CN113212892A - Semiconductor detection taping process and system - Google Patents
Semiconductor detection taping process and system Download PDFInfo
- Publication number
- CN113212892A CN113212892A CN202110517761.4A CN202110517761A CN113212892A CN 113212892 A CN113212892 A CN 113212892A CN 202110517761 A CN202110517761 A CN 202110517761A CN 113212892 A CN113212892 A CN 113212892A
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- China
- Prior art keywords
- carrier tape
- materials
- aoi
- unit
- semiconductor test
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B57/00—Automatic control, checking, warning, or safety devices
- B65B57/10—Automatic control, checking, warning, or safety devices responsive to absence, presence, abnormal feed, or misplacement of articles or materials to be packaged
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
- B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
- B65B51/10—Applying or generating heat or pressure or combinations thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B61/00—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages
- B65B61/04—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages
- B65B61/06—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages by cutting
Abstract
The invention relates to the technical field of semiconductor assembly, in particular to a semiconductor detection taping process and a system capable of realizing the process, wherein the process comprises the following steps: A. detecting the material through AOI equipment; B. placing the detected material into a carrier tape; C. carrying out hot pressing treatment on the carrier tape; D. and cutting and blanking the hot-pressed carrier tape. According to the invention, the AOI equipment is used for detecting the materials, so that the appearances of the materials can be effectively detected, whether the materials are placed reversely or not is identified, the posture of the materials is conveniently and timely adjusted to avoid the reverse placement in the carrier tape, and the reject ratio is reduced.
Description
Technical Field
The invention relates to the technical field of semiconductor assembly, in particular to a semiconductor detection taping process and a semiconductor detection taping system.
Background
Traditional braider has following not enough: the material loading device can only detect whether materials (namely semiconductors) can be normally electrified or not, and cannot accurately identify whether the positive electrode and the negative electrode of the materials are placed rightly or not, so that the possibility of reverse placement exists when the materials are placed into a loading belt, and the reject ratio of the loading belt is difficult to reduce.
Disclosure of Invention
The invention provides a semiconductor detection taping process and a semiconductor detection taping system aiming at the problems in the prior art, which can carry out high-precision detection on materials, thereby ensuring that the materials are not placed in a carrier tape reversely.
In order to solve the technical problems, the invention adopts the following technical scheme:
the invention provides a semiconductor detection taping process, which comprises the following steps:
A. detecting the material through AOI equipment;
B. placing the detected material into a carrier tape;
C. carrying out hot pressing treatment on the carrier tape;
D. and cutting and blanking the hot-pressed carrier tape.
And further, C' is also included between the steps B and C, whether all the materials are correctly placed into the carrier tape is detected.
Further, in step C', the carrier tape is inspected by the AOI device.
And further, D' is included between the step C and the step D, whether the hot-pressed carrier tape is reversely placed into the carrier tape or not is detected through an AOI device.
Further, in step B, the method specifically includes:
B1. picking up the detected material by a PP machine;
B2. and assembling the picked materials on a carrier tape by a PP machine.
Further, before the step A, the method also comprises the step A', and the material is loaded through a mechanical arm.
The invention also provides a semiconductor detection taping system, which comprises
The AOI unit is used for carrying out visual inspection on the material;
the feeding unit is used for placing the detected materials into the carrier tape;
the hot pressing unit is used for carrying out hot pressing treatment on the carrier tape after the materials are put in;
and the cutting unit is used for cutting the hot-pressed carrier tape.
Further, the device also comprises a first detection unit, wherein the first detection unit is used for detecting whether the materials are correctly placed into the carrier tape.
Further, the first inspection unit includes an AOI inspection apparatus.
And the second detection unit is used for detecting whether the materials on the hot-pressed carrier tape are reversely placed.
The invention has the beneficial effects that: according to the invention, the AOI equipment is used for detecting the materials, so that the appearances of the materials can be effectively detected, whether the materials are placed reversely or not is identified, the posture of the materials is conveniently and timely adjusted to avoid the reverse placement in the carrier tape, and the reject ratio is reduced.
Drawings
FIG. 1 is a flow chart of example 1.
FIG. 2 is a schematic view of example 2.
Reference numerals: the device comprises a 1-AOI unit, a 2-feeding unit, a 3-hot pressing unit, a 4-cutting unit, a 5-first detection unit and a 6-second detection unit.
Detailed Description
In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and drawings, which are not intended to limit the present invention. The present invention is described in detail below with reference to the attached drawings.
Example 1
As shown in fig. 1, the present embodiment provides a semiconductor detection taping process, which includes the following steps:
A. detecting the material through AOI equipment;
B. placing the detected material into a carrier tape;
C. carrying out hot pressing treatment on the carrier tape;
D. and cutting and blanking the hot-pressed carrier tape.
Compared with the prior art that only the materials can normally work, the AOI equipment is adopted to detect the materials, specifically the appearance of the materials, so that whether the posture of the materials is correct or not is identified; in addition, whether two electric connection ends of the materials are abraded or not can be judged by detecting the appearance of the materials, so that whether the materials can be electrified or not is detected.
In conclusion, the AOI detection method has the following advantages:
the pixel of AOI detection is high, and the materials with equal volumes or smaller thicknesses of wafer-level parts and blue membranes can be detected, so that the braid of products with higher precision can be realized;
secondly, AOI can reliably discern the positive and negative of material and whether polarity is opposite for can in time adjust the gesture of material before putting into the material into the carrier band, all be in exact gesture when guaranteeing to put into the carrier band, be favorable to avoiding leading to the carrier band to scrap because of the material is put conversely.
In this embodiment, a step C' is further included between the steps B and C. When the carrier tape is placed, the carrier tape cannot be placed reliably due to the fact that the material is low in mass and is easily interfered by factors such as wind and the like, and therefore the carrier tape is required to be detected once before hot pressing, the carrier tape is hot pressed only when the materials are placed at the mounting positions on the carrier tape, and the yield is further improved; and if the installation position where the material is not placed exists, reminding workers in an alarm mode, displaying the position on the interaction device, and judging whether to execute the next action by the workers.
Specifically, in step C', the carrier tape is inspected by the AOI device. Detect the carrier band also through AOI promptly, can effectively promote the precision, the material of putting into the carrier band promptly carries out the gesture detection again to avoid the material to put conversely. It should be noted that the AOI of step a and step C' may be the same AOI device or different AOI devices, and in actual use, the two steps are usually performed by two AOI devices respectively, so as to ensure efficiency.
In this embodiment, step C and step D' are further included between the steps C and D. After hot pressing is completed, the carrier tape is detected through AOI equipment, whether the materials are turned over is mainly detected at the moment, namely the materials are not accurately installed to the carrier tape, so that the materials can be removed in the subsequent tape cutting action, and the delivered carrier tape is good.
In this embodiment, in step B, the method specifically includes:
B1. picking up the detected material by a PP machine;
B2. and assembling the picked materials on a carrier tape by a PP machine.
To the less material of volume promptly, accessible PP machine this type of high-progress semiconductor is got and is put equipment and pick up and put into the carrier band to guarantee can not cause the scratch to the material surface, promoted the yields.
In this embodiment, before step a, a' is further included. The manipulator can pick up and feed materials in modes of negative pressure and the like, so that the feeding of the invention is more stable.
Example 2
As shown in FIG. 2, the present embodiment provides a semiconductor test taping system including
The AOI unit 1 is used for carrying out visual inspection on the material;
the feeding unit 2 is used for placing the detected materials into the carrier tape;
the hot pressing unit 3 is used for carrying out hot pressing treatment on the carrier tape with the materials;
and the cutting unit 4 is used for cutting the carrier tape after hot pressing.
This embodiment can be used to realize embodiment 1 the technology, carry out outward appearance detection to the material through AOI unit 1 before the braid promptly to whether detect its outward appearance have wearing and tearing, the gesture is accurate, can judge reliably to connect the electricity according to the outward appearance, and whether put conversely, make can not appear unable circular telegram and connect the phenomenon of reversal when putting into the material carrier band, promoted the yields.
In addition, this embodiment can detect and braid the less material of volume, because AOI detects the precision and the pixel is all higher, and prior art's circular telegram detects then must detect the great material of volume, therefore this embodiment has also realized the effect that can braid to multiple specification material compared in prior art, has promoted general usability.
In this embodiment, the present invention further includes a first detecting unit 5, where the first detecting unit 5 is configured to detect whether the material is correctly placed in the carrier tape, so that the state of the carrier tape is determined again before hot pressing, and if a situation that the material is turned over or empty due to interference of an external factor is found, the material can be supplemented in time, which is beneficial to improving the yield. Specifically, first detecting element 5 includes AOI check out test set, except having promoted the detection precision, can also detect whether the material on the carrier band is put reversely.
In this embodiment, the present invention further includes a second detecting unit 6, where the second detecting unit 6 is used to detect whether the material on the carrier tape after hot pressing is placed reversely. The phenomenon that the materials are stressed or heated to move and turn over the sheets possibly exists in the hot pressing process, so that the positions with the problems can be identified in advance by detecting the second detection unit 6 after hot pressing, the positions can be cut off when the carrier tape is cut by the subsequent cutting unit 4, the positions and other parts are separated for blanking, and the condition that the outgoing carrier tape is good is guaranteed. Specifically, the second inspection unit 6 includes an AOI inspection apparatus, and the AOI inspection apparatuses of the second inspection unit 6 and the first inspection unit 5 may be the same AOI inspection apparatus, but it is preferable to use two AOI inspection apparatuses for efficiency.
Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A semiconductor detection taping process is characterized in that: the method comprises the following steps:
A. detecting the material through AOI equipment;
B. placing the detected material into a carrier tape;
C. carrying out hot pressing treatment on the carrier tape;
D. and cutting and blanking the hot-pressed carrier tape.
2. The semiconductor test taping process of claim 1, wherein: and C' is also included between the steps B and C, whether all the materials are correctly placed into the carrier tape is detected.
3. The semiconductor test taping process of claim 2, wherein: in step C', the carrier tape is inspected by the AOI device.
4. The semiconductor test taping process of claim 1, wherein: d' is further included between the step C and the step D, whether the hot-pressed carrier tape is reversely placed into the carrier tape or not is detected through an AOI device.
5. The semiconductor test taping process of claim 1, wherein: in the step B, the method specifically comprises:
B1. picking up the detected material by a PP machine;
B2. and assembling the picked materials on a carrier tape by a PP machine.
6. The semiconductor test taping process of claim 1, wherein: and before the step A, also comprising A', loading the material by a mechanical arm.
7. A semiconductor test taping system, characterized by: comprises that
The AOI unit is used for carrying out visual inspection on the material;
the feeding unit is used for placing the detected materials into the carrier tape;
the hot pressing unit is used for carrying out hot pressing treatment on the carrier tape after the materials are put in;
and the cutting unit is used for cutting the hot-pressed carrier tape.
8. The semiconductor test taping system of claim 7, wherein: the material loading device further comprises a first detection unit, and the first detection unit is used for detecting whether the materials are correctly placed into the carrier tape.
9. The semiconductor test taping system of claim 8, wherein: the first inspection unit includes an AOI inspection apparatus.
10. The semiconductor test taping system of claim 7, wherein: the hot-pressing device further comprises a second detection unit, and the second detection unit is used for detecting whether the materials on the hot-pressed carrier tape are reversely placed or not.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110517761.4A CN113212892A (en) | 2021-05-12 | 2021-05-12 | Semiconductor detection taping process and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110517761.4A CN113212892A (en) | 2021-05-12 | 2021-05-12 | Semiconductor detection taping process and system |
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| Publication Number | Publication Date |
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| CN113212892A true CN113212892A (en) | 2021-08-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110517761.4A Pending CN113212892A (en) | 2021-05-12 | 2021-05-12 | Semiconductor detection taping process and system |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1244028A (en) * | 1998-07-31 | 2000-02-09 | 精工爱普生株式会社 | Semiconductor device and manufacture thereof, substrate, electric circuit board and electronic device for manufacturing same |
| EP1993333A2 (en) * | 2007-05-18 | 2008-11-19 | Augux Co., Ltd. | Method for manufacturing tag integrated circuit flexible board and structure of the same |
| CN101989535A (en) * | 2009-08-05 | 2011-03-23 | 深圳市远望工业自动化设备有限公司 | All-in-one machine of semiconductor device for testing, sorting, marking and braiding and one-stop processing method |
| CN104369893A (en) * | 2014-12-01 | 2015-02-25 | 东莞市台工电子机械科技有限公司 | Full-automatic high-speed SMD LED braiding machine |
| CN105575939A (en) * | 2014-10-29 | 2016-05-11 | 恩智浦有限公司 | Leadless semiconductor device and method of making thereof |
| CN205801599U (en) * | 2016-07-12 | 2016-12-14 | 苏州德机自动化科技有限公司 | Carrier band automatic packaging machine |
| CN209567110U (en) * | 2019-01-10 | 2019-11-01 | 深圳市诺泰自动化设备有限公司 | A kind of novel braid encapsulating structure |
| CN111162744A (en) * | 2020-01-13 | 2020-05-15 | 深圳市三一联光智能设备股份有限公司 | Packaging equipment and packaging method |
| CN211296693U (en) * | 2020-01-13 | 2020-08-18 | 深圳市三一联光智能设备股份有限公司 | Packaging device |
| CN212733116U (en) * | 2020-07-10 | 2021-03-19 | 东莞市金族通用机械设备有限公司 | Capacitor braider with electric measurement |
-
2021
- 2021-05-12 CN CN202110517761.4A patent/CN113212892A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1244028A (en) * | 1998-07-31 | 2000-02-09 | 精工爱普生株式会社 | Semiconductor device and manufacture thereof, substrate, electric circuit board and electronic device for manufacturing same |
| EP1993333A2 (en) * | 2007-05-18 | 2008-11-19 | Augux Co., Ltd. | Method for manufacturing tag integrated circuit flexible board and structure of the same |
| CN101989535A (en) * | 2009-08-05 | 2011-03-23 | 深圳市远望工业自动化设备有限公司 | All-in-one machine of semiconductor device for testing, sorting, marking and braiding and one-stop processing method |
| CN105575939A (en) * | 2014-10-29 | 2016-05-11 | 恩智浦有限公司 | Leadless semiconductor device and method of making thereof |
| CN104369893A (en) * | 2014-12-01 | 2015-02-25 | 东莞市台工电子机械科技有限公司 | Full-automatic high-speed SMD LED braiding machine |
| CN205801599U (en) * | 2016-07-12 | 2016-12-14 | 苏州德机自动化科技有限公司 | Carrier band automatic packaging machine |
| CN209567110U (en) * | 2019-01-10 | 2019-11-01 | 深圳市诺泰自动化设备有限公司 | A kind of novel braid encapsulating structure |
| CN111162744A (en) * | 2020-01-13 | 2020-05-15 | 深圳市三一联光智能设备股份有限公司 | Packaging equipment and packaging method |
| CN211296693U (en) * | 2020-01-13 | 2020-08-18 | 深圳市三一联光智能设备股份有限公司 | Packaging device |
| CN212733116U (en) * | 2020-07-10 | 2021-03-19 | 东莞市金族通用机械设备有限公司 | Capacitor braider with electric measurement |
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