JP2012064702A - Die bonder and semiconductor manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a die bonder and a semiconductor manufacturing method, capable of reducing a measurement error and an incorrect detection by a non-contact method, capable of continuously monitoring a static electricity amount when handling an electronic component, and capable of instantly coping with an abnormal case by determining an abnormal value in real time.SOLUTION: A die bonder comprises: a pickup portion having a collet to pick up a die; a die bonding portion for bonding the die carried by the collet to a frame; a static electricity measurement sensor for measuring static electricity amount charged in the die by contacting the die; and a pressing force application member attached on a portion of the static electricity measurement sensor so that the static electricity measurement sensor is pressed to the die with a prescribed pressure. The static electricity amount of the die is measured by using the static electricity measurement sensor during a pickup operation.

Description

  The present invention relates to a die bonder and a semiconductor manufacturing method, and more particularly, to a highly reliable die bonder and a semiconductor manufacturing method for preventing destruction of an electronic component due to charge-up that occurs when a die is picked up in an electronic component assembly process.

  A part of the process of assembling a package by mounting a die (semiconductor chip) (hereinafter simply referred to as a die) on a substrate such as a wiring board or a lead frame, and a step of dividing the die from a semiconductor wafer (hereinafter simply referred to as a wafer) And a die bonding step of mounting the divided dies on the substrate.

  In the die bonding process, there is a peeling process for peeling the divided dies from the wafer. In the peeling process, these dies are peeled one by one from the dicing tape held by the pickup device, and conveyed onto a substrate using a suction jig called a collet.

  In the die bonding process, especially in the peeling process, when the die is peeled from the dicing tape, static electricity is charged up, and when the static electricity flows to the ground potential, the electronic components formed on the die may be electrostatically destroyed. is there.

  As measures for preventing electrostatic breakdown of electronic components caused by static electricity, for example, Patent Document 1 discloses an electrostatic measurement device that measures the amount of static electricity in the vicinity of a semiconductor element to be tested, and upper and lower limits of the electrostatic measurement device. And a technology for stopping the test of the semiconductor element when the upper and lower limit values are exceeded.

  Further, in Patent Document 2, in a measuring device that calculates a charge amount using a capacitor larger than the capacitance value of a die, it is generated by an ionizer in order to measure a charge amount of a measurement object placed in an ionizer atmosphere. A measuring device provided with offset current canceling means for canceling the offset current of the capacitor is disclosed.

JP-A-62-144083 JP 2002-365322 A

  Conventionally, in the electronic component assembly process such as the die bonding process described above, the charged amount of static electricity is measured by using a handy type simple measuring device when it is determined that an abnormality has occurred. I knew the state of static electricity. At that time, the non-contact type was mainly used for measuring the amount of static electricity.

  This non-contact type measurement measures the amount of static electricity in a wide range, so that it is not possible to accurately grasp the electrostatic amount in the desired narrow range where static electricity discharge occurs, or it is erroneously detected, or the measured value There was a problem that became unstable.

  In addition, since measurements were normally made only when it was determined that an abnormality occurred, the amount of static electricity could not be monitored continuously during work, and abnormal values were judged in real time and there was an abnormality. There was a problem that it was not possible to deal with it immediately.

  Accordingly, the present invention has been made in view of the above problems, and a first object of the present invention is to provide a contact bond die bonder and a semiconductor manufacturing method that reduce measurement errors and false detections due to a contactless process. is there.

  A second object of the present invention is to provide a die bonder and a semiconductor manufacturing method that can continuously monitor the amount of static electricity during electronic component handling, determine an abnormal value in real time, and take immediate action when there is an abnormality. That is.

  In order to achieve the above object, the main one of the die bonders according to the present invention is a pickup unit having a collet for picking up a die, a die bonding unit for bonding the die conveyed by the collet to a frame, and a die A static electricity measuring sensor for measuring static electricity charged on the die by contacting the die, and a pressing member attached to a part of the static electricity measuring sensor so that the electrostatic measurement sensor is pressed against the die at a predetermined pressure. And measuring the amount of static electricity of the die using a sensor for measuring static electricity during the pick-up operation.

  Another die bonder according to the present invention includes a pick-up unit having a collet for picking up a die, a die bonding unit for bonding the die conveyed by the collet to a frame, and static electricity generated in the die. A sensor for measuring static electricity that is measured by contact, a charge amount display device that displays the amount of static electricity measured by the sensor for electrostatic measurement, an ionizer that irradiates ions that reduce static electricity generated on the die, and a charge amount display device Control means for transmitting and receiving signals and controlling the ionizer, and during the pick-up operation, the amount of static electricity of the die is measured, and when the measured amount of static electricity exceeds a specified amount, the control means sends the ionizer to the die. It has the means to instruct | indicate ion irradiation with respect to it.

  Furthermore, another die bonder according to the present invention includes a pickup unit having a collet for picking up a die, a die bonding unit for bonding the die conveyed by the collet to the frame, and static electricity generated in the frame to the frame. A sensor for measuring static electricity that is measured by contact, a charge amount display device that displays the amount of static electricity measured by the sensor for electrostatic measurement, an ionizer that irradiates ions that reduce static electricity generated in the frame, and a charge amount display device Control means for transmitting and receiving signals and controlling the ionizer. During the frame transport operation, the amount of static electricity of the frame is measured, and when the measured amount of static electricity exceeds the specified amount, the control means is attached to the ionizer on the frame. It has the means to instruct | indicate ion irradiation with respect to it.

  One of the semiconductor manufacturing methods according to the present invention includes a step of adsorbing a die to be peeled out of a plurality of dies attached to a dicing tape with a collet, and pushing up a predetermined position of the dicing tape. It has a step of peeling from the dicing tape and a step of picking up the peeled die. At least in the peeling step, the sensor for measuring static electricity is brought into contact with the die for measurement, and the amount of static electricity charged on the die is measured in real time. It is characterized by doing.

  ADVANTAGE OF THE INVENTION According to this invention, the die bonder and semiconductor manufacturing method by a contact system which reduced the measurement error and the false detection can be provided.

  In addition, it is possible to provide a die bonder and a semiconductor manufacturing method that can continuously monitor the amount of static electricity during electronic component handling, determine an abnormal value in real time, and take immediate action when there is an abnormality. Thereby, a large amount of defects can be prevented.

It is the conceptual diagram which looked at the die bonder which is one Embodiment of this invention from the top. 1 is an external perspective view of a pickup device that is an embodiment of the present invention. It is a schematic sectional drawing which shows the principal part of the pick-up apparatus which is one Embodiment of this invention. It is a schematic side view which shows the principal part of the die bonder which is one Embodiment of this invention. It is a flowchart which shows the outline | summary of the static electricity amount measurement in a pick-up process. It is a flowchart which shows abnormality determination of the amount of static electricity, and the countermeasure at the time of abnormality. It is a figure which shows the collet shape used by this invention, and a static electricity measurement sensor attachment position. It is a schematic side view which shows the principal part of the die bonder which is another one Embodiment of this invention. It is a flowchart which shows the outline | summary of the static electricity amount measurement in a pick-up process. It is a figure which shows an example of conveyance of the flame | frame in which die | dye is mounted, and static electricity measurement. It is a figure which shows another example of conveyance of the flame | frame in which die | dye is mounted, and static electricity measurement. It is a figure which shows an example of the conveyance of the flame | frame in which die | dye is mounted, electrostatic measurement, and the countermeasure at the time of abnormality occurrence.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a conceptual view of a die bonder 10 according to an embodiment of the present invention as viewed from above. The die bonder 10 roughly includes a wafer supply unit 1, a workpiece supply / conveyance unit 2, and a die bonding unit 3.
The workpiece supply / conveyance unit 2 includes a stack loader 13, a frame feeder 14, and a loader 15. The stack loader 13 supplies a work (lead frame) to which the die is bonded to the frame feeder 14. The frame feeder 14 conveys the workpiece to the unloader 18 through two processing positions on the frame feeder 14. The unloader 18 stores the conveyed work.
The die bonding unit 3 includes a preform unit 16 and a bonding head unit 17. The preform unit 16 applies a die adhesive to the work conveyed by the frame feeder 14. The bonding head unit 17 picks up the die from the pickup device 12 and moves up, and moves the die horizontally to a bonding point on the frame feeder 14. Then, the bonding head unit 17 lowers the die at the bonding point, and bonds the die onto the work coated with the die adhesive.

  The wafer supply unit 1 includes a wafer cassette lifter 11 and a pickup device 12. The wafer cassette lifter 11 has a wafer cassette (not shown) filled with wafer rings, and sequentially supplies the wafer rings to the pickup device 12. The pick-up device 12 moves the wafer ring so that a desired die can be picked up from the wafer ring.

  Next, the configuration of the pickup device 12 will be described with reference to FIGS. FIG. 2 is an external perspective view of the pickup device 12. FIG. 3 is a schematic cross-sectional view showing the main part of the pickup device 12. As shown in FIGS. 2 and 3, the pickup device 12 horizontally positions the expand ring 6 that holds the wafer ring 7 and the dicing tape 8 that is held by the wafer ring 7 and to which a plurality of dies (chips) 4 are bonded. It has a support ring 9 and a push-up unit 30 that is arranged inside the support ring 9 and pushes the die 4 upward. The push-up unit 30 is moved in the vertical direction by a drive mechanism (not shown), and the pickup device 12 is moved in the horizontal direction.

The pickup device 12 lowers the expanding ring 6 holding the wafer ring 7 when the die 4 is pushed up. As a result, the dicing tape 8 held on the wafer ring 7 is stretched to widen the distance between the dies 4, and the die 4 is pushed up from below the die by the push-up unit 30 to improve the pickup performance of the die 4. As the die is thinned, the adhesive is changed from a liquid to a film, and a film-like adhesive material called a die attach film 5 is attached between the wafer and the dicing tape 8. In the wafer having the die attach film 5, dicing is performed on the wafer and the die attach film 5. Therefore, in the peeling step, the wafer and the die attach film 5 are peeled from the dicing tape 8.
<Example 1>
FIG. 4 is a schematic side view showing a main part of a die bonder according to an embodiment of the present invention.
The die bonder shown in this figure is shown centering on the pickup portion of the die 4. As a function, the dicing tape 43 is pushed up by the push-up piece 44, and then pushed up again by the push-up needle. The collet 42 picks up the die 4 protruding upward, and the picked up die 4 is temporarily stored in a storage container (not shown). The stored die 4 is taken out and transferred to the bonding unit 3 shown in FIG. 1, and the die 4 is bonded onto the frame (substrate).

  FIG. 4 illustrates an example in which the static electricity measurement sensor 45 is attached to the collet 42. In the first embodiment, the case where the collet is a sleeveless collet will be described. If a collet with sleeves is applied, it will be described in Example 2.

  The electrostatic measurement sensor 45 is attached to the collet 42 and connected to one end of a signal line 49 provided via a support portion 47 fixed to the bonding head tip 41. A spring 46 is attached to the electrostatic measurement sensor 45. The reason for using the spring 46 is that when the electrostatic measurement sensor 45 comes into contact with the die (electronic component) 4, the static electricity measurement sensor 45 is pressed with a low load by the spring 46, and the contact with the die 4 at the time of measurement is performed. This is to prevent chattering and the like due to instability. In this embodiment, the case where the spring 46 is used is shown, but other members may be used as long as they have a function of applying a low load to the static electricity measurement sensor 45.

Here, a commercially available contact type surface potential meter is used for the static electricity measurement sensor 45. For example, a contact type surface potential meter manufactured by Trek can be used. This electrometer has a high input impedance of 10 ¹³ Ω or more and 10 ^-13 F or less, has a measurement range of 0 to ± 2000 V, and can measure the charged potential in a minute area by touching the measurement object. I have.

  In this embodiment, the collet 42 is made of rubber, the push-up piece is made of resin, and the die is mainly a semiconductor material such as silicon. The collet, the push-up piece, and the die are not particularly related to this, and it goes without saying that, for example, the die can be applied to other electronic parts that are affected by electrostatic breakdown.

  On the other hand, the other end of the signal line 49 is connected to the charge amount real-time display device 40. The charge amount real-time display device 40 is further connected to the control processing unit via a signal line. The amount of static electricity measured by the static electricity measurement sensor 45 is transmitted to the charge amount real-time display device 40 via the signal line 49. The charge amount real-time display device 40 has a function of displaying the transmitted amount of static electricity so that it can be seen, and transmits the amount of static electricity to the control processing unit. In this figure, the amount of electrostatic charge is indicated by an arrow needle. In this case, when there is no charge amount, it faces upward. It is assumed that the arrow needle rotates clockwise as the charge amount increases.

  The control processing unit determines whether or not the transmitted static electricity amount is within a standard value. Based on the result of the determination, it is determined whether or not to start the ionizer irradiation. The standard value of the static electricity amount is stored in advance in the memory unit in the control processing unit.

  In this embodiment, an ionizer is used, but other methods can be used. For example, the pick-up operation of the die 4 can be stopped, and discharge due to the contact between the die 4 and the collet 42 can be prevented in advance.

FIG. 5 is a flowchart showing an outline of the measurement of the amount of static electricity in a pickup process in which the die and the dicing tape are separated using the die bonder shown in FIG.
The peeling process is shown in order from a) to d) in FIG. 5, the amount of static electricity measured in each process is shown in the charge amount real-time display device 40, and changes in each process are shown. In this figure, it is assumed that the push-up piece 44 has already started pushing up the dicing tape 43 and the push-up needle has not yet started pushing up.

  First, FIG. 5 a) shows a state before the electrostatic measurement sensor 45 comes into contact with the die 4. In this state, since the measurement of the die 4 is not yet performed, the arrow needle of the charge amount real-time display device 40 indicates upward, that is, zero.

  Next, FIG. 5 b) shows a state where the electrostatic measurement sensor 45 is in contact with the die 4. In this state, the charge amount real-time display device 40 shows that the arrow needle is slightly rotated clockwise. At this time, the charge amount is within the standard value.

  Next, in FIG. 5c), the push-up needle 51 rises from the inside of the push-up piece, pushes up the dicing tape, and peeling of the die and the dicing tape is started. In the charge amount real-time display device 40, it can be seen that the arrow needle rotates further to the right. At this time, the charge amount is still within the standard value.

  Finally, in FIG. 5d), the die 4 is attracted by the collet 42 by vacuum suction by a vacuum device (not shown), and the bonding head portion 41 starts to rise. At this time, the die 4 and the dicing tape 43 are completely peeled off, and the amount of static electricity generated at the time of peeling is usually considered to reach the maximum. At this time, in the charge amount real-time display device 40, it can be seen that the arrow needle rotates significantly clockwise and comes to the lower side. Although the standard value is not shown in the figure, for example, if the position exceeding the position of the arrow needle of the charge amount real-time display device 40 shown in FIG. 5c) is the standard value, the standard value is sufficient in FIG. You can see that it is over.

Here, the control processing unit starts the determination work of whether or not the static electricity amount displayed on the charge amount real-time display device 40 is within the standard from the stage of FIG. 5c) and continues to the stage of FIG. 5d).
In addition, the measurement of the amount of static electricity by the static electricity measurement sensor 45 is continuously performed in real time while the static electricity measurement sensor 45 is in contact with the die 4.

  In this figure, for convenience of illustration, the control processing unit is not shown, but it is assumed that the same control processing unit as that in FIG. 4 is provided.

  In c) and d) of FIG. 5, when the control processing unit determines that the charge amount exceeds the standard, a command is issued to the ionizer 48 to start ion irradiation. The ion irradiation condition, that is, the ion irradiation amount is determined based on a correlation table between the charge amount and the irradiation amount stored in the memory in advance.

When the ion irradiation is completed, as shown in the charge amount real-time display device 40a, it can be seen that the arrow needle is sufficiently returned to the level of FIG.
In this figure, the irradiation by the ionizer is shown as representative of the case of FIG. 5d), but the irradiation may be performed in FIG. 5c).

FIG. 6 is a flowchart showing abnormality determination of the static electricity amount and coping with the abnormality.
This determination work is performed by the control processing unit in the steps c) and d) of FIG.
First, the static electricity amount of the die 4 is measured by the static electricity measuring sensor 45 in contact with the surface of the die 4 (step 60). Next, information on the measured static electricity amount is transmitted to the control processing unit, and the control processing unit determines whether the static electricity amount is within the standard or exceeds the standard (step 61).
If it is within the standard, pickup of the die 4 is started by the collet 42 (step 62).
If it exceeds the standard, the control processing unit that has received the information on the amount of static electricity issues an irradiation command to the ionizer 48, and ions are irradiated from the ionizer 48 (step 63). As the irradiation conditions, the conditions already stored in the memory as described above are used.

  Since the static electricity amount is measured in real time by the static electricity measurement sensor 45, the state in which the static electricity amount decreases due to ion irradiation is monitored by the charge amount real-time display device 40, and at the same time, the reduced static electricity is displayed on the control processing unit. Quantity information is communicated in real time.

Information on the measured static electricity amount is transmitted to the control processing unit, and the control processing unit determines whether the static electricity amount is within the standard or exceeds the standard (step 64).
Irradiation is stopped when it is determined that the amount of static electricity transferred has returned to the standard. Thereafter, pickup of the die 4 is started by the collet 42 (step 62). If it exceeds the standard, the control processing unit issues an irradiation command to the ionizer 48, and ions are irradiated from the ionizer 48 (step 63).

  As described above, in the first embodiment, it is possible to measure the amount of static electricity generated within a specific range by using the contact type. For this reason, it is possible to perform abnormality determination with higher accuracy than in the past.

  Further, since the measurement is continuously performed in real time during the work, it is possible to respond immediately after the occurrence of an abnormality, so that it is possible to prevent a so-called doka defect in which a large number of defective products are created. As a result, it is possible to produce the planned quantity, and at the same time, it is possible to reduce the production of defects, which is advantageous in terms of production cost.

In addition, since the method shown in this embodiment measures a specific area in real time, the charged-up static electricity amount can be measured with high accuracy in terms of space and time, so the irradiation conditions for irradiation with an ionizer are appropriately determined. it can. For this reason, it is possible to reduce the amount of ions to be irradiated as much as necessary, resulting in shortage or excessive generation of secondary defects.
<Example 2>
FIG. 7 explains how to install the sensor when the collet is different.
In FIG. 5, the case of the sleeveless collet shown in FIG. 7a) has been described. Here, the case of the sleeved collet shown in FIG. 7b) will be described.

  In FIG. 7b) a collet 71 with sleeves and a die adsorber 72 are shown. The cross-sectional shape of the collet with sleeves is U-shaped, and has a structure in which the die adsorber 72 is accommodated inside. The die adsorber 72 is used to adsorb the die 4 and is provided so that vacuum suction is uniformly performed during the adsorption. A large number of fine suction holes are provided inside the die adsorber 72. Vacuuming is performed through the suction hole, and the die 4 is adsorbed.

  The attachment of the electrostatic measurement sensor 45 will be described. A through hole is provided in a part of the die adsorber 72, and the static electricity measurement sensor 45 and a spring 46 for applying a low load to the hole are accommodated in the hole. The static electricity measuring sensor 45 and the spring 46 are held in a state where their movements are freely movable without being restricted by the side surface of the through hole.

  A signal line from the electrostatic measurement sensor 45 and a member supporting the signal line are drawn out through a through hole provided in a part of the collet 71 with a sleeve. In addition, since the said through-hole needs to maintain an airtight state at the time of vacuum suction, the vacuum sealing is given.

  The signal line 49 led out of the collet 71 with the sleeve is connected to the charge amount real-time display device 40 through the support portion 47.

When using a collet with a sleeve, the effect that the adsorption | suction of die | dye 4 can adsorb | suck more stably and reliably can be anticipated.
<Example 3>
FIG. 8 shows an example in which the electrostatic measurement sensor 85 is attached to the push-up piece 84.
The present embodiment will be described below with a focus on differences from the first embodiment.

The electrostatic measurement sensor 85 is attached to the push-up piece 84 and is connected to one end of a signal line 89 provided via a support portion 87 fixed to the push-up piece 84. A spring 86 is attached to the static electricity measurement sensor 85. The reason for using the spring 86 is the same as in the first embodiment. However, in the case of the present embodiment, the static electricity measurement sensor 85 performs measurement by contacting the dicing tape 83. This point differs from the case of Example 1 in contact with the die (electronic component) 4. The polarity of the static electricity to be measured is different from that in the first embodiment due to the difference in the contact object.
In this embodiment, the case where the spring 86 is used is shown. However, any other device may be used as long as it has a function of applying a low load to the static electricity measurement sensor 85.

  Here, the static electricity measurement sensor 85 is the same as the static electricity measurement sensor 45 of the first embodiment.

  On the other hand, the other end of the signal line 89 is connected to the charge amount real-time display device 80. The charge amount real-time display device 80 is further connected to the control processing unit via a signal line 89, and the static electricity amount measured by the electrostatic measurement sensor 85 is transmitted to the charge amount real-time display device 80 via the signal line 89. . The charge amount real-time display device 80 has a function of displaying the transmitted static electricity amount so as to be visible, and transmits the static electricity amount to the control processing unit. In this figure, the amount of electrostatic charge is indicated by an arrow needle. In this case, when there is no charge amount, it faces upward. It is assumed that the arrow needle rotates clockwise as the charge amount increases.

  The control processing unit determines whether or not the transmitted static electricity amount is within a standard value. Based on the result of the determination, it is determined whether or not to start the ionizer irradiation. The standard value of the static electricity amount is stored in advance in the memory unit in the control processing unit. As described above, the polarity of the static electricity measured in this embodiment is different from that in the first embodiment. However, since the polarity of the static electricity charged up to the die 4 that is the irradiation target of the ionizer is the same, the ionizer The irradiation conditions are the same as in Example 1.

  In this embodiment, an ionizer is used, but other methods can be used. For example, the pick-up operation of the die 4 can be stopped, and discharge due to the contact between the die 4 and the collet 42 can be prevented in advance.

FIG. 9 is a flowchart showing an outline of the measurement of the amount of static electricity in a pickup process in which the die and the dicing tape are separated using the die bonder shown in FIG.
The peeling process is shown in order from a) to d) in FIG. 9, and the static electricity amount measured in each process is shown in the charge amount real-time display device 80, and the state of change for each process is shown. In this figure, it is assumed that the push-up piece 84 has already started pushing up the dicing tape 83 and the push-up needle has not yet started pushing up.
Since the operation flow from FIG. 9a) to FIG. 9d) and the description of the display of the charge amount real-time display device 80 are the same as those in the first embodiment, a description thereof will be omitted.

Here, the control processing unit starts the determination work as to whether or not the static electricity amount displayed on the charge amount real-time display device 80 is within the standard from the stage of FIG. 9c) and continues to the stage of FIG. 9d).
In addition, the measurement of the amount of static electricity by the static electricity measurement sensor 85 is continuously performed in real time while the static electricity measurement sensor 85 is in contact with the dicing tape 83.
In this figure, for convenience of illustration, the control processing unit is not shown, but it is assumed that the same control processing unit as that in FIG. 8 is provided.

  As described above, in Example 3, it was possible to measure the amount of static electricity generated within a specific range by using the contact type. For this reason, it is possible to perform abnormality determination with higher accuracy than in the past.

Further, since the measurement is continuously performed in real time during the work, it is possible to respond immediately after the occurrence of an abnormality, so that it is possible to prevent a so-called doka defect in which a large number of defective products are created. As a result, it is possible to produce the planned quantity, and at the same time, it is possible to reduce the production of defects, which is advantageous in terms of production cost.
<Example 4>
10 to 12 show a case where the present invention is applied to frame conveyance.
As shown in FIG. 1, the die 4 picked up by the pickup device 12 is transferred to the die bonding unit 3, and the die 4 is bonded onto the frame (substrate). The frame after the die bonding is completed is conveyed to the workpiece supply / conveyance unit 2.

  The present embodiment shows an example in which the die-bonded frame is applied to the process of transporting the frame to the workpiece supply / conveyance unit 2.

  In the first and third embodiments, the case where the present invention is applied to the peeling process for picking up the die 4 is shown. However, the generation of static electricity may occur in another work process. For example, static electricity may be generated during the transfer operation of a frame (substrate) on which a die is mounted.

  FIG. 10 shows a state where the frame 104 to which a plurality of dies 4 are bonded is vacuum-sucked by the suction pad 103 and is lifted in the air. The vacuum suction of the frame is performed by vacuum suction from the vacuum device VAC being transmitted to the suction pad 103 through the pipe 110 and sucking the frame.

  The electrostatic measurement sensor 105 is connected to one end of a signal line 109 provided via a support portion 107 fixed to the suction mechanism 108. A spring 106 is attached to the electrostatic measurement sensor 105. The reason for using the spring 106 is the same as in the first embodiment.

  The contact-type surface potential meter used for the electrostatic measurement sensor 105 is the same as that shown in the first embodiment.

  On the other hand, the other end of the signal line 109 is connected to the charge amount real-time display device 100. The charge amount real-time display device 100 is further connected to a control processing unit (not shown) via a signal line 109, and the static electricity amount measured by the static electricity measurement sensor 105 is charged via the signal line 109. 100. The charge amount real-time display device 100 has a function of displaying the transmitted static electricity amount so as to be visible, and transmits the static electricity amount to the control processing unit. In this figure, the amount of electrostatic charge is indicated by an arrow needle. In this case, when there is no charge amount, it faces upward. It is assumed that the arrow needle rotates clockwise as the charge amount increases.

  The control processing unit determines whether or not the transmitted static electricity amount is within a standard value. Based on the result of the determination, it is determined whether or not to start the ionizer irradiation. The standard value of the static electricity amount is stored in advance in the memory unit in the control processing unit.

  In FIG. 10 a), the electrostatic measurement sensor 105 is in contact with the frame 101 and the measurement is started. In the charge amount real-time display device 100, the arrow needle indicates diagonally right upward, indicating that the amount of static electricity is within the standard.

  FIG. 10B) shows the case where the frame 101 is lowered onto the frame guide 104 and placed on the frame guide because the amount of static electricity is within the regulation as a result of the measurement.

On the other hand, in FIG. 11 a), in the charge amount real-time display device 100, the arrow needle indicates the right side, indicating that the amount of static electricity exceeds the standard.
In FIG. 11b), as a result of the measurement, the amount of static electricity exceeds the standard. Therefore, when the frame 101 is lowered onto the frame guide 104 and placed on the frame guide 104, it is accumulated in the frame 101 as shown in the figure. This shows that the static electricity causes discharge 120 and the mounted die (potential component) 4 may be destroyed.

FIG. 12 shows an example to which the present invention is applied. When the amount of static electricity as shown in FIG. 11 exceeds the standard (see FIG. 12A), the frame 101 is lowered to the frame guide 104 and the ions are ionized using the ionizer 111 before being placed on the frame guide 104. The frame 101 is irradiated to reduce or eliminate the amount of static electricity (see FIG. 12b). As shown in the figure, it can be seen that the arrow needle of the charge amount real-time display device 100 returns to the zero level.
Thereafter, the frame 101 is lowered to the frame guide 104 and placed on the frame guide 104 (see FIG. 12c).

  In the present embodiment, a case where a plurality of dies are applied to a frame mounted for bonding is shown. However, when electrostatic breakdown occurs in this process, the entire frame on which a large number of dies are mounted becomes defective. Therefore, the loss is larger than that in the case where a single die failure occurs. By applying the present invention to such a process, the loss can be greatly reduced.

DESCRIPTION OF SYMBOLS 1 ... Wafer supply part, 2 ... Work supply / conveyance part, 3 ... Die bonding part, 4 ... Die (semiconductor chip), 5 ... Die attachment film, 6 ... Expand ring, 7 ... Wafer ring, 8 ... Dicing tape, 9 DESCRIPTION OF SYMBOLS ... Supporting ring, 10 ... Die bonder, 11 ... Wafer cassette lifter, 12 ... Pickup device, 13 ... Stack loader, 14 ... Frame feeder, 15 ... Loader, 16 ... Preform part, 17 ... Bonding head part, 18 ... Unloader, 30 ... Push-up unit, 40, 80, 100 ... Real-time charge amount display device, 41, 81 ... Bonding head tip, 42, 82 ... Collet, 43, 83 ... Dicing tape, 44, 84 ... Push-up piece, 45, 85, 105 ... Electrostatic measurement sensor, 46, 86, 106 ... Spring, 47, 87, 107 ... Supporting part, 48, 88, 10 6, 111 ... Ionizer, 49, 89, 109 ... Signal line, 51, 91 ... Push-up needle, 71 ... Collet with sleeve, 72 ... Die adsorber, 101 ... Frame (substrate), 102 ... Spring, 103 ... Adsorption pad, 104: frame guide, 108: suction mechanism, 110: vacuum pipe, 120: discharge.

Claims (11)

A pickup section having a collet for picking up a die;
A die bonding part for bonding the die conveyed by the collet to a frame;
A static electricity measuring sensor for measuring static electricity charged on the die in contact with the die; and
A pressing member attached to a part of the electrostatic measurement sensor so that the electrostatic measurement sensor is pressed against the die at a predetermined pressure,
A die bonder that measures the static electricity amount of the die using the static electricity measuring sensor during the pick-up operation.   The die bonder according to claim 1, wherein the electrostatic measurement sensor is installed in the collet. The pick-up unit has a push-up piece that pushes up the dicing tape when peeling the dicing tape and the dicing tape to which a wafer composed of a plurality of dies is attached,
The die bonder according to claim 1, wherein the static electricity measuring sensor is installed on the push-up piece. A pickup section having a collet for picking up a die;
A die bonding part for bonding the die conveyed by the collet to a frame;
A static electricity measuring sensor for measuring static electricity generated in the die in contact with the die;
A charge amount display device for displaying the amount of static electricity measured by the static electricity measuring sensor;
An ionizer that irradiates ions that reduce static electricity generated in the die;
Control means for transmitting and receiving signals from the charge amount display device and controlling the ionizer;
Have
During the pick-up operation, the amount of static electricity of the die is measured, and when the measured amount of static electricity exceeds a specified amount, the control means has means for instructing the ionizer to perform ion irradiation on the die. A die bonder characterized by that. The electrostatic measurement sensor is installed in the collet,
The die bonder according to claim 4, wherein the electrostatic measurement sensor has a pressing member attached to a part of the electrostatic measurement sensor so as to be pressed against the die with a predetermined pressure. The pick-up unit has a push-up piece that pushes up the dicing tape when peeling the dicing tape and the dicing tape to which a wafer composed of a plurality of dies is attached,
The electrostatic measurement sensor is installed on the push-up piece,
5. The die bonder according to claim 4, wherein the static electricity measuring sensor includes a pressing member attached to a part of the static electricity measuring sensor so as to be pressed against the die with a predetermined pressure. A pickup section having a collet for picking up a die;
A die bonding part for bonding the die conveyed by the collet to a frame;
A static electricity measuring sensor for measuring static electricity generated in the frame in contact with the frame;
A charge amount display device for displaying the amount of static electricity measured by the static electricity measuring sensor;
An ionizer that irradiates ions that reduce static electricity generated in the frame;
Control means for transmitting and receiving signals from the charge amount display device and controlling the ionizer;
Have
During the frame transport operation, the amount of static electricity of the frame is measured, and when the measured amount of static electricity exceeds a specified amount, the control means includes means for instructing the ionizer to perform ion irradiation on the frame. A die bonder comprising: A step of adsorbing a die to be peeled among a plurality of dies attached to a dicing tape with a collet;
Pushing up a predetermined position of the dicing tape and peeling the die from the dicing tape;
Picking up the peeled die, and
At least in the step of peeling, a semiconductor manufacturing method characterized by measuring a static electricity measurement sensor in contact with the die and measuring the amount of static electricity charged on the die in real time.   9. The semiconductor manufacturing method according to claim 8, wherein when the measured amount of static electricity exceeds a specified value, the die is irradiated with ions using an ionizer.   9. The semiconductor manufacturing method according to claim 8, wherein the static electricity amount charged on the die is measured by the static electricity measuring sensor provided on the collet.   The semiconductor manufacturing method according to claim 8, wherein the static electricity amount charged on the dicing tape is measured by the static electricity measuring sensor provided on a push-up piece that pushes up the dicing tape.

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