CN113219740A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN113219740A CN113219740A CN202110423592.8A CN202110423592A CN113219740A CN 113219740 A CN113219740 A CN 113219740A CN 202110423592 A CN202110423592 A CN 202110423592A CN 113219740 A CN113219740 A CN 113219740A
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- 239000002184 metal Substances 0.000 claims abstract description 126
- 239000000758 substrate Substances 0.000 claims abstract description 73
- 239000003292 glue Substances 0.000 claims abstract description 35
- 239000000853 adhesive Substances 0.000 claims abstract description 11
- 230000001070 adhesive effect Effects 0.000 claims abstract description 11
- 239000000565 sealant Substances 0.000 claims description 72
- 238000012546 transfer Methods 0.000 claims description 16
- 239000011148 porous material Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 abstract description 23
- 230000007797 corrosion Effects 0.000 abstract description 22
- 239000010410 layer Substances 0.000 description 87
- 238000010586 diagram Methods 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000002829 reductive effect Effects 0.000 description 6
- 230000008054 signal transmission Effects 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000000979 retarding effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136204—Arrangements to prevent high voltage or static electricity failures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract
The application discloses display panel and display device, display panel includes: the display panel comprises a first substrate, a second substrate corresponding to the first substrate, and frame glue arranged between the first substrate and the second substrate, wherein the first substrate comprises a first metal layer and a second metal layer which are sequentially stacked corresponding to a non-display area, and the first metal layer and the second metal layer are mutually insulated; the first metal layer is provided with a first metal wiring group, and the second metal layer is provided with a second metal wiring group; the first metal wiring groups and the second metal wiring groups are in one-to-one corresponding conducting connection through a group of bridging structures; in the group of bridging structures, the bridging structure closest to the edge of the outer side of the frame adhesive is the outermost bridging structure, the outermost bridging structure is positioned under the frame adhesive, and the aperture of the outermost bridging structure is smaller than the apertures of other bridging structures except the outermost bridging structure in the group of bridging structures; to improve the corrosion resistance of the outermost bridging structure.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel and a display device.
Background
The display panel generally includes an array substrate and a color film substrate, the array substrate and the color film substrate are sealed by sealant, and the display panel is formed by sealing the array substrate and the color film substrate.
The array substrate generally adopts the design of a bridging structure to realize the electrode connection between different metal layers, a plurality of bridging structures need to be formed on the array substrate, wherein part of the bridging structures are positioned outside the frame glue and are easily corroded by water vapor, and a part of the bridging structures are positioned below the frame glue.
Disclosure of Invention
The present application provides a display panel and a display device to improve the corrosion resistance of a bridge structure of the display panel.
The application discloses display panel is divided into display area and non-display area, its characterized in that includes: the display panel comprises a first substrate, a second substrate arranged corresponding to the first substrate, and frame glue arranged between the first substrate and the second substrate, wherein the frame glue is arranged in a non-display area; the first substrate comprises a first metal layer and a second metal layer which are sequentially stacked corresponding to the non-display area, and the first metal layer and the second metal layer are insulated from each other; the first metal layer is provided with a first metal wiring group, and the second metal layer is provided with a second metal wiring group; the first metal wiring group comprises at least one sub-wiring, and the second metal wiring group comprises at least one sub-connecting line; sub-wires of the first metal wire group and sub-connecting wires of the second metal wire group are in one-to-one corresponding conduction connection through a group of bridging structures, and each group of bridging structures at least comprises one bridging structure; one side of the frame glue close to the display area is the inner side of the frame glue, and one side of the frame glue far away from the display area is the outer side of the frame glue; all the bridging structures are arranged in the direction that the edge of the outer side of the frame glue faces the display area; in the group of bridging structures, the bridging structure closest to the edge of the outer side of the frame glue is an outermost bridging structure, the outermost bridging structure is positioned under the frame glue, and the aperture of the outermost bridging structure is smaller than the apertures of other bridging structures in the group of bridging structures.
Optionally, the pore diameter of the outermost bridging structure is 20-100 um.
Optionally, the distance between the outermost side bridging structure and the outermost side edge of the sealant is 50-300 um.
Optionally, the first metal routing group includes a plurality of sub-routing lines arranged in parallel, and the second metal routing group includes a plurality of sub-connection lines arranged in parallel; one sub-wire closest to the outer side edge of the frame glue is a first sub-wire, the first sub-wire is a grounding wire or a low-level wire, and the first sub-wire is connected to the sub-connecting wire through the outermost side bridging structure.
Optionally, the first metal routing group includes a plurality of sub-routing lines, among the plurality of sub-routing lines, a sub-routing line whose transmitted signal voltage is lower than a preset voltage is a low-voltage sub-routing line, a sub-routing line whose transmitted signal voltage is higher than the preset voltage is a high-voltage sub-routing line, and an aperture of a bridging structure corresponding to the low-voltage sub-routing line is smaller than an aperture of a bridging structure corresponding to the high-voltage sub-routing line.
Optionally, in the group of bridging structures, the distances between the bridging structures and the edge of the outer side of the sealant are in a descending order, and the apertures of the bridging structures are gradually increased.
Optionally, the outermost bridge structure includes at least two transfer holes, among the plurality of transfer holes, a transfer hole closer to an edge of the outer side of the sealant is an outermost transfer hole, and in the outermost bridge structure, an aperture of the outermost transfer hole is larger than apertures of other transfer holes except the outermost transfer hole.
Optionally, each of the bridge structures includes at least one deep hole, at least one shallow hole, and a conductive layer, the conductive layer is connected to the first metal layer through the deep hole, and the conductive layer is connected to the second metal layer through the shallow hole; the outermost switch hole is a deep hole.
The application also discloses a display panel, is divided into display area and non-display area, includes: the display panel comprises an array substrate, a color film substrate arranged corresponding to the array substrate, and frame glue arranged between the array substrate and the color film substrate, wherein the frame glue is arranged in the non-display area; the array substrate comprises a substrate, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a conducting layer which are sequentially stacked corresponding to the non-display area; two adjacent edges of the first substrate extend along a first direction and a second direction respectively, and the first direction and the second direction are perpendicular to each other; the first metal layer is provided with a plurality of sub-wires with the wire direction parallel to the first direction, and the second metal layer is provided with a plurality of sub-connecting wires with the wire direction parallel to the second direction and at least one branch wire; a group of bridging structures are correspondingly arranged on the plurality of sub-wires and the plurality of sub-connecting lines one by one; the conducting layer is connected with the sub-wiring and the sub-connecting line through the corresponding bridging structure; all the bridging structures are arranged in the direction that the edge of the outer side of the frame glue faces the display area; the group of bridging structures comprises at least one direct connecting bridging structure and at least one transfer bridging structure;
the direct connection bridging structures are arranged on the sub-connecting lines and directly connect the sub-wires with the sub-connecting lines, the switching bridging structures are correspondingly arranged on the branch lines one by one, and the switching bridging structures are communicated with the branch lines and the sub-wires; the branch line is connected with the sub-connecting line; the number of the transfer bridge structures is the same as that of the branch lines; the wiring direction of the branch line and the wiring direction of the sub-connecting line are not in the same linear direction, and the branch line and the sub-connecting line are arranged on the same layer and are mutually communicated; the junction of the branch line and the sub-connecting line is positioned under the frame glue, and the distance between the junction and the adjacent bridging structure is less than 20 um; each of the bridging structures comprises a deep hole and a shallow hole, the conductive layer covers the deep hole and the shallow hole, the conductive layer is connected to the first metal layer through the deep hole, and the conductive layer is connected to the second metal layer through the shallow hole;
in the group of bridging structures, the bridging structure closest to the edge of the outer side of the frame adhesive is the outermost bridging structure, the outermost bridging structure is the transfer bridging structure, and the outermost bridging structure is arranged under the frame adhesive and covered by the frame adhesive; the pore diameter of the outermost bridging structure is smaller than that of other bridging structures except the outermost bridging structure in the group of bridging structures; the distance between the outermost side bridging structure and the outer edge of the frame glue is 50-300 um; the distance between the outermost bridging structure and the adjacent bridging structure is at least 20 um; the pore diameter of the outermost bridging structure is smaller than that of other bridging structures except for the outermost bridging structure in the group of bridging structures; the sub-wirings are peripheral wirings located in the non-display area, and the sub-connecting lines are transmission signal lines connected with the peripheral wirings in a one-to-one correspondence manner.
The application also discloses a display device, which comprises the display panel and a backlight module for providing a light source for the display panel.
For the scheme of the exemplary protective layer that sets up through on the via hole, and this application moves to the frame through the bridging structure with non-display area and glues inside, and the outermost bridging structure that is close to the display panel edge receives external influence most easily, the aperture that will outermost bridging structure diminishes, and be less than other bridging structure's aperture, bridging structure's aperture is less, just littleer with the area of contact of external steam, the risk corroded by steam is lower, thereby slow down steam and from gluing edge corrosion to bridging structure by frame, can protect bridging structure not corroded by external steam, and can save the processing procedure of protective layer.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
fig. 1 is a schematic diagram of a display panel according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a bridge structure according to an embodiment of the present application;
FIG. 3 is a schematic diagram of an arrangement of a set of bridge structures according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a first metal routing group of a display panel according to an embodiment of the present application; (ii) a
Fig. 5 is a schematic diagram illustrating a deep hole near the outer side of the sealant according to an embodiment of the present application;
FIG. 6 is a schematic diagram of a set of bridge structures of another embodiment of the present application;
fig. 7 is a graph illustrating different corrosion degrees of the outermost bridge structure from the outer side of the sealant according to an embodiment of the disclosure;
FIG. 8 is a graphical illustration of the degree of erosion at different distances of the outermost bridging structure from adjacent bridging structures in another embodiment of the present application;
fig. 9 is a schematic diagram of a set of bridge structures and sealant positions according to another embodiment of the present application;
fig. 10 is a schematic diagram of a display device of the present application.
Wherein, 1, a display device; 10. a display panel; 11. a display area; 12. a non-display area; 21. a first direction; 22. a second direction; 30. a backlight module; 100. a first substrate; 101. An array substrate; 110. a first metal layer; 111. a first metal wiring group; 112. sub-routing; 112a, a first sub-trace; 120. a second metal layer; 121. a second metal wiring group; 122. A sub-connection line; 123. a branch line; 130. a bridging structure; 131. an outermost bridge structure; 132. Deep holes; 132a, a first deep hole; 133. shallow holes; 133a, a first shallow hole; 140. a conductive layer; 150. a first insulating layer; 160. a second insulating layer; 170. a substrate; 200. a second substrate; 201. a color film substrate; 300. frame glue; 301. the outer side of the frame glue; 302. the inner side of the frame glue; 304. a straight line region; 305. a corner area.
Detailed Description
It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implying any number of indicated technical features. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, which may exist or add to one or more other features, integers, steps, operations, elements, components, and/or combinations thereof.
Further, terms of orientation or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, are described based on the orientation or relative positional relationship shown in the drawings, are simply for convenience of simplifying the description of the present application, and do not indicate that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.
Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, fixed connections, removable connections, and integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The present application is described in detail below with reference to the figures and alternative embodiments.
As shown in fig. 1, a display panel 10 is disclosed, the display panel 10 includes a first substrate 100 and a second substrate 200 arranged in a box-to-box manner, the first substrate 100 is divided into a display region 11 and a non-display region 12, a sealant 300 is arranged between the first substrate 100 and the second substrate 200, and the sealant 300 is arranged in the non-display region 12.
As fig. 2 discloses a schematic view of the first substrate 100, the array substrate 101 includes a substrate 170, a first metal layer 110, a first insulating layer 150, a second metal layer 120, a second insulating layer 160, and a conductive layer 140, which are sequentially stacked corresponding to the non-display region 12; specifically, the first metal routing group 111 and the second metal routing group 121 are respectively conducted through the bridging structure 130 and the conductive layer 140, the first substrate 100 includes a first metal layer 110 and a second metal layer 120 disposed corresponding to the non-display region 12, and the first metal layer 110 and the second metal layer 120 are insulated from each other; the first metal layer 110 is formed with a first metal routing group 111, and the second metal layer 120 is formed with a second metal routing group 121; the first metal routing group 111 and the second metal routing group 121 are in one-to-one correspondence conductive connection through a group of bridging structures 130; wherein the first metal layer 110 and the second metal layer 120 in the present application belong to the same layer as the first metal layer 110 and the second metal layer 120 in the display area 11 of the display panel 10; in the present application, the first substrate 100 is an array substrate 101, and the second substrate 200 is a color filter substrate 201.
As shown in fig. 3, an arrangement order of the bridge structures 130 is shown, in a group of the bridge structures 130, the bridge structure 130 closest to the edge of the outer side of the sealant is an outermost bridge structure 131, and the aperture of the outermost bridge structure 131 is smaller than the apertures of the other bridge structures 130 in the group of the bridge structures 130 except for the outermost bridge structure 130.
The inventor of the present application has found that the bridging structure 130 in the non-display area is easily corroded by external moisture or the like due to the proximity of the bridging structure to the outer side of the display panel, thereby causing the problem of open circuit or the like. Compared with the exemplary scheme of disposing the protective layer on the bridging structure, the present application moves the bridging structure 130 of the non-display area into the sealant, and the outermost bridging structures 131 near the edges of the display panel are most susceptible to external influences, the apertures of the outermost bridging structures 131 are reduced, and is smaller than the apertures of the other bridging structures 130, the smaller the aperture of the bridging structure 130, the contact area with the external water vapor is smaller, the aperture size is reduced, the probability of contacting the external substance with the metal layer can be greatly reduced, the risk of water vapor corrosion is lower, thereby retarding the corrosion of water vapor from the edge of the sealant to the bridging structure 130, protecting the bridging structure 130 from the corrosion of water vapor from the outside, even after corrosion occurs, the corrosion speed is obviously slowed down due to the small contact area, and the service life of a final product is finally prolonged; and the process of the protective layer can be saved.
As shown in the following table, a schematic diagram of the corrosion degree of the bridge structure 130 with different apertures is shown, where the corrosion degree of the bridge structure 130 is represented by the resistance of the bridge structure 130, the edge of the outermost bridge structure 131 away from the outer side of the sealant is 50um, and the corrosion conditions are as follows: the temperature is 85 ℃, and the humidity is 85%; as can be seen from the table, in the case of the aperture of 25um, the resistance of the bridging structure 130 reaches more than 1k Ω at 600H, and in the case of the aperture of 10um, the resistance of the bridging structure 130 does not change drastically until 1000H, and thus, it can be found that the smaller the aperture, the better the corrosion resistance of the bridging structure 130. From the data in the table, the resistance of the bridging structure 130 reached 1k Ω at 680H for a 20um aperture of the bridging structure 130, and 1k Ω at 760H for a 15um aperture of the bridging structure 130. It can be seen that when the aperture of the bridging structure 130 is 20um, the bridging structure has a certain corrosion protection capability, and specifically, the aperture of the outermost bridging structure 131 is 10-20 um; the aperture can bring another problem too little, and the aperture is less, and the area of contact between conducting layer and the metal level is less, and corresponding resistance is also big more, and the too big problem that can cause signal transmission of resistance, therefore bridging structure 130's resistance can not be too big, and the aperture that corresponds can not set up too little, under the condition of aperture more than or equal to 10um in this scheme, does not influence the transmission of normal signal.
Watch 1
Specifically, the first metal routing group includes a plurality of sub-routing lines 112 arranged in parallel, and the second metal routing group includes a plurality of sub-connecting lines 122 arranged in parallel; one sub-trace closest to the outer edge of the sealant is a first sub-trace 112a, the first sub-trace 112a is a ground trace or a low-level trace, and the first sub-trace 112a is connected to the sub-connection line 122 through the first bridging structure 130.
The signals transmitted by the ground wire and the low-level wiring are generally low-level signals or zero-level signals, and compared with high-level signals, the requirement on the resistance value of the wiring is not high, and even under the condition of higher impedance, the signal transmission of the ground wire and the low-level wiring cannot be influenced, and compared with high-level signals, when the impedance is higher, the signal transmission is damaged, so that the problem of inaccurate voltage or signal transmission is caused. Therefore, the ground line and the low-level trace are disposed on the outer side and connected by the bridging structure 130 with a small aperture, so that the risk of corroding the outermost bridging structure 131 can be reduced, and the signal transmission affecting other bridging structures 130 after being corroded can also be avoided.
In another embodiment, the first metal trace group includes a plurality of sub-traces 112 arranged in parallel, the second metal trace group includes a plurality of sub-connecting lines 113 arranged in parallel, among the plurality of sub-traces, a sub-trace transmitting a signal voltage lower than a preset voltage is a low-voltage sub-trace, a sub-trace transmitting a signal voltage higher than the preset voltage is a high-voltage sub-trace, and an aperture of the bridging structure 130 corresponding to the low-voltage sub-trace is smaller than an aperture of the bridging structure 130 corresponding to the high-voltage sub-trace. The aperture of the bridging structure 130 for all low-level routing is made small, so that the risk of corrosion of the bridging structure 130 can be reduced without affecting normal signal transmission, and the corrosion resistance of the overall bridging structure 130 is improved.
Fig. 4 is a schematic diagram illustrating a first metal routing group 111 of a display panel 10, where the first metal routing group 111 surrounds three sides of the display panel 10; a plurality of second metal routing groups 121 are formed on the second metal layer 120, and the plurality of second metal routing groups 121 are respectively connected to the first metal routing groups 111 through a plurality of bridging structures 130; the multiple second metal routing wire groups 121 are respectively connected to different electrostatic discharge blocks, and the electrostatic discharge routing wires in the present application are provided with multiple groups, and are respectively arranged at different positions of the first metal routing wire group 111, so that the electrostatic discharge on the first metal routing wire group 111 is realized.
Specifically, in each group of second metal routing groups 121, the bridging structure 130 closest to the edge of the outer side 301 of the sealant is an outermost bridging structure 131, and the outermost bridging structure 131 includes a first deep hole 132a and a first shallow hole 133a which are arranged in pair; the straight line of the first deep hole 132a and the corresponding first shallow hole 133a is parallel to the direction of the sealant 300. The first metal routing group 111 has two routing lines in different directions, which respectively include a first routing line and a second routing line of the display panel 10, so that in the bridging structures 130 in different groups, the outermost bridging structure 131 in each group is in the same direction as the nearest sealant 300, but not the outermost bridging structure 131 in each group.
As shown in fig. 5, the outermost bridge structure 131 includes at least two switching holes, among which, the switching hole closer to the edge of the outer side of the sealant is the outermost switching hole 131, and the aperture of the outermost switching hole in the outermost bridge structure is larger than the apertures of other switching holes except the outermost switching hole. Each of said bridging structures comprising at least one deep hole 132, at least one shallow hole 133 and an electrically conductive layer, said electrically conductive layer being connected to said first metal layer through said deep hole, said electrically conductive layer being connected to said second metal layer through said shallow hole; the outermost switching hole 131 is closer to the edge of the outer side 301 of the sealant, and therefore needs to have better corrosion resistance and a small aperture. Specifically, the outermost transfer hole is a deep hole 132, and it should be noted that the transfer hole in this application is a deep hole or a shallow hole.
As shown in fig. 6, a schematic view of the directions of the bridging structures 130 is shown, in all the bridging structures 130, a straight line where the shallow hole 133 and the deep hole 132 of each bridging structure 130 are located is parallel to the routing direction of the sealant 300, wherein the aperture of the outermost bridging structure is the smallest. All the bridging structures 130 are designed along the moving direction of the sealant 300, and one of them can further narrow the distance between the bridging structures 130, so that the wiring area of the first metal wiring group 111 is further reduced. In order to reduce the wiring area of the first metal wiring group 111, the present application also provides a schematic diagram illustrating the direction of another bridge structure 130 as shown in fig. 6. In addition to the outermost bridging structure 131, in the other bridging structures 130, a straight line where the deep hole 132 and the shallow hole 133 are located is perpendicular to the moving direction of the sealant 300; the deep holes 132 and the shallow holes 133 are arranged side by side, and in one row close to the edge of the outer side 301 of the frame glue, the deep holes 132 and the shallow holes 133 are arranged in a staggered manner; in the present application, in the bridging structure 130, in a row of holes close to the edge of the display panel 10, the deep holes 132 and the shallow holes 133 are staggered, and with respect to a scheme that all the deep holes 132 face outward or all the shallow holes 133 face inward, because the deep holes 132 need to penetrate through two insulating layers, the conductive layer 140 is connected to the first metal layer 110 through the deep holes 132, and the shallow holes 133 only need to penetrate through one insulating layer, the conductive layer 140 is connected to the second metal layer 120 through the shallow holes 133, so that the fracture height of the deep holes 132 is high, the deep holes 132 or the shallow holes 133 all face one side of the edge of the display panel 10, a large-area fracture is formed between the deep holes 132 and the shallow holes 133, so that the thickness of the conductive layer 140 is not uniform, so that the area of the conductive layer 140 is larger, and is easily corroded by external water vapor, and in the present application, after the deep holes 132 and the shallow holes 133 are staggered, the fracture height between the deep holes 132 and the shallow holes 133 is discontinuous, the conductive layer 140 has better uniformity and is not easily corroded by the outside.
Specifically, in the group of bridging structures, the distances between the bridging structures and the edge of the outer side of the frame adhesive are in the order from small to large, and the aperture of the bridging structures is gradually increased; the aperture of the normal bridging structure ranges between 20-25um, the closer the bridging structure is to the display area, the closer the aperture is to the aperture of the normal bridging structure.
The application discloses another display panel 10, other structures are as in the above embodiment, and are omitted here, a plurality of bridge structures 130 are arranged in a straight line along the moving direction of the sealant 300, in one bridge structure 130, one deep hole 132 and one shallow hole 133 are arranged side by side, and the straight line where the deep hole 132 and the shallow hole 133 are arranged side by side is perpendicular to the moving direction of the sealant 300; along the walking direction of the frame sealant 300, the deep holes 132 and the shallow holes 133 are arranged in a staggered manner; in the group of bridge structures 130, the bridge structure 130 closest to the edge of the outer side 301 of the sealant is an outermost bridge structure 131, and the outermost bridge structure 131 is disposed under the sealant 300 and covered by the sealant 300; the distance between the outermost side bridging structure 131 and the edge of the outer side 301 of the frame glue is 50-300 um.
As shown in fig. 7, a graph of the corrosion degree and time variation is shown when the distance between the outermost bridge structure 131 and the edge of the outer side 301 of the sealant is different, w in the graph is the length of the outermost bridge structure 131 from the edge of the outer side 301 of the sealant, the abscissa in the graph is the reliability time (unit is hour), the ordinate in the graph is the resistance value of the outermost bridge structure 131, since the phenomenon after the bridge structure 130 is corroded is that the resistance is increased, the ordinate in the graph is the resistance value of the outermost bridge structure 131 to represent the corrosion degree, and in combination, the second table corresponds to the value of each point of the curve in fig. 7 to represent the specific value of the abscissa and the ordinate, and the experimental conditions in fig. 7 and the second table are as follows: under a dependable environment of 85 ℃ and 85% humidity; table II is as follows: it should be noted that other variables, such as the aperture size, are controlled as default apertures in this application, so that the distance W in this experiment is a single variable.
Results of the reliability test of Table II
From the experimental data, the larger the value of w is, that is, the farther the outermost bridging structure 131 is from the edge of the frame sealant outer side 301, that is, the closer the outermost bridging structure 131 is to the display region 11, the corrosion resistance is significantly improved, as can be seen from fig. 7 and table two, in the present application, by moving the bridging structure 130 of the non-display region 12 into the frame sealant 300 and at least 50um away from the edge of the frame sealant outer side 301, the water vapor is prevented from corroding from the edge of the frame sealant 300 to the bridging structure 130, which not only can save the manufacturing process of the protective layer, but also can protect the bridging structure 130 from being corroded by the water vapor in the outside; however, since the wiring space of the display panel 10 is limited, the value of w cannot be infinite, and generally, in the range of the width of the sealant 300 from 500um to 1500um, when the value of w is less than 300um, the internal wiring space can be satisfied, so that the wiring space of the display region 11 and the region of the edge of the inner side 302 of the sealant facing the display region 11 is not compressed. For example, for a narrow-frame display panel 10 with a width of the sealant 300 of 200um to 500um, when the value of w is less than 200um, the other bridging structures 130 can be ensured to have a certain space for arrangement.
Specifically, in one group of the bridge structures 130, the bridge structure 130 closest to the edge of the outer side 301 of the sealant is an outermost bridge structure 131, and a distance between the outermost bridge structure 131 and the adjacent bridge structure 130 is at least 20 um.
Fig. 8 shows a graph with time on the abscissa and resistance of the bridging structure 130 on the ordinate for different distances between adjacent bridging structures 130, and the corrosion test conditions are: under the conditions that the temperature is 85 ℃ and the humidity is 85%, as seen from a curve in the figure, the closer the distance between two bridge connection structures 130 is, when one bridge connection structure 130 is corroded, the larger the resistance of the adjacent bridge connection structure 130 becomes within a certain time, which indicates that the adjacent bridge connection structure 130 is corroded, that is, after one bridge connection structure 130 is corroded, the resistance is easy to continuously deteriorate along the direction of metal routing, and the similar bridge connection structure 130 is damaged and corroded; correspondingly, when the adjacent distance is 20um or more, after one bridging structure 130 is corroded, the resistance change of the adjacent bridging structure 130 is small, which means that the adjacent bridging structure 130 is not easily corroded under the condition that the distance between the adjacent bridging structures 130 is 20 um. The data corresponding to the horizontal and vertical coordinates can be shown in the following table three.
Watch III
However, due to the influence of other wiring conditions from the edge of the outer side 301 of the sealant to the side of the display area 11, the first metal wiring group 111 and the second metal wiring group 121 cannot be arranged in the area closer to the display area 11, and can only be arranged in the position close to the edge of the first substrate 100, and on the basis of pursuing a narrow-frame display panel 10, the length of the sealant 300 from the first substrate 100 is shorter, so that the wiring area of the non-display area 1212 is narrower, the length of the outermost bridge structure 131 from the edge of the outer side 301 of the sealant cannot be formed to be at least 50um, and the length of the outermost bridge structure 131 from the adjacent bridge structure 130 cannot be at least 20um, the following technical scheme for transferring the bridge structures 130 using the branch lines 123 is provided.
As shown in fig. 9, in an embodiment of transferring the bridging structure 130 through the branch lines 123, the non-display region 12 of the first substrate 100 includes a substrate 170, a first metal layer 110, a first insulating layer 150, a second metal layer 120, a second insulating layer 160, a conductive layer 140, and a sealant 300, which are sequentially stacked; a first metal routing group 111 is formed in the first metal layer 110, and a second metal routing group 121 is formed in the second metal layer 120; the first metal routing group 111 and the second metal routing group 121 are in one-to-one corresponding conductive connection through a set of bridging structures 130; two adjacent edges of the first substrate extend along a first direction and a second direction respectively, wherein the first direction 21 is perpendicular to the second direction 22; the first metal routing group 111 has a routing direction parallel to the first direction 21, the second metal routing group 121 has a routing direction parallel to the second direction 22,
one side of the sealant 300 close to the display region 11 is the edge of the inner side 302 of the sealant, and one side of the sealant 300 far from the display region 11 is the edge of the outer side 301 of the sealant; all the bridging structures 130 are located on one side of the frame glue outer side 301 in the direction toward the display region 11; the first metal routing group 111 is located on one side of the edge of the outer side 301 of the sealant facing the display region 11, the second metal routing group 121 is located on one side of the edge of the outer side 301 of the sealant facing the display region 11, the first metal routing group 111 includes a plurality of sub-routing lines 112 arranged in parallel, and the second metal routing group 121 includes a plurality of sub-connecting lines 122 arranged in parallel and a branch line 123;
the set of bridging structures 130 includes a plurality of directly connected bridging structures 130 and one transfer bridging structure 130; the direct-connection bridging structures 130 are disposed on the sub-connection lines 122, the direct-connection bridging structures 130 directly connect the sub-traces 112 and the sub-connection lines 122, the switching bridging structures 130 are disposed on the branch lines 123 in a one-to-one correspondence, and the switching bridging structures 130 connect the branch lines 123 and the sub-traces 112; the branch line 123 is connected with the sub-connecting line 122; the number of the transit bridge structures 130 is the same as that of the branch lines 123; the routing direction of the branch line 123 and the routing direction of the sub-connection line 122 are not in the same straight line direction, and the branch line 123 and the sub-connection line 122 are arranged on the same layer and are mutually conducted; the frame sealant 300 is in a shape of a Chinese character 'hui', and is divided into a straight line region 304 and a corner region 305, the straight line region 304 includes a first straight line region 304 parallel to the first direction 21 and a second straight line region 304 parallel to the second direction 22, and the first straight line region 304 and the second straight line region 304 are connected through the corner region 305;
the sealant 300 in the first straight line area 304 and the second straight line area 304 is a straight line segment, and the sealant 300 in the corner area 305 is an arc segment; part of the bridging structure 130 is located under the sealant 300 in the corner region 305; the junction of the branch line 123 and the sub-connecting line 122 is located under the sealant 300 in the corner region 305, and the distance between the junction and the edge of the outer side 301 of the sealant is less than 50 um; the transit bridge structure 130 is the outermost bridge structure 131; the distance between the outermost bridging structure 131 and the adjacent bridging structure 130 is greater than 20 um.
Because the distance between the bridging structure 130 close to the outer side 301 of the sealant and the edge of the outer side 301 of the sealant is short, a part of the bridging structure 130 cannot meet the condition that the distance from the edge of the outer side 301 of the sealant reaches 50um, in the scheme, the position of the corresponding bridging structure 130 is changed through the branch line 123, so that the distance from the corresponding bridging structure 130 to the edge of the outer side 301 of the sealant reaches 50um, and further, the anti-corrosion effect is good. Correspondingly, when the adjacent distance is 20um or more, after one bridging structure 130 is corroded, the resistance change of the adjacent bridging structure 130 is small, which means that the adjacent bridging structure 130 is not easily influenced by corrosion under the condition that the adjacent bridging structure 130 is 20um away.
As another embodiment of the present application, the present application discloses a display device 1, the display device 1 includes a display panel 10 and a backlight module 30, the display panel 10 is divided into a display area 11 and a non-display area 12, including: the array substrate 101 is a color film substrate 201 arranged opposite to the array substrate 101; a sealant 300 is arranged between the array substrate 101 and the color film substrate 201, and the sealant 300 is arranged in the non-display area 12;
the array substrate 101 includes a substrate 170, a first metal layer 110, a first insulating layer 150, a second metal layer 120, a second insulating layer 160, and a conductive layer 140, which are sequentially stacked corresponding to the non-display region 12; a plurality of sub-traces 112 are formed on the first metal layer 110, and a plurality of sub-connection lines 122 and at least one branch line 123 are formed on the second metal layer 120; a set of bridging structures 130 is disposed in the sub-traces 112 and the sub-connecting lines 122 in a one-to-one correspondence; the conductive layer 140 connects the sub-traces 112 and the sub-connection lines 122 through the corresponding bridging structures 130; all the bridging structures 130 are disposed at the edge of the outer side 301 of the sealant toward the display region 11;
the set of bridge structures 130 includes at least one directly connected bridge structure 130 and at least one transit bridge structure 130; the direct-connection bridging structures 130 are disposed on the sub-connection lines 122, the direct-connection bridging structures 130 directly connect the sub-traces 112 and the sub-connection lines 122, the switching bridging structures 130 are disposed on the branch lines 123 in a one-to-one correspondence, and the switching bridging structures 130 connect the branch lines 123 and the sub-traces 112; the branch line 123 is connected with the sub-connecting line 122; the number of the transit bridge structures 130 is the same as that of the branch lines 123; the routing direction of the branch line 123 and the routing direction of the sub-connection line 122 are not in the same straight line direction, and the branch line 123 and the sub-connection line 122 are arranged in the same layer and are mutually conducted; the junction of the branch line 123 and the sub-connection line 122 is located under the sealant 300, and the distance between the junction and the adjacent bridging structure 130 is less than 20 um;
each of the bridging structures 130 comprises at least one deep hole 132 and at least one shallow hole 133, the conductive layer 140 covers the deep hole 132 and the shallow hole 133, the conductive layer 140 is connected to the first metal layer 110 through the deep hole 132, and the conductive layer 140 is connected to the second metal layer 120 through the shallow hole 133; the plurality of bridging structures 130 are arranged in a straight line along the direction of the frame sealant 300, in one bridging structure 130, the deep hole 132 and the shallow hole 133 are arranged side by side, and the straight line where the deep hole 132 and the shallow hole 133 are arranged side by side is perpendicular to the moving direction of the frame sealant 300; along the moving direction of the frame sealant 300, the deep holes 132 and the shallow holes 133 are arranged in a staggered manner;
in the group of bridge structures 130, the bridge structure 130 closest to the edge of the outer side 301 of the sealant is the outermost bridge structure 131, the outermost bridge structure 131 is the transfer bridge structure 130, and the outermost bridge structure 131 is disposed under the sealant 300 and covered by the sealant 300; the distance between the outermost side bridging structure 131 and the edge of the outer side 301 of the frame glue is 50-300 um; the distance between the outermost bridging structure 131 and the adjacent bridging structure 130 is at least 20 um; the outermost bridging structure 131 has a smaller pore size than the pore size of the other bridging structures 130 within the set of bridging structures except the outermost bridging structure; the sub-traces 112 are peripheral traces located in the non-display area 12, and the sub-connection lines 122 are transmission signal lines correspondingly connected to the peripheral traces one to one.
The technical solution of the present application can be widely applied to various display panels, such as TN (Twisted Nematic) display panel, IPS (In-Plane Switching) display panel, VA (Vertical Alignment) display panel, MVA (Multi-Domain Vertical Alignment) display panel, and of course, other types of display panels, such as OLED (Organic Light-Emitting Diode) display panel, and can be applied to the above solutions.
The foregoing is a more detailed description of the present application in connection with specific alternative embodiments, and the specific implementations of the present application are not to be considered limited to these descriptions. For those skilled in the art to which the present application pertains, several simple deductions or substitutions may be made without departing from the spirit of the present application, which should be considered as belonging to the protection scope of the present application.
Claims (10)
1. A display panel divided into a display area and a non-display area, comprising:
a first substrate having a first surface and a second surface,
the second substrate is arranged corresponding to the first substrate; and
the frame glue is arranged between the first substrate and the second substrate and arranged in the non-display area;
the first substrate comprises a first metal layer and a second metal layer which are sequentially arranged corresponding to the non-display area, and the first metal layer and the second metal layer are mutually insulated;
the first metal layer is provided with a first metal wiring group, and the second metal layer is provided with a second metal wiring group; the first metal wiring group comprises at least one sub-wiring, and the second metal wiring group comprises at least one sub-connecting line; sub-wires of the first metal wire group and sub-connecting wires of the second metal wire group are in one-to-one corresponding conduction connection through a group of bridging structures, and each group of bridging structures at least comprises one bridging structure;
one side of the frame glue close to the display area is the inner side of the frame glue, and one side of the frame glue far away from the display area is the outer side of the frame glue;
in the group of bridging structures, the bridging structure closest to the edge of the outer side of the frame adhesive is the outermost bridging structure, the outermost bridging structure is covered by the frame adhesive, and the aperture of the outermost bridging structure is smaller than the apertures of other bridging structures in the group of bridging structures.
2. The display panel of claim 1, wherein the outermost bridging structure has an aperture of 10-20 um.
3. The display panel of claim 1, wherein a distance between the outermost bridge structure and the outermost edge of the sealant is 50-300 um.
4. The display panel of claim 1, wherein one of the sub-traces closest to the outer edge of the sealant is a first sub-trace, the first sub-trace is a ground line or a low-level trace, and the first sub-trace is connected to the sub-connection line through the outermost bridging structure.
5. The display panel according to claim 1, wherein the first metal trace group includes a plurality of sub-traces, among the plurality of sub-traces, a sub-trace transmitting a signal voltage lower than a predetermined voltage is a low voltage sub-trace, a sub-trace transmitting a signal voltage higher than the predetermined voltage is a high voltage sub-trace, and an aperture of a bridge structure corresponding to the low voltage sub-trace is smaller than an aperture of a bridge structure corresponding to the high voltage sub-trace.
6. The display panel according to claim 1, wherein in the set of bridge structures, the distances between the bridge structures and the outer edge of the sealant are gradually increased from small to large.
7. The display panel of claim 1, wherein the outermost bridge structure comprises at least two switching holes, and among the switching holes, a switching hole closer to an outer edge of the sealant is an outermost switching hole, and in the outermost bridge structure, an aperture of the outermost switching hole is larger than apertures of other switching holes except the outermost switching hole.
8. A display panel as claimed in claim 7 wherein each of said bridging structures comprises at least one deep hole, at least one shallow hole and a conductive layer, said conductive layer being connected to said first metal layer through said deep hole, said conductive layer being connected to said second metal layer through said shallow hole; the outmost side switching hole is a deep hole.
9. A display panel divided into a display area and a non-display area, comprising:
an array substrate is provided with a plurality of first electrodes,
the color film substrate is arranged corresponding to the array substrate; and
the frame glue is arranged between the array substrate and the color film substrate, and the frame glue is arranged in the non-display area;
the array substrate comprises a substrate, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a conducting layer, wherein the substrate, the first metal layer, the first insulating layer, the second metal layer, the second insulating layer and the conducting layer are sequentially stacked corresponding to the non-display area;
two adjacent edges of the first substrate extend along a first direction and a second direction respectively, and the first direction and the second direction are perpendicular to each other;
the first metal layer is provided with a plurality of sub-wires with the wire direction parallel to the first direction, and the second metal layer is provided with a plurality of sub-connecting wires with the wire direction parallel to the second direction and at least one branch wire;
a group of bridging structures are arranged in one-to-one correspondence between the sub-wires and the sub-connecting lines; the conductive layer is connected with the sub-routing lines and the sub-connecting lines through the corresponding bridging structures;
the set of bridge structures comprises at least one direct connection bridge structure and at least one switching bridge structure;
the direct-connection bridging structure is arranged on the sub-connecting line and directly communicates the sub-routing with the sub-connecting line,
the switching bridge structures are arranged on the branch lines in a one-to-one correspondence mode, and the switching bridge structures are communicated with the branch lines and the sub-routing lines; the branch line is connected with the sub-connecting line; the number of the transfer bridge structures is the same as that of the branch lines;
the wiring direction of the branch line and the wiring direction of the sub-connecting line are not in the same straight line direction, and the branch line and the sub-connecting line are arranged on the same layer and are mutually communicated;
the junction of the branch line and the sub-connecting line is positioned under the frame glue, and the distance between the junction and the adjacent bridging structure is less than 20 um;
each of said bridging structures comprising a deep hole and a shallow hole, said conductive layer covering said deep hole and said shallow hole, said conductive layer being connected to said first metal layer through said deep hole, said conductive layer being connected to said second metal layer through said shallow hole;
in the group of bridging structures, the bridging structure closest to the edge of the outer side of the frame adhesive is the outermost bridging structure, the outermost bridging structure is the transfer bridging structure, and the outermost bridging structure is arranged under the frame adhesive and covered by the frame adhesive; the pore diameter of the outermost bridging structure is smaller than that of other bridging structures except the outermost bridging structure in the group of bridging structures;
the distance between the outermost side bridging structure and the outer edge of the frame glue is 50-300 um; the distance between the outermost bridging structure and the adjacent bridging structure is at least 20 um; the pore diameter of the outermost bridging structure is smaller than that of other bridging structures except the outermost bridging structure in the group of bridging structures;
the sub-wirings are peripheral wirings located in the non-display area, and the sub-connecting lines are transmission signal lines connected with the peripheral wirings in a one-to-one correspondence manner.
10. A display device comprising the display panel of any one of claims 1 to 9 and a backlight module for providing a light source to the display panel.
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