CN113302731A - 用于器件密封的沃伏尔封装件 - Google Patents

用于器件密封的沃伏尔封装件 Download PDF

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CN113302731A
CN113302731A CN201980089237.2A CN201980089237A CN113302731A CN 113302731 A CN113302731 A CN 113302731A CN 201980089237 A CN201980089237 A CN 201980089237A CN 113302731 A CN113302731 A CN 113302731A
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package
layer
static dissipative
tray
vovoler
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R·罗奇福德
E·L·布莱班特
D·M·巴斯克斯
D·A·戴维斯
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Daifeng Industry Co ltd
BAE Systems Information and Electronic Systems Integration Inc
Delphon Industries LLC
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Daifeng Industry Co ltd
BAE Systems Information and Electronic Systems Integration Inc
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Abstract

一种用于安全地存储半导体芯片和器件的系统，该系统采用配置为与沃伏尔封装件托盘匹配的沃伏尔封装件盖。盖的主体具有带有腔体的内表面，该腔体包括减震层。存在至少一个静电消散层，该静电消散层附接到减震层，使得静电消散层密封沃伏尔封装件托盘上的隔室。

Description

用于器件密封的沃伏尔封装件
相关申请交叉引用
本申请要求2018年11月20日提交的名称为Waffle Pack Lid for DeviceContainment的第62/769,899号美国申请的利益，其全部公开内容以引用方式并入本文。
技术领域
本公开总体上涉及用于封装半导体器件的沃伏尔封装件(Waffle Pack)。
背景技术
沃伏尔封装件通常用于小型电气设备的运输和处理，包括但不限于集成电路的薄芯片。传统的沃伏尔封装件包括托盘(tray)、盖和用于将盖固定到托盘上的夹。用沃伏尔封装件运送薄芯片对半导体行业的许多公司来说都是一个挑战。芯片非常脆弱，可能会因运输和搬运的碰撞而损坏。即使是最轻微的碰撞也会移动芯片，并可能导致寿命缩短、故障增加或使其无法运行。沃伏尔封装件托盘通常具有带有隔室[也称为口袋(pocket)或腔体])的基部，这些隔室容纳单个芯片以最大限度地减少运输过程中的碰撞和损坏，并且通常具有盖以防止灰尘和其它颗粒污染芯片。然而，芯片移位，有时也被称为“芯片超出口袋(dieout of pocket)”，在行业中很常见。芯片很小并且在运输过程中容易从其隔室中移位(称为“芯片超出口袋”)，这会导致零件混合和潜在损坏。损坏的设备会导致库存控制不佳并增加更换损坏设备的成本。尽管托盘的口袋有多种设计，但仍然存在对芯片的位移和损坏。
传统的沃伏尔封装件盖通常包括覆盖基部和隔室的硬塑料盖。传统盖的一个困难是硬塑料不能为托盘内的芯片提供足够的保护，也不能防止在运输和处理过程中芯片移位。一种现有的解决方案是在每个隔室中使用粘合剂。该解决方案具有存在许多残留物和在移除过程中损坏芯片的问题。
一些传统的盖包括具有厚泡沫垫的盖，例如闭孔泡沫，由于其缺乏减震特性，其可能无法防止损坏。此外，芯片也可能粘在泡沫上，然后在沃伏尔封装件中移位和损坏。传统层往往是可能影响零件功能或零件寿命的异物碎片(FOD)的来源。它还可以为电气元件提供表面，以便粘附在沃伏尔封装件中，然后移位和损坏。该层还可能具有诸如放气之类的特性，其可能影响沃伏尔封装件托盘的隔室中的设备。
一些硬塑料盖包括在盖与托盘之间放置一个或多个静电消散薄片。在放置和打开/关闭盖的过程中，静电消散薄片很容易与托盘错位。静电消散薄片的错位导致托盘和盖错位，这有利于芯片的移位并因此损坏芯片。
传统的沃伏尔封装件涉及使用独立于托盘和盖的单个夹，该夹将托盘和盖保持在一起，但不能充分地将托盘与盖固定或密封在一起。夹使沃伏尔封装件弯曲和翘曲，这为芯片从各自的口袋中移出创造了空间。另外，夹通常从沃伏尔封装件移除以取回芯片，然后再次使用以闭合包含剩余芯片的沃伏尔封装件。每次重复使用夹时，夹对沃伏尔封装件施加的夹紧力较小，这使得闭合的沃伏尔封装件不太安全，导致托盘和盖未对准，从而促进芯片的位移。
发明内容
因此，需要一种改进的盖和附接机构，以防止芯片在运输和处理过程中从其口袋中移位和损坏，并克服上述问题。
本公开的示例实施例提供了一种用于被构造成与沃伏尔封装件托盘匹配的沃伏尔封装件盖的系统，该沃伏尔封装件托盘包括主体，该主体包括外表面和内表面，内壁形成内腔体。减震层在减震层的第一侧附接到内腔体，并且至少一个静电消散(ESD)层附接到减震层的第二侧，其中当匹配以密封沃伏尔封装件托盘中的多个隔室时，ESD层接合沃伏尔封装件托盘。
特定实现可以包括以下特征中的一个或多个。沃伏尔封装件盖可以配置为与传统的2英寸或4英寸沃伏尔封装件托盘相匹配。减震层和ESD层可以具有基本相同的尺寸。主体的两个或更多个倾斜部分可以与沃伏尔封装件托盘的相应倾斜部分接合。沃伏尔封装件盖可以通过主体的开口部分沿着倾斜部分滑动。用于匹配的沃伏尔封装件盖和托盘的附接机构可以包括至少四个壁，其中至少三个壁包括连续的外围侧壁，并且至少一个壁可以具有用于沃伏尔封装件与连续的外围侧壁能滑动地接合的开口。盖可以包括与托盘能滑动地接合的另外两个吸引腿(captivating legs)。
本公开的一个示例实施例提供了一种用于被构造成与沃伏尔封装件托盘匹配的沃伏尔封装件盖的系统，沃伏尔封装件托盘包括主体，其包括外表面和内表面；至少一个静电消散(ESD)层，其包括附接到内侧的第一侧和匹配时靠近沃伏尔封装件托盘的第二侧；以及粘合层，其将主体的内表面粘合到ESD层的第一侧。
特定实现可以包括以下特征中的一个或多个。静电消散层可以至少围绕内侧的外围固定。沃伏尔封装件托盘可以包括放置在隔室中的多个半导体器件。盖可以包括两个或更多个与托盘能滑动地接合的吸引腿。
本公开的示例实施例提供了一种用于封装半导体器件的方法，该方法包括在沃伏尔封装件托盘中的隔室中设置多个半导体器件；将盖放置在沃伏尔封装件托盘上，其中盖包括联接到盖内部的静电消散层；以及将盖固定到沃伏尔封装件托盘上。
特定实现可以包括以下特征中的一个或多个。通过将盖滑离沃伏尔封装件托盘，可以从沃伏尔封装件托盘上取下盖。静电消散层可以包括导电PS碳材料。盖可以包括联接到盖内部的减震层和联接到减震层的静电消散层。
上述技术的实现可以包括方法或过程、系统或装置。在附图和以下描述中阐述了细节或一种或多种实施方式。从描述和附图以及从权利要求中，其它特征将是显而易见的。
在此描述的特征和优点并不是包罗万象的，特别是，鉴于附图、说明书和权利要求，许多附加特征和优点对于本领域普通技术人员来说将是显而易见的。此外，应当注意，在说明书中使用的语言主要是出于可读性和指导目的而选择的，而不是为了限制本发明主题的范围。
附图说明
图1A是描绘根据一个实施例的沃伏尔封装件盖的剖视图。
图1B是根据另一个实施例的沃伏尔封装件盖的剖视图。
图1C是根据另一个实施例的沃伏尔封装件盖的剖视图。
图2A是描绘根据一个实施例的沃伏尔封装件盖与沃伏尔封装件托盘的匹配/联接的剖视图。
图2B是描绘根据一个实施例的沃伏尔封装件盖与沃伏尔封装件托盘的匹配/联接的剖视图。
图3是描绘根据一个替代实施例的沃伏尔封装件盖与沃伏尔封装件托盘的匹配/联接的剖视图。
图4A是根据一个实施例的沃伏尔封装件附接机构的透视图。
图4B是图4A的沃伏尔封装件附接机构的仰视透视图。
图5是根据一个替代实施例的沃伏尔封装件附接机构的透视图。
图6是用于封装半导体器件的方法的流程图。
通过阅读以下详细描述以及本文所述的附图，将更好地理解本实施例的这些和其它特征。附图旨在按比例绘制。为清楚起见，并非每个组件都能够在每张图中标出。
具体实施方式
本公开涉及用于半导体器件封装的沃伏尔封装件。更具体地，一种用于沃伏尔封装件盖的系统。以下描述集中于沃伏尔封装件盖和固定沃伏尔封装件盖和底座的附接机构，其适用于在运输和处理期间防止包含在沃伏尔封装件内的小型电气设备的位移和损坏。举例来说，小型电子器件可以包括集成电路芯片，并且通常包括任何静电敏感器件(ESD)。本文将描述本公开的各种实施例。
传统的沃伏尔封装件系统具有托盘，该托盘具有多个单独的隔室(也称为口袋或腔体)，用于保持半导体元件，例如芯片。隔室的尺寸、形状和数量是根据用于容纳半导体元件的设计标准配置的，但通常沃伏尔封装件是方形的，尺寸为2英寸和4英寸。
传统的沃伏尔封装件系统具有与托盘匹配的盖。可以将一个或多个静电消散薄片放置在托盘的顶部以覆盖设备。铺好薄片后，将盖放在薄片的顶部。这种组合的一个已知问题是，在放置薄片、放置盖或运输或处理期间，薄片往往会移动。
当静电消散薄片在放置期间或运输或处理期间移动时，它们可能变得未对准托盘和盖，这提供了托盘和盖的未对准，促进了半导体元件的位移和损坏。它还可能会阻止盖正确固定到托盘上。
图1A是根据一个实施例的沃伏尔封装件盖100的剖视图。沃伏尔封装件盖100具有主体110、减震层120和静电消散层130。本领域技术人员将理解沃伏尔封装件的大小和形状可以变化以适应在沃伏尔封装件中的小型电子元件的数量、大小、形状。沃伏尔封装件盖100可以具有多种形状和尺寸，被定制以承载多种小型电子元件，并且通常是任何受到静电放电(ESD)问题影响的小型电子元件。在一个实施例中，沃伏尔封装件盖100可以是2x2或4x4英寸并且被配置为与对应的沃伏尔封装件托盘(未示出)匹配。主体110可以由任何抗静电或适于ESD的材料形成，以防止由静电放电引起的电子元件的损坏，同时为包含在其中的贵重元件创建安全外壳。例如，主体110可以由具有ESD保护的诸如聚碳酸酯或抗静电丙烯腈丁二烯苯乙烯之类的塑料形成。
在各种实施例中，主体110可以包括内壁160，其限定了容纳减震层120的腔体或凹部140。减震层120可以具有与凹部140相同的总体形状或者否则占据腔体140中的空间。沃伏尔封装件盖100可以是平面的，其中减震层120可以与主体110的外围邻接。在一个实施例中，2英寸沃伏尔封装件盖可以包括具有1.78英寸x1.78英寸尺寸的凹部140。
在一个示例中，静电消散层130附接到减震层120以满足ESD和FOD的最高工业标准，以防止芯片的污染和芯片粘附到减震层120。
作为示例，静电消散层130可以由夹层(interleaf)材料形成，包括但不限于高密度聚乙烯纤维或导电PS碳隔板材料。举例来说，夹层材料可以是eM20，它是来自
Figure BDA0003164672940000061
的导电PS碳隔板材料，提供无绒材料和ESD屏蔽以及电磁干扰(EMI)屏蔽。
减震层120可以由合适的减震材料形成以保护沃伏尔封装件内的芯片。举例来说，减震层120可由微孔聚氨基甲酸酯泡沫形成。
在各种实施例中，减震层120通过一个或多个粘合层150附接到主体110并且静电消散层130通过粘合层150附接到减震层120。粘合层150可以由满足ESD工业标准的任何材料形成并且在一个示例中粘合层150是相同的。举例来说，在一个示例中，粘合层150是聚酯薄膜粘合剂。粘胶层150通过任何合适的方法分别附接到减震层120、静电消散层130和主体110，包括但不限于喷涂、滚压、热激活的切割粘合薄片等。在一个示例中，用于静电消散层130的粘合层150至少在该层的外围周围具有粘合剂，以使其完全覆盖减震层120。
在一个示例中，一片粘合剂可以放置在一片减震材料和一个静电消散薄片之间。可以通过加热将减震材料、粘合剂和静电消散薄片层压在一起从而产生具有静电消散层130的一体式减震层120。然后，可以将具有静电消散层130的一体式减震层120切割成配置为与其一起使用的主体110的尺寸。减震层120和静电消散层130的粘合防止了盖100与托盘200之间的沃伏尔封装件的空间内的两层错位。这种粘合还防止了盖100与托盘200的错位，这减少了器件从其隔室中移位并损坏的可能性。
在各种实施例中，静电消散层130附接到减震层120，使得两层都可以容纳在盖的主体110的凹部140内。减震层120和静电消散层130可以具有基本相同的尺寸。在各种实施例中，减震层120和静电消散层130可以大约具有与盖100相同的尺寸。在各种实施例中，减震层120和静电消散层130可以大约具有与托盘200的面积相同的尺寸以接触每个隔室的顶部。在一个示例中，静电消散层130在托盘中的每个隔室周围形成密封。
在图1B所示的替代实施例中，盖100具有主体110和静电消散层130，静电消散层130附接到盖110的下侧主体。内壁160可以进一步延伸以减小腔体的尺寸并使静电消散层130更靠近匹配的沃伏尔封装件托盘中的半导体器件。在一个替代实施例中，静电消散层130更厚并且没有减震层。
图1C中描绘了另一个实施例，其中减震层是高密度(HD)微孔氨基甲酸酯170。它可以装入腔体内，在某些标准尺寸的2英寸沃伏尔封装件中，腔体尺寸约为1.73英寸x1.73英寸x0.093英寸。在一个示例中，静电消散层180是填充碳的聚苯乙烯并且在2英寸沃伏尔封装件中的尺寸可以为1.73英寸x1.73英寸x0.005英寸。在用于2英寸沃伏尔封装件的一个示例中，外径(OD)为2英寸，内径(ID)为1.8英寸。
从盖的内部到主体的下边缘的腔体距离190表示通常填充有减震材料的距离，使得当被压缩时，ESD层密封沃伏尔封装件中的隔室。
图2A和图2B是描绘沃伏尔封装件盖100与沃伏尔封装件托盘200匹配的截面图。沃伏尔封装件托盘200具有位于其相关隔室220内的芯片210。在各种实施例中，减震层120填充隔室的顶部与盖的主体110之间的空间，其将芯片210固定在其各自的隔室220内以防止在运输和处理期间错位和移位到它们的预期的隔室220之外。此外，减震层120在运输和处理期间吸收来自推挤的震动以进一步保护它们的隔室220内的芯片210。
在匹配的沃伏尔封装件230(图2B)中，静电消散层130接触隔室220的顶部并密封每个隔室，因为有来自减震层120的足够压力使得ESD层130与隔室的顶部接触。ESD层130和减震层120的组合厚度允许在匹配时施加压力时密封隔室，但防止ESD层130进一步偏转以将ESD层130推入隔室中。除了密封隔室以防止器件错位之外，ESD层130还保护芯片210免于粘附以及提供更好的ESD和除气保护。
在一个示例中，沃伏尔封装件盖以已知方式与沃伏尔封装件托盘接合并且能滑动地接合，使得盖被推入到位，从而覆盖托盘中的隔室。盖被配置为与沃伏尔封装件托盘匹配，并且在一个示例中，盖上有与托盘上的相应倾斜部分匹配的倾斜部分。一旦盖的倾斜部分与托盘的倾斜部分匹配，匹配的沃伏尔封装件托盘和盖可以通过附接机构紧固或固定。在一个示例中，在匹配的沃伏尔封装件托盘和盖的一侧有倾斜部分。在另一示例中，倾斜部分位于三侧，其中一侧是敞开的，使得盖可以滑动以经由敞开侧移除。盖的倾斜部分和托盘的倾斜部分有利于沃伏尔封装件的匹配并降低芯片从它们的隔室移位的可能性。
参照图3，另一个实施例包括进一步延伸到盖的凹部140中的盖的主体110。在该示例中较厚的静电消散层300直接固定到内腔体140。不需要额外的减震层，因为功能由较厚的静电消散层300容纳。例如，可以有多个提供适当缓冲效果的静电消散薄片，或者静电薄片可以形成中间具有泡沫的封闭构件。静电消散层300可以通过一个或多个粘合层150附接到盖的主体110的内部。在一个示例中，静电消散层300可以附接到盖的主体110的内侧的外围。在另一个示例中，静电消散层300可以附接在盖的凹部140内。
参考图4A和图4B，匹配的沃伏尔封装件托盘和盖400由附接机构410固定。如本文详述的，盖包括静电消散层并保护沃伏尔封装件中的半导体器件。盖配置为与沃伏尔封装件托盘匹配，并且在一个示例中，盖上有与托盘上的相应倾斜部分匹配的倾斜部分。一旦盖与托盘匹配，匹配的沃伏尔封装件托盘和盖400可以通过附接机构410紧固或固定。
在一个示例中，附接机构410具有基部480，基部480具有附接到基部480的至少两个延伸的吸引腿420。吸引腿420可移动以通过旋转吸引腿420来接合和脱离保持夹430。在一个示例中，保持夹430具有延伸部440，该延伸部440具有一定角度的轮廓，使得它们与沃伏尔封装件盖接合并在它们抓住沃伏尔封装件时施加均匀的压力。可以通过将盖和托盘400放置在附接机构410上然后旋转展开保持夹430的吸引腿420而将盖和托盘400放置到附接机构410中。在一个示例中有两个保持夹430，在所示示例中有四个保持夹430。通过接合如本文详述的保持夹，附接机构410提供均匀压缩，这降低了沃伏尔封装件中的装置移位和损坏的可能性。
如图4B所示，吸引腿420从可绕毂455旋转的公共中央单元450延伸，使得吸引腿420一致移动以接合/脱离保持夹430。中央单元450包括与保持夹突出部460接合的结节或突起470，使得它像凸轮一样操作以在吸引腿420移动时打开和关闭保持夹。
如图5所示，沃伏尔封装件附接机构或支架500可具有连续的外围左侧壁和右侧壁520，后侧壁525具有顶底一体盖530。前侧540至少部分地敞开，使得匹配的沃伏尔封装件510滑入开口并由三个外围壁以及顶底盖固定。这将压力均匀分布到沃伏尔封装件510上，并确保内部减震材料施加足够的压力，使静电消散层接触托盘隔室，从而使其中的器件保持在适当的隔室中。通过将匹配的沃伏尔封装件510保持在支架500中，器件移位的可能性较小。在一个示例中，在顶部和底部中的至少一个上具有切口区域550，以允许容易地放置和取出匹配的沃伏尔封装件510。在一个示例中，可以通过抓握在拇指和食指从支架上拔出。支架500的尺寸取决于匹配的沃伏尔封装件的尺寸，并且在一个示例中完全接收匹配的沃伏尔封装件510，使得它在匹配的沃伏尔封装件上保持连续和均匀的压力。
在许多情况下，查看沃伏尔封装件510的顶部和/或底部以获取关于沃伏尔封装件内的器件的信息是有用的。在一个实施例中，顶部和/或底部的附加切口区域560可以允许更大的区域用于查看显示在沃伏尔封装件上的信息，无论是印刷在沃伏尔封装件上还是标签上。在一个示例中，标签被设计成安装在切口区域500、560内。
在一个实施例中，支架500的内径的尺寸确定允许沃伏尔封装件510的摩擦安装，使得它保持在支架内并且不容易滑出。在又一示例中，唇缘或突出部570位于沃伏尔封装件510的前部540处，从而更容易确认沃伏尔封装件正确位于支架500内并增加额外的保护以防止沃伏尔封装件从支架500上移位。
根据一个示例，支架被注射成型为整体单元以降低单个单元的成本。支架可以是塑料材料，例如聚碳酸酯或具有ESD保护的抗静电丙烯腈丁二烯苯乙烯。在一个示例中，材料是Permastat 600plus。在一个示例中，塑料材料相对透明或半透明，使得沃伏尔封装件上的任何信息都是可见的，而不必依赖大的切口区域。
某些传统的支架在沃伏尔封装件510的两个侧边缘上施加压力，这会导致支架的翘曲和弯曲，这允许隔室中的元件移动，因为没有足够的均匀压力。在一些示例中，传统的支架可以包括在下表面上施加压力的片簧，但是由于保持机构位于沃伏尔封装件的两侧边缘，所以压力是不均匀的。本支架的实施例通过采用固定静电消散层以及减震层来避免传统技术中的这些问题，当关闭并保持在支架装置中时，减震层在每个隔室周围形成密封。
现在参照图6，示出了一种用于封装半导体器件600的方法。该方法可以包括在沃伏尔封装件托盘610中的隔室中设置多个半导体器件。该方法还可以包括将盖放置在沃伏尔封装件托盘620上。在一个示例中，盖可以具有附接到盖内部的静电消散层。在另一个示例中，盖可以具有附接到盖内部的减震层和附接到减震层的静电消散层。该方法还可以包括将盖固定到沃伏尔封装件托盘630。该方法还可以包括通过将盖滑离沃伏尔封装件托盘640而从沃伏尔封装件托盘上移除盖。
已经出于说明和描述的目的呈现了本公开的实施例的前述描述。并不旨在穷举或将本公开限制为所公开的精确形式。根据本公开，许多修改和变化是可能的。本公开的范围旨在不受该详细描述的限制，而是受所附权利要求的限制。
已经描述了许多实施方式。然而，应当理解，在不脱离本公开的范围的情况下可以进行各种修改。尽管在附图中以特定顺序描述了操作，但这不应被理解为要求以所示的特定顺序或按顺序执行这些操作，或者执行所有图示的操作，以获得期望的结果。

Claims (17)

1.一种沃伏尔封装件盖，其配置为与沃伏尔封装件托盘匹配，该沃伏尔封装件盖包括：
主体，其包括外表面和内表面，其内壁形成内腔体；
减震层，其在该减震层的第一侧附接到该内腔体；和
至少一个静电消散层，其附接到该减震层的第二侧，其中当匹配以密封该沃伏尔封装件托盘中的多个隔室时，该静电消散层接合该沃伏尔封装件托盘。
2.根据权利要求1所述的沃伏尔封装件盖，还包括粘合层，其将该静电消散层粘合到该减震层的第二侧。
3.根据权利要求1所述的沃伏尔封装件盖，其中，该沃伏尔封装件盖配置为与2英寸或4英寸沃伏尔封装件托盘匹配。
4.根据权利要求1所述的沃伏尔封装件盖，还包括将该减震层粘合到该内腔体的粘合层。
5.根据权利要求1所述的沃伏尔封装件盖，其中，该减震层是微孔聚氨基甲酸酯泡沫或高密度微孔氨基甲酸酯。
6.根据权利要求1所述的沃伏尔封装件盖，其中，该减震层和该静电消散层层压在一起以产生具有该静电消散层的一体式减震层。
7.根据权利要求1所述的沃伏尔封装件盖，其中，该静电消散层包括导电PS碳或高密度聚乙烯。
8.根据权利要求1所述的沃伏尔封装件盖，还包括支架，其中该支架包括后壁、两个侧壁、和前壁，该前壁具有用于接收匹配的沃伏尔封装件盖和沃伏尔封装件托盘的开口。
9.根据权利要求1所述的沃伏尔封装件盖，还包括支架，其中该支架包括至少两个保持夹以固定匹配的沃伏尔封装件盖和沃伏尔封装件托盘。
10.一种沃伏尔封装件盖，其配置为与沃伏尔封装件托盘匹配，包括：
塑料主体，其包括外表面和内表面，其内壁形成内腔体；
至少一个静电消散层，其附接在该内腔体内；和
粘合层，其将该静电消散层粘合到该内腔体。
11.根据权利要求10所述的沃伏尔封装件盖，其中，该静电消散层围绕该内侧的外围而固定。
12.根据权利要求10所述的沃伏尔封装件盖，其中，该静电消散层是导电PS碳材料。
13.根据权利要求10所述的沃伏尔封装件盖，其中，该沃伏尔封装件托盘包括放置在隔室中的多个半导体器件，其中，当与该沃伏尔封装件盖匹配时，该静电消散层密封该隔室。
14.根据权利要求13所述的沃伏尔封装件盖，其中，该静电消散层是填充碳的聚苯乙烯。
15.一种用于封装半导体器件的装置，包括，
沃伏尔封装件盖，其具有外表面和内表面，其内壁形成内腔体；
减震层，其附接到该内表面；
至少一个静电消散层，其附接到该减震层；和
沃伏尔封装件托盘，其具有用于该半导体器件的多个隔室，并且配置为与该沃伏尔封装件盖匹配。
16.根据权利要求15所述的装置，还包括支架，其中，该支架包括后壁、两个侧壁和具有开口的前壁以接收匹配的该沃伏尔封装件盖和该沃伏尔封装件托盘并施加均匀的压力，从而使该减震层有一些压缩并且该静电消散层密封该隔室。
17.根据权利要求15所述的装置，还包括支架，其中，该支架包括至少两个保持夹，该保持夹配置为通过旋转吸引腿而一致地展开以固定匹配的该沃伏尔封装件盖和该沃伏尔封装件托盘并施加均匀的压力，从而使该减震层有一些压缩并且该静电消散层密封该隔室。
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