CN113219740B - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN113219740B CN113219740B CN202110423592.8A CN202110423592A CN113219740B CN 113219740 B CN113219740 B CN 113219740B CN 202110423592 A CN202110423592 A CN 202110423592A CN 113219740 B CN113219740 B CN 113219740B
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- 239000002184 metal Substances 0.000 claims abstract description 109
- 239000003292 glue Substances 0.000 claims abstract description 99
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 239000011148 porous material Substances 0.000 claims description 22
- 238000012546 transfer Methods 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 abstract description 22
- 230000007797 corrosion Effects 0.000 abstract description 22
- 239000010410 layer Substances 0.000 description 90
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 238000010586 diagram Methods 0.000 description 10
- 239000000565 sealant Substances 0.000 description 9
- 230000008054 signal transmission Effects 0.000 description 7
- 239000011241 protective layer Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136204—Arrangements to prevent high voltage or static electricity failures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
The application discloses a display panel and a display device, the display panel includes: the display device comprises a first substrate, a second substrate corresponding to the first substrate and frame glue arranged between the first substrate and the second substrate, wherein the first substrate comprises a first metal layer and a second metal layer which are sequentially laminated and arranged corresponding to the non-display area, and the first metal layer and the second metal layer are mutually insulated; the first metal layer is formed with a first metal wire set, and the second metal layer is formed with a second metal wire set; the first metal wiring group and the second metal wiring group are in one-to-one corresponding conduction connection through a group of bridging structures; in the group of bridging structures, the bridging structure closest to the edge outside the frame glue is an outermost bridging structure, the outermost bridging structure is positioned under the frame glue, and the aperture of the outermost bridging structure is smaller than the aperture of other bridging structures except the outermost bridging structure in the group of bridging structures; to improve the corrosion resistance of the outermost bridge structure.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to a display panel and a display device.
Background
The display panel generally comprises an array substrate and a color film substrate, the array substrate and the color film substrate are sealed by frame glue, the display panel is formed on a box, and the inside of the box is in a sealed state and is difficult to be corroded by water vapor, but wiring, bridging structures and the like formed outside the frame glue can be corroded by the water vapor.
The electrode connection between different metal layers is generally realized by the array substrate through the design of the bridging structure, a plurality of bridging structures are required to be formed on the array substrate, wherein part of bridging structures are positioned outside the frame glue and are easy to be corroded by water vapor, and part of bridging structures are positioned below the frame glue.
Disclosure of Invention
The application aims to provide a display panel and a display device, so as to improve the corrosion resistance of a bridging structure of the display panel.
The application discloses a display panel, which is divided into a display area and a non-display area, and is characterized by comprising: the display device comprises a first substrate, a second substrate corresponding to the first substrate and frame glue arranged between the first substrate and the second substrate, wherein the frame glue is arranged in the non-display area; the first substrate comprises a first metal layer and a second metal layer which are sequentially laminated corresponding to the non-display area, and the first metal layer and the second metal layer are mutually insulated; the first metal layer is formed with a first metal wire set, and the second metal layer is formed with a second metal wire set; the first metal wire set comprises at least one sub-wire, and the second metal wire set comprises at least one sub-connecting wire; the sub-wires of the first metal wire group and the sub-connecting wires of the second metal wire group are in one-to-one corresponding conduction connection through a group of bridging structures, and one group of bridging structures at least comprises one bridging structure; the side of the frame glue, which is close to the display area, is the inner side of the frame glue, and the side of the frame glue, which is far away from the display area, is the outer side of the frame glue; all the bridge structures are arranged at the edge of the outer side of the frame glue in the direction of the display area; in the group of bridging structures, the bridging structure closest to the edge outside the frame glue is an outermost bridging structure, the outermost bridging structure is located under the frame glue, and the pore diameter of the outermost bridging structure is smaller than that of other bridging structures in the group of bridging structures.
Optionally, the pore diameter of the outermost bridging structure is 20-100um.
Optionally, the distance between the outermost bridging structure and the outermost edge of the frame glue is 50-300um.
Optionally, the first metal wire group includes a plurality of sub wires arranged in parallel, and the second metal wire group includes a plurality of sub connecting wires arranged in parallel; one of the sub-wires closest to the outer side edge of the frame glue is a first sub-wire, the first sub-wire is a ground wire or a low-level wire, and the first sub-wire is connected to the sub-connection wire through the outermost bridging structure.
Optionally, the first metal wire group includes a plurality of sub wires, among the plurality of sub wires, the sub wire with the transmitted signal voltage lower than the preset voltage is a low-voltage sub wire, the sub wire with the transmitted signal voltage higher than the preset voltage is a high-voltage sub wire, and the aperture of the bridging structure corresponding to the low-voltage sub wire is smaller than that of the bridging structure corresponding to the high-voltage sub wire.
Optionally, in the group of bridging structures, the distance between the bridging structures and the edge outside the frame glue is from small to large, and the aperture of the bridging structures is gradually increased.
Optionally, the outermost bridging structure includes at least two transfer holes, among the plurality of transfer holes, the transfer hole that is closer to the edge in the frame glue outside is the outermost transfer hole, in the outermost bridging structure, the aperture in the outermost transfer hole is greater than the aperture in other transfer holes except for the outermost transfer hole.
Optionally, each of the bridge structures includes at least one deep hole, at least one shallow hole, and a conductive layer connected to the first metal layer through the deep hole, the conductive layer connected to the second metal layer through the shallow hole; the outermost transfer hole is a deep hole.
The application also discloses a display panel divided into a display area and a non-display area, comprising: the color film display device comprises an array substrate, a color film substrate and frame glue, wherein the color film substrate and the frame glue are arranged corresponding to the array substrate, and the frame glue is arranged between the array substrate and the color film substrate and is arranged in the non-display area; the array substrate comprises a substrate, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a conductive layer, wherein the substrate is sequentially laminated corresponding to the non-display area; adjacent edges of the first substrate extend along a first direction and a second direction respectively, and the first direction and the second direction are mutually perpendicular; the first metal layer is provided with a plurality of sub-wirings with wiring directions parallel to a first direction, and the second metal layer is provided with a plurality of sub-connecting lines with wiring directions parallel to a second direction and at least one branch line; the plurality of sub-wirings and the plurality of sub-connecting wires are correspondingly provided with a group of bridging structures one by one; the conductive layer is connected with the sub-wiring and the sub-connecting wire through the corresponding bridging structures; all the bridging structures are arranged at the edge of the outer side of the frame glue in the direction of the display area; the set of bridging structures includes at least one direct bridging structure and at least one transit bridging structure;
the direct connection bridging structures are arranged on the sub-connection lines, the direct connection bridging structures are directly communicated with the sub-wiring lines and the sub-connection lines, the switching bridging structures are arranged on the branch lines in a one-to-one correspondence manner, and the switching bridging structures are communicated with the branch lines and the sub-wiring lines; the branch lines are connected with the sub-connecting lines; the number of the switching bridging structures is the same as that of the branch lines; the wiring direction of the branch line and the wiring direction of the sub-connecting line are not in the same straight line direction, and the branch line and the sub-connecting line are arranged in the same layer and are mutually communicated; the junction of the branch line and the sub-connecting line is positioned under the frame glue, and the distance between the junction and the adjacent bridging structure is smaller than 20um; each bridging structure comprises a deep hole and a shallow hole, the conductive layer covers the deep hole and the shallow hole, the conductive layer is connected to the first metal layer through the deep hole, and the conductive layer is connected to the second metal layer through the shallow hole;
in the group of bridging structures, the bridging structure closest to the edge of the outer side of the frame glue is an outermost bridging structure, the outermost bridging structure is the switching bridging structure, and the outermost bridging structure is arranged under the frame glue and is covered by the frame glue; the pore diameter of the outermost bridging structure is smaller than the pore diameters of other bridging structures except the outermost bridging structure in the group of bridging structures; the distance between the outermost bridging structure and the outer edge of the frame glue is 50-300um; the distance between the outermost bridging structure and the adjacent bridging structure is at least 20um; the pore diameter of the outermost bridging structure is smaller than the pore diameters of other bridging structures except the outermost bridging structure in the group of bridging structures; the sub-wirings are peripheral wirings positioned in the non-display area, and the sub-connecting lines are transmission signal lines which are connected with the peripheral wirings in a one-to-one correspondence manner.
The application also discloses a display device which comprises the display panel and a backlight module for providing a light source for the display panel.
Compared with the scheme of arranging the protective layer on the through hole, the bridge structure of the non-display area is moved to the inside of the frame glue, the bridge structure at the outermost side close to the edge of the display panel is most easily influenced by the outside, the aperture of the bridge structure at the outermost side is smaller and smaller than that of other bridge structures, the smaller the aperture of the bridge structure is, the smaller the contact area between the bridge structure and outside water vapor is, and the lower the risk of being corroded by the water vapor is, so that the corrosion of the water vapor from the edge of the frame glue to the bridge structure is slowed down, the bridge structure can be protected from being corroded by the outside water vapor, and the manufacturing process of the protective layer can be saved.
Drawings
The accompanying drawings, which are included to provide a further understanding of embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is evident that the figures in the following description are only some embodiments of the application, from which other figures can be obtained without inventive labour for a person skilled in the art. In the drawings:
FIG. 1 is a schematic diagram of a display panel according to an embodiment of the application;
FIG. 2 is a schematic diagram of a bridging structure according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a set of bridge structures arrangement according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a first metal routing group of a display panel according to an embodiment of the present application; the method comprises the steps of carrying out a first treatment on the surface of the
FIG. 5 is a schematic view of a deep hole near the outside of a frame glue according to an embodiment of the application;
FIG. 6 is a schematic diagram of a set of bridging structures in accordance with another embodiment of the present application;
FIG. 7 is a graph showing the degree of corrosion of the outermost bridge structure from the outside of the sealant according to an embodiment of the present application;
FIG. 8 is a graph showing the degree of corrosion of an outermost bridge structure at different distances from an adjacent bridge structure according to another embodiment of the present application;
FIG. 9 is a schematic diagram of a set of bridge structures and frame glue locations according to another embodiment of the application;
fig. 10 is a schematic view of a display device of the present application.
1, a display device; 10. a display panel; 11. a display area; 12. a non-display area; 21. a first direction; 22. a second direction; 30. a backlight module; 100. a first substrate; 101. an array substrate; 110. a first metal layer; 111. a first metal wire set; 112. a sub-wiring; 112a, a first sub-trace; 120. a second metal layer; 121. a second metal wire set; 122. A sub-connection line; 123. a branch line; 130. a bridging structure; 131. an outermost bridging structure; 132. Deep holes; 132a, a first deep hole; 133. shallow holes; 133a, first shallow holes; 140. a conductive layer; 150. a first insulating layer; 160. a second insulating layer; 170. a substrate; 200. a second substrate; 201. a color film substrate; 300. frame glue; 301. the outer side of the frame adhesive; 302. the inner side of the frame glue; 304. a straight line region; 305. and a corner region.
Detailed Description
It is to be understood that the terminology used herein, the specific structural and functional details disclosed are merely representative for the purpose of describing particular embodiments, but that the application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or implicitly indicating the number of technical features indicated. Thus, unless otherwise indicated, features defining "first", "second" may include one or more such features either explicitly or implicitly; the meaning of "plurality" is two or more. The terms "comprises," "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or groups thereof may be present or added.
In addition, terms of directions or positional relationships indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., are described based on orientations or relative positional relationships shown in the drawings, are merely for convenience in describing the simplified description of the present application, and do not indicate that the apparatus or element to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus are not to be construed as limiting the present application.
Furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
The application is described in detail below with reference to the attached drawings and alternative embodiments.
As disclosed in fig. 1, a display panel 10 includes a first substrate 100 and a second substrate 200 arranged in a box, the first substrate 100 is divided into a display area 11 and a non-display area 12, a sealant 300 is disposed between the first substrate 100 and the second substrate 200, and the sealant 300 is disposed in the non-display area 12.
As shown in fig. 2, the array substrate 101 includes a substrate 170, a first metal layer 110, a first insulating layer 150, a second metal layer 120, a second insulating layer 160, and a conductive layer 140, which are sequentially stacked and disposed corresponding to the non-display area 12; specifically, the first metal trace group 111 and the second metal trace group 121 are respectively conducted through the bridge structure 130 and the conductive layer 140, and the first substrate 100 includes a first metal layer 110 and a second metal layer 120 disposed corresponding to the non-display area 12, where the first metal layer 110 and the second metal layer 120 are insulated from each other; the first metal layer 110 is formed with a first metal wire set 111, and the second metal layer 120 is formed with a second metal wire set 121; the first metal wire set 111 and the second metal wire set 121 are connected in a one-to-one correspondence manner through a set of bridging structures 130; wherein the first metal layer 110 and the second metal layer 120 in the present application belong to the same layer as the first metal layer 110 and the second metal layer 120 in the display area 11 of the display panel 10; in the present application, the first substrate 100 is an array substrate 101, and the second substrate 200 is a color film substrate 201.
As shown in fig. 3, the bridge structures 130 closest to the outer edge of the frame glue are the outermost bridge structures 131 in a group of bridge structures 130, and the pore size of the outermost bridge structures 131 is smaller than the pore sizes of the other bridge structures 130 except the outermost bridge structures 130 in the group of bridge structures 130.
The present inventors have studied and found that the bridge structure 130 of the non-display area is easily corroded by external moisture and the like due to the proximity to the outside of the display panel, thereby causing problems such as disconnection. Compared with the scheme of arranging the protective layer on the bridging structure, the bridging structure 130 of the non-display area is moved to the inside of the frame glue, the outermost bridging structure 131 near the edge of the display panel is most easily influenced by the outside, the aperture of the outermost bridging structure 131 is smaller and smaller than that of other bridging structures 130, the smaller the aperture of the bridging structure 130 is, the smaller the contact area with outside water vapor is, the smaller the aperture size can greatly reduce the contact probability of external substances with a metal layer, the lower the risk of water vapor corrosion is, and therefore the corrosion of the water vapor from the edge of the frame glue to the bridging structure 130 is slowed down, the bridging structure 130 can be protected from being corroded by the outside water vapor, and even after the corrosion occurs, the corrosion speed is obviously slowed down due to the smaller contact area, and the service life of a final product is finally prolonged; but also can save the manufacturing process of the protection layer.
As shown in the following table, a schematic diagram showing the corrosion degree of the bridge structures 130 with different pore diameters is shown, wherein the corrosion degree of the bridge structures 130 is expressed by the resistance of the bridge structures 130, and the edge of the outermost bridge structure 131, which is located at a distance of 50um from the outer side of the frame glue, is formed by: the temperature is 85 ℃ and the humidity is 85%; it can be seen from the table that, in the case of the aperture of 25um, the resistance of the bridge structure 130 reaches more than 1kΩ at 600H, and in the case of the aperture of 10um, the resistance of the bridge structure 130 does not change drastically up to 1000H, so it can be derived that the smaller the aperture, the better the corrosion resistance of the bridge structure 130. From the data in the table, the resistance of the bridge structure 130 reaches 1kΩ at 680H, and the resistance of the bridge structure 130 reaches 1kΩ at 760H, with the aperture of the bridge structure 130 being 20um. It can be seen that when the pore diameter of the bridge structure 130 is 20um, the bridge structure has a certain corrosion resistance, and specifically, the pore diameter of the outermost bridge structure 131 is 10-20um; the aperture is too small and can bring another problem, and the smaller the aperture, the smaller the contact area between conducting layer and the metal layer, the bigger the corresponding resistance, and the too big resistance can cause signal transmission's problem, so the resistance of bridging structure 130 can not be too big, and the corresponding aperture can not set too little, under the condition that the aperture in this scheme is more than or equal to 10um, does not influence normal signal's transmission.
List one
Specifically, the first metal wire set includes a plurality of sub wires 112 arranged in parallel, and the second metal wire set includes a plurality of sub connection wires 122 arranged in parallel; one of the sub-traces closest to the outer edge of the frame glue is a first sub-trace 112a, the first sub-trace 112a is a ground line or a low-level trace, and the first sub-trace 112a is connected to the sub-connection line 122 through the first bridging structure 130.
The signals transmitted by the ground wire and the low-level wiring are generally low-level signals or zero-level signals, and compared with the high-level signals, the impedance requirement on the wiring is low, the signal transmission of the ground wire and the low-level wiring is not affected even under the condition of large impedance, and compared with the high-level signals, the signal transmission is damaged when the impedance is large, so that the problem of inaccurate voltage or signal transmission is caused. Therefore, the ground wire and the low-level wire are arranged on the outer side and connected through the bridge structure 130 with small aperture, so that the risk of corrosion of the outermost bridge structure 131 can be reduced, and the influence on signal transmission of other bridge structures 130 after corrosion can be avoided.
In another embodiment, the first metal routing group includes a plurality of sub-routing wires 112 arranged in parallel, the second metal routing group includes a plurality of sub-connection wires 113 arranged in parallel, among the plurality of sub-routing wires, the sub-routing wire with a signal voltage lower than a preset voltage is a low-voltage sub-routing wire, the sub-routing wire with a signal voltage higher than the preset voltage is a high-voltage sub-routing wire, and the aperture of the bridge structure 130 corresponding to the low-voltage sub-routing wire is smaller than the aperture of the bridge structure 130 corresponding to the high-voltage sub-routing wire. The apertures of all the bridge structures 130 with low-level wiring are made small, so that the risk of corrosion of the bridge structures 130 can be reduced under the condition that normal signal transmission is not affected, and the corrosion resistance of the whole bridge structures 130 is improved.
Fig. 4 shows a schematic view of a first metal wire set 111 of a display panel 10, where the first metal wire set 111 is disposed around three sides of the display panel 10; the second metal layer 120 is formed with a plurality of groups of second metal wire groups 121, and the plurality of groups of second metal wire groups 121 are respectively connected with the first metal wire groups 111 through a plurality of groups of bridging structures 130; the plurality of second metal wire groups 121 are respectively connected to different electrostatic discharge blocks, and the electrostatic discharge wires in the present application are provided with a plurality of groups, and are respectively disposed at different positions of the first metal wire group 111, so that the electrostatic discharge on the first metal wire group 111 is performed.
Specifically, in each second metal routing group 121, the bridge structure 130 closest to the edge of the outer side 301 of the frame glue is an outermost bridge structure 131, and the outermost bridge structure 131 includes a first deep hole 132a and a first shallow hole 133a arranged in pairs; the straight line where the first deep hole 132a and the corresponding first shallow hole 133a are located is parallel to the running direction of the frame glue 300. The first metal routing group 111 has two routing lines with different directions, including the routing lines with the first direction and the routing lines with the second direction of the display panel 10, so that the outermost bridging structures 131 of each group are identical to the nearest frame glue 300 in the bridging structures 130 of the different groups, but not the outermost bridging structures 131 of each group are identical in the routing direction.
As shown in fig. 5, the outermost bridging structure 131 includes at least two through holes, and among the plurality of through holes, the through hole closer to the edge of the outer side of the frame glue is the outermost through hole 131, and in the outermost bridging structure, the hole diameter of the outermost through hole is larger than the hole diameters of the other through holes except for the outermost through hole. Each of the bridge structures includes at least one deep hole 132 through which the conductive layer is connected to the first metal layer, at least one shallow hole 133 through which the conductive layer is connected to the second metal layer, and a conductive layer; the outermost transfer hole 131 is closer to the edge of the outer side 301 of the frame glue, so that better corrosion resistance is required, and the aperture is required to be made small. Specifically, the outermost adapting hole is a deep hole 132, and it should be noted that the adapting hole in the present application is a deep hole or a shallow hole.
Fig. 6 shows a schematic diagram of the direction of the bridge structures 130, wherein the straight line where the shallow hole 133 and the deep hole 132 of each bridge structure 130 are located is parallel to the routing direction of the frame glue 300, and the aperture of the outermost bridge structure is the smallest in all bridge structures 130. All the bridge structures 130 are designed along the direction of the frame glue 300, and one of them can further narrow the distance between the bridge structures 130, so that the wiring area of the first metal wiring group 111 is further reduced. In order to reduce the wiring area of the first metal wiring group 111, the present application also provides a schematic diagram illustrating the trend of another bridge structure 130 as shown in fig. 6. In the other bridge structures 130 except the outermost bridge structure 131, the straight line where the deep hole 132 and the shallow hole 133 are located is perpendicular to the running direction of the frame glue 300; the deep holes 132 and the shallow holes 133 are arranged side by side, and the deep holes 132 and the shallow holes 133 are staggered in a row near the edge of the outer side 301 of the frame glue; according to the application, in the bridging structure 130, the deep holes 132 and the shallow holes 133 are staggered in a row of holes near the edge of the display panel 10, compared with the scheme that all the deep holes 132 face outwards or all the shallow holes 133 face inwards, as the deep holes 132 need to penetrate through two layers of insulating layers, the conducting layer 140 is connected with the first metal layer 110 through the deep holes 132, and the shallow holes 133 need only penetrate through one layer of insulating layer, the conducting layer 140 is connected with the second metal layer 120 through the shallow holes 133, so that the deep holes 132 are high in gap, the deep holes 132 or the shallow holes 133 are all close to one side of the edge of the display panel 10, and a large-area gap is formed between the deep holes 132 and the shallow holes 133, so that the thickness of the conducting layer 140 is uneven, the area of the conducting layer 140 is larger and is easy to be corroded by external water vapor.
Specifically, in the group of bridging structures, the distances between the bridging structures and the edge at the outer side of the frame glue are from small to large, and the aperture of the bridging structures is gradually increased; the pore diameter of the normal bridging structure ranges from 20 to 25um, and the pore diameter of the bridging structure which is closer to the display area is closer to the pore diameter of the normal bridging structure.
The present application discloses another display panel 10, and other structures, such as the above embodiment, are omitted herein, wherein a plurality of bridge structures 130 are arranged along the frame glue 300 along a straight line, one deep hole 132 and one shallow hole 133 are arranged side by side in one bridge structure 130, and the straight line of the deep hole 132 and the shallow hole 133 arranged side by side is perpendicular to the direction of the frame glue 300; along the running direction of the frame glue 300, the deep holes 132 and the shallow holes 133 are staggered; among the bridge structures 130, the bridge structure 130 closest to the edge of the outer side 301 of the frame glue is the outermost bridge structure 131, and the outermost bridge structure 131 is disposed under the frame glue 300 and covered by the frame glue 300; the distance between the outermost bridging structure 131 and the edge of the outer side 301 of the frame glue is 50-300um.
As shown in fig. 7, in the case that the distance between the outermost bridge structure 131 and the edge of the outer side 301 of the sealant is different, the corresponding corrosion degree and time change are shown in the graph, w is the length of the outermost bridge structure 131 from the edge of the outer side 301 of the sealant, the abscissa is the reliability time (in hours), the ordinate is the resistance value of the outermost bridge structure 131, the corrosion degree is shown by the resistance value of the outermost bridge structure 131 as the phenomenon after the bridge structure 130 is corroded is larger, and the second graph corresponds to the values of the points of the curve in fig. 7, and shows the values of specific abscissas, where the experimental conditions in fig. 7 and second graph are: in a reliable environment of 85 ℃ and 85% humidity; the table two is as follows: it should be noted that other variables, such as pore size, are controlled in the present application as default pore size, so that the distance W in the experiment is a single variable.
Table II reliability test results
As can be seen from fig. 7 and table two, the greater the value of w, i.e. the farther the outermost bridge structure 131 is from the edge of the outer side 301 of the frame glue, i.e. the nearer the outermost bridge structure 131 is from the display area 11, the corrosion resistance is significantly improved, while the present application can not only save the process of protecting the layer, but also protect the bridge structure 130 from being corroded by external water vapor by moving the bridge structure 130 of the non-display area 12 into the frame glue 300 and at least 50um from the edge of the outer side 301 of the frame glue, thereby preventing water vapor from corroding from the edge of the frame glue 300 to the bridge structure 130; however, since the wiring space of the display panel 10 is limited, the value of w cannot be infinitely large, and in general, when the width of the frame glue 300 is in the range of 500um to 1500um and the value of w is less than 300um, the internal wiring space can be satisfied, so that the wiring space of the display area 11 and the area where the edge of the frame glue inner side 302 faces the display area 11 is not compressed. Compared with the frame glue 300 having a relatively narrow width, for example, when the frame glue 300 has a narrow frame display panel 10 having a width of 200um-500um, the value of w is smaller than 200um, so that a certain space is ensured for other bridge structures 130 to be arranged.
Specifically, in one set of bridge structures 130, the bridge structure 130 closest to the edge of the outer side 301 of the frame glue is the outermost bridge structure 131, and the distance between the outermost bridge structure 131 and the adjacent bridge structure 130 is at least 20um.
Fig. 8 shows a schematic diagram of a graph of the bridge structure 130 resistance on the abscissa versus time and on the ordinate versus the distance between adjacent bridge structures 130, where the corrosion test conditions are: the closer the distance between two bridge structures 130 is from the graph, the greater the resistance of an adjacent bridge structure 130 will become in a certain period of time after one bridge structure 130 is corroded, thus indicating that the adjacent bridge structure 130 is corroded, i.e. when one bridge structure 130 is corroded, the adjacent bridge structure 130 is easily and continuously deteriorated along the direction of the metal wiring, and the adjacent bridge structure 130 is damaged and corroded; correspondingly, when the adjacent distance is 20um or more, after one bridge structure 130 is corroded, the resistance change of the adjacent bridge structure 130 is smaller, which means that the adjacent bridge structure 130 is not easily corroded when the adjacent bridge structure 130 is 20um apart. The data corresponding to the abscissa and ordinate are shown in the following table three.
Watch III
However, due to the influence of other wiring conditions from the edge of the outer side 301 of the frame glue toward the side of the display area 11, the first metal wiring set 111 and the second metal wiring set 121 cannot be disposed in a region closer to the display area 11, but only in a position closer to the edge of the first substrate 100, and on the basis of pursuing a narrow bezel display panel 10, the length of the frame glue 300 from the first substrate 100 is shorter, so that the wiring area of the non-display area 1212 is narrower, the length of the outermost bridge structure 131 from the edge of the outer side 301 of the frame glue cannot be formed to be at least 50um, and when the length of the outermost bridge structure 131 from the adjacent bridge structure 130 cannot be at least 20um, the following technical scheme for transferring the bridge structure 130 using the branch line 123 is provided.
As shown in fig. 9, the present application discloses an embodiment of transferring the bridge structure 130 by the branch line 123, wherein the non-display area 12 of the first substrate 100 includes a substrate 170, a first metal layer 110, a first insulating layer 150, a second metal layer 120, a second insulating layer 160, a conductive layer 140, and a frame glue 300, which are sequentially stacked; a first metal wire set 111 is formed in the first metal layer 110, and a second metal wire set 121 is formed in the second metal layer 120; the first metal wire set 111 and the second metal wire set 121 are connected in a one-to-one correspondence manner through a set of bridging structures 130; adjacent edges of the first substrate extend along a first direction and a second direction respectively, wherein the first direction 21 is perpendicular to the second direction 22; the first metal trace group 111 has a trace direction parallel to the first direction 21, the second metal trace group 121 has a trace direction parallel to the second direction 22,
the side of the frame glue 300 close to the display area 11 is the edge of the inner side 302 of the frame glue, and the side of the frame glue 300 far from the display area 11 is the edge of the outer side 301 of the frame glue; all the bridging structures 130 are located at one side from the edge of the outer side 301 of the frame glue towards the display area 11; the first metal wire set 111 is located at a side of the edge of the outer side 301 of the frame glue facing the display area 11, the second metal wire set 121 is located at a side of the edge of the outer side 301 of the frame glue facing the display area 11, the first metal wire set 111 includes a plurality of sub wires 112 arranged in parallel, and the second metal wire set 121 includes a plurality of sub connecting wires 122 arranged in parallel and a branch line 123;
the set of bridging structures 130 includes a plurality of direct bridging structures 130 and one transit bridging structure 130; the direct-connection bridging structures 130 are arranged on the sub-connection wires 122, the direct-connection bridging structures 130 are directly communicated with the sub-routing wires 112 and the sub-connection wires 122, the switching bridging structures 130 are arranged on the branch wires 123 in a one-to-one correspondence manner, and the switching bridging structures 130 are communicated with the branch wires 123 and the sub-routing wires 112; the branch line 123 is connected to the sub-connection line 122; the number of transit bridge structures 130 is the same as the number of branch lines 123; the wiring direction of the branch line 123 and the wiring direction of the sub-connection line 122 are not in the same straight line direction, and the branch line 123 and the sub-connection line 122 are arranged in the same layer and are mutually conducted; the frame glue 300 is in a shape of a Chinese character 'hui', and is divided into a linear region 304 and a corner region 305, wherein the linear region 304 comprises a first linear region 304 parallel to the first direction 21 and a second linear region 304 parallel to the second direction 22, and the first linear region 304 is connected with the second linear region 304 through the corner region 305;
the frame glue 300 in the first linear region 304 and the second linear region 304 is a linear segment, and the frame glue 300 in the corner region 305 is an arc segment; a portion of the bridge structure 130 is located under the sealant 300 in the corner region 305; the junction between the branch line 123 and the sub-connection line 122 is located under the sealant 300 in the corner region 305, and the distance between the junction and the edge of the sealant outer side 301 is less than 50um; the transit bridge structure 130 is the outermost bridge structure 131; the distance between the outermost bridge structure 131 and the adjacent bridge structure 130 is greater than 20um.
Because the distance between the bridging structure 130 near the outer side 301 of the frame glue and the edge of the outer side 301 of the frame glue is relatively short, there is a situation that part of the bridging structure 130 cannot meet the requirement that the distance from the edge of the outer side 301 of the frame glue reaches 50 um. Correspondingly, when the adjacent distance is 20um or more, after one bridge structure 130 is corroded, the resistance change of the adjacent bridge structure 130 is smaller, which means that the adjacent bridge structure 130 is not easily corroded under the condition that the adjacent bridge structure 130 is 20um apart.
As another embodiment of the present application, the present application discloses a display device 1, the display device 1 includes a display panel 10 and a backlight module 30, the display panel 10 is divided into a display area 11 and a non-display area 12, including: an array substrate 101, and a color film substrate 201 disposed opposite to the array substrate 101; a frame glue 300 is arranged between the array substrate 101 and the color film substrate 201, and the frame glue 300 is arranged in the non-display area 12;
the array substrate 101 includes a substrate 170, a first metal layer 110, a first insulating layer 150, a second metal layer 120, a second insulating layer 160, and a conductive layer 140, which are sequentially stacked in correspondence to the non-display area 12; the first metal layer 110 is formed with a plurality of sub-wires 112, and the second metal layer 120 is formed with a plurality of sub-connection wires 122 and at least one branch wire 123; the plurality of sub-wires 112 and the plurality of sub-connecting wires 122 are provided with a group of bridging structures 130 in a one-to-one correspondence; the conductive layer 140 connects the sub-trace 112 and the sub-connection line 122 through the corresponding bridge structure 130; all the bridge structures 130 are disposed at the edge of the outer side 301 of the sealant in the direction towards the display area 11;
the set of bridge structures 130 includes at least one direct-connect bridge structure 130 and at least one transit bridge structure 130; the direct-connection bridging structures 130 are arranged on the sub-connection wires 122, the direct-connection bridging structures 130 are directly communicated with the sub-routing wires 112 and the sub-connection wires 122, the switching bridging structures 130 are arranged on the branch wires 123 in a one-to-one correspondence manner, and the switching bridging structures 130 are communicated with the branch wires 123 and the sub-routing wires 112; the branch line 123 is connected to the sub-connection line 122; the number of the transit bridge structures 130 is the same as the number of the branch lines 123; the wiring direction of the branch line 123 is not in the same straight line direction as the wiring direction of the sub-connection line 122, and the branch line 123 and the sub-connection line 122 are arranged in the same layer and are mutually conducted; the junction between the branch line 123 and the sub-connection line 122 is located under the frame glue 300, and the distance between the junction and the adjacent bridge structure 130 is less than 20um;
each of the bridge structures 130 includes at least one deep hole 132, at least one shallow hole 133, the conductive layer 140 covers the deep hole 132 and the shallow hole 133, the conductive layer 140 is connected to the first metal layer 110 through the deep hole 132, and the conductive layer 140 is connected to the second metal layer 120 through the shallow hole 133; the plurality of bridge structures 130 are arranged in a straight line along the running direction of the frame glue 300, one deep hole 132 and one shallow hole 133 are arranged side by side in one bridge structure 130, and the straight line of the deep hole 132 and the shallow hole 133 arranged side by side is perpendicular to the running direction of the frame glue 300; along the running direction of the frame glue 300, the deep holes 132 and the shallow holes 133 are staggered;
in the group of bridge structures 130, the bridge structure 130 closest to the edge of the outer side 301 of the frame glue is an outermost bridge structure 131, the outermost bridge structure 131 is the transfer bridge structure 130, and the outermost bridge structure 131 is disposed under the frame glue 300 and covered by the frame glue 300; the distance between the outermost bridging structure 131 and the edge of the outer side 301 of the frame glue is 50-300um; the distance between the outermost bridge structure 131 and the adjacent bridge structure 130 is at least 20um; the pore size of the outermost bridging structure 131 is smaller than the pore sizes of the other bridging structures 130 in the set of bridging structures except the outermost bridging structure; the sub-wirings 112 are peripheral wirings located in the non-display area 12, and the sub-connection lines 122 are transmission signal lines connected to the peripheral wirings in a one-to-one correspondence.
The technical scheme of the application can be widely applied to various display panels, such as TN (Twisted Nematic) display panels, IPS (In-Plane Switching) display panels, VA (Vertical Alignment) display panels, MVA (Multi-Domain Vertical Alignment) display panels, and of course, other types of display panels, such as OLED (Organic Light-Emitting Diode) display panels, can be applied to the scheme.
The above description of the application in further detail in connection with specific alternative embodiments does not identify the practice of the application as limited to these descriptions. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the application, and these shall be considered to be within the scope of the application.
Claims (2)
1. A display panel divided into a display area and a non-display area, comprising:
an array substrate having a plurality of substrates arranged in a row,
the color film substrate is arranged corresponding to the array substrate; and
the frame glue is arranged between the array substrate and the color film substrate and is arranged in the non-display area;
the array substrate comprises a substrate, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a conductive layer, wherein the substrate is sequentially laminated corresponding to the non-display area;
adjacent edges of the array substrate extend along a first direction and a second direction respectively, and the first direction is perpendicular to the second direction;
the first metal layer is provided with a plurality of sub-wirings with wiring directions parallel to a first direction, and the second metal layer is provided with a plurality of sub-connecting lines with wiring directions parallel to a second direction and at least one branch line;
the plurality of sub-wirings and the plurality of sub-connecting wires are correspondingly provided with a group of bridging structures one by one; the conductive layer is connected with the sub-wiring and the sub-connecting wire through the corresponding bridging structures;
the group of bridging structures comprises at least one direct connection bridging structure and at least one transfer bridging structure;
the direct connection bridging structure is arranged on the sub-connection line and is directly communicated with the sub-wiring line and the sub-connection line,
the switching bridging structures are arranged on the branch lines in a one-to-one correspondence manner, and the switching bridging structures are communicated with the branch lines and the sub-wiring; the branch lines are connected with the sub-connecting lines; the number of the switching bridging structures is the same as that of the branch lines;
the wiring direction of the branch line and the wiring direction of the sub-connecting line are not in the same straight line direction, and the branch line and the sub-connecting line are arranged in the same layer and are mutually communicated;
the junction of the branch line and the sub-connecting line is positioned under the frame glue, and the distance between the junction and the adjacent bridging structure is smaller than 20um;
each bridging structure comprises a deep hole and a shallow hole, the conductive layer covers the deep hole and the shallow hole, the conductive layer is connected to the first metal layer through the deep hole, and the conductive layer is connected to the second metal layer through the shallow hole;
in the group of bridging structures, the bridging structure closest to the edge of the outer side of the frame glue is an outermost bridging structure, the outermost bridging structure is the switching bridging structure, and the outermost bridging structure is arranged under the frame glue and is covered by the frame glue; the pore diameter of the outermost bridging structure is smaller than the pore diameters of other bridging structures except the outermost bridging structure in the group of bridging structures;
the distance between the outermost bridging structure and the outer edge of the frame glue is 50-300um; the distance between the outermost bridging structure and the adjacent bridging structure is at least 20um; the pore diameter of the outermost bridging structure is smaller than the pore diameters of other bridging structures except the outermost bridging structure in the group of bridging structures;
the sub-wirings are peripheral wirings positioned in the non-display area, and the sub-connecting lines are transmission signal lines which are connected with the peripheral wirings in a one-to-one correspondence manner.
2. A display device comprising the display panel of claim 1 and a backlight module for providing a light source for the display panel.
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