurality of second line segments in the adjacent area of the pattern, the lengths of every two adjacent first line segments are different from each other, and every two adjacent first line segments The lengths of the two line segments are different from each other. The end of each first line segment away from the second pattern constitutes a first boundary of the adjacent area of the pattern, and the end of each second line segment away from the first pattern constitutes the adjacent pattern of the pattern. A second boundary of the area, and the sum of the length of each first line segment and the length of the second line segment adjacent to the first line segment is equal to a distance between the first boundary and the second boundary. The laser processing system according to claim 1, wherein the first boundary is parallel to the first processing section, the second boundary is parallel to the second processing section, and the distance between the first boundary and the second boundary Not more than 50% of the length of the first pattern in the first processing area along the direction perpendicular to the first processing section, and the distance between the first boundary and the second boundary is not greater than the distance between the second pattern 50% of the length in the second processing area along the direction perpendicular to the second processing section. The laser processing system according to claim 1, wherein the light source module is fixed to the moving mechanism, and the control unit controls the moving mechanism to drive the light source module to move the light source module relative to the processing path and Provide that light. The laser processing system according to claim 1, wherein the moving mechanism includes a movable workpiece carrying platform, the workpiece is arranged on the movable workpiece carrying platform, and the control unit is coupled to the movable workpiece carrying platform, And the control unit controls the movable workpiece carrying platform to drive the workpiece to make the light source module move relative to the processing path and provide the light. The laser processing system according to claim 1, wherein the light source module further includes a laser light source, a first galvanometer, a second galvanometer, and a focusing lens, and the light source module transmits through the laser light source A laser light is provided and sequentially passes through the modulation of the first galvanometer, the second galvanometer and the focusing lens to provide the light. The laser processing system according to claim 1, wherein the processing path further includes a connecting section, wherein the connecting section connects the first processing section and the second processing section respectively, and the first processing section is parallel to the second processing section. In the processing section, the connecting section is a straight line section, and the control unit controls the light source module to not provide the light when the connecting section is relatively moved. The laser processing system according to claim 1, wherein the control unit controls the time for the light source module to provide the light to adjust the length of each of the first line segments and each of the second line segments.

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