TWI450163B - Touch panel - Google Patents

Description

Touch panel

The present invention relates to a touch panel, and more particularly to a touch panel having an Electro Static Discharge (ESD) function.

With the development of technology, the application of touch panels is becoming more and more popular. After receiving the external pressing or sensing, the touch panel calculates the coordinates of the touch position. Since the touch panel is directly in contact with external input, it also receives static electricity from the outside. The electrostatic discharge generated by the static electricity easily causes damage to the circuit components of the touch panel and affects the function of the touch panel.

Therefore, how to protect the touch panel from electrostatic discharge is one of the directions of the industry.

The invention relates to a touch panel, wherein the electrostatic protection component is electrically connected to a grounding end and an outermost sensing series of the touch panel, so as to electrically discharge the static electricity around the touch panel to the grounding end to avoid static electricity damage. Circuit components within the touch panel.

According to an aspect of the invention, a touch panel is proposed. The touch panel includes a substrate, a plurality of first sensing series, a plurality of second sensing series, a driving chip, and an electrostatic protection component. The first sensing string is disposed on the substrate. The second sensing series is disposed on the substrate and arranged in a staggered manner with the first sensing series. The driving chip is connected to the first sensing strings and the second sensing strings by the wires. The ESD protection component is electrically connected to a grounding end, and is electrically connected in parallel to the wire connected to the outermost first sensing series and the wire connected to the outermost second sensing series.

In order to make the above-mentioned contents of the present invention more comprehensible, the preferred embodiments are described below, and the detailed description is as follows:

First embodiment

Referring to FIG. 1 and FIG. 2 together, FIG. 1 is a top view of the touch panel according to the first embodiment of the present invention, and FIG. 2 is a cross-sectional view of the direction 2-2' in FIG. As shown in FIG. 1 , the touch panel 100 is, for example, a capacitive touch panel, and includes a substrate 102 , a plurality of first conductive leads 104 , a plurality of second conductive leads 118 , a first static protection component 106 , and a second static electricity The protective element 116, the driving wafer 120, the plurality of first sensing series 108, the plurality of second sensing series 110, the insulating layer 122 (shown in FIG. 2) and the protective layer 128 (shown in FIG. 2).

The first sensing series 108 and the second sensing series 110 are all disposed on the same surface of the substrate 102, that is, the upper surface 132 (shown in FIG. 2). The first sensing series 108 and the second sensing series 110 are alternately arranged to sense a touch signal caused by a finger or a stylus. The driving chip 120 is connected to the first sensing series 108 and the second sensing strings 110 by a plurality of wires 162. In this embodiment, the substrate 102 is a cover lens of the touch panel, and the material may be glass or plastic.

The first conductive lead 104 is electrically connected to the outermost first sensing series 108' (the side 144 closest to the substrate 102), and the second conductive lead 118 is electrically connected to the outermost second sensing series 110' (closest Side 146) of substrate 102. The first static protection component 106 is electrically connected to the ground terminal G, and is electrically connected in parallel to the wire 162a connected to the outermost first sensing series 108'. Similarly, the second ESD protection component 116 is electrically connected to the ground terminal G, and is electrically connected in parallel to the wire 162b connected to the outermost second inductive string 110'. The static electricity around the touch panel 100 is diverted to the grounding end G by the parallel electrostatic protection components through the wire path of the first sensing series 108' and the second sensing series 110', thereby preventing static electricity from damaging the electronic components on the touch panel 100. element.

The first conductive lead 104 extends in the direction of the side surface 144 of the substrate 102 and the end surface 154 (the end surface 154 is shown in FIG. 2 ) is exposed from the side surface of the touch panel 100 . In this embodiment, the end surface 154 of the first conductive lead 104, the side 156 of the protective layer 128, and the side 160 of the insulating layer 122 are substantially flush (coplanar) with the side 144 of the substrate 102; or, in another embodiment In this example, the end surface 154 of the first conductive lead 104 may also slightly protrude from the side surface 156, the side surface 160 or the side surface 144, thereby attracting static electricity around the touch panel 100.

The protective layer 128 can cover the upper surface 158 of the first conductive lead 104 (the upper surface 158 is shown in FIG. 2) to more completely protect the first conductive lead 104. In another embodiment, if the upper surface 158 of the first conductive lead 104 is not covered by any component, the end surface 154 of the first conductive lead 104 may not be exposed from the side of the touch panel 100, and is exposed through the first conductive lead 104. The upper surface 158 can still attract static electricity around the touch panel 100.

Similar to the technical feature of the first conductive lead 104, one end surface of the second conductive lead 118 is exposed from the other side of the touch panel 100.

Further, the material of the first conductive lead 104 and the second conductive lead 118 is made of a conductive material, for example, metal or indium tin oxide (ITO). The first conductive lead 104 and the second conductive lead 118 of this embodiment are exemplified by a metal. The metal's impedance is very low, which has a very good effect on the static electricity.

In this embodiment, the first static electricity protection component 106 and the second static electricity protection component 116 may be Transient Voltage Suppressor Diode (TVS), Multi-Layer Varistors (MLV), or the like. The component of the ESD protection function. In this embodiment, the first static electricity protection element 106, the second static electricity protection element 116, and the driving wafer 120 are disposed on the substrate 102 in a chip-on-glass (COG) manner; in another embodiment, The first static electricity protection element 106, the second static electricity protection element 116, and the driving wafer 120 may also be disposed on a flexible circuit board in a film on film (COF).

The grounding terminal in this embodiment is represented by a circuit symbol, but can be realized by connecting the ground end of the system or the GND pin in the driving chip. For the grounding method known in the art, no further description is provided. . In addition, the touch panel of the embodiment of the present invention can be applied to a product in combination with a display, wherein the display can be a liquid crystal display, a bi-stable display, an organic electroluminescent display, or an electrowetting display.

Please refer to Fig. 2 and Fig. 3 at the same time. Fig. 3 is an enlarged schematic view showing a portion 3' in Fig. 1. The insulating layer 122 is disposed on the substrate 102 and covers the first sensing series 108 and the second sensing series 110. The insulating layer 122 has a plurality of first lead vias 124 and a plurality of through holes 142. The first conductive lead 104 is electrically connected to all of the first sensing units 112' in the outermost first sensing series 108' through the first lead vias 124, as shown in FIG. In other implementations, the number of the first conductive leads 104 may be less than the number of the first sensing units 112 ′ located at the outermost side, that is, the first conductive leads 104 are connected to some of the first sensing units 112 ′. The first sensing unit 112'.

The protective layer 128 covers the first conductive lead 104 and the second conductive lead 118 (not shown in FIG. 2) to prevent the atmospheric environment from invading the first conductive lead 104 and the second conductive lead 118.

In addition, each of the second sensing series 110 includes a plurality of second sensing units 114 and a plurality of bridge wires 126. The bridge wires 126 are connected to the adjacent two second sensing units 114 through the through holes 142. The material of the bridge wire 126 is a conductive material, such as metal or transparent ITO.

As shown in FIG. 3, the insulating layer 122 further has a plurality of second lead vias 152 (only one is shown in FIG. 3), and the second conductive leads 118 are electrically connected to the outermost side through the second lead vias 152. The second sensing unit 114' of the second sensing series 110' is not intended to limit the present invention. In other implementations, the second lead vias 152 may also be connected to some of the second sensing units 114'. In addition, each of the first sensing series 108 includes a plurality of first sensing units 112 and a plurality of connecting lines 148. The connecting lines 148 and the first sensing unit 112 are disposed on the upper surface 132 (the upper surface 132 is shown in FIG. 2). )on. The connecting line 148 connects the adjacent two first sensing units 112. The material of the connecting wire 148 is a conductive material, such as metal or transparent ITO.

Hereinafter, a method of manufacturing the touch panel of the present invention will be described by taking the touch panel 100 as an example. Please refer to FIG. 4 , which is a flow chart of manufacturing a touch panel according to a first embodiment of the present invention.

In step S102, the substrate 102 as shown in Fig. 2 is provided.

Then, in step S104, the first sensing series 108 (ie, the first sensing unit 112 and the connecting line 148) and the second sensing unit 114 are formed on the upper surface 132 of the substrate 102. The material of the connecting line 148 may be the same as the first sensing unit 112, for example, a transparent electrode; or the material of the first sensing unit 112 is transparent ITO, for example, and the material of the connecting line 148 is metal.

Then, in step S106, the insulating layer 122 is formed to cover the first sensing series 108 and the second sensing unit 114.

Then, in step S108, a plurality of first lead vias 124, vias 142 and second lead vias 152 as shown in FIG. 3 are formed on the insulating layer 122. The position of the first lead via 124 corresponds to the first sensing unit 112 ′ of the outermost first sensing series 108 ′, and the position of the second lead via 152 corresponds to the outermost second sensing series 110 . 'The second sensing unit 114'.

Then, in step S110, the first conductive lead 104, the second conductive lead 118, and the bridge line 126 as shown in FIG. 3 are formed. A portion of the first conductive lead 104 is formed in the first lead via 124 and connected to the first sensing unit 112 ′, and another portion of the first conductive lead 104 is directed to the side 144 of the substrate 102 (the side 144 is shown in the first Figure) extends in the direction. One portion of the second conductive lead 118 is formed in the second lead via 152 and connected to the second sensing unit 114', and the other portion of the second conductive lead 118 is directed to the side 146 of the substrate 102 (the side 146 is shown in FIG. 1). The direction extends. Preferably, but not limited to, the first conductive lead 104 and the second conductive lead 118 are formed of the same material, such as a metal.

Then, in step S112, the first static electricity protection element 106 and the second static electricity protection element 116 are formed on the substrate 102.

Second embodiment

Referring to FIG. 5, a partial cross-sectional view of a touch panel in accordance with a second embodiment of the present invention is shown. The touch panel 200 of the second embodiment is different from the touch panel 100 of the first embodiment in that the first sensing series 208 and the second sensing series 210 are formed on different substrate surfaces.

The touch panel 200 is, for example, a capacitive touch panel, and may include a substrate 202, a plurality of first conductive leads 204, a plurality of second conductive leads (not shown), and a first static protection element 106 (not shown in the first 5)), a second static protection component 116 (not shown in FIG. 5), a driving chip 120 (not shown in FIG. 5), a plurality of first sensing series 208, and a plurality of second sensing series 210 Insulation layers 238 and 240.

The substrate 202 has a corresponding first substrate surface 234 and a second substrate surface 236. The first sensing series 208 and the first conductive lead 204 are formed on the first substrate surface 234, the first conductive lead 204 is connected to the outermost first sensing series 208' and the end surface 254 of the first conductive lead 204 is touched. The side of the panel 200 is exposed.

The second sensing string 210 is formed on the second substrate surface 236. Similar to the first conductive lead 204, the second conductive lead of the touch panel 200 is connected to the outermost second sensing series and the end surface thereof is exposed from the other side of the touch panel 200.

Hereinafter, a method of manufacturing the touch panel 200 of the second embodiment will be described with reference to FIG. FIG. 6 is a flow chart showing the manufacturing of the touch panel according to the second embodiment of the present invention.

In step S202, the substrate 202 as shown in Fig. 5 is provided.

Then, in step S204, the first sensing series 208 and the first conductive leads 204 are formed on the first substrate surface 234 of the substrate 202.

The first conductive lead 204 and the first sensing series 208 may be formed of the same material in step S204, such as indium tin oxide. In other implementations, the material of the first sensing series 208 is, for example, transparent ITO, and the material of the first conductive lead 204 is, for example, metal.

Then, in step S206, an insulating layer 238 is formed to cover the first sensing series 208 and the first conductive leads 204.

Then, in step S208, a second sensing series 210 and a second conductive lead (not shown) are formed on the second substrate surface 236 of the substrate 202.

The second conductive lead and the second sensing series 210 may be formed of the same material in step S208, such as indium tin oxide. However, in other implementations, the material of the second sensing series 210 is, for example, transparent ITO, and the material of the second conductive lead is, for example, metal.

Then, in step S210, the insulating layer 240 is formed to cover the second sensing series 210 and the second conductive leads.

The next step S212 is similar to the step S112 of the first embodiment, and the details are not repeated here.

Third embodiment

Please refer to FIG. 7 , which is a schematic diagram of a touch panel according to a third embodiment of the present invention. In the third embodiment, the same reference numerals are used for the same parts as the first embodiment, and details are not described herein again. The touch panel 300 of the third embodiment is different from the touch panel 100 of the first embodiment in that the sensing array of the touch panel 300 is a strip-shaped sensing unit.

The touch panel 300 includes a substrate 302, a plurality of first conductive leads 304, a plurality of second conductive leads 318, a first static protection element 106, a second static protection element 116, a driving chip 320, and a plurality of first sensing series and Several second sense strings. The first sensing series is the first strip sensing unit 308, and the second sensing string is the second strip sensing unit 310. The driving wafer 320 is similar to the driving wafer 120 of the first embodiment, and will not be described again.

The first strip sensing units 308 and the second strip sensing units 310 are alternately arranged.

The first conductive lead 304 is electrically connected to the outermost first strip sensing unit 308', and the second conductive lead 318 is electrically connected to the outermost second strip sensing unit 310'.

The first ESD protection component 106 and the second ESD protection component 116 are electrically connected to the ground terminal G. The first static protection element 106 is electrically connected in parallel to the wire 362a connected to the outermost first strip sensing unit 308', and the second static protection element 116 is electrically connected in parallel to the outermost second strip. The sensing unit 310' is connected to the wire 362b.

In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100, 200, 300. . . Touch panel

102, 202, 302. . . Substrate

104, 204, 304. . . First conductive lead

106. . . First electrostatic protection element

108, 108', 208. . . First sense train

110, 110', 210. . . Second sense train

112, 112', 212. . . First sensing unit

114, 114’. . . Second sensing unit

116. . . Second electrostatic protection element

118,318. . . Second conductive lead

120, 320. . . Driver chip

122, 238, 240. . . Insulation

124. . . First lead via

126. . . Bridge wiring

128. . . The protective layer

132,158. . . Upper surface

142. . . Through hole

144, 146, 156, 160. . . side

148. . . Cable

152. . . Second lead via

154, 254. . . End face

162, 162a, 162b, 362a, 362b. . . wire

234. . . First substrate surface

236. . . Second substrate surface

308, 308'. . . First strip sensing unit

310, 310'. . . Second strip sensing unit

G. . . Ground terminal

FIG. 1 is a top view of a touch panel in accordance with a first embodiment of the present invention.

Fig. 2 is a cross-sectional view showing the direction 2-2' in Fig. 1.

Fig. 3 is an enlarged schematic view showing a portion 3' in Fig. 1.

4 is a flow chart showing a method of manufacturing a touch panel according to a first embodiment of the present invention.

FIG. 5 is a partial cross-sectional view of a touch panel in accordance with a second embodiment of the present invention.

FIG. 6 is a flow chart showing the manufacturing of the touch panel according to the second embodiment of the present invention.

FIG. 7 is a schematic diagram of a touch panel according to a third embodiment of the present invention.

100. . . Touch panel

102. . . Substrate

104. . . First conductive lead

106. . . First electrostatic protection element

108, 108'. . . First sense train

110, 110'. . . Second sense train

112, 112’. . . First sensing unit

114, 114’. . . Second sensing unit

116. . . Second electrostatic protection element

118. . . Second conductive lead

120. . . Driver chip

144, 146. . . side

162, 162a, 162b. . . wire

Claims (9)

A capacitive touch panel includes: a substrate; a plurality of first sensing strings disposed on the substrate, wherein the first sensing series are patterned sensing series; and the plurality of second sensing series are configured On the substrate, and interlaced with the first sensing strings, wherein the second sensing strings are patterned sensing series; a driving chip is connected to the first sensing strings by a plurality of wires And the second sensing series; an ESD protection component electrically connected to a grounding end, and electrically connected in parallel to the wire connected to the outermost first sensing series and the second outermost And sensing a plurality of conductive leads, electrically connected to the outermost first sensing series and the outermost second sensing series. The capacitive touch panel of claim 1, wherein each of the first sensing series comprises a plurality of first sensing units, and each of the second sensing series comprises a plurality of second sensing units and a plurality of connecting Bridge connection of the second sensing unit. The capacitive touch panel of claim 2, further comprising an insulating layer disposed on the first sensing series and the second sensing series, and comprising a plurality of lead vias and a plurality of And the conductive leads are electrically connected to the outermost ones of the first sensing units by the lead vias, and the bridge wires are connected to the second sensing units by the through holes. The capacitive touch panel of claim 3, wherein the conductive leads and the bridge wires are formed in the same process. The capacitive touch panel of claim 4, wherein the conductive leads and the bridge wires are metal or indium tin oxide. For example, the capacitive touch panel described in claim 1 is Each of the first sensing series is a first strip sensing unit, and each of the second sensing series is a second strip sensing unit. The capacitive touch panel of claim 1, wherein the first sensing series and the second sensing series are disposed on the same surface of the substrate. The capacitive touch panel of claim 1, wherein the first sensing series and the second sensing series are disposed on opposite surfaces of the substrate. The capacitive touch panel of claim 1, wherein the electrostatic protection component is a transient voltage suppression diode or a multilayer varistor.