CN113380614A - 一种晶圆减薄方法 - Google Patents
一种晶圆减薄方法 Download PDFInfo
- Publication number
- CN113380614A CN113380614A CN202110645550.9A CN202110645550A CN113380614A CN 113380614 A CN113380614 A CN 113380614A CN 202110645550 A CN202110645550 A CN 202110645550A CN 113380614 A CN113380614 A CN 113380614A
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- CN
- China
- Prior art keywords
- wafer
- thickness
- substrate
- thinning
- colloid layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 73
- 239000000084 colloidal system Substances 0.000 claims abstract description 43
- 239000003292 glue Substances 0.000 claims description 37
- 239000000843 powder Substances 0.000 claims description 33
- 239000011248 coating agent Substances 0.000 claims description 29
- 238000000576 coating method Methods 0.000 claims description 29
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 8
- 238000005498 polishing Methods 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- 229910052681 coesite Inorganic materials 0.000 claims description 6
- 229910052906 cristobalite Inorganic materials 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- 238000002791 soaking Methods 0.000 claims description 6
- 229910052682 stishovite Inorganic materials 0.000 claims description 6
- 229910052905 tridymite Inorganic materials 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 238000012544 monitoring process Methods 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 119
- 238000000926 separation method Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000013467 fragmentation Methods 0.000 description 2
- 238000006062 fragmentation reaction Methods 0.000 description 2
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110645550.9A CN113380614B (zh) | 2021-06-10 | 2021-06-10 | 一种晶圆减薄方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110645550.9A CN113380614B (zh) | 2021-06-10 | 2021-06-10 | 一种晶圆减薄方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113380614A true CN113380614A (zh) | 2021-09-10 |
CN113380614B CN113380614B (zh) | 2023-04-07 |
Family
ID=77573439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110645550.9A Active CN113380614B (zh) | 2021-06-10 | 2021-06-10 | 一种晶圆减薄方法 |
Country Status (1)
Country | Link |
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CN (1) | CN113380614B (zh) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102044428A (zh) * | 2009-10-13 | 2011-05-04 | 中芯国际集成电路制造(上海)有限公司 | 晶圆的减薄方法 |
CN102377406A (zh) * | 2010-07-08 | 2012-03-14 | 精工电子有限公司 | 带贯通电极的玻璃基板的制造方法及电子部件的制造方法 |
JP2013243174A (ja) * | 2012-05-17 | 2013-12-05 | Tokyo Ohka Kogyo Co Ltd | 支持体 |
CN103907175A (zh) * | 2011-10-21 | 2014-07-02 | 皇家飞利浦有限公司 | 通过使用有槽的衬底的低翘曲晶片结合 |
CN105457843A (zh) * | 2016-01-18 | 2016-04-06 | 武汉华星光电技术有限公司 | 光阻涂布装置及光阻涂布方法 |
CN105551943A (zh) * | 2016-02-26 | 2016-05-04 | 上海华力微电子有限公司 | 晶圆背面减薄方法 |
US10134635B1 (en) * | 2013-11-18 | 2018-11-20 | Amkor Technology, Inc. | Stress relieving through-silicon vias |
CN111216034A (zh) * | 2020-02-26 | 2020-06-02 | 中国科学院微电子研究所 | 一种半导体器件及其制作方法 |
-
2021
- 2021-06-10 CN CN202110645550.9A patent/CN113380614B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102044428A (zh) * | 2009-10-13 | 2011-05-04 | 中芯国际集成电路制造(上海)有限公司 | 晶圆的减薄方法 |
CN102377406A (zh) * | 2010-07-08 | 2012-03-14 | 精工电子有限公司 | 带贯通电极的玻璃基板的制造方法及电子部件的制造方法 |
CN103907175A (zh) * | 2011-10-21 | 2014-07-02 | 皇家飞利浦有限公司 | 通过使用有槽的衬底的低翘曲晶片结合 |
JP2013243174A (ja) * | 2012-05-17 | 2013-12-05 | Tokyo Ohka Kogyo Co Ltd | 支持体 |
US10134635B1 (en) * | 2013-11-18 | 2018-11-20 | Amkor Technology, Inc. | Stress relieving through-silicon vias |
CN105457843A (zh) * | 2016-01-18 | 2016-04-06 | 武汉华星光电技术有限公司 | 光阻涂布装置及光阻涂布方法 |
CN105551943A (zh) * | 2016-02-26 | 2016-05-04 | 上海华力微电子有限公司 | 晶圆背面减薄方法 |
CN111216034A (zh) * | 2020-02-26 | 2020-06-02 | 中国科学院微电子研究所 | 一种半导体器件及其制作方法 |
Also Published As
Publication number | Publication date |
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CN113380614B (zh) | 2023-04-07 |
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Address after: Building 4, No. 157, Shipai Section, Dongyuan Avenue, Shipai Town, Dongguan City, Guangdong Province, 523000 Applicant after: Dongguan Ansheng Semiconductor Technology Co.,Ltd. Applicant after: DONGGUAN MENTECH OPTICAL & MAGNETIC Co.,Ltd. Address before: 510700 room 410, building a, No. 18, Kexue Avenue, Huangpu District, Guangzhou City, Guangdong Province Applicant before: Guangzhou Ansheng Semiconductor Technology Co.,Ltd. Applicant before: DONGGUAN MENTECH OPTICAL & MAGNETIC Co.,Ltd. |
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