CN113249084A - 一种高闪点的单组份脱醇型有机硅密封材料 - Google Patents
一种高闪点的单组份脱醇型有机硅密封材料 Download PDFInfo
- Publication number
- CN113249084A CN113249084A CN202110412258.2A CN202110412258A CN113249084A CN 113249084 A CN113249084 A CN 113249084A CN 202110412258 A CN202110412258 A CN 202110412258A CN 113249084 A CN113249084 A CN 113249084A
- Authority
- CN
- China
- Prior art keywords
- parts
- sealing material
- component dealcoholized
- flash
- point single
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003566 sealing material Substances 0.000 title claims abstract description 18
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 10
- 239000013522 chelant Substances 0.000 claims abstract description 9
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 8
- 229920000642 polymer Polymers 0.000 claims abstract description 6
- 239000000945 filler Substances 0.000 claims abstract description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 18
- 229910052582 BN Inorganic materials 0.000 claims description 9
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 9
- 239000011787 zinc oxide Substances 0.000 claims description 9
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 8
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 7
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 7
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 7
- -1 polydimethylsiloxane Polymers 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 125000002751 aliphatic alkane group Chemical group 0.000 claims description 2
- 229940008099 dimethicone Drugs 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000004590 silicone sealant Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052710 silicon Inorganic materials 0.000 abstract description 3
- 239000010703 silicon Substances 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 4
- 238000005303 weighing Methods 0.000 description 4
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920002545 silicone oil Polymers 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 208000005156 Dehydration Diseases 0.000 description 1
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
Abstract
本发明涉及一种高闪点的单组份脱醇型有机硅密封材料，按照重量份数计算，包括以下组分：聚合物，40～90份，填料，25～65份，交联剂，2～3份，钛酸异丙酯的螯合物，1～3份，硅烷偶联剂，0.1～1份，通过使用R‑三甲氧基硅烷，其闪点高于60℃，在生产有机硅密封材料时，安全性高，方便运输和储存。
Description
技术领域
本发明涉及填缝材料，具体是一种高闪点的单组份脱醇型有机硅密封材料。
背景技术
有机硅密封材料因其具有卓越的耐候性、优良的耐高低温性及耐候性在建筑工业得到了广泛的应用。常见的有机硅密封胶有:脱酸性、脱酮肟性和脱醇型。其中脱醇型有机硅密封胶具有无腐蚀性、无臭味更环保等特点，而且对玻璃、金属等材料具有良好的粘结性能。因此具有相当大的市场。
现有的有机硅密封材料使用的交联剂主要是甲基三甲氧基硅烷和乙烯基三甲氧基硅烷，甲基三甲氧基硅烷的闪点是11.1℃，乙烯基三甲氧基硅烷的闪点是22.8℃，闪点均较低，在生产有机硅密封材料时，不易储存和运输。
发明内容
针对上述现有技术存在的问题，本发明提供了一种高闪点的单组份脱醇型有机硅密封材料，解决了原有交联剂闪点低不易储存和运输的问题。
为了实现上述目的，本发明通过以下技术方案来实现：
一种高闪点的单组份脱醇型有机硅密封材料，按照重量份数计算，包括以下组分：聚合物，40～90份，填料，25～65份，交联剂，2～3份，钛酸异丙酯的螯合物，1～3份，硅烷偶联剂，0.1～1份。
本发明进一步描述，所述聚合物包括二甲基硅油和烷氧基封端的聚二甲基硅氧烷的一种或两种。
本发明进一步描述，所述填料包括氧化铝、氧化锌、氮化铝中和氮化硼，氧化铝、氧化锌、氮化铝中和氮化硼的含水量均小于0.5％。
本发明进一步描述，所述交联剂是R-三甲氧基硅烷，R为脂肪烷烃，且碳原子数量大于4，纯度大于95％。
本发明进一步描述，所述硅烷偶联剂使用的是KH792，且纯度大于97％。
借由上述方案，本发明具有以下优点：通过使用R-三甲氧基硅烷，其闪点高于60℃，在生产有机硅密封材料时，安全性高，方便运输和储存。
具体实施方式
结合以下具体实施例,对本发明作进一步的详细说明，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
实施例1
按照如下重量份数称取原料：二甲基硅油：30份，烷氧基封端的聚二甲基硅氧烷：60份，氧化铝5份，氧化锌：5份，氮化铝：5份，氮化硼：10份，R-三甲氧基硅烷：2份，硅烷偶联剂：0.1份，钛酸异丙酯的螯合物，3份。
实施例2
按照如下重量份数称取原料：二甲基硅油：40，氧化铝20份，氧化锌：5份，氮化铝：20份，氮化硼：20份，R-三甲氧基硅烷：2.5份，硅烷偶联剂：0.5份，钛酸异丙酯的螯合物，1份。
实施例3
按照如下重量份数称取原料：烷氧基封端的聚二甲基硅氧烷：60，氧化铝10份，氧化锌：10份，氮化铝：20份，氮化硼：10份，R-三甲氧基硅烷：3份，硅烷偶联剂：1份，钛酸异丙酯的螯合物，1.5份。
实施例4
按照如下重量份数称取原料：二甲基硅油：20份，烷氧基封端的聚二甲基硅氧烷：50份，氧化铝6份，氧化锌：9份，氮化铝：20份，氮化硼：15份，R-三甲氧基硅烷：2.5份，硅烷偶联剂：0.8份，钛酸异丙酯的螯合物，2.5份
本实施例提供的填缝材料的制备方法为：
按照质量份数，将氧化铝、氧化锌、氮化铝中和氮化硼在110～1309C的环境下抽真空搅拌120分钟进行脱水处理，将其水分降至0.5％以下，冷却后依次按比例加入聚合物、R-三甲氧基硅烷、硅烷偶联剂和钛酸异丙酯的螯合物，最后制得成品有机硅密封材料。
性能的测试：
表干时间：按GB/T 13477.5-2003测试；
固化深度：使用固化深度板在标准固化条件下(温度为21～25℃，相对湿度为45～55％)，固化时间为24h的固化深度；
拉伸粘结强度：按GB/T 13477.8-2002测试拉伸粘结强度；
断裂伸长率：按GB/T 528-1992测试断裂伸长率；
按GB/T528-92在XL-100A型万能拉力机上进行，内聚破坏拉伸速度为500mm/min，粘结测试拉伸速度5mm/min，测得的拉伸强度和断裂伸长率如下表所示。
实验结果：
| 试样 | 表干时间/min | 固化深度/mm/24h | 拉伸强度/Mpa | 断裂伸长率/％ |
| 实施例1 | 10 | 2.5 | 1.99 | 212 |
| 实施例2 | 12 | 4.1 | 2.12 | 227 |
| 实施例3 | 15 | 3.5 | 2.22 | 235 |
| 实施例4 | 13 | 3.8 | 2.15 | 225 |
上表是实施例1至实施例4密封材料的主要指标。
从上述结果可知，通过改变交联剂的种类，其密封材料的各性能表现较优，且安全性更高，输送和保存更加方便。
尽管已经示出和描述了本发明的实施例，对于本领域的普通技术人员而言，可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型，本发明的范围由所附权利要求及其等同物限定。
Claims (5)
1.一种高闪点的单组份脱醇型有机硅密封材料，其特征在于，按照重量份数计算，包括以下组分：聚合物，40～90份，填料，25～65份，交联剂，2～3份，钛酸异丙酯的螯合物，1～3份，硅烷偶联剂，0.1～1份。
2.根据权利要求1所述的一种高闪点的单组份脱醇型有机硅密封材料，其特征在于，所述聚合物包括二甲基硅油和烷氧基封端的聚二甲基硅氧烷的一种或两种。
3.根据权利要求1所述的一种高闪点的单组份脱醇型有机硅密封材料，其特征在于，所述填料包括氧化铝、氧化锌、氮化铝中和氮化硼，且氧化铝、氧化锌、氮化铝中和氮化硼的含水量均小于0.5％。
4.根据权利要求1所述的一种高闪点的单组份脱醇型有机硅密封材料，其特征在于，所述交联剂是R-三甲氧基硅烷，R为脂肪烷烃，且碳原子数量大于4，纯度大于95％。
5.据权权利要求1所述的一种高闪点的单组份脱醇型有机硅密封材料，其特征在于，所述硅烷偶联剂使用的是KH792，且纯度大于97％。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110412258.2A CN113249084A (zh) | 2021-04-16 | 2021-04-16 | 一种高闪点的单组份脱醇型有机硅密封材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110412258.2A CN113249084A (zh) | 2021-04-16 | 2021-04-16 | 一种高闪点的单组份脱醇型有机硅密封材料 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113249084A true CN113249084A (zh) | 2021-08-13 |
Family
ID=77221045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110412258.2A Pending CN113249084A (zh) | 2021-04-16 | 2021-04-16 | 一种高闪点的单组份脱醇型有机硅密封材料 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113249084A (zh) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103435640A (zh) * | 2013-08-05 | 2013-12-11 | 广州中国科学院工业技术研究院 | 硅酮密封胶交联剂及其制备方法和应用 |
| CN111892906A (zh) * | 2020-08-13 | 2020-11-06 | 广州市白云化工实业有限公司 | 可快速深层固化的脱醇型单组分硅酮密封胶及其制备方法 |
-
2021
- 2021-04-16 CN CN202110412258.2A patent/CN113249084A/zh active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103435640A (zh) * | 2013-08-05 | 2013-12-11 | 广州中国科学院工业技术研究院 | 硅酮密封胶交联剂及其制备方法和应用 |
| CN111892906A (zh) * | 2020-08-13 | 2020-11-06 | 广州市白云化工实业有限公司 | 可快速深层固化的脱醇型单组分硅酮密封胶及其制备方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7339012B2 (en) | Crosslinkable compositions based on organosilicon compounds | |
| CN109824903B (zh) | 一种高折射率含硼有机硅增粘剂及其制备方法 | |
| CN101012364A (zh) | 单组分室温快速硫化脱醇型硅酮结构密封胶及其制造方法 | |
| CN108179003B (zh) | 低模量、高位移能力的脱醇型硅酮耐候密封胶及其制备方法 | |
| CN111004604B (zh) | 有机硅密封胶及其制备方法 | |
| CN114316882B (zh) | 聚氨酯胶导热灌封胶及其制备方法 | |
| CN107674643B (zh) | 一种倒装cob用耐高温封装胶及其制备方法 | |
| CN107722918B (zh) | 一种传感器用密封材料及其制备方法 | |
| CN110078909B (zh) | 一种含磷硅烷封端聚醚及其制备方法 | |
| CN114702676B (zh) | 一种单组分低粘度快固脱醇型rtv硅橡胶及其制备方法 | |
| CN112980375A (zh) | 一种单组分硅烷改性聚醚密封胶及制备方法 | |
| CN115124974A (zh) | 一种脱醇有机硅密封胶及其制备方法 | |
| CN110699026A (zh) | 一种柔性环氧灌封胶 | |
| CN116574472A (zh) | 一种耐高低温老化双组份环氧灌封胶及制备方法 | |
| CN113249084A (zh) | 一种高闪点的单组份脱醇型有机硅密封材料 | |
| KR101829213B1 (ko) | 온도감지기 충진용 수지 조성물 | |
| WO2015044757A9 (en) | A self-healing epoxy resin composition | |
| CN106750818B (zh) | 一种防护车管路用热缩组合物及由其制备的内齿热缩套管 | |
| CN110791198A (zh) | 涂层材料及其制备方法 | |
| CN114214024A (zh) | 一种环保型高位移硅酮密封胶及其制备方法 | |
| CN102358817A (zh) | 磷酸尾气风机叶轮耐腐蚀耐磨损涂料 | |
| CN115948145A (zh) | 一种快速固化单组分中性硅酮密封胶及其制备方法 | |
| CN111777941B (zh) | 一种可固化的有机硅组合物及其制备方法和应用 | |
| CN113845757A (zh) | 一种耐腐蚀高电气性能树脂及其制备方法 | |
| CN110078923B (zh) | 一种苯基硅树脂及其制备方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210813 |
|
| RJ01 | Rejection of invention patent application after publication |