CN113219741B - Display panel and display device - Google Patents

Display panel and display device Download PDF

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Publication number
CN113219741B
CN113219741B CN202110423716.2A CN202110423716A CN113219741B CN 113219741 B CN113219741 B CN 113219741B CN 202110423716 A CN202110423716 A CN 202110423716A CN 113219741 B CN113219741 B CN 113219741B
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China
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sub
bridging
frame glue
outermost
structures
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CN113219741A (en
Inventor
唐榕
王立苗
王杰
张建英
康报虹
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HKC Co Ltd
Mianyang HKC Optoelectronics Technology Co Ltd
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HKC Co Ltd
Mianyang HKC Optoelectronics Technology Co Ltd
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1339Gaskets; Spacers; Sealing of cells
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136204Arrangements to prevent high voltage or static electricity failures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

The application discloses a display panel and a display device, wherein the display panel comprises a first substrate and a second substrate which is arranged corresponding to the first substrate; frame glue is arranged between the first substrate and the second substrate, the first substrate comprises a first metal layer and a second metal layer which are arranged corresponding to the non-display area, and the first metal wiring groups and the second metal wiring groups are in one-to-one correspondence conduction connection through a group of bridging structures; one side of the frame glue away from the display area is the outer side of the frame glue; all the bridging structures are arranged in the direction that the edge of the outer side of the frame glue faces the display area; in the group of bridging structures, the bridging structure closest to the edge of the outer side of the frame glue is the outermost bridging structure, and the outermost bridging structure comprises first deep holes and first shallow holes which are arranged in pairs; the straight line where the first deep hole and the corresponding first shallow hole are located is parallel to the moving direction of the frame glue, so that the corrosion resistance of the bridging structure of the display panel is improved.

Description

Display panel and display device
Technical Field
The application relates to the technical field of display, in particular to a display panel and a display device.
Background
The display panel generally includes an array substrate and a color film substrate, the array substrate and the color film substrate are sealed by sealant, and the display panel is formed by sealing the array substrate and the color film substrate.
The array substrate generally adopts the design of a bridging structure to realize the electrode connection between different metal layers, a plurality of bridging structures need to be formed on the array substrate, wherein part of the bridging structures are positioned outside the frame glue and are easily corroded by water vapor, and a part of the bridging structures are positioned below the frame glue.
Disclosure of Invention
The application aims to provide a display panel and a display device, and the corrosion resistance of a bridging structure of a non-display area of the display panel is improved.
The application discloses a display panel, which is divided into a display area and a non-display area, wherein the display panel comprises a first substrate and a second substrate arranged corresponding to the first substrate; frame glue is arranged between the first substrate and the second substrate and arranged in the non-display area; the first substrate comprises a first metal layer and a second metal layer which are arranged corresponding to the non-display area, and the first metal layer and the second metal layer are mutually insulated; the first metal layer is provided with a first metal routing group, and the second metal layer is provided with a second metal routing group; the first metal wiring group comprises at least one sub-wiring, and the second metal wiring group comprises at least one sub-connecting line; sub-wires of the first metal wire group and sub-connecting wires of the second metal wire group are in one-to-one corresponding conduction connection through a group of bridging structures, and each group of bridging structures at least comprises one bridging structure; one side of the frame glue close to the display area is the inner side of the frame glue, and one side of the frame glue far away from the display area is the outer side of the frame glue; in the group of bridging structures, the bridging structure closest to the edge of the outer side of the frame glue is the outermost bridging structure, and the outermost bridging structure is covered by the frame glue;
each of the bridge structures comprises at least one deep hole, at least one shallow hole, and a conductive layer, wherein the conductive layer is connected to the first metal layer through the deep hole, and the conductive layer is connected to the second metal layer through the shallow hole; and the straight line where the deep hole of the outermost side bridging structure and the shallow hole of the outermost side bridging structure are located is parallel to the extending direction of the frame glue at the position corresponding to the outermost side bridging structure.
Optionally, the first metal routing group is arranged around three sides of the display panel; the second metal layer is formed with a plurality of groups of second metal wiring groups, and the plurality of groups of second metal wiring groups are respectively connected with the first metal wiring groups through a plurality of groups of bridging structures.
Optionally, in each group of second metal routing groups, the bridge structure closest to the edge on the outer side of the frame adhesive is an outermost side bridge structure, and the outermost side bridge structure includes a first deep hole and a first shallow hole which are arranged in pair; the straight line of the first deep hole and the corresponding first shallow hole is parallel to the moving direction of the frame glue.
Optionally, the distance between the outermost bridge structure and the outer edge of the sealant is 50-300um.
Optionally, the distance between the outermost bridging structure and the adjacent bridging structure is at least greater than 20um.
Optionally, in all the bridging structures, a straight line where the shallow hole and the deep hole of each bridging structure are located is parallel to the routing direction of the sealant.
Optionally, in the other bridging structures except the outermost bridging structure, a straight line where the deep hole and the shallow hole are located is perpendicular to the moving direction of the frame adhesive; the deep holes and the shallow holes are arranged side by side, and the deep holes and the shallow holes are distributed in a staggered mode in one row close to the edge of the outer side of the frame glue.
Optionally, the length direction of the first substrate is a first direction, and the height direction is a second direction, where the first direction is perpendicular to the second direction; the wiring direction of the first metal wiring group is parallel to a first direction, and the wiring direction of the second metal wiring group is parallel to a second direction; the first metal wiring group comprises a plurality of sub-wirings which are arranged in parallel, and the second metal wiring group comprises a plurality of sub-connecting lines which are arranged in parallel and at least one branch line;
the set of bridge structures comprises at least one direct connection bridge structure and at least one transfer bridge structure; the direct connection bridging structures are arranged on the sub-connecting lines and directly communicated with the sub-wires and the sub-connecting lines, the switching bridging structures are correspondingly arranged on the branch lines one by one, and the switching bridging structures are communicated with the branch lines and the sub-wires; the branch line is connected with the sub-connecting line; the number of the transfer bridge structures is the same as that of the branch lines; the wiring direction of the branch lines and the wiring direction of the sub-connecting lines are not in the same straight line direction, and the branch lines and the sub-connecting lines are arranged in the same layer and are mutually conducted; the frame glue is in a shape of a Chinese character 'hui', and is divided into a linear area and a corner area, the linear area comprises a first linear area parallel to a first direction and a second linear area parallel to a second direction, and the first linear area is connected with the second linear area through the corner area; the frame glue in the first straight line area and the second straight line area is a straight line section, and the frame glue in the corner area is an arc line section; part of the bridging structure is positioned under the frame glue of the corner region; the joint of the branch line and the sub-connecting line is positioned under the frame glue of the corner area, and the distance between the joint and the edge of the outer side of the frame glue is less than 50um; the transfer bridge structure is the outermost side bridge structure.
The present application also discloses another display panel, which is divided into a display area and a non-display area, including: the array substrate is a color film substrate arranged opposite to the array substrate; frame glue is arranged between the array substrate and the color film substrate and is arranged in the non-display area; the array substrate comprises a substrate, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a conducting layer, wherein the substrate, the first metal layer, the first insulating layer, the second metal layer, the second insulating layer and the conducting layer are sequentially stacked corresponding to the non-display area; the length direction of the first substrate is a first direction, the height direction of the first substrate is a second direction, and the first direction is perpendicular to the second direction; the first metal layer is provided with a plurality of sub-wires with the wire direction parallel to the first direction, and the second metal layer is provided with a plurality of sub-connecting wires with the wire direction parallel to the second direction and at least one branch wire; the plurality of sub-routing lines and the plurality of sub-connecting lines are provided with a group of bridging structures in a one-to-one correspondence manner; the conductive layer is connected with the sub-routing lines and the sub-connecting lines through the corresponding bridging structures; all the bridging structures are arranged in the direction that the edge of the outer side of the frame glue faces the display area;
the set of bridge structures comprises at least one direct connection bridge structure and at least one transfer bridge structure; the direct connection bridging structures are arranged on the sub-connecting lines and directly communicated with the sub-wires and the sub-connecting lines, the switching bridging structures are correspondingly arranged on the branch lines one by one, and the switching bridging structures are communicated with the branch lines and the sub-wires; the branch line is connected with the sub-connecting line; the number of the transfer bridge structures is the same as that of the branch lines; the wiring direction of the branch line and the wiring direction of the sub-connecting line are not in the same straight line direction, and the branch line and the sub-connecting line are arranged on the same layer and are mutually communicated; the junction of the branch line and the sub-connecting line is positioned under the frame glue, and the distance between the junction and the adjacent bridging structure is less than 20um; each of said bridging structures comprising a deep hole and a shallow hole, said conductive layer covering said deep hole and said shallow hole, said conductive layer being connected to said first metal layer through said deep hole, said conductive layer being connected to said second metal layer through said shallow hole;
in the group of bridging structures, the bridging structure closest to the edge of the outer side of the frame adhesive is the outermost bridging structure, the outermost bridging structure is the transfer bridging structure, and the outermost bridging structure is arranged under the frame adhesive and covered by the frame adhesive; the straight line where the deep hole of the outermost side bridging structure and the shallow hole of the outermost side bridging structure are located is parallel to the extending direction of the frame glue at the position corresponding to the outermost side bridging structure; the distance between the outermost side bridging structure and the outer edge of the frame glue is 50-300um; the distance between the outermost bridging structure and the adjacent bridging structure is at least 20um; the sub-wirings are peripheral wirings positioned in the non-display area, and the sub-connecting lines are transmission signal lines which are connected with the peripheral wirings in a one-to-one correspondence manner.
The application also discloses a display device, including foretell display panel and for display panel provides the backlight unit of light source.
This application will the bridging structure in non-display area moves to and seals inside and extend to the display area direction of gluing, utilizes and seals the preliminary isolated outside steam of glue, and this application is parallel with the frame glue trend through the deep hole with outside bridging structure and shallow hole and sets up moreover for the marginal distance in outside bridging structure and the frame glue outside is farther, and for the scheme that the shallow hole setting is close to the display panel edge, the deep hole is stronger with shallow hole parallel arrangement's anti-corrosion ability, also is difficult for receiving external corrosion.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
fig. 1 is a schematic view of a display panel according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a bridge structure according to an embodiment of the present application;
FIG. 3 is a schematic illustration of the deep and shallow hole orientation of an outermost bridging structure according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a first metal routing group of a display panel according to an embodiment of the present application;
FIG. 5 is a schematic view of a set of bridge structures according to an embodiment of the present application;
FIG. 6 is a schematic view of a set of bridge structures according to another embodiment of the present application;
FIG. 7 is a graphical illustration of the different erosion levels of the deep hole and shallow hole arrangements of another embodiment of the present application;
fig. 8 is a schematic diagram of a set of bridge structures and sealant positions according to another embodiment of the present application;
fig. 9 is a graph illustrating different corrosion degrees of the outermost bridging structure from the outside of the sealant according to an embodiment of the disclosure;
FIG. 10 is a graphical illustration of the degree of erosion at different distances from the outermost bridging structure to adjacent bridging structures of another embodiment of the present application;
fig. 11 is a schematic diagram of a set of bridge structures and sealant positions according to another embodiment of the present application;
fig. 12 is a schematic diagram of a display device of the present application.
Wherein, 1, a display device; 10. a display panel; 11. a display area; 12. a non-display area; 21. a first direction; 22. a second direction; 30. a backlight module; 100. a first substrate; 101. an array substrate; 110. a first metal layer; 111. a first metal wiring group; 112. sub-routing; 120. a second metal layer; 121. a second metal wiring group; 122. a sub-connection line; 123. a branch line; 130. a bridging structure; 131. an outermost bridging structure; 132. deep holes; 132a, a first deep hole; 133. shallow holes; 133a, a first shallow hole; 140. a conductive layer; 150. a first insulating layer; 160. a second insulating layer; 170. a substrate; 200. a second substrate; 201. a color film substrate; 300. frame glue; 301. the outer side of the frame glue; 302. the inner side of the frame glue; 304. a linear region; 305. a corner region.
Detailed Description
It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and any variations thereof, are intended to cover a non-exclusive inclusion, which may have the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or combinations thereof.
Further, terms of orientation or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, are described based on the orientation or relative positional relationship shown in the drawings, are simply for convenience of description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.
Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly and encompass, for example, both fixed and removable coupling as well as integral coupling; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.
The present application is described in detail below with reference to the figures and alternative embodiments.
As shown in fig. 1, a display panel 10 is disclosed, the display panel 10 includes a first substrate 100 and a second substrate 200 arranged in a box-to-box manner, the first substrate 100 is divided into a display region 11 and a non-display region 12, a sealant 300 is arranged between the first substrate 100 and the second substrate 200, and the sealant 300 is arranged in the non-display region 12.
As fig. 2 discloses a schematic view of the first substrate 100, the array substrate 101 includes a substrate 170, a first metal layer 110, a first insulating layer 150, a second metal layer 120, a second insulating layer 160, and a conductive layer 140, which are sequentially stacked corresponding to the non-display region 12; specifically, the first metal routing group 111 and the second metal routing group 121 are respectively conducted through the bridging structure 130 and the conductive layer 140, the first substrate 100 includes a first metal layer 110 and a second metal layer 120 disposed corresponding to the non-display region 12, and the first metal layer 110 and the second metal layer 120 are insulated from each other; a first metal routing group 111 is formed on the first metal layer 110, and a second metal routing group 121 is formed on the second metal layer 120; the first metal wiring group 111 and the second metal wiring group 121 are in one-to-one corresponding conductive connection through a group of bridging structures 130; each of the bridging structures 130 comprises a deep hole 132, a shallow hole 133 and a conductive layer 140, wherein the conductive layer 140 covers the deep hole 132 and the shallow hole 133, the conductive layer 140 is connected to the first metal layer 110 through the deep hole 132, and the conductive layer 140 is connected to the second metal layer 120 through the shallow hole 133; as shown in fig. 3, each of the bridge structures 130 includes at least one deep hole 132, at least one shallow hole 133, and a conductive layer 140, wherein the conductive layer 140 covers the deep hole 132 and the shallow hole 133, the conductive layer 140 is connected to the first metal layer 110 through the deep hole 132, and the conductive layer 140 is connected to the second metal layer 120 through the shallow hole 133; in the group of bridge structures 130, the bridge structure 130 closest to the edge of the outer side 301 of the sealant is an outermost bridge structure 131, and the outermost bridge structure 131 includes a first deep hole 132a and a first shallow hole 133a which are arranged in pair; the straight line of the first deep hole 132a and the corresponding first shallow hole 133a is parallel to the extending direction of the sealant 300 at the position corresponding to the outermost bridging structure 131.
This application will the bridging structure 130 of non-display area 12 moves inside to frame and glues 300 and extend to display area 11 direction, utilize and glue 300 preliminary isolated outside steam, and this application is through the deep hole 132 with the shallow hole 133 parallel with the frame that the bridging structure 131 outside moves towards the setting with the frame, make the marginal distance of the outside bridging structure 131 and the frame outside 301 farther, and set up the scheme that is close to display panel 10 edge for shallow hole 133, deep hole 132 is stronger with shallow hole 133 parallel arrangement's anti-corrosion ability, also difficult external corruption.
Wherein the first metal layer 110 and the second metal layer 120 in the present application belong to the same layer as the first metal layer 110 and the second metal layer 120 in the display area 11 of the display panel 10; in the present application, the first substrate 100 is an array substrate 101, and the second substrate 200 is a color filter substrate 201. It should be noted that, in the present application, the first metal routing group 111, i.e. the sub-routing 112, is a peripheral routing of the non-display region 12 and provides a driving signal voltage (e.g. VGH, VGL, CLK, VCOM, etc.) for the display panel 10, and the second metal routing group 121, i.e. the sub-connecting line 122, is an electrostatic discharge (ESD) routing, and switches and conducts the Static electricity of the peripheral routing of the non-display region 12 to the outside of the display panel 10 through the bridging structure 130, so as to prevent the peripheral routing of the non-display region 12 from failing due to ESD.
Fig. 4 is a schematic diagram illustrating a first metal routing group 111 of a display panel 10, where the first metal routing group 111 surrounds three sides of the display panel 10; a plurality of groups of second metal routing groups 121 are formed on the second metal layer 120, and the plurality of groups of second metal routing groups 121 are respectively connected with the first metal routing groups 111 through a plurality of groups of bridging structures 130; the multiple groups of second metal routing groups 121 are respectively connected to different electrostatic discharge blocks, and the electrostatic discharge routing in this application is provided with multiple groups, which are respectively arranged at different positions of the first metal routing group 111, so that the electrostatic discharge on the first metal routing group 111 is realized.
Specifically, in each group of second metal routing groups 121, the bridging structure 130 closest to the edge of the outer side 301 of the sealant is an outermost bridging structure 131, and the outermost bridging structure 131 includes a first deep hole 132a and a first shallow hole 133a which are arranged in pair; the straight line of the first deep hole 132a and the corresponding first shallow hole 133a is parallel to the moving direction of the sealant 300. The first metal routing group 111 has two routing lines in different directions, which respectively include a routing line in the length direction and a routing line in the width direction of the display panel 10, so that in the bridging structures 130 in different groups, the outermost bridging structure 131 in each group is in the same direction as the closest sealant 300, but not the outermost bridging structure 131 in each group is in the same direction.
As shown in fig. 5, which is a schematic view illustrating the trend of a bridging structure 130 in the area a of fig. 4, in all bridging structures 130, a straight line where the shallow hole 133 and the deep hole 132 of each bridging structure 130 are located is parallel to the routing direction of the sealant 300. All the bridging structures 130 are designed along the moving direction of the sealant 300, and one of them can further narrow the distance between the bridging structures 130, so as to further reduce the wiring area of the first metal wiring group 111. In order to reduce the wiring area of the first metal wiring group 111, the present application also provides a schematic diagram illustrating the direction of another bridge structure 130 as shown in fig. 6.
Different from the previous embodiment, in the other bridging structures 130 except for the outermost bridging structure 131, the straight line where the deep hole 132 and the shallow hole 133 are located is perpendicular to the moving direction of the sealant 300; the deep holes 132 and the shallow holes 133 are arranged side by side, and in one row close to the edge of the outer side 301 of the frame glue, the deep holes 132 and the shallow holes 133 are arranged in a staggered manner; in the bridging structure 130, in a row of holes near the edge of the display panel 10, the deep holes 132 and the shallow holes 133 are arranged in a staggered manner, and for the scheme that all the deep holes 132 face outward or all the shallow holes 133 face inward, because the deep holes 132 need to penetrate through two insulating layers, the conductive layer 140 is connected with the first metal layer 110 through the deep holes 132, and the shallow holes 133 only need to penetrate through one insulating layer, the conductive layer 140 is connected with the second metal layer 120 through the shallow holes 133, so that the fracture height of the deep holes 132 is high, the deep holes 132 or the shallow holes 133 all lean against one side of the edge of the display panel 10, a large-area fracture is formed between the deep holes 132 and the shallow holes 133, so that the thickness of the conductive layer 140 is not uniform, the area of the conductive layer 140 is larger, and is easily corroded by external water vapor, and after the deep holes 132 and the shallow holes 133 are arranged in a staggered manner, the fracture between the deep holes 132 and the shallow holes 133 is discontinuous, the uniformity of the conductive layer 140 is better, and the conductive layer is not easily corroded by the external world.
Specifically, the aperture of the row of holes close to the edge of the outer side 301 of the sealant is smaller than the aperture of the row of holes close to one side of the display region 11. As shown in the following table, a schematic diagram of the corrosion degree of the bridge structure 130 with different apertures is shown, where the corrosion degree of the bridge structure 130 is represented by the resistance of the bridge structure 130, the edge of the outermost bridge structure 131 away from the outer side of the sealant is 50um, and the corrosion conditions are as follows: the temperature is 85 ℃, and the humidity is 85%; as can be seen from the table, in the case of the aperture of 25um, the resistance of the bridging structure 130 reaches more than 1k Ω at 600H, and in the case of the aperture of 10um, the resistance of the bridging structure 130 does not change drastically up to 1000H, and thus, it can be found that the smaller the aperture, the better the corrosion resistance of the bridging structure 130. From the data in the table, the resistance of the bridging structure 130 reached 1k Ω at 680H for a 20um aperture of the bridging structure 130, and 1k Ω at 760H for a 15um aperture of the bridging structure 130. It can be seen that when the aperture of the bridging structure 130 is 20um, the bridging structure has a certain corrosion protection capability, and specifically, the aperture of the outermost bridging structure 131 is 10 to 20um; the aperture is too little can bring another problem, and the aperture is less, and the area of contact between conducting layer and the metal level is less, and corresponding resistance is also big more, and the too big problem that can cause signal transmission of resistance, therefore bridging structure 130's resistance can not be too big, and the aperture that corresponds can not set up too little, under the condition of aperture more than or equal to 10um in this scheme, does not influence the transmission of normal signal.
Watch 1
Figure BDA0003028924260000131
Figure BDA0003028924260000141
In another embodiment, the aperture of the shallow holes 133 in the row of holes near the edge of the outer side 301 of the sealant is smaller than the aperture of the deep holes 132. The shallow hole is more easily corroded than the deep hole, and the corrosion resistance of the shallow hole is improved by making the diameter of the shallow hole small.
As shown in fig. 8, the present application discloses another display panel 10, other structures are as in the above embodiment, and are omitted here, a plurality of the bridge structures 130 are arranged in a straight line along the moving direction of the sealant 300, in one of the bridge structures 130, the one deep hole 132 and the one shallow hole 133 are arranged side by side, and the straight line where the deep hole 132 and the shallow hole 133 arranged side by side is perpendicular to the moving direction of the sealant 300; along the running direction of the frame sealant 300, the deep holes 132 and the shallow holes 133 are arranged in a staggered manner; in the group of bridge structures 130, the bridge structure 130 closest to the edge of the outer side 301 of the sealant is an outermost bridge structure 131, and the outermost bridge structure 131 is disposed under the sealant 300 and covered by the sealant 300; the distance between the outermost side bridging structure 131 and the edge of the outer side 301 of the frame glue is 50-300um.
As shown in fig. 9, a graph corresponding to the change of corrosion degree and time when the distance between the outermost bridge structure 131 and the edge of the outer side 301 of the sealant is different is shown, where w is the length of the outermost bridge structure 131 from the edge of the outer side 301 of the sealant, the abscissa in the graph is reliability time (unit is hour), and the ordinate is the resistance value of the outermost bridge structure 131, since the phenomenon after the bridge structure 130 is corroded is that the resistance value is increased, the ordinate in the graph is the resistance value of the outermost bridge structure 131 to represent the corrosion degree, in combination, the first table corresponds to the value of each point of the curve of fig. 9 to represent the specific value of the abscissa, and the experimental conditions in fig. 9 and the second table are as follows: under a reliable environment of 85 ℃ and 85% humidity; table II is as follows: it should be noted that other variables, such as the aperture size, are controlled as default apertures in this application, so that the distance W in this experiment is a single variable.
Watch two
Figure BDA0003028924260000151
From the experimental data, the larger the value of w is, i.e. the farther the outermost bridging structure 131 is from the edge of the outer side 301 of the sealant, i.e. the closer the outermost bridging structure 131 is to the display area 11, the corrosion resistance is significantly improved, as can be seen from fig. 9 and table one, in the present application, by moving the bridging structure 130 of the non-display area 12 into the sealant 300 and at least 50um away from the edge of the outer side 301 of the sealant, the water vapor is prevented from corroding from the edge of the sealant 300 to the bridging structure 130, which not only can save the manufacturing process of the protective layer, but also can protect the bridging structure 130 from being corroded by the water vapor outside; however, since the wiring space of the display panel 10 is limited, the value of w cannot be infinite, and generally, in the range of the width of the sealant 300 from 500um to 1500um, when the value of w is less than 300um, the internal wiring space can be satisfied, so that the wiring space of the display region 11 and the region of the edge of the inner side 302 of the sealant facing the display region 11 is not compressed. For example, for a narrow-frame display panel 10 with a width of the sealant 300 of 200um to 500um, when the value of w is less than 200um, it can be ensured that the other bridging structures 130 have a certain space for arrangement.
Specifically, in one group of the bridge structures 130, the bridge structure 130 closest to the edge of the outer side 301 of the sealant is an outermost bridge structure 131, and a distance between the outermost bridge structure 131 and the adjacent bridge structure 130 is at least 20um.
Fig. 10 shows a graph with time on the abscissa and resistance of the bridging structure 130 on the ordinate for different distances between adjacent bridging structures 130, under the corrosion test conditions: under the conditions that the temperature is 85 ℃ and the humidity is 85%, as seen from a curve in the figure, the closer the distance between two bridging structures 130 is, after one bridging structure 130 is corroded, the greater the resistance of the adjacent bridging structure 130 becomes within a certain time, which indicates that the adjacent bridging structure 130 is corroded, that is, after one bridging structure 130 is corroded, the resistance is easy to continuously deteriorate along the direction of the metal routing, and the adjacent bridging structure 130 is damaged and corroded; correspondingly, when the adjacent distance is 20um or more, after one bridging structure 130 is corroded, the resistance change of the adjacent bridging structure 130 is small, which means that the adjacent bridging structure 130 is not easily influenced by corrosion under the condition that the adjacent bridging structure 130 is 20um away. The data corresponding to the abscissa and ordinate can be represented by the following table three.
Watch III
Figure BDA0003028924260000161
However, due to the influence of other wiring conditions from the edge of the frame glue outer side 301 toward the side of the display area 11, the first metal wiring group 111 and the second metal wiring group 121 cannot be arranged in the area closer to the display area 11, and can only be arranged at the position close to the edge of the first substrate 100, and on the basis of pursuing a narrow-frame display panel 10, the length of the frame glue 300 from the first substrate 100 is shorter, so that the wiring area of the non-display area 1212 is narrower, the length of the outermost bridge structure 131 from the edge of the frame glue outer side 301 cannot be formed to be at least 50um, and the length of the outermost bridge structure 131 from the adjacent bridge structure 130 cannot be at least 20um, the following technical solution for transferring the bridge structures 130 by using the branch lines 123 is provided.
As shown in fig. 11, the present application discloses an embodiment of transferring the bridge structure 130 through the branch line 123, the non-display area 12 of the first substrate 100 includes a substrate 170, a first metal layer 110, a first insulating layer 150, a second metal layer 120, a second insulating layer 160, a conductive layer 140, and a sealant 300, which are sequentially stacked; a first metal routing group 111 is formed in the first metal layer 110, and a second metal routing group 121 is formed in the second metal layer 120; the first metal wiring group 111 and the second metal wiring group 121 are in one-to-one corresponding conductive connection through a group of bridging structures 130; the first substrate 100 includes two transversely disposed sides in a first direction 21, and two vertically disposed sides in a second direction 22, wherein the first direction 21 is perpendicular to the second direction 22; the first metal routing group 111 has a routing direction parallel to the first direction 21, the second metal routing group 121 has a routing direction parallel to the second direction 22,
one side of the sealant 300 close to the display region 11 is an inner side 302 edge of the sealant, and one side of the sealant 300 far away from the display region 11 is an outer side 301 edge of the sealant; all the bridging structures 130 are located at one side of the frame glue outer side 301 in the direction toward the display region 11; the first metal routing group 111 is located on one side of the edge of the outer side 301 of the sealant facing the display area 11, the second metal routing group 121 is located on one side of the edge of the outer side 301 of the sealant facing the display area 11, the first metal routing group 111 includes a plurality of sub-routing lines 112 arranged in parallel, and the second metal routing group 121 includes a plurality of sub-connection lines 122 arranged in parallel and a branch line 123;
the set of bridge structures 130 includes a plurality of directly connected bridge structures 130 and a transit bridge structure 130; the direct-connection bridging structures 130 are disposed on the sub-connection lines 122, the direct-connection bridging structures 130 directly connect the sub-traces 112 and the sub-connection lines 122, the switching bridging structures 130 are disposed on the branch lines 123 in a one-to-one correspondence, and the switching bridging structures 130 connect the branch lines 123 and the sub-traces 112; the branch line 123 is connected with the sub-connecting line 122; the number of the transit bridge structures 130 is the same as that of the branch lines 123; the routing direction of the branch line 123 and the routing direction of the sub-connection line 122 are not in the same straight line direction, and the branch line 123 and the sub-connection line 122 are arranged in the same layer and are mutually conducted; the frame sealant 300 is in a shape of a Chinese character 'hui', and is divided into a linear region 304 and a corner region 305, the linear region 304 includes a first linear region 304 parallel to the first direction 21 and a second linear region 304 parallel to the second direction 22, and the first linear region 304 and the second linear region 304 are connected through the corner region 305;
the sealant 300 in the first straight line area 304 and the second straight line area 304 is a straight line segment, and the sealant 300 in the corner area 305 is an arc segment; part of the bridging structure 130 is located under the sealant 300 in the corner region 305; the joint of the branch line 123 and the sub-connecting line 122 is located under the sealant 300 of the corner region 305, and the distance between the joint and the edge of the outer side 301 of the sealant is less than 50um; the transit bridge structure 130 is the outermost bridge structure 131; the distance between the outermost bridging structure 131 and the adjacent bridging structure 130 is greater than 20um.
Because the distance between the bridging structure 130 close to the outer side 301 of the sealant and the edge of the outer side 301 of the sealant is short, the situation that part of the bridging structure 130 cannot meet the requirement that the distance from the edge of the outer side 301 of the sealant reaches 50um exists, in the scheme, the position corresponding to the bridging structure 130 is changed through the branch line 123, the distance from the corresponding bridging structure 130 to the edge of the outer side 301 of the sealant reaches 50um, and therefore a good anti-corrosion effect is achieved. Correspondingly, when the adjacent distance is 20um or more, after one bridging structure 130 is corroded, the resistance change of the adjacent bridging structure 130 is small, which means that the adjacent bridging structure 130 is not easily influenced by corrosion under the condition that the adjacent bridging structure 130 is 20um away.
As another embodiment of the present application with reference to fig. 1-12, a display device 1 is disclosed, where the display device 1 includes a display panel 10 and a backlight module 30 for providing a light source for the display panel 10, the display panel 10 is divided into a display area 11 and a non-display area 12, and includes: the liquid crystal display device comprises an array substrate 101 and a color film substrate 201 arranged opposite to the array substrate 101; a sealant 300 is arranged between the array substrate 101 and the color film substrate 201, and the sealant 300 is arranged in the non-display area 12; the array substrate 101 comprises a substrate 170, a first metal layer 110, a first insulating layer 150, a second metal layer 120, a second insulating layer 160 and a conducting layer 140, which are sequentially stacked corresponding to the non-display area 12; a plurality of sub-traces 112 are formed on the first metal layer 110, and a plurality of sub-connection lines 122 and at least one branch line 123 are formed on the second metal layer 120; a set of bridging structures 130 is disposed in one-to-one correspondence between the sub-traces 112 and the sub-connecting lines 122; the conductive layer 140 connects the sub-traces 112 and the sub-connection lines 122 through the corresponding bridging structures 130; all the bridging structures 130 are disposed at the edge of the outer side 301 of the sealant toward the display region 11;
the set of bridge structures 130 includes at least one direct connection bridge structure 130 and at least one transfer bridge structure 130; the direct-connection bridging structures 130 are disposed on the sub-connection lines 122, the direct-connection bridging structures 130 directly connect the sub-traces 112 and the sub-connection lines 122, the switching bridging structures 130 are disposed on the branch lines 123 in a one-to-one correspondence, and the switching bridging structures 130 connect the branch lines 123 and the sub-traces 112; the branch line 123 is connected with the sub-connecting line 122; the number of the transfer bridge structures 130 is the same as that of the branch lines 123; the routing direction of the branch line 123 and the routing direction of the sub-connection line 122 are not in the same straight line direction, and the branch line 123 and the sub-connection line 122 are arranged in the same layer and are mutually conducted; the junction of the branch line 123 and the sub-connection line 122 is located under the sealant 300, and the distance between the junction and the adjacent bridging structure 130 is less than 20um; each of the bridge structures 130 comprises a deep hole 132 and a shallow hole 133, the conductive layer 140 covers the deep hole 132 and the shallow hole 133, the conductive layer 140 is connected to the first metal layer 110 through the deep hole 132, and the conductive layer 140 is connected to the second metal layer 120 through the shallow hole 133;
in the group of bridge structures 130, the bridge structure 130 closest to the edge of the outer side 301 of the sealant is an outermost bridge structure 131, the outermost bridge structure 131 is the transfer bridge structure 130, and the outermost bridge structure 131 is disposed under the sealant 300 and covered by the sealant 300; the outermost bridging structure 131 includes a first deep hole 132a and a first shallow hole 133a arranged in pairs; the straight line of the first deep hole 132a and the corresponding first shallow hole 133a is parallel to the moving direction of the sealant 300; the distance between the outermost side bridging structure 131 and the edge of the outer side 301 of the frame glue is 50-300um; the distance between the outermost bridging structure 131 and the adjacent bridging structure 130 is at least 20um; the sub-traces 112 are peripheral traces located in the non-display area 12, and the sub-connection lines 122 are transmission signal lines connected with the peripheral traces in a one-to-one correspondence manner.
The technical solution of the present application can be widely applied to various display panels, such as TN (Twisted Nematic) display panel, IPS (In-Plane Switching) display panel, VA (Vertical Alignment) display panel, MVA (Multi-Domain Vertical Alignment) display panel, and of course, other types of display panels, such as OLED (Organic Light-Emitting Diode) display panel, and the above solution can be applied thereto.
The foregoing is a more detailed description of the present application in connection with specific alternative embodiments, and the specific implementations of the present application are not to be considered limited to these descriptions. For those skilled in the art to which the present application pertains, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be considered as belonging to the protection scope of the present application.

Claims (10)

1. A display panel divided into a display area and a non-display area, comprising:
a first substrate having a first surface and a second surface,
a second substrate disposed opposite to the first substrate;
the frame glue is arranged between the first substrate and the second substrate and arranged in the non-display area;
the first substrate comprises a first metal layer, a second metal layer and a conducting layer which are sequentially arranged corresponding to the non-display area, the first metal layer and the second metal layer are mutually insulated, and the second metal layer and the conducting layer are mutually insulated;
the first metal layer is provided with a first metal wiring group, and the second metal layer is provided with a second metal wiring group; the first metal wiring group comprises at least one sub-wiring, and the second metal wiring group comprises at least one sub-connecting line; sub-wires of the first metal wire group and sub-connecting wires of the second metal wire group are in one-to-one corresponding conduction connection through a group of bridging structures, and each group of bridging structures at least comprises one bridging structure;
one side of the frame glue close to the display area is the inner side of the frame glue, and one side of the frame glue far away from the display area is the outer side of the frame glue;
in the group of bridging structures, the bridging structure closest to the edge of the outer side of the frame glue is an outermost bridging structure, and the outermost bridging structure is covered by the frame glue;
each of the bridging structures comprises at least one deep hole through which the conductive layer is connected to the first metal layer and at least one shallow hole through which the conductive layer is connected to the second metal layer;
and the straight line where the deep hole of the outermost side bridging structure and the shallow hole of the outermost side bridging structure are located is parallel to the extending direction of the frame glue at the position corresponding to the outermost side bridging structure.
2. The display panel of claim 1, wherein the first set of metal traces is disposed around three sides of the display panel;
the second metal layer is formed with a plurality of groups of second metal wiring groups, and the plurality of groups of second metal wiring groups are respectively connected with the first metal wiring groups through a plurality of groups of bridging structures.
3. The display panel according to claim 2, wherein in each second metal routing group, the bridge structure closest to the edge of the frame glue outer side is an outermost bridge structure, and the outermost bridge structure comprises a first deep hole and a first shallow hole which are arranged in pair;
the straight line of the first deep hole and the corresponding first shallow hole is parallel to the moving direction of the frame glue.
4. The display panel of claim 1, wherein a distance between the outermost bridge structure and an outer edge of the sealant is 50-300um.
5. A display panel as claimed in claim 1 wherein the distance between the outermost bridge structure and the adjacent bridge structure is at least greater than 20um.
6. The display panel according to claim 1, wherein a straight line of the shallow hole and the deep hole of each of the bridging structures is parallel to a routing direction of the sealant.
7. The display panel according to claim 1, wherein in the other bridge structures except the outermost bridge structure, a straight line where the deep hole and the shallow hole are located is perpendicular to a moving direction of the sealant;
the deep holes and the shallow holes are arranged side by side and are close to one row of the outer side of the frame glue, and the deep holes and the shallow holes are distributed in a staggered mode.
8. The display panel according to claim 1, wherein the first substrate has a length direction in a first direction and a height direction in a second direction, wherein the first direction is perpendicular to the second direction;
the wiring direction of the first metal wiring group is in a first direction, and the wiring direction of the second metal wiring group is parallel to a second direction;
the second metal wiring group also comprises at least one branch line;
the set of bridge structures comprises at least one direct connection bridge structure and at least one switching bridge structure;
the direct-connection bridging structure is arranged on the sub-connecting line and directly communicates the sub-routing and the sub-connecting line,
the switching bridge structures are arranged on the branch lines in a one-to-one correspondence manner, and the switching bridge structures are communicated with the branch lines and the sub-routing lines; the branch line is connected with the sub-connecting line; the number of the transfer bridge structures is the same as that of the branch lines;
the wiring direction of the branch line and the wiring direction of the sub-connecting line are not in the same straight line direction, and the branch line and the sub-connecting line are arranged on the same layer and are mutually communicated;
the frame glue is in a shape of Chinese character 'hui', and is divided into a linear area and a corner area, the linear area comprises a first linear area parallel to a first direction and a second linear area parallel to a second direction, and the first linear area is connected with the second linear area through the corner area;
the frame glue in the first straight line area and the second straight line area is a straight line section, and the frame glue in the corner area is an arc line section;
part of the bridging structure is positioned under the frame glue of the corner region;
the joint of the branch line and the sub-connecting line is positioned under the frame glue of the corner area, and the distance between the joint and the edge of the outer side of the frame glue is less than 50um;
the transfer bridge structure is the outermost side bridge structure.
9. A display panel divided into a display area and a non-display area, comprising:
an array substrate is provided with a plurality of first electrodes,
the color film substrate is arranged corresponding to the array substrate;
frame glue is arranged between the array substrate and the color film substrate and arranged in the non-display area;
the array substrate comprises a substrate, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer and a conducting layer, wherein the substrate, the first metal layer, the first insulating layer, the second metal layer, the second insulating layer and the conducting layer are sequentially stacked corresponding to the non-display area;
the length direction of the array substrate is a first direction, the height direction of the array substrate is a second direction, and the first direction is perpendicular to the second direction;
the first metal layer is provided with a plurality of sub-wires with the wire direction parallel to the first direction, and the second metal layer is provided with a plurality of sub-connecting wires with the wire direction parallel to the second direction and at least one branch wire;
a group of bridging structures are arranged in one-to-one correspondence between the sub-wires and the sub-connecting lines; the conductive layer is connected with the sub-routing lines and the sub-connecting lines through the corresponding bridging structures; all the bridging structures are arranged in the direction that the edge of the outer side of the frame glue faces the display area;
the set of bridge structures comprises at least one direct connection bridge structure and at least one transfer bridge structure;
the direct-connection bridging structure is arranged on the sub-connecting line and directly communicates the sub-routing and the sub-connecting line,
the switching bridge structures are arranged on the branch lines in a one-to-one correspondence mode, and the switching bridge structures are communicated with the branch lines and the sub-routing lines; the branch line is connected with the sub-connecting line; the number of the transfer bridge structures is the same as that of the branch lines;
the wiring direction of the branch line and the wiring direction of the sub-connecting line are not in the same straight line direction, and the branch line and the sub-connecting line are arranged on the same layer and are mutually communicated;
the junction of the branch line and the sub-connecting line is positioned under the frame glue, and the distance between the junction and the adjacent bridging structure is less than 20um;
each of said bridging structures comprising a deep hole and a shallow hole, said conductive layer covering said deep hole and said shallow hole, said conductive layer being connected to said first metal layer through said deep hole, said conductive layer being connected to said second metal layer through said shallow hole;
in the group of bridging structures, the bridging structure closest to the edge of the outer side of the frame adhesive is an outermost bridging structure, the outermost bridging structure is a transfer bridging structure, and the outermost bridging structure is arranged under the frame adhesive and is covered by the frame adhesive;
the straight line where the deep hole of the outermost side bridging structure and the shallow hole of the outermost side bridging structure are located is parallel to the extending direction of the frame glue at the position corresponding to the outermost side bridging structure;
the distance between the outermost side bridging structure and the outer edge of the frame glue is 50-300um; the distance between the outermost bridging structure and the adjacent bridging structure is at least 20um
The sub-wirings are peripheral wirings located in the non-display area, and the sub-connecting lines are transmission signal lines connected with the peripheral wirings in a one-to-one correspondence manner.
10. A display device comprising the display panel of any one of claims 1-9 and a backlight module for providing a light source for the display panel.
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