CN113370602A - 一种铝箔盖板及其制备方法 - Google Patents

一种铝箔盖板及其制备方法 Download PDF

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CN113370602A
CN113370602A CN202011429903.3A CN202011429903A CN113370602A CN 113370602 A CN113370602 A CN 113370602A CN 202011429903 A CN202011429903 A CN 202011429903A CN 113370602 A CN113370602 A CN 113370602A
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aluminum foil
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CN113370602B (zh
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刘康
李雪顺
阙玉环
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Yantai Liuxin New Material Technology Co ltd
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Abstract

本发明公开了一种铝箔盖板及其制备方法，其中，所述制备方法包括步骤：将石粉、木纤维以及可降解高分子材料进行混合后再压延成型，制得复合材料纸；将铝箔与胶层以及所述复合材料纸按照从下至上的顺序依次层叠并进行热压处理，制得所述铝箔盖板。本发明提供的铝箔盖板由导电层、胶层以及复合材料纸组成，所述铝箔盖板的主要创新点在其面层由复合材料纸代替，所述复合材料纸由石粉，木纤维，可降解高分子材料组成，因其表面柔软，其钻孔时有很好的抓针能力，提高了钻孔精度，同时因其中有石粉，能润滑钻头，吸收钻孔时产生的高热量，保护了钻针，提高钻针排屑能力，防止塞孔。

Description

一种铝箔盖板及其制备方法
技术领域
本发明涉及PCB板钻孔技术领域，尤其涉及一种铝箔盖板及其制备方法。
背景技术
盖板是印制电路板(PCB)机械钻孔时置于代加工板的上面，以满足加工工艺要求的材料。盖板的主要功效是保护PCB表面，既保护电路板表面防止划伤或划痕，又抑制电路板表面的出口性披锋，提高钻孔精度。
PCB背钻技术通常采用高频电子感应原理钻机进行钻孔背钻加工，依靠钻针下钻时，钻针尖接触金属面时产生的微电流来感应板面高度位置，再依据设定的下钻深度进行下钻，在达到下钻深度时停止下钻。现在市场上背钻盖板有单面覆铜箔盖板、单面覆铜环氧盖板、单面覆铝箔盖板、铝箔叠合冷冲板。
目前所使用的背钻铝箔板大多数是由漂白木浆纸或是牛皮纸浸渍酚醛树脂或是脲醛树脂等树脂，然后与铝箔进行热压而成，这些背钻铝箔板制备工艺繁琐，压制时间较长不利于提高生产效率，并且钻孔时易产生塞孔缺陷，因面层使用树脂跟漂白木浆纸或是牛皮纸浸渍而成，其钻孔精度并不高，且不利于环保。
因此，现有技术还有待于改进。
发明内容
鉴于上述现有技术的不足，本发明的目的在于提供一种铝箔盖板及其制备方法，旨在解决现有铝箔盖板的钻孔排屑能力较差、易塞孔的问题。
本发明的技术方案如下：
一种铝箔盖板的制备方法，其中，包括步骤：
将石粉、木纤维以及可降解高分子材料进行混合后再压延成型，制得复合材料纸；
将铝箔与胶层以及所述复合材料纸按照从下至上的顺序依次层叠并进行热压处理，制得所述铝箔盖板。
所述铝箔盖板的制备方法，其中，包括步骤：
按重量份计将30-40份的石粉、10-30份的木纤维以及40-50份的可降解高分子材料进行混合后再压延成型，制得所述复合材料纸。
所述的铝箔盖板的制备方法，其中，所述石粉为碳酸钙粉，所述可降解高分子材料为聚酯类材料或聚氨酯材料。
所述铝箔盖板的制备方法，其中，所述胶层为高分子膜层或热塑型树脂层。
所述铝箔盖板的制备方法，其中，所述高分子膜层为PET膜、PP膜或LDPE膜中的一种。
所述铝箔盖板的制备方法，其中，所述热塑型树脂层为丙烯酸类树脂层、乙烯醋酸树脂层或聚烯烃树脂层中的一种。
所述铝箔盖板的制备方法，其中，所述热压处理的步骤包括：在温度为130-160℃，压力为5-8Mpa的条件下压制60-80min；在20-50℃温度下冷却35-45min。
所述铝箔盖板的制备方法，其中，所述铝箔的厚度为0.01mm-0.14mm。
所述铝箔盖板的制备方法，其中，所述胶层的厚度为0.03-0.08mm；所述复合材料纸的厚度为0.03-0.08mm。
一种铝箔盖板，其中，采用本发明所述铝箔盖板的制备方法制得。
有益效果：本发明提供的铝箔盖板由导电层、胶层以及复合材料纸组成，所述铝箔盖板的主要创新点在其面层由复合材料纸代替，所述复合材料纸由石粉，木纤维，可降解高分子材料组成，因其表面柔软，其钻孔时有很好的抓针能力，提高了钻孔精度，同时因其中有石粉，能润滑钻头，吸收钻孔时产生的高热量，保护了钻针，提高钻针排屑能力，防止塞孔。
附图说明
图1为本发明一种铝箔盖板的制备方法较佳实施例的流程图。
图2为实施例1制得的铝箔盖板用于PCB钻孔时的孔口展示图。
图3为现有覆膜铝片盖板用于PCB钻孔时的孔口展示图。
具体实施方式
本发明提供一种铝箔盖板及其制备方法，为使本发明的目的、技术方案及效果更加清楚、明确，以下对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
请参阅图1，图1为本发明一种铝箔盖板的制备方法较佳实施例的流程图，如图所示，其包括步骤：
S10、将石粉、木纤维以及可降解高分子材料进行混合后再压延成型，制得复合材料纸；
S20、将铝箔与胶层以及所述复合材料纸按照从下至上的顺序依次层叠并进行热压处理，制得所述铝箔盖板。
通过本实施例方法制得的铝箔盖板由导电层、胶层以及复合材料纸组成，所述铝箔盖板的主要创新点在其面层由复合材料纸代替，所述复合材料纸由石粉，木纤维，可降解高分子材料组成，因其表面柔软，其钻孔时有很好的抓针能力，提高了钻孔精度，同时因其中有石粉，能润滑钻头，吸收钻孔时产生的高热量，保护了钻针，提高钻针排屑能力，防止塞孔。
在一些实施方式中，按重量份计将30-40份的石粉、10-30份的木纤维以及40-50份的可降解高分子材料进行混合后再压延成型，制得所述复合材料纸。本实施例在复合材料纸中添加了石粉，所述石粉能够润滑钻头，吸收钻孔时产生的高热量，既保护了钻针，又提高了钻针排屑能力，防止塞孔。
在一些具体的实施方式中，所述石粉为碳酸钙粉，但不限于此。
在一些具体的实施方式中，所述可降解高分子材料为聚酯类材料或聚氨酯材料，但不限于此。
在一些实施方式中，所述胶层为高分子膜层或热塑型树脂层。本实施例中的胶层为高分子膜层，或者为热塑性树脂层，其钻孔后可将铝箔盖板的铝箔层与复合材料纸分离，有利于后期垫板的处理以及环境的保护。
在一些具体的实施方式中，所述高分子膜层为PET膜、PP膜或LDPE膜中的一种，但不限于此。
在一些实施方式中，所述热塑型树脂层为丙烯酸类树脂层、乙烯醋酸树脂层或聚烯烃树脂层中的一种，但不限于此。
在一些实施方式中，将铝箔与胶层以及所述复合材料纸按照从下至上的顺序依次层叠并放入层压机中进行热压处理，所述热压处理的步骤包括：在温度为130-160℃，压力为5-8Mpa的条件下压制60-80min；在20-50℃温度下冷却35-45min，最终制得所述铝箔盖板。
在一些实施方式中，所述铝箔要求厚度均匀，无针空、杂质。作为举例，所述铝箔的厚度为0.01mm-0.14mm。
在一些实施方式中，所述胶层的厚度为0.03-0.08mm，但不限于此。
在一些实施方式中，所述复合材料纸的厚度为0.03-0.08mm，但不限于此。
在一些实施方式中，还提供一种铝箔盖板，其采用本发明所述铝箔盖板的制备方法制得。
下面通过具体实施例对本发明一种铝箔盖板及其制备方法做进一步的解释说明：
实施例1
一种铝箔盖板的制备方法，其包括以下步骤：
1、按重量份计将30份的石粉、20份的木纤维以及50份的可降解高分子材料进行混合后再压延成型，制得所述复合材料纸；
2、将铝箔与PET膜以及所述复合材料纸按照从下至上的顺序依次层叠并放入层压机中进行热压处理，所述热压处理的步骤包括：在温度为160℃，压力为6Mpa的条件下压制70min；在50℃温度下冷却40min，最终制得所述铝箔盖板。
实施例2
一种铝箔盖板的制备方法，其包括以下步骤：
1、按重量份计将40份的石粉、10份的木纤维以及45份的可降解高分子材料进行混合后再压延成型，制得所述复合材料纸；
2、将铝箔与丙烯酸类树脂层以及所述复合材料纸按照从下至上的顺序依次层叠并放入层压机中进行热压处理，所述热压处理的步骤包括：在温度为140℃，压力为7Mpa的条件下压制80min；在35℃温度下冷却45min，最终制得所述铝箔盖板。
实施例3
一种铝箔盖板的制备方法，其包括以下步骤：
1、按重量份计将35份的石粉、25份的木纤维以及50份的可降解高分子材料进行混合后再压延成型，制得所述复合材料纸；
2、将铝箔与PP膜以及所述复合材料纸按照从下至上的顺序依次层叠并放入层压机中进行热压处理，所述热压处理的步骤包括：在温度为140℃，压力为5Mpa的条件下压制60min；在20℃温度下冷却40min，最终制得所述铝箔盖板。
对实施案例1、2、3及现有技术制备的覆膜铝片盖板进行0.25mm孔径钻孔测试，钻孔测试结果表1所示；所述实施例1制得的铝箔盖板和现有覆膜铝片盖板用于PCB钻孔时的孔口展示图分别如图2和图3所示。
表1钻孔结果
盖板种类 孔位精度 残屑 表面塞孔 钻针缠丝
普通覆膜铝片 CPK＝1.964 轻微 轻微 无
实施例1 CPK＝2.492 无 无 无
实施例2 CPK＝2.486 无 无 无
实施例3 CPK＝2.502 无 无 无
从表1及图2-图3可以看出，本实施例提供的铝箔盖板具有更高的孔位精度，其钻孔后的塞孔、残屑现象比现有覆膜铝片的表现要好。
综上所述，本发明提供的铝箔盖板由导电层、胶层以及复合材料纸组成，所述铝箔盖板的主要创新点在其面层由复合材料纸代替，所述复合材料纸由石粉，木纤维，可降解高分子材料组成，因其表面柔软，其钻孔时有很好的抓针能力，提高了钻孔精度，同时因其中有石粉，能润滑钻头，吸收钻孔时产生的高热量，保护了钻针，提高钻针排屑能力，防止塞孔；胶层为高分子膜层，或者为热塑性树脂层，其钻孔后可将铝箔盖板的铝箔层与复合材料纸分离，有利于后期垫板的处理以及环境的保护。
应当理解的是，本发明的应用不限于上述的举例，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，所有这些改进和变换都应属于本发明所附权利要求的保护范围。

Claims (10)

1.一种铝箔盖板的制备方法，其特征在于，包括步骤：
将石粉、木纤维以及可降解高分子材料进行混合后再压延成型，制得复合材料纸；
将铝箔与胶层以及所述复合材料纸按照从下至上的顺序依次层叠并进行热压处理，制得所述铝箔盖板。
2.根据权利要求1所述铝箔盖板的制备方法，其特征在于，包括步骤：
按重量份计将30-40份的石粉、10-30份的木纤维以及40-50份的可降解高分子材料进行混合后再压延成型，制得所述复合材料纸。
3.根据权利要求2所述的铝箔盖板的制备方法，其特征在于，所述石粉为碳酸钙粉，所述可降解高分子材料为聚酯类材料或聚氨酯材料。
4.根据权利要求1所述铝箔盖板的制备方法，其特征在于，所述胶层为高分子膜层或热塑型树脂层。
5.根据权利要求4所述铝箔盖板的制备方法，其特征在于，所述高分子膜层为PET膜、PP膜或LDPE膜中的一种。
6.根据权利要求4所述铝箔盖板的制备方法，其特征在于，所述热塑型树脂层为丙烯酸类树脂层、乙烯醋酸树脂层或聚烯烃树脂层中的一种。
7.根据权利要求1所述铝箔盖板的制备方法，其特征在于，所述热压处理的步骤包括：在温度为130-160℃，压力为5-8Mpa的条件下压制60-80min；在20-50℃温度下冷却35-45min。
8.根据权利要求1所述铝箔盖板的制备方法，其特征在于，所述铝箔的厚度为0.01mm-0.14mm。
9.根据权利要求1所述铝箔盖板的制备方法，其特征在于，所述胶层的厚度为0.03-0.08mm；所述复合材料纸的厚度为0.03-0.08mm。
10.一种铝箔盖板，其特征在于，采用权利要求1-9任一所述铝箔盖板的制备方法制得。
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102775677A (zh) * 2011-05-13 2012-11-14 陈昭田 绿色环保纸及其制造方法
CN103937387A (zh) * 2014-04-22 2014-07-23 深圳市柳鑫实业有限公司 一种pcb钻孔用覆膜铝基盖板及其制备方法
CN206123803U (zh) * 2016-10-11 2017-04-26 深圳市柳鑫实业股份有限公司 一种pcb机械钻孔用盖板
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CN102775677A (zh) * 2011-05-13 2012-11-14 陈昭田 绿色环保纸及其制造方法
CN103937387A (zh) * 2014-04-22 2014-07-23 深圳市柳鑫实业有限公司 一种pcb钻孔用覆膜铝基盖板及其制备方法
CN206123803U (zh) * 2016-10-11 2017-04-26 深圳市柳鑫实业股份有限公司 一种pcb机械钻孔用盖板
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