CN113157073B - Heat abstractor and terminal equipment thereof - Google Patents

Heat abstractor and terminal equipment thereof Download PDF

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Publication number
CN113157073B
CN113157073B CN202110363601.9A CN202110363601A CN113157073B CN 113157073 B CN113157073 B CN 113157073B CN 202110363601 A CN202110363601 A CN 202110363601A CN 113157073 B CN113157073 B CN 113157073B
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phase change
heat
change material
terminal device
temperature
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CN113157073A (en
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李伟
陈纯洋
陈葆春
张治国
李泉明
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Signal Processing (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)
  • Confectionery (AREA)

Abstract

A heat sink for a terminal device includes a phase change material (PCM, phase Change Material) and a temperature equalizing module. The temperature of the phase change material is kept unchanged basically in the phase change process, so that the heat is absorbed, the temperature of the heat dissipation device is not too high, and good user experience is realized.

Description

Heat abstractor and terminal equipment thereof
Technical Field
The embodiment of the invention relates to a heat dissipation device, in particular to a heat dissipation device for terminal equipment.
Background
Terminal equipment such as a tablet computer, a notebook computer and the like are required to be light, thin and portable, and meanwhile, the terminal equipment has high performance and good temperature experience, so that the heat dissipation performance of the product is more and more important.
In the current terminal field, in order to improve product performance, the power consumption of a CPU or a GPU chip is generally dynamically controlled, and the running power consumption is dynamically adjusted according to the running program requirement and the product temperature. For example, when some large programs or documents are started, the operation power consumption is greatly improved by adopting instantaneous over-frequency short time so as to obtain higher performance, the program starting time is shortened, and the user experience is improved. This transient scenario places higher demands on heat dissipation, and the industry currently lacks an effective solution, thereby limiting the performance improvement of the terminal.
Disclosure of Invention
In view of the above, the embodiment of the invention provides a heat dissipation device, which can effectively cope with the heat dissipation requirement caused by the short-time power consumption improvement of the terminal equipment.
In one aspect, embodiments of the present invention provide a heat sink for a terminal device, including a phase change material (PCM, phase Change Material) and a heat transfer unit. The heat transfer unit is in contact with the phase change material for conducting heat from the terminal device to the phase change material. The temperature of the phase change material is kept unchanged basically in the phase change process, so that the heat is absorbed, the temperature of the heat dissipation device is not too high, and good user experience is realized. For the terminal product in which the processor can dynamically adjust the operation power consumption, the heat dissipation device provided by the embodiment of the invention can prolong the time of the processor working in the high power consumption mode.
In one possible embodiment, the heat transfer unit is in contact with the processor of the terminal device to conduct heat of the processor to the phase change material. The processor is usually the main source of heat of the terminal equipment, and the heat dissipation efficiency of the heat dissipation device can be improved by directly contacting the heat transfer unit with the processor.
In one possible embodiment, the phase change material has a predetermined phase change point and heat capacity to absorb heat generated by the terminal device and to maintain the phase change material temperature not to exceed the phase change point.
In one possible embodiment, the heat transfer unit has a heat dissipation structure for dissipating heat to the external environment to improve the heat dissipation effect and to accelerate the dissipation of heat absorbed by the phase change material when the processor is operating in the low power mode.
In one possible embodiment, the phase change material has a phase change point of 10-70 ℃ for use in an environment in which a user normally lives.
Further, the phase change point of the phase change material is 30-45 ℃ to balance the heat capacity and the temperature.
In one possible embodiment, the thermal capacity of the phase change material is 100-10000 joules. To balance the heat capacity and occupied volume.
In one possible embodiment, the heat capacity of the phase change material is 1-200g. To balance the heat capacity and occupied volume.
In one possible embodiment, the phase change material comprises a solid-solid, or solid-liquid phase change material, which has a small volume change during phase change, facilitating production and installation.
In another possible embodiment, the phase change material comprises a solid-gas, or liquid-vapor phase change material, and has a shell of sufficient strength to maintain the shape and volume of the phase change material substantially unchanged upon phase change.
In one possible embodiment, the phase change material may comprise a composite phase change material.
Further, in one possible embodiment, the morphology of the composite phase change material comprises: microcapsules, shaped phase change materials, nanocomposite phase change materials, or porous composite phase change materials.
In one possible embodiment, the phase change material is attached to the heat transfer unit by means of an adhesive or mechanical fastening to prevent detachment during use.
In one possible embodiment, the heat transfer unit is made of one or more materials of metal or non-metal materials to improve heat dissipation efficiency.
In one possible embodiment, the phase change material fills the entire heat transfer unit, so that the thickness of the phase change material can be reduced, making the interior of the terminal device more compact.
In one possible embodiment, the heat dissipating device further comprises a temperature equalizing unit. The temperature equalizing unit is arranged between the phase change material and the heat transfer unit and is used for more uniformly conducting heat on the heat transfer unit to the phase change material, so that the heat dissipation efficiency is improved.
In one possible embodiment, the heat transfer unit may be provided with a groove matching the shape of the temperature equalizing unit, and the temperature equalizing unit is disposed in the groove to reduce the thickness of the heat dissipating device.
In one possible embodiment, the temperature equalization unit may be a heat pipe or VC.
In one possible embodiment, the phase change material has a void matching the shape of the temperature equalizing unit, and the temperature equalizing unit is disposed in the void, so that the efficiency of the heat dissipating device is improved while the thickness of the heat dissipating device is maintained.
In one possible embodiment, the phase change material has a protective film for maintaining the shape of the phase change material and for protecting the phase change material during production.
In one possible embodiment, the protective film may be an organic film such as PET, PI, or a metal film, further, the thickness is about 5% to 15% of the total thickness, and may be adjusted as desired.
In one possible embodiment, the heat transfer unit has a cavity therein, and the phase change material is embedded in the cavity of the heat transfer unit.
In another aspect, an embodiment of the present invention provides a terminal device, including: a processor, a housing, and a phase change material. The processor can dynamically adjust the working mode and is arranged in the shell. The phase change material is in contact with the housing for absorbing heat from the terminal device. In this embodiment, the structure of the terminal device such as a tablet or a mobile phone is more compact, and the application of the phase change material can directly reduce the temperature of the external surface of the tablet or the mobile phone product, and the existing heat dissipation structure is not changed.
In one possible embodiment, the phase change material is provided on an inner or outer surface of the housing, or the wall of the housing has a cavity, in which the phase change material is provided.
In one possible embodiment, the terminal device further comprises a temperature equalization unit. The temperature equalizing unit is arranged on the inner surface and the outer surface of the shell or in the cavity of the shell and is in contact with the phase change material.
In one possible implementation, an air layer is further disposed between the phase change material and the processor, so as to perform temperature equalization on heat emitted by the processor.
On the other hand, the embodiment of the invention provides terminal equipment with the heat dissipation device. The terminal equipment can be a mobile phone, a tablet personal computer, a notebook computer, a desktop computer, a vehicle-mounted terminal, a television, a set-top box, a VR equipment and the like.
In still another aspect, an embodiment of the present invention provides a terminal device having the above heat dissipation device. The terminal device comprises a computing chip and a heat dissipation device. The computing chip dynamically adjusts the operating power consumption. The heat dissipation device has a predetermined heat capacity to absorb heat of the terminal device, and prolong the operating time of the computing chip in the high power consumption mode.
The above embodiments may be arbitrarily combined to achieve different implementation effects.
Through the scheme, the embodiment of the invention can cope with short-time power consumption promotion of the terminal equipment, effectively radiate heat while keeping the temperature of the outer surface of the terminal equipment not too high, or slow down the temperature rising speed of the outer surface of the terminal equipment, and has good user experience.
Drawings
Fig. 1 is a schematic diagram of a terminal device according to one possible embodiment of the present invention.
Fig. 2 is a block diagram showing a part of the structure of a terminal device according to a possible embodiment of the present invention.
Fig. 3 is a graph of the endotherm and temperature change of a solid-liquid phase change material.
Fig. 4 is a schematic view of a heat dissipating device according to one possible embodiment of the present invention.
Fig. 5 is a schematic structural diagram of the heat dissipating device in fig. 4.
Fig. 6 is a schematic view of a heat dissipating device according to another possible embodiment of the present invention.
Fig. 7 is a schematic structural diagram of the heat dissipating device in fig. 6.
Fig. 8 is a schematic view of a heat dissipating device according to still another possible embodiment of the present invention.
Fig. 9 is a schematic structural diagram of the heat dissipating device in fig. 8.
Fig. 10 is a schematic structural view of a PCM material according to one possible embodiment of the present invention.
Fig. 11 is a schematic structural diagram of a heat dissipating device according to another possible embodiment of the present invention.
Fig. 12 is a schematic structural diagram of a heat dissipating device according to still another possible embodiment of the present invention.
Fig. 13 is a schematic structural diagram of a heat dissipating device according to another possible embodiment of the present invention.
Fig. 14 is a schematic structural view of a heat dissipating device according to still another possible embodiment of the present invention.
Fig. 15 is a schematic structural diagram of a heat dissipating device according to another possible embodiment of the present invention.
Fig. 16 is a schematic structural view of a heat dissipating device according to still another possible embodiment of the present invention.
Fig. 17 is a schematic structural diagram of a terminal device according to a possible embodiment of the present invention.
Fig. 18 is a schematic structural diagram of a terminal device according to another possible embodiment of the present invention.
Fig. 19 is a schematic structural diagram of a terminal device according to still another possible embodiment of the present invention.
Fig. 20 is a schematic structural diagram of a terminal device according to still another possible embodiment of the present invention.
Detailed Description
Fig. 1 is a schematic diagram of a terminal device according to one possible embodiment of the present invention.
The terminal device 100 according to the embodiment of the present invention may include a mobile phone, a tablet computer, a PDA (Personal Digital Assistant ), a POS (Point of Sales), a car computer, and the like.
Taking the terminal device 100 as an example of a mobile phone, fig. 2 is a block diagram illustrating a part of the structure of the mobile phone 100 according to an embodiment of the present invention. Referring to fig. 2, a handset 100 includes, among other components, RF (Radio Frequency) circuitry 110, memory 120, other input devices 130, a display screen 140, sensors 150, audio circuitry 160, I/O subsystem 170, processor 180, and power supply 190. It will be appreciated by those skilled in the art that the handset construction shown in fig. 2 is not limiting of the handset and may include more or fewer components than shown, or may combine certain components, or split certain components, or a different arrangement of components. Those skilled in the art will appreciate that the display 140 pertains to a User Interface (UI), and that the handset 100 may include fewer User interfaces than shown or otherwise.
The following describes the components of the mobile phone 100 in detail with reference to fig. 2:
the RF circuit 110 may be used for receiving and transmitting signals during the process of receiving and transmitting information or communication, specifically, after receiving downlink information of the base station, the downlink information is processed by the processor 180; in addition, the data of the design uplink is sent to the base station. Typically, RF circuitry includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, an LNA (Low Noise Amplifier ), a duplexer, and the like. In addition, RF circuit 110 may also communicate with networks and other devices via wireless communications. The wireless communication may use any communication standard or protocol including, but not limited to, GSM (Global System of Mobile communication, global system for mobile communications), GPRS (General Packet Radio Service ), CDMA (Code Division Multiple Access, code division multiple access), WCDMA (Wideband Code Division Multiple Access ), LTE (Long Term Evolution, long term evolution), email, SMS (Short Messaging Service, short message service), and the like.
The memory 120 may be used to store software programs and modules, and the processor 180 performs various functional applications and data processing of the mobile phone 100 by running the software programs and modules stored in the memory 120. The memory 120 may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, application programs required for at least one function (such as a sound playing function, an image playing function, etc.), and the like; the storage data area may store data (such as audio data, phonebook, etc.) created according to the use of the handset 100, etc. In addition, memory 120 may include high-speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid-state storage device.
Other input devices 130 may be used to receive entered numeric or character information and to generate key signal inputs related to user settings and function control of the handset 100. In particular, other input devices 130 may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a trackball, a mouse, a joystick, a light mouse (a light mouse is a touch-sensitive surface that does not display visual output, or an extension of a touch-sensitive surface formed by a touch screen), and the like. The other input devices 130 are connected to the other input device controllers 171 of the I/O subsystem 170 and interact with the processor 180 under control of the other device input controllers 171.
The display 140 may be used to display information entered by a user or provided to a user as well as various menus of the handset 100 and may also accept user inputs. The specific display 140 may include a display panel 141, and a touch panel 142. The display panel 141 may be configured in the form of an LCD (Liquid Crystal Display), an OLED (Organic Light-Emitting Diode), or the like. The touch panel 142, also referred to as a touch screen, a touch sensitive screen, etc., may collect touch or non-touch operations on or near the user (e.g., operations of the user using any suitable object or accessory such as a finger, a stylus, etc., on the touch panel 142 or near the touch panel 142, may also include somatosensory operations; the operations include single-point control operations, multi-point control operations, etc., operation types.) and drive the corresponding connection devices according to a preset program. Alternatively, the touch panel 142 may include two parts, a touch detection device and a touch controller. The touch detection device detects the touch azimuth and the touch gesture of a user, detects signals brought by touch operation and transmits the signals to the touch controller; the touch controller receives touch information from the touch detection device, converts the touch information into information which can be processed by the processor, sends the information to the processor 180, and can receive and execute commands sent by the processor 180. In addition, the touch panel 142 may be implemented by various types such as resistive, capacitive, infrared, and surface acoustic wave, and the touch panel 142 may be implemented by any technology developed in the future. Further, the touch panel 142 may overlay the display panel 141, and a user may operate on or near the touch panel 142 overlaid on the display panel 141 according to content displayed on the display panel 141 (including, but not limited to, a soft keyboard, a virtual mouse, virtual keys, icons, etc.), and after the touch panel 142 detects a touch operation thereon or thereabout, the touch operation is transmitted to the processor 180 through the I/O subsystem 170 to determine a type of touch event to determine a user input, and then the processor 180 provides a corresponding visual output on the display panel 141 through the I/O subsystem 170 according to the user input at the display panel according to the type of touch event. Although in fig. 2, the touch panel 142 and the display panel 141 are two separate components to implement the input and output functions of the mobile phone 100, in some embodiments, the touch panel 142 and the display panel 141 may be integrated to implement the input and output functions of the mobile phone 100.
The handset 100 may also include at least one sensor 150, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor that may adjust the brightness of the display panel 141 according to the brightness of ambient light, and a proximity sensor that may turn off the display panel 141 and/or the backlight when the mobile phone 100 moves to the ear. As one of the motion sensors, the accelerometer sensor can detect the acceleration in all directions (generally three axes), and can detect the gravity and direction when stationary, and can be used for applications of recognizing the gesture of a mobile phone (such as horizontal and vertical screen switching, related games, magnetometer gesture calibration), vibration recognition related functions (such as pedometer and knocking), and the like; other sensors such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc. that may be configured with the mobile phone 100 are not described herein.
Audio circuitry 160, speaker 161, and microphone 162 can provide an audio interface between the user and the handset 100. The audio circuit 160 may transmit the received audio data converted signal to the speaker 161, and the speaker 161 converts the signal into a sound signal to output; on the other hand, the microphone 162 converts the collected sound signal into a signal, which is received by the audio circuit 160 and converted into audio data, which is output to the RF circuit 108 for transmission to, for example, another cell phone, or to the memory 120 for further processing.
The I/O subsystem 170 is used to control input and output external devices, which may include other device input controllers 171, sensor controllers 172, and display controllers 173. Optionally, one or more other input control device controllers 171 receive signals from other input devices 130 and/or send signals to other input devices 130, and other input devices 130 may include physical buttons (push buttons, rocker buttons, etc.), dials, slider switches, joysticks, click wheels, optical mice (optical mice are touch-sensitive surfaces that do not display visual output, or extensions of touch-sensitive surfaces formed by touch screens). It is noted that other input control device controller 171 may be coupled to any one or more of the above devices. The display controller 173 in the I/O subsystem 170 receives signals from the display screen 140 and/or transmits signals to the display screen 140. After the display screen 140 detects the user input, the display controller 173 converts the detected user input into an interaction with the user interface object displayed on the display screen 140, i.e., a man-machine interaction is realized. The sensor controller 172 may receive signals from one or more sensors 150 and/or transmit signals to one or more sensors 150.
The processor 180 is a control center of the mobile phone 100, connects various parts of the entire mobile phone using various interfaces and lines, and performs various functions of the mobile phone 100 and processes data by running or executing software programs and/or modules stored in the memory 120 and calling data stored in the memory 120, thereby performing overall monitoring of the mobile phone. Optionally, the processor 180 may include one or more processing units; preferably, the processor 180 may integrate an application processor that primarily handles operating systems, user interfaces, applications, etc., with a modem processor that primarily handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into the processor 180.
The handset 100 also includes a power supply 190 (e.g., a battery) for powering the various components, which may preferably be logically connected to the processor 180 via a power management system so as to provide for the management of charge, discharge, and power consumption by the power management system.
Although not shown, the mobile phone 100 may further include a camera, a bluetooth module, etc., which will not be described herein.
The terminal device 100 may dynamically adjust the operating state of the processor 180 and the like to optimize the operating efficiency. In the case where the system load is low, such as the memory and processor resources occupied by the currently running program are low, the terminal device 100 places the processor 180 in a low power consumption mode, thereby prolonging the service life of the battery and reducing the temperature of the terminal device 100. When the system load is high, for example, when a user starts the system or turns on the APP, the processor 180 may be placed in a high power consumption mode, for example, by means of over-clocking, so as to increase the running power consumption, thereby obtaining higher performance, shortening the program start time, and improving the user experience. It will be appreciated that the operating state of the processor 180 may also be achieved by turning the processor 180 on and off, or on and off.
In one possible implementation, the terminal device 100 may set the sensor to monitor the temperature of its outer surface and keep the temperature of its outer surface no more than a threshold to provide a good experience to the user. The time that the processor 180 is in the high power consumption mode may depend on the temperature of the external surface of the terminal device 100.
For example, when the processor 180 is in the low power mode, operating at 1w of power, the temperature of the external surface of the terminal device 100 is 30 degrees. When the processor 180 is in the high power mode, it operates at 3w of power. After 10 seconds, the temperature of the external surface of the terminal device 100 rises to a threshold of 40 degrees. The processor 180 is switched back to the low power mode, i.e. operating at a power of 1 w. It can be seen that the longer the temperature of the external surface of the terminal device 100 reaches the threshold, the longer the processor 180 can provide a high performance output, thereby optimizing the user experience.
In one possible implementation, the processor 180 may be a heating element such as CPU, GPU, FPGA, a baseband chip, or an MCU.
In one possible implementation, to effectively dissipate heat when the processor 180 is operating in the high power mode, to prevent the processor 180 from burning out due to overheating, and to prevent the external surface of the terminal device 100 from being too hot to provide a user with a bad experience, and to extend the operating time of the processor 180 in the high power mode, embodiments of the present invention use a phase change material (PCM, phase Change Material) having a predetermined phase change point and heat capacity to dissipate heat from the processor 180.
Fig. 3 is a graph of the endotherm and temperature change of a solid-liquid PCM material. Phase change material (PCM-Phase Change Material) refers to a substance that changes morphology with temperature changes and is capable of providing latent heat. The phase change material is affected by the change of external conditions, and the phase change material changes between different solid, liquid and vapor states or changes phases in the same state, which is called a phase change process, and the phase change material absorbs or releases a large amount of latent heat. As shown in fig. 3, taking a solid-liquid PCM material as an example, the horizontal axis is the absorbed heat, the vertical axis is the PCM material temperature, the PCM material is initially solid, and the absorbed heat temperature increases; when the temperature rises to the phase change point, phase change starts to be carried out, latent heat is absorbed, and the temperature of the PCM material is kept unchanged at the moment and is in a solid-liquid mixed state; after all of them become liquid, the temperature of the heat-absorbing PCM material continues to rise.
It can be seen that while the PCM material is in the phase change state, the temperature does not rise even if heat continues to be absorbed, but remains at the phase change point temperature. Therefore, according to the power consumption and application scenario of the processor 180, PCM materials with predetermined phase change points and heat capacities may be set, so that the PCM materials can keep the temperature not to exceed the phase change point for a certain time after absorbing heat emitted by the processor 180 in the high power consumption mode. In one aspect, the heat emitted by the processor 180 may be effectively absorbed by the PCM material; on the other hand, the temperature of the outer surface of the terminal device 100 is controlled not to exceed the phase transition point temperature, so that scalding is avoided, and a good experience is provided for a user. The heat absorbed by the PCM material may be dissipated directly into the air, or through other heat dissipating structures.
It should be noted that even though the PCM material continues to rise in temperature after completing the phase change, the processor 180 is operated in the high power mode for a prolonged period of time, providing a good user experience.
In addition, the heat transfer unit may itself function to radiate heat to the external environment, in addition to conducting heat from the processor 180 to the PCM material. After the processor 180 is switched from the high power mode to the low power mode, the heat emitted from the processor 180 is reduced, the temperature is lowered, the heat absorbed by the PCM material can be rapidly emitted into the air through the heat transfer unit, and a reverse phase change occurs, so that the ability of absorbing the heat is recovered.
It should be noted that fig. 3 shows a graph of ideal endothermic and temperature change of a solid-liquid PCM material, and according to an embodiment of the present invention, the PCM material may have a certain temperature rise in the melting stage, for example, 40-45 ℃ due to impurities, uneven heating, or mixture. In view of this, the phase change point temperature is defined as the highest temperature of the PCM material in the melting phase, and the PCM material is maintained near the phase change point temperature substantially all the time in the melting phase, and still functions to slow down the temperature rise of the outer surface of the terminal device 100.
In one possible implementation, the heat transfer unit may be an existing heat dissipating structure, facilitating retrofitting and reducing costs.
For example, when the processor 180 is operated in the low power mode, 10s is required to open one excel document, and when the processor 180 is operated in the high power mode, only 5s is required to open the same excel document. If the external surface temperature of the terminal device 100 has reached the threshold after 3s, the processor 180 either switches back to the low power mode, thereby extending the time to open the document, or continues to operate in the high power mode, thereby causing the external surface temperature of the terminal device 100 to be above the threshold, giving the user a bad experience. According to the embodiment of the invention, the PCM material with the preset phase change point and the heat capacity, namely the PCM material with the preset dosage is arranged, so that a large amount of heat emitted by the processor 180 in the high power consumption mode is absorbed, the temperature of the PCM material still does not exceed the phase change point after the processor 180 works for 5 seconds in the high power consumption mode, and the temperature of the outer surface of the terminal equipment 100 is lower than the threshold value, so that good experience is provided for a user.
In one possible embodiment, the PCM material has a phase transition point of 10-70 ℃. For use in the environment in which the user normally lives.
Further, the phase transition point of the PCM material is 30-45 ℃ to balance the heat capacity and temperature.
In one possible embodiment, the heat capacity of the PCM material is 100-10000 joules. To balance the heat capacity and occupied volume.
In one possible embodiment, the heat capacity of the PCM material is in the range of 1-200g. To balance the heat capacity and occupied volume.
In one possible embodiment, the thermal capacity of the PCM material is calculated according to the following formula:
q=w=t=h×m where,
q-the amount of heat absorbed or released, i.e. the thermal capacity;
w-power consumption by PCM material;
t-time required for continuous heat absorption;
h-phase change latent heat value of PCM material;
m-the mass of PCM material required.
For example, the enthalpy of the PCM material is 145J/g, the design requires the PCM material to absorb 10W of heat, the processor 180 needs to continue heating for 3min (i.e., the PCM material needs to continue absorbing heat for 3 min), and the PCM material is required to be 10×3×60/145=12.4g.
In one possible embodiment, the PCM material need only meet the requirements, and the shape and size may be set according to the specific requirements.
In one possible embodiment, the PCM material is used in a determined amount according to a usage scenario of the terminal device 100 in the high power consumption mode. For example, the terminal device 100 may take one minute to turn on and the processor 180 may emit 2000J of heat. For example, the user may take five seconds to turn on an APP, and the processor 180 may emit 200J of heat. For example, the terminal device 100 radiates 3000J of heat additionally on the basis of normal heat radiation without running the game for one hour of the user running the game "angry bird".
In one possible implementation, the amount of PCM material may be determined according to the frequency and/or habit of the user, for example, according to the habit of the user or big data, determining a scenario in which the user continuously opens a plurality of APPs for a short period of time, and determining the accumulated heat emitted by the processor 180 in the high power mode.
In one possible embodiment, the amount of PCM material may be set to have a heat capacity greater than the heating value of all usage scenarios at high power consumption, so that the temperature of the PCM material does not always exceed the phase transition point; also in some scenarios, the PCM material may be made to have a temperature higher than the phase transition point, which may still extend the time the processor 180 is operating in the high power mode, to achieve a balance of heat dissipation and cost savings.
In embodiments of the present invention, a variety of PCM materials available may be used. A description of common PCM materials follows.
Phase change materials are of various kinds and can be classified into inorganic materials, organic materials and composite phase change materials 3 from the viewpoint of chemical composition. The temperature range of the stored energy can be classified into high temperature, medium temperature, low temperature and the like. In the energy storage process, the solid-liquid phase change energy storage can be classified according to the change of the material phase. Solid-gas, liquid-liquid, liquid-gas phase change energy storage materials.
1. Inorganic phase change material
The inorganic phase change material mainly comprises metal alloy (Mg-Cu), hydrate of metal salt (Na2SO4.4H2O, mgCl.6H2O), hydrate of alkali metal, activated clay, mineral wool and the like. The phase change mechanism is as follows: the material is heated to remove crystallization water and absorb heat; otherwise, absorb moisture and release heat. The phase transition temperature is high, the heat storage capacity is high, and the heat storage device is applied to high-temperature heat environments.
Table 1 common inorganic phase change material parameters
Figure BDA0003006520420000081
2. Organic phase change material
The organic phase change material has high solid-liquid phase change and solid-solid phase change application value, and is widely studied. Materials of which solid-liquid phases are widely used mainly include: ethyl palmitate, butyl stearate, dodecanoic acid, short-chain acids, caproic acid, paraffin, dodecanol, tetradecyl, butyl stearic acid, and the like.
TABLE 2 solid-liquid phase Material parameters
Figure BDA0003006520420000082
The solid-solid phase change material is mainly subjected to energy storage and release processes through structural transformation from ordered to disordered crystals. Mainly comprises polyalcohol, crosslinked polyethylene and lamellar zincite. The solid-solid phase change material has no macroscopic state change in the phase change process.
3. Composite phase change material
The composite phase change material can be changed from liquid to solid or solid-liquid phase change during phase change, and can easily react with other blended materials. The solution method mainly comprises the following steps: 1) Preparing microcapsules; 2) Preparing a shaped PCM; 3) Preparing nano composite PCM; 4) Preparing the porous composite PCM.
1) Microcapsule technology
The microcapsule technology is a technology of coating solid or liquid with film-forming material to form tiny particles with a core-shell structure (particle size of 2-1000 μm, and thickness of shell of 0.2-10 μm). The main preparation methods of the microcapsule are interfacial polymerization method and in-situ polymerization method.
The in-situ polymerization process for preparing microcapsules has been widely studied, and the shell layers of paraffin microcapsules which are generally used include melamine formaldehyde resin, urea formaldehyde resin, polyurethane, polypropylene, phenolic resin and the like.
The interfacial polymerization method has the advantages of high reaction speed, mild reaction condition, low requirement on the purity of the reaction monomer, low requirement on the raw material proportion, high permeability of the formed wall film and low cost.
2) Shaped PCM
The shaping PCM takes a polymer material as a matrix, and paraffin is dispersed in the matrix to form the PCM. Paraffin wax and a high molecular polymer (polyethylene, ethylene-vinyl acetate copolymer, ethylene propylene rubber, etc.) are melt blended, and the paraffin wax is uniformly dispersed in the cured high molecular polymer. Polyethylene is a common matrix coating material, and paraffin leakage is generally improved by crosslinking, grafting and the like.
3) Nanocomposite PCM
The nano-scale or metal oxide particles are added into the base solution according to a certain mode and proportion to prepare the nano-composite PCM, which can be applied to innovative research in the field of thermal energy engineering.
4) Porous composite PCM
Inorganic porous materials (attapulgite, opal, expanded graphite, bentonite, perlite and the like) absorb organic PCM by utilizing methods such as vacuum adsorption, seepage method, fusion intercalation method, blending and the like, and the PCM is controlled and fixed to perform phase change within a certain space range, so that the porous paraffin PCM with stable phase change temperature and phase change enthalpy is prepared.
In one possible embodiment, the PCM material comprises a solid-solid, or solid-liquid phase change material. The solid-solid or solid-liquid phase change material can maintain the shape and volume basically unchanged in the phase change process, and can be applied to terminal equipment, so that the installation and use process is more reliable, and other elements of the terminal equipment are not damaged by extrusion caused by the volume change of the PCM material in the phase change process.
In another possible embodiment, the PCM material comprises a solid-gas, or liquid-vapor phase change material, and has a shell of sufficient strength to maintain the shape and volume of the PCM material substantially unchanged upon phase change.
In one possible embodiment, multiple phase change materials may be mixed to achieve a designed heat capacity and phase change point. The proportion can be obtained by a person skilled in the art through limited experiments without creative labor.
In one possible embodiment, the PCM material may comprise a composite phase change material.
Further, in one possible embodiment, the morphology of the composite phase change material comprises: microcapsules, shaped PCM, nanocomposite PCM, or porous composite PCM.
Fig. 4 is a schematic view of a heat dissipating device according to one possible embodiment of the present invention. Fig. 5 is a schematic structural diagram of the heat dissipating device in fig. 4. As shown in fig. 4 and 5, the heat sink 200 is in contact with the processor 180 to absorb heat emitted from the processor 180 and then to be emitted into the air or to be conducted to another heat sink element.
In one possible embodiment, the heat sink 200 includes PCM material 210 and a heat transfer unit 220. The heat transfer unit 220 is used to directly contact the processor 180, and the PCM material 210 contacts the heat transfer unit 220.
In one possible embodiment, the PCM material 210 is attached to the heat transfer unit 220 by adhesive or mechanical fastening to prevent removal during use.
In one possible embodiment, the heat transfer unit 220 is made of a material having a good heat transfer coefficient, such as a metal, e.g., gold, silver, copper, iron, aluminum, or a non-metallic material, e.g., graphite, or other composite material having a good heat transfer coefficient. The heat transfer unit 220 may be made of one or more materials.
In one possible embodiment, the PCM material 210 is spread over the entire heat transfer unit 220, so that the thickness of the PCM material 210 may be reduced, making the interior of the terminal apparatus 100 more compact.
In one possible embodiment, when the processor 180 is switched from the high power consumption mode to the low power consumption mode, the heat transfer unit 220 serves to radiate heat absorbed by the PCM material 210 into the air or to conduct to another heat radiating element.
Fig. 6 is a schematic view of a heat dissipating device according to another possible embodiment of the present invention. Fig. 7 is a schematic structural diagram of the heat dissipating device in fig. 6. As shown in fig. 6 and 7, the heat sink 200 further includes a temperature equalizing unit 230. The temperature equalizing unit 230 is disposed between the PCM material 210 and the heat transfer unit 220, and is used for more uniformly transferring heat from the heat transfer unit 220 to the PCM material 210, thereby improving heat dissipation efficiency. In an embodiment of the present invention, one or both of the temperature equalization unit 230 and the heat transfer unit 220 may be referred to as a temperature equalization module.
In one possible embodiment, the heat transfer unit 220 may be provided with a groove 221 having a shape matching that of the temperature equalizing unit 230, and the temperature equalizing unit 230 is disposed in the groove 221 to reduce the thickness of the heat sink 200.
In one possible embodiment, the temperature equalization unit 230 may be a heat pipe or VC (Vapor Chamber, which uses the latent heat of evaporation and condensation of a liquid to make heat conduct rapidly). Heat is conducted from the processor 180 to the area where the heat transfer unit 220 contacts the processor 180, and then the heat is diffused to the entire heat transfer unit 220 through the heat pipe or VC or the like of the temperature equalization unit 230. In one possible implementation, the temperature equalization unit 230 makes the temperature difference between any two points of the whole heat transfer unit 220 < 5 ℃, and then the PCM material 210 absorbs and stores heat from the surface of the heat transfer unit 220, and delays the time for the surface temperature of the terminal device 100 to reach the phase transition point, so that the processor 180 obtains as much high performance working time as possible.
In one possible embodiment, the heat pipe may be a thermally conductive metal pipe, such as a copper pipe, an aluminum pipe, or the like.
In one possible embodiment, VC is a hollow sealed metal tube, such as a copper tube, aluminum tube, or the like. The VC is internally sealed with a small amount of PCM material, generally 0.01 g-0.1 g. The PCM material in VC has low consumption and very low heat capacity, so that the surface temperature of VC is far higher than the phase change point of the PCM material in VC, and the PCM material is only used for accelerating the heat transfer of VC and is not used for heat storage.
Further, in one possible embodiment, the PCM material within the VC comprises a solid-gas, or liquid-vapor phase change material, and has a metal shell of sufficient strength to maintain the shape and volume of the PCM material substantially unchanged upon phase change.
Fig. 8 is a schematic view of a heat dissipating device according to still another possible embodiment of the present invention. Fig. 9 is a schematic structural diagram of the heat dissipating device in fig. 8. As shown in fig. 8 and 9, unlike the embodiment shown in fig. 6, the PCM material 210 is removed at the region overlapping the temperature equalizing unit 230, with voids matching the shape of the temperature equalizing unit 230, and the temperature equalizing unit 230 is disposed in the voids. Therefore, the thickness of the heat sink 200 is only the combined thickness of the temperature equalizing unit 230 and the heat transfer unit 220. In the present embodiment, the PCM material 210 maintains the thickness of the heat sink 200 while improving the performance of the heat sink 200.
In each of the above possible embodiments, the positions of the PCM material 210, the heat transfer unit 220, and the temperature equalization unit 230 may be arbitrarily adjusted, for example, the PCM material 210 or the temperature equalization unit 230 may directly contact the processor 180.
Fig. 10 is a schematic structural view of a PCM material according to one possible embodiment of the present invention. As shown in fig. 10, the PCM material 210 has a protective film 211 for maintaining the shape of the PCM material 210 and for protecting the CM material 210 during the production process.
In one possible embodiment, the protective film 211 may be an organic film such as PET, PI, or a metal film, and further, the thickness is about 5% to 15% of the total thickness, which may be adjusted as needed.
Fig. 11 is a schematic structural diagram of a heat dissipating device according to another possible embodiment of the present invention. As shown in fig. 11, for low power consumption tablet or cell phone products, or terminal equipment having a metal case, PCM material 210 may be directly attached to the middle frame or rear case of the tablet or cell phone, or may be provided on other modules, such as a heat transfer unit. In this embodiment, the structure of the terminal device such as a tablet or a mobile phone is more compact, and the PCM material 210 can be applied to directly reduce the temperature of the external surface of the tablet or the mobile phone product, without changing the existing heat dissipation structure.
In one possible implementation, the heat transfer unit, the middle frame or the middle of the shell may be embedded with a heat pipe or a VC or other temperature equalization unit 230 for temperature equalization.
In one possible embodiment, if the middle frame or the outer shell is thinner, the heat pipe or the VC cannot be embedded, and a layer of high thermal conductivity material may be compounded on the PCM material 210 to serve as a soaking layer, to function as the temperature equalization unit 230, and to improve the temperature equalization performance, such as graphite, copper foil, and the like. The soaking layer may be outside the PCM material 210 or between the PCM material 210 and the casing.
Fig. 12 is a schematic structural diagram of a heat dissipating device according to still another possible embodiment of the present invention. As shown in fig. 12, the module/middle frame/case includes a cavity in the middle, and PCM material 210 is filled in the cavity without changing the internal structure of the terminal apparatus 100, so as to facilitate production and reduce costs.
In one possible embodiment, the PCM material 210 has little volume change and small stress during phase change, and the module/middle frame/housing may use a material having a certain strength or reserve a part of space to ensure that the PCM material 210 does not affect the appearance of the terminal device or damage the module/middle frame/housing during phase change.
Fig. 13 is a schematic structural diagram of a heat dissipating device according to another possible embodiment of the present invention. As shown in fig. 13, a temperature equalization unit 230, such as a heat pipe or a high thermal conductivity soaking layer, may be disposed within the module/center/housing, contacting the PCM material 210 to provide temperature equalization.
Fig. 14 is a schematic structural view of a heat dissipating device according to still another possible embodiment of the present invention. As shown in fig. 14, the temperature equalizing unit 230 may also be disposed outside the module/center/housing without directly contacting the PCM material 210 to provide temperature equalization and reduce the thickness of the housing.
Fig. 15 is a schematic structural diagram of a heat dissipating device according to another possible embodiment of the present invention. As shown in fig. 15, the PCM material 210 is not in direct contact with a heat source such as the processor 180, but an air layer is provided to perform uniform temperature. In the present embodiment, the air layer allows the temperature of the PCM material 210 to be more uniform.
Fig. 16 is a schematic structural view of a heat dissipating device according to still another possible embodiment of the present invention. As shown in fig. 16, a local hot spot exists in the terminal device, and the PCM material 210 may not be disposed at the local hot spot, but the air layer may be disposed to perform temperature equalization. In the present embodiment, the air layer allows the temperature of the PCM material 210 to be more uniform, and the PCM material 210 may be disposed using as much space as possible.
Fig. 17 is a schematic structural diagram of a terminal device according to a possible embodiment of the present invention. PCM material 210 may be provided on the outside of the heat sink structure near the housing to facilitate retrofitting PCM material 210 to existing heat sink structures.
Fig. 18 is a schematic structural diagram of a terminal device according to another possible embodiment of the present invention. The PCM material 210 may be disposed inside the heat dissipation structure, and the temperature equalizing module may be disposed between the PCM material 210 and the case, so as to facilitate the realization of the compactness of the heat dissipation structure.
Fig. 19 is a schematic structural diagram of a terminal device according to still another possible embodiment of the present invention. The outside of heat radiation structure, near the position of keyboard can provide good experience for the user.
Fig. 20 is a schematic structural diagram of a terminal device according to still another possible embodiment of the present invention. PCM material 210 may be provided on the housing without direct contact with other heat dissipating structures for ease of production and manufacturing.
The embodiment of the invention can realize the following effects.
The PCM material and soaking module may be combined in various forms. For example:
the PCM material can be stuck in the groove gap of the heat radiation module without increasing the thickness of the product;
the PCM material can be stuck on the back of the module besides the surface of the module, can be stuck on the inner wall of the shell of the equipment, can be stuck on the back of a keyboard and the like, and can be stuck on the PCM at different areas at the same time according to the needs;
in the low-power consumption flat panel and mobile phone application, a heat transfer unit can be omitted, the PCM can be attached to the middle frame or the rear shell, the middle frame or the rear shell can be subjected to heat pipe temperature equalization, and if the heat pipe cannot be used, a soaking layer can be added;
PCM may also be embedded in cavities in the module/center/housing while heat pipes, high thermal conductivity soaking layers may be used to improve temperature uniformity.
In the above embodiments, PCM material 210 and/or heat sink 200 may also dissipate heat from components other than processor 180, such as memory, batteries, screens, and the like.
The above embodiments may be arbitrarily combined to achieve different effects.
In summary, the foregoing description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the principle of the present invention should be included in the protection scope of the present invention.

Claims (9)

1. A terminal device, comprising:
a housing comprising a shell;
the processor is arranged inside the shell, and the working modes of the processor comprise a high-power-consumption mode and a low-power-consumption mode; and
The heat dissipation device comprises a temperature equalizing module and a phase change material,
the phase change material is in direct contact with the processor and is used for absorbing the heat of the processor and changing the shape along with the change of temperature, the temperature equalizing module is arranged between the phase change material and the shell and is used for uniformly conducting the heat of the processor,
the temperature equalization module specifically comprises a heat transfer unit and a temperature equalization unit, wherein the heat transfer unit is in contact with the phase change material, and the temperature equalization unit is close to a middle frame or a shell of the terminal equipment.
2. The terminal device of claim 1, wherein the temperature equalization unit is embedded in a center or the housing of the terminal device.
3. The terminal device of claim 1, wherein the temperature equalization unit comprises a heat pipe or VC.
4. A terminal device according to claim 3, wherein the VC interior comprises a solid-gas or liquid-vapor phase change material.
5. The terminal device of any of claims 1-4, wherein the phase change material comprises a solid-solid or solid-liquid phase change material.
6. The terminal device of any of claims 1-4, wherein the phase change material comprises a morphology comprising any of: microcapsules, shaped phase change materials, nanocomposite phase change materials, or porous composite phase change materials.
7. The terminal device of claim 5, wherein the phase change material has a protective film for maintaining a shape of the phase change material.
8. The terminal device of any of claims 1-4, wherein the phase change material is further disposed at a location of a housing or a keyboard of the terminal device.
9. The terminal device of any of claims 1-4, wherein the phase change material is further covered with a soaking layer, and the soaking layer is graphite or copper foil.
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