CN110494016B - Heat dissipation device and terminal electronic equipment - Google Patents
Heat dissipation device and terminal electronic equipment Download PDFInfo
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- CN110494016B CN110494016B CN201910722686.8A CN201910722686A CN110494016B CN 110494016 B CN110494016 B CN 110494016B CN 201910722686 A CN201910722686 A CN 201910722686A CN 110494016 B CN110494016 B CN 110494016B
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- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
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- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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Abstract
The embodiment of the application provides a heat abstractor and terminal electronic equipment, relates to heat dissipation technical field, and heat abstractor is used for dispelling the heat to terminal electronic equipment's the source that generates heat, and heat abstractor includes: the system comprises a hydrated salt phase-change material and a refrigeration unit which is in contact with the hydrated salt phase-change material and is used for refrigerating the hydrated salt phase-change material; a heat transfer unit for transferring heat of the heat generating source to the hydrated salt phase-change material.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a heat dissipation device and terminal electronic equipment.
Background
Nowadays, terminal electronic devices are rapidly developed towards high power and light weight, and thermal design has become one of the bottlenecks that restrict the development. While the steady-state heat dissipation capability of the terminal electronic equipment is improved, the Phase Change Material (PCM) is also applied to the heat management of the electronic equipment by utilizing the characteristic that the electronic equipment works intermittently or has high intermittent power consumption. The technical idea is as follows: when the terminal electronic equipment works under short-time high power consumption, the phase-change material is utilized to store excessive heat; when the terminal electronic device is powered down to a lower stable power consumption, the heat stored in the phase change material is dissipated to the environment. The phase-change heat storage mode of 'peak clipping and valley filling' has the following advantages: (a) the performance or duration of short-time high-power operation is improved; (b) the shell temperature of the terminal electronic equipment is effectively controlled; (c) the system thermal response is more gentle, and the system-level intelligent temperature control can be accurately carried out.
Referring to fig. 1 and 2, a heat dissipation device applied to a terminal electronic device in the prior art includes a temperature equalizing plate 002 for contacting with a processor 001, and a PCM module 003, and the specific working principle thereof is as follows: the heat that gives off the treater 001 through temperature-uniforming plate 002 expands to temperature-uniforming plate 002's whole surface fast among the heat abstractor, and PCM module 003 is from temperature-uniforming plate 002's surface absorption heat, gives PCM module 003 inside phase change material 004, carries out the heat-retaining through phase change material 004 to delay treater 001 intensification time, the operating time of extension work under the high power consumption mode, and then promote the working property of treater 001.
The phase change material 004 can be made of a waxy phase change material or a hydrated salt phase change material, the energy storage density of the waxy phase change material is small, the heat storage energy is only about 105J/cc at most, so that the enthalpy of the whole PCM module 003 is small, the heat dissipation effect is influenced, and compared with the waxy phase change material, although the energy storage density is increased, the hydrated salt phase change material has a large supercooling degree (15-20 ℃), namely, the hydrated salt phase change material needs to be cooled to a temperature 15-20 ℃ lower than the melting point after being melted and can be reused, so that the hydrated salt phase change material cannot be solidified at normal temperature to store heat again, and further cannot be repeatedly applied at normal temperature.
Disclosure of Invention
The embodiment of the application provides a heat dissipation device and terminal electronic equipment, and mainly provides the heat dissipation device which has a high enthalpy value and can be repeatedly used at normal temperature.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:
in a first aspect, the present application provides a heat dissipation device for dissipating heat from a heat source of a terminal electronic device, including:
the system comprises a hydrated salt phase-change material and a refrigeration unit which is in contact with the hydrated salt phase-change material and is used for refrigerating the hydrated salt phase-change material;
a heat transfer unit for transferring heat of the heat generating source to the hydrated salt phase-change material.
The heat abstractor that this application embodiment provided conducts the heat of the source that generates heat to the salt hydrate phase change material through heat transfer unit, and the phase transition process of the salt hydrate phase change material of rethread absorbs the heat that the source that generates heat diffused to reach the radiating purpose of the source that generates heat. Because the phase-change material is a hydrous salt phase-change material, compared with a waxy phase-change material, the hydrous salt phase-change material has higher energy storage density, can effectively improve the stored energy, has higher heat storage energy, can effectively improve the heat dissipation effect, meanwhile, because the embodiment of the application comprises the refrigerating unit, although the hydrated salt has larger supercooling degree, that is, after melting is reduced to the melting point temperature, the material is difficult to cool and solidify, so that the material cannot be melted again and absorb heat, but the hydrous salt phase-change material can be cooled by the arrangement of the cooling unit, the supercooling phenomenon of the hydrous salt phase-change material is inhibited, preparing for next melting heat storage by stimulating the hydrated salt phase change material to solidify, further realizing the circulating heat storage and heat release of the hydrated salt phase change material at normal temperature, therefore, the heat dissipation device provided by the embodiment of the application has a high enthalpy value, and can be used for repeatedly and efficiently dissipating heat of the heating source at normal temperature.
In a possible implementation manner of the first aspect, the refrigeration unit includes a cold-end substrate and a hot-end substrate that are arranged oppositely, multiple sets of semiconductor thermocouple pairs that are arranged in parallel are provided between the cold-end substrate and the hot-end substrate, both ends of the semiconductor thermocouple pairs are disposed on the corresponding cold-end substrate and the corresponding hot-end substrate through conductive electrodes, and both the cold-end substrate and the hot-end substrate are in contact with the hydrous salt phase-change material. The refrigeration unit adopting thermoelectric refrigeration refrigerates the hydrated salt phase-change material, has simple structure, can continuously work, has power consumption less than 1w, is electrified for several seconds, can reach the maximum temperature difference, does not shake during work, and can not generate noise.
In a possible implementation manner of the first aspect, the heat transfer unit includes an input end for inputting heat of the heat generating source and an output end for transmitting the input heat to the hydrous salt phase change material, the hot-end substrate is close to the output end, and the cold-end substrate is far from the output end. Through keeping away from the cold junction base plate and leading out the end setting, the last heat that absorbs generates heat the source just can not be easy conduction to the cold junction base plate on the heat transfer unit, and then prevents to conduct the refrigeration effect that the heat influence cold junction base plate on the cold junction base plate becomes the looks material to the salt hydrate.
In a possible implementation manner of the first aspect, a heat dissipation structure is disposed on the hot end substrate, and the heat dissipation structure is configured to diffuse heat on the hot end substrate. The heat dissipation structure is arranged on the hot end substrate, so that heat on the hot end substrate is diffused in time, and the heat of the cold end substrate is smoothly transmitted into the hot end substrate, and the refrigeration effect of the refrigeration unit is improved.
In a possible implementation manner of the first aspect, the heat dissipation structure includes a metal heat sink disposed on a surface of the hot end substrate, and a surface area of the metal heat sink is larger than a surface area of the hot end substrate. The metal radiating fins are used as radiating structures, the structure is simple, the implementation is convenient, and the surface area of the metal radiating fins is larger than that of the hot end substrate, namely, the heat diffusion speed on the hot end substrate is accelerated in a mode of expanding the radiating area, so that the temperature on the hot end substrate is reduced as soon as possible, and the refrigerating effect of the refrigerating unit is improved.
In a possible implementation manner of the first aspect, a heat insulation structure is arranged on the cold-end substrate, the heat insulation structure is used for preventing external heat from diffusing to the cold-end substrate, a heat transfer structure is arranged on the cold-end substrate, and the heat transfer structure is used for transferring cold on the cold-end substrate to the hydrated salt phase-change material. Through set up thermal-insulated structure on the cold junction base plate, prevent on external heat transfer to the cold junction base plate to increase the temperature on the cold junction base plate, influence refrigeration effect, conduct to the salt hydrate phase change material in through the cold volume of heat transfer structure on with the cold junction base plate, so that the salt hydrate phase change material nucleation of melting, the crystal nucleus is grown afterwards, and then it is regional to whole salt hydrate phase change material region to solidify, restrain the supercooling phenomenon of salt hydrate phase change material, can reduce refrigeration unit's energy consumption like this.
In a possible implementation manner of the first aspect, the heat transfer structure includes a metal heat transfer element, one end of the metal heat transfer element is connected with the cold-end substrate, and the other end of the metal heat transfer element passes through the heat insulation structure and extends into the hydrated salt phase change material. The metal heat transfer element is adopted as the heat transfer structure, the structure is simple, the implementation is convenient, and the heat transfer effect is good.
In a possible implementation manner of the first aspect, the heat transfer structure includes a heat transfer hole opened on the heat insulation structure, and the heat transfer hole is filled with the hydrated salt phase-change material. The heat transfer hole is formed in the heat insulation structure, and the hydrated salt phase change material is filled in the heat transfer hole, so that the hydrated salt phase change material is directly contacted with the cold end substrate, crystallization and solidification of the hydrated salt phase change material are stimulated more quickly, and solidification efficiency is improved.
In a possible implementation manner of the first aspect, the heat dissipation device further comprises a heat dissipation box arranged on one side of the heat transfer unit and a framework arranged in the heat dissipation box, the hydrated salt phase-change material is filled on the framework, the refrigeration unit is installed on the framework filled with the hydrated salt phase-change material, one side of the framework, close to the heat transfer unit, is connected with the heat dissipation box through a first heat conduction structure, and the heat dissipation box and the framework are made of heat conduction materials. Because the side of the framework close to the heat transfer unit is connected with the heat dissipation box through the first heat conduction structure, the contact thermal resistance between the framework and the heat dissipation box is reduced, the heat exchange efficiency of the heat transferred to the heat dissipation box through the heat transfer unit and the hydrated salt phase-change material is improved, and the heat dissipation effect of the whole heat dissipation device is further improved.
In a possible implementation manner of the first aspect, the first heat conducting structure includes a welding layer. Through the first heat conduction structure that the welded layer formed, both ensured heat conduction efficiency, also improved the joint strength of skeleton and heat dissipation box.
In a possible implementation manner of the first aspect, a second heat conducting structure is disposed between the heat dissipation box and the heat transfer unit. Through setting up second heat conduction structure to reduce the thermal contact resistance between heat dissipation box and the heat transfer unit, improve the heat exchange efficiency of heat transfer unit and heat dissipation box, and then improve whole heat abstractor's radiating effect.
In a possible implementation manner of the first aspect, the second heat conducting structure comprises a heat conducting silicone layer. The heat-conducting silicone grease layer is used as a second heat-conducting structure, so that the energy storage module and the heat transfer unit can be quickly separated on the basis of heat conduction, and the energy storage module to be maintained can be maintained.
In a possible implementation manner of the first aspect, the heat transfer unit includes a temperature-equalizing plate, the heat dissipation box and the heat source are disposed on the temperature-equalizing plate, and the heat dissipation box and the heat source are disposed on the same side of the temperature-equalizing plate, or the heat dissipation box and the heat source are disposed on opposite sides of the temperature-equalizing plate. The temperature equalizing plate is used as a heat transfer unit, so that the structure is simple and the installation is convenient. And when the heat dissipation box and the heating source are arranged on the same side of the temperature equalizing plate, the thickness of the whole heat dissipation device can be reduced, and the requirement of miniaturization design is met.
In a possible implementation manner of the first aspect, the heat transfer unit includes a first heat pipe, the heat dissipation device further includes a temperature-equalizing metal plate, a second heat pipe, and a heat source temperature-equalizing sheet connected to the heat source, the heat source and the heat dissipation box are disposed on the same side of the temperature-equalizing metal plate, the heat source temperature-equalizing sheet is disposed on the temperature-equalizing metal plate, the heat source temperature-equalizing sheet is connected to the temperature-equalizing metal plate through the second heat pipe, and the heat source temperature-equalizing sheet is further connected to the heat dissipation box through the first heat pipe. The heating source and the heat dissipation box are arranged on the same side of the uniform-temperature metal plate, so that the thickness of the whole heat dissipation device can be reduced, the requirement of miniaturization design is met, meanwhile, due to the design of the uniform-temperature metal plate and the second heat pipe, the uniform-temperature effect of the heat dissipation device can be increased, and the cooling speed is increased.
In a possible implementation manner of the first aspect, at least part of the heat source temperature equalizing sheet is embedded in the temperature equalizing metal plate. At least part of the heat source temperature equalizing sheet is embedded in the temperature equalizing metal plate, so that the thickness of the whole heat dissipation device is further reduced.
In a possible implementation manner of the first aspect, the hydrated salt phase change material is filled with a heat conducting material. By adding the heat conduction material, the heat conduction coefficient of the hydrated salt phase change material mixed with the heat conduction material is improved, and high heat conduction capability is realized.
In a possible implementation manner of the first aspect, the thermally conductive material is graphene or copper foam.
In a possible implementation form of the first aspect, the volume fraction of the hydrous salt phase change material is greater than or equal to 90%. Therefore, the hydrous salt phase change material mixed with the heat conduction material has high heat conduction capability under the condition of ensuring that the hydrous salt phase change material has a larger enthalpy value.
In a possible implementation manner of the first aspect, the volume fraction of the hydrous salt phase change material is greater than or equal to 95%.
In a possible implementation manner of the first aspect, the heat dissipation device further includes: the temperature detection module is arranged in the hydrated salt phase-change material and is used for detecting the temperature of the hydrated salt phase-change material. The temperature of the hydrated salt phase-change material is detected in real time through the temperature detection module, so that the refrigeration unit can effectively refrigerate the hydrated salt phase-change material, and the hydrated salt phase-change material is guaranteed to have better service performance.
In a possible implementation manner of the first aspect, the phase transition point temperature of the hydrous salt phase change material is 35-65 ℃.
In a possible implementation manner of the first aspect, the phase transition point temperature of the hydrous salt phase change material is 40-58 ℃.
In a possible implementation manner of the first aspect, the energy storage density of the hydrous salt phase change material is greater than 300J/cc.
In a possible implementation manner of the first aspect, the energy storage density of the hydrous salt phase change material is greater than 320J/cc. In a possible implementation manner of the first aspect, the hydrous salt phase change material is CH3COONa·3H2O，Na2S2O3·5H2O-CH3COONa·3H2Eutectic of O or Na2HPO4·12H2And O. The three hydrated salt phase-change materials have larger phase-change latent heat which is 2 times to 2.5 times of that of the wax phase-change material.
In a second aspect, the present application further provides a terminal electronic device, including: the heat dissipation device is the heat dissipation device in the first aspect or any implementation manner of the first aspect, the processor and the heat dissipation device are both disposed in the casing, and the heat dissipation device is configured to dissipate heat of the processor.
The terminal electronic equipment that this application embodiment provided, because heat abstractor has adopted any embodiment of above-mentioned first aspect heat abstractor, adopt hydrated salt phase change material as energy storage medium in the energy storage module among the heat abstractor, hydrated salt phase change material compares waxy phase change material and has higher energy storage density, can improve heat abstractor's radiating effect like this, and because the setting of refrigeration unit, can restrain hydrated salt phase change material's supercooling phenomenon, so that hydrated salt phase change material solidifies, make good preparation for melting the heat-retaining next time, and then realize that the circulation heat-retaining of hydrated salt phase change material under normal atmospheric temperature is exothermic, so, the terminal electronic equipment that this application embodiment provided had both had high enthalpy value, also can repeat under normal atmospheric temperature, the efficient dispels the heat to the treater.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation device in the prior art;
FIG. 2 is an exploded view of FIG. 1;
FIG. 3 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application;
FIG. 4 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application;
FIG. 5 is an enlarged view of FIG. 4 at A;
FIG. 6 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application;
FIG. 7 is a schematic structural diagram of a refrigeration unit according to an embodiment of the present application;
FIG. 8 is a schematic structural diagram of a refrigeration unit according to an embodiment of the present application;
FIG. 9 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application;
FIG. 10 is a view from the direction B of FIG. 9;
fig. 11 is a view in the direction C of fig. 9.
Detailed Description
The present invention relates to a heat dissipation device and a terminal electronic device, and the following describes the heat dissipation device and the terminal electronic device in detail with reference to the drawings. The following is a brief description of the concepts involved in the above embodiments:
phase Change Material (PCM): the phase change material is a substance that changes the state of a substance and can provide latent heat under the condition that the temperature is constant or is maintained in a small interval range, and the process of converting physical properties is called a phase change process, and the phase change material can absorb or release a large amount of latent heat.
Thermoelectric Cooler (TEC): thermoelectric refrigeration is a refrigeration method based on the thermoelectric phenomenon, in which charge carriers move in a conductor to form a current, and since the charge carriers are at different energy levels in different materials, when it moves from a high level to a low level, heat is released, whereas heat needs to be absorbed from the outside.
A thermistor (NTC).
A Central Processing Unit (CPU).
Graphics Processing Unit (GPU).
Vapor Chamber (VC).
In one aspect, referring to fig. 3 and 4, the embodiment of the present application provides a heat dissipation device for dissipating heat from a heat generating source 1 of a terminal electronic device, wherein the heat dissipation device includes a hydrated salt phase-change material 32 and a heat transfer unit 2, and a refrigeration unit 4, the refrigeration unit 4 is in contact with the hydrated salt phase-change material 32 and can refrigerate the hydrated salt phase-change material 32; the heat transfer unit 2 serves to transfer heat of the heat generating source 1 to the hydrous salt phase change material 32.
The working principle of the heat dissipation device provided by the embodiment of the application is as follows: the heat source 1 emits heat during operation, the heat transfer unit 2 transfers the heat emitted by the heat source 1 to the hydrous salt phase-change material 32, the temperature of the hydrous salt phase-change material 32 is not changed or is maintained in a small interval range in the phase change process, the temperature of the heat dissipation device is not too high while the heat is absorbed, and the heat is absorbed by the hydrous salt phase-change material 32 to dissipate the heat of the heat source 1.
It should be noted that: the heat source 1 may be a central processing unit and a graphic processor, because the central processing unit and the graphic processor are main sources of heat of the terminal electronic device, however, the heat source 1 of the present application may also be other heat generating components, and the heat source 1 is not limited herein.
Because the phase-change material adopts the hydrated salt phase-change material, the hydrated salt phase-change material has higher energy storage density, and compared with the wax phase-change material of which the heat storage density is only about 105J/cc, the heat storage density of the hydrated salt phase-change material can reach 300J/cc, which is 2 times to 2.5 times of the heat storage density of the wax phase-change material, so that the hydrated salt phase-change material can absorb more heat, thereby improving the heat dissipation effect of the heat dissipation device. And the phase change point of the hydrous salt phase change material is higher than that of the waxy phase change material, and the hydrous salt phase change material has proper phase change temperature and is suitable for storing heat of a terminal electronic product.
Although the hydrous salt phase-change material has a large supercooling degree, the supercooling degree is generally 15-20 degrees, that is, after the hydrous salt phase-change material absorbs heat and is melted, the hydrous salt phase-change material needs to be cooled to a temperature 15-20 degrees lower than the melting point temperature to be solidified, that is, the hydrous salt phase-change material cannot be solidified at normal temperature and cannot be reused, in the embodiment of the application, the hydrous salt phase-change material is refrigerated by contacting the refrigeration unit 4 with the hydrous salt phase-change material, when the temperature of the hydrous salt phase-change material is reduced to the phase-change point temperature or is close to the phase-change point temperature after being melted, the refrigeration unit 4 is used for refrigerating the hydrous salt phase-change material to inhibit supercooling of the hydrous salt phase-change material, and the hydrous salt phase-change material is prepared for next melting and heat storage after being solidified, so that the. Therefore, the heat dissipation device provided by the embodiment of the application has high heat storage capacity and realizes repeated and efficient heat dissipation at normal temperature.
To increase the cooling effect, the cooling unit 4 is located in the central region of the stack of materials formed of the hydrous salt phase change material.
Referring to fig. 3 and 7, the refrigeration unit 4 includes a cold-side substrate 41 and a hot-side substrate 42 which are arranged oppositely, a plurality of semiconductor thermocouple pairs (N-type semiconductor 45 and P-type semiconductor 46) which are arranged in parallel are arranged between the cold-side substrate 41 and the hot-side substrate 42, two ends of each semiconductor thermocouple pair are arranged on the corresponding cold-side substrate 41 and the corresponding hot-side substrate 42 through conductive electrodes, and the cold-side substrate 41 and the hot-side substrate 42 are both in contact with the hydrate phase change material. Specifically, one end of the semiconductor thermocouple pair is disposed on the cold-side substrate 41 via the first conductive electrode 43, and the other end of the semiconductor thermocouple pair is disposed on the hot-side substrate 42 via the second conductive electrode 44. When the heat dissipation device works, the conducting electrode is electrified to refrigerate the hydrous salt phase change material, the hydrous salt phase change material on the periphery of the cold-end substrate 41 is stimulated to reach a solidification point, the molten hydrous salt phase change material is nucleated and crystallized, and a solidification area is expanded to the whole hydrous salt phase change material area, so that the solidified hydrous salt phase change material is prepared for next melting heat storage, the influence of supercooling degree is eliminated, the hydrous salt phase change material is circulated to store heat and release heat at normal temperature, and the whole heat dissipation device is guaranteed to have the performance of being capable of being repeatedly used for a long time. Meanwhile, the refrigerating unit 4 provided by the embodiment of the application is thermoelectric refrigerating, is pollution-free and can continuously work, and vibration cannot be generated during refrigerating, so that noise is prevented.
The refrigeration unit 4 may be a refrigeration unit that performs refrigeration by a refrigerant, but may be a refrigeration unit of another refrigeration system.
In order to guarantee the refrigeration effect of the refrigeration unit 4, in some embodiments, the heat transfer unit 2 includes an introduction end for introducing heat of the heat generation source 1 and a discharge end for conducting the introduced heat to the hydrated salt phase change material, the hot-side substrate is close to the discharge end, and the cold-side substrate is far from the discharge end. Through being close to the derivation end with the hot junction base plate, the cold junction base plate is kept away from the derivation and is held the setting, and the absorptive heat source 1's that generates heat of heat transfer unit 2 heat conduction to cold junction base plate is difficult to, and then ensures the cold junction base plate to the refrigeration effect of hydrated salt phase change material.
When the refrigeration unit 4 is powered on to refrigerate the hydrous salt phase-change material, the temperature on the hot-side substrate 42 is also high, and in order to diffuse the heat on the hot-side substrate 42 as soon as possible to improve the heat transfer efficiency between the cold-side substrate 41 and the hot-side substrate 42, referring to fig. 7 and 8, a heat dissipation structure 49 is arranged on the hot-side substrate 42, and the heat dissipation structure 49 is used for diffusing the heat on the hot-side substrate 42. The heat dissipation structure is used to dissipate the heat on the hot side substrate 42, and the temperature of the hot side substrate 42 is reduced, so as to improve the refrigeration effect of the refrigeration unit 4.
The heat dissipation structure 49 has various implementation manners, and for example, referring to fig. 7 and 8, the heat dissipation structure 49 includes a metal heat sink disposed on the surface of the hot-side substrate 42, and the heat on the hot-side substrate 42 is absorbed by the metal heat sink to achieve heat diffusion; as another example, the heat dissipation structure 49 includes a fan disposed on the hot-side substrate 42, and the heat on the hot-side substrate 42 is dissipated by the fan, but compared with the heat dissipation structure shown in fig. 7 and 8, the operation of the fan consumes energy, which results in energy consumption of the whole heat dissipation device, and the fan has a complicated structure compared with a metal heat dissipation plate, especially occupies a larger space in the thickness direction, and is contrary to the current requirement of a miniaturized terminal electronic device, so the embodiment of the present application preferably uses a metal heat dissipation plate as the heat dissipation structure.
The metal heat sink can be a copper sheet or an aluminum sheet, and of course, can also be made of other metal materials. The metal heat sink can be a metal sheet in a sheet shape or a micro fin.
In order to further improve the efficiency of heat diffusion on hot side substrate 42, referring to fig. 7 and 8, the surface area of the metal fins is larger than that of hot side substrate 42. Because the surface area of the metal radiating fin is larger than that of the hot end substrate, namely, the heat conducted from the hot end substrate 42 to the metal radiating fin can be diffused through a larger radiating area, so that the diffusing speed of the heat on the hot end substrate is increased, the temperature on the hot end substrate is reduced as soon as possible, and the refrigerating effect of the refrigerating unit is improved. In some embodiments, the surface area of the metal heat sink is at least 1.5 times the surface area of the hot side substrate 42, and the metal heat sink is symmetrically disposed with respect to the hot side substrate 42, which ensures the uniformity of heat spread across the metal heat sink. The connection manner of the metal heat sink and the hot end substrate 42 is various, for example, connection via an adhesive layer, welding, bolts, riveting, etc., and the connection manner of the metal heat sink and the hot end substrate 42 is not limited herein. Typically, the hot-side substrate 42 is made of thermally conductive and electrically non-conductive Al2O3Or an AlN ceramic substrate, and may be preferably bonded by an adhesive layer for easy attachment and detachment.
This application embodiment adopts the cold junction base plate 41 with the contact of hydrated salt phase change material directly to refrigerate the hydrated salt phase change material, in order to ensure the temperature on the cold junction base plate 41, prevent that external heat from conducting to the cold junction base plate 41 on, with the refrigeration effect to the hydrated salt phase change material of influence, refer to figure 7 and figure 8, be provided with thermal-insulated structure 47 on the cold junction base plate 41, thermal-insulated structure 47 is used for preventing external heat to diffuse to the cold junction base plate 41 on, if not set up thermal-insulated structure 47, external temperature conducts to the cold junction base plate 41 on, will reduce the difference in temperature of cold junction base plate 41 and hydrated salt phase change material, and then the influence is to the refrigeration effect of hydrated salt phase change material.
The heat insulation structure 47 may be a heat insulation layer made of a heat insulation material, for example, an asbestos layer, a rock wool layer, a silicate layer, or the like, or an aerogel felt layer, a vacuum plate, or the like. To reduce the mass of the entire refrigeration unit 4, insulation 47 may be preferred over vacuum panels. In addition, the heat insulating structure 47 may have another structure.
To further enhance the thermal insulation effect of the thermal insulation structure 47 on the cold-side substrate 41, referring to fig. 7 and 8, the thermal insulation structure 47 is coated on the cold-side substrate 41 except for the first conductive electrode 43.
When the heat insulation structure 47 is adopted to insulate the cold-end substrate 41, a heat transfer structure for transferring cold on the cold-end substrate 41 to the hydrated salt phase-change material needs to be arranged, the cold on the cold-end substrate 41 is transferred into the hydrated salt phase-change material by the arrangement of the heat transfer structure, the temperature of the hydrated salt phase-change material on the periphery of the cold-end substrate 41 is stimulated to reach the solidification point (generally lower than the melting point by 15 ℃) of the hydrated salt phase-change material, the liquid hydrated salt phase-change material nucleates and starts to solidify, and the solidification area continuously expands to solidify the whole hydrated salt phase-change material, so that the solidified hydrated salt phase-change material is subjected to next melting heat storage by inhibiting the supercooling degree of the hydrated salt phase-change material, and the cyclic heat storage and heat release of the hydrated salt phase-change.
There are a number of situations for the heat transfer structure, and in some embodiments, referring to fig. 7, the heat transfer structure includes a metal heat transfer element 48, with one end of the metal heat transfer element 48 connected to the cold side substrate 41 and the other end extending through the insulation structure 47 into the hydrated salt phase change material. The metal heat transfer element 48 is adopted as a heat transfer structure, so that the structure is simple, the implementation is convenient, and the heat transfer effect is good; in other embodiments, referring to fig. 8, the heat transfer structure includes heat transfer holes 471 formed in the insulation structure 47, and the heat transfer holes 471 are filled with a hydrated salt phase change material. The heat transfer structure is simple in structure, convenient to implement and good in operability.
When the metal heat transfer member 48 shown in fig. 7 is used as the heat transfer structure, the cold energy on the cold-side substrate 41 is introduced into the hydrated salt phase change material through the metal heat transfer member 48, the hydrated salt phase change material in contact with the metal heat transfer member 48 serves as a trigger point, the trigger point is firstly the nucleation and crystallization, then the growth and the expansion of crystal nuclei are carried out, and finally the whole molten hydrated salt phase change material is solidified.
In order to prevent excessive cold loss on the metal heat transfer element 48, the length of the metal heat transfer element 48 should not be too long, as exemplified by the length dimension of the metal heat transfer element 48 being 2 to 3 times the thickness of the thermal insulation structure 47.
There are many instances where the metal heat transfer elements 48 are mounted on the cold side substrate 41, for example, the metal heat transfer elements 48 may be disposed in a central region of the cold side substrate 41, and for example, the metal heat transfer elements 48 may be disposed at the ends of the cold side substrate 41. However, in order to improve the refrigeration effect of the cold-end substrate 41 on the hydrated salt phase-change material, the metal heat transfer element 48 is disposed in the middle region of the cold-end substrate 41, and the temperature of the middle region is lower than the temperatures of the two ends, so that the temperature is more uniform, the refrigeration capacity of the metal heat transfer element 48 can be improved, and the refrigeration effect of the metal heat transfer element 48 can be further improved.
The metal heat transfer member 48 may be a metal wire, a metal sheet, a metal rod, or other structures.
When the heat transfer structure as shown in fig. 8 is employed, since the heat transfer holes 471 are filled with the hydrous salt phase change material, that is, the hydrous salt phase change material filled in the heat transfer holes 471 serves as a trigger point, the trigger point nucleates crystallization, and then the growth of crystal nuclei is extended, and finally the entire melted hydrous salt phase change material is solidified.
The heat transfer holes 471 can be opened in the middle of the cold-end substrate 41, and the heat transfer holes 471 can be arranged at the ends of the cold-end substrate 41, and similarly, in order to improve the refrigeration effect of the cold-end substrate 41 on the hydrated salt phase-change material, the heat transfer holes 471 are arranged in the middle of the cold-end substrate 41, the temperature of the middle is lower than that of the two ends, and is more uniform, so that the refrigeration capacity of the hydrated salt phase-change material conducted into the heat transfer holes 471 can be improved, and the refrigeration effect is further improved.
In some embodiments, the hydrous salt phase change material has a phase transition point temperature of 35 ° to 65 ° C and a phase transition point temperature of 40 ° to 58 ° C. The energy storage density of the hydrous salt phase change material is more than 300J/cc, and the energy storage density of the hydrous salt phase change material is more than 320J/cc.
In some embodiments, the hydrated salt phase change material may be selected from CH3COONa·3H2O，Na2S2O3·5H2O-CH3COONa·3H2Eutectic of O or Na2HPO4·12H2And O, the three hydrated salt phase-change materials have more proper phase-change temperatures compared with the waxy phase-change material with the temperature of only 20-50 ℃ because the average phase-change point of the three hydrated salt phase-change materials is 37-58 ℃, and are more suitable for storing heat of terminal electronic products. Meanwhile, the three hydrated salt phase-change materials are used as heat storage media, have higher enthalpy values and are 2 times to 2.5 times of the phase-change latent heat of the waxy phase-change materials, so that more heat can be stored, and the heat dissipation effect is guaranteed. Of course, other hydrated salt phase change materials may be used.
Referring to fig. 3 and 4, the heat sink further includes: the temperature detection module 5 is arranged in the hydrated salt phase-change material 32, and is used for detecting the temperature of the hydrated salt phase-change material. Specifically, when the refrigeration unit 4 adopts the thermoelectric refrigeration method as shown in fig. 7 and 8, the temperature of the hydrous salt phase-change material 32 is detected in real time by the temperature detection module 5, and when the temperature of the hydrous salt phase-change material is detected to be around the melting point (within a range of 3 ℃ of the upper and lower deviation of the melting point), the refrigeration unit 4 is powered on to refrigerate the hydrous salt phase-change material.
During specific implementation, the power-on time of the refrigeration unit 4 is 5 seconds to 10 seconds, when crystallization nucleation occurs in the hydrated salt phase-change material, the refrigeration unit 4 can be powered off, and crystal nuclei are continuously generated by utilizing the characteristics of the hydrated salt phase-change material, so that the solidification of the whole hydrated salt phase-change material is completed.
In some embodiments, the temperature detecting module 5 may be selected from an NTC belonging to a negative temperature coefficient hot-surface resistor, and of course, other temperature measuring elements may be selected without limitation to the structure.
The heat conductivity coefficient of the hydrous salt phase change material is only 0.5W/m.K, the heat conductivity is poor, and in order to improve the heat conductivity of the hydrous salt phase change material, the hydrous salt phase change material is filled with heat conduction materials. Through increasing the heat conduction material to improve the hydrated salt phase change material after mixing with the heat conduction material and have great coefficient of heat conductivity, and then improve heat conductivility, finally improve heat abstractor's radiating efficiency. Therefore, the heat dissipation device provided by the embodiment of the application realizes a heat dissipation device which has a high enthalpy value and high heat conduction and can be reused for a long time by selecting the hydrated salt phase-change material as a heat storage medium and refrigerating the hydrated salt phase-change material by the refrigerating unit and adding the heat conduction material in the hydrated salt phase-change material, and compared with the prior art, the service performance of the heat dissipation device is obviously improved.
The heat conducting material can be foam copper, and the foam copper is formed by uniformly distributing a large number of communicated holes on a copper substrate; the heat conduction material can be graphene. Of course, other thermally conductive materials may be used.
In order to ensure that the hydrous salt phase-change material mixed with the heat conduction material has higher enthalpy value and higher heat conduction performance, the volume fraction of the hydrous salt phase-change material is greater than or equal to 95%. For example, if the hydrous salt phase change material with the energy storage density of 320J/cc and the volume fraction of 95% is adopted and the copper foam with the volume fraction of 5% is filled, the energy storage density of the mixed hydrous salt phase change material is at least 320J/cc, so that the heat storage capacity of the hydrous salt phase change material is ensured.
In some embodiments, after filling the heat conductive material, the hydrated salt phase change material is filled in a framework made of the heat conductive material, the framework may be made of a metal foam with a porosity of greater than 95%, the metal foam may be a sheet, a cylinder or other irregular ribs, and the metal foam may be made of a metal material such as copper or aluminum.
In some embodiments, referring to fig. 4, the heat dissipation device further comprises a heat dissipation box 31 disposed at one side of the heat transfer unit, the skeleton is disposed in the heat dissipation box 31, the refrigeration unit 4 is mounted on the skeleton filled with the hydrous salt phase change material 32, referring to fig. 5, one side of the skeleton near the heat transfer unit is connected with the heat dissipation box 31 through a first heat conduction structure 33, and the heat dissipation box 31 is made of a heat conduction material. Because the side of the framework close to the heat transfer unit is connected with the heat dissipation box 31 through the first heat conduction structure 33, the contact thermal resistance between the framework and the heat dissipation box is reduced, the heat exchange efficiency of the heat transferred to the heat dissipation box through the heat transfer unit and the hydrated salt phase change material is improved, and the heat dissipation effect of the whole heat dissipation device is further improved. The heat dissipation box can be made of metal materials such as copper or aluminum. Wherein, heat storage module 3 is constituteed to heat dissipation box 31, skeleton and hydrous salt phase change material.
The first heat conducting structure 33 has various structures, for example, referring to fig. 4, a welding layer is disposed between the frame and the heat dissipating box, the welding layer forms the first heat conducting structure 33, and the welding layer not only ensures the heat transfer efficiency between the frame and the heat dissipating box, but also improves the connection strength between the frame and the heat dissipating box; for another example, a heat conductive silicone layer is disposed between the frame and the heat dissipation case. In addition, the first heat conducting structure may have other structures.
In some embodiments, referring to fig. 4, a second heat conducting structure 6 is provided between the heat dissipation box 31 and the heat transfer unit. By arranging the second heat conducting structure 6, the thermal contact resistance between the heat dissipation box 31 and the heat transfer unit is reduced, the heat exchange efficiency between the heat transfer unit and the heat dissipation box is improved, and the heat dissipation effect of the whole heat dissipation device is further improved. For example, a heat conducting interface material such as a heat conducting silicone layer, a heat conducting pad, or a heat conducting gel is disposed between the heat dissipation box 31 and the heat transfer unit, and the heat conducting interface material forms the second heat conducting structure 6. The benefits of using a thermally conductive interface material as the second thermally conductive structure are: compare fixed connection modes such as welding, the quick dismouting heat dissipation box of being convenient for if need dismantle the heat dissipation box to fill hydrous salt phase change material here to the skeleton, perhaps when maintaining refrigeration unit, can be quick pull down the heat dissipation box.
When the hydrated salt phase-change material is Na2S2O3·5H2O-CH3COONa·3H2When eutectic of O, N isa2S2O3·5H2O-CH3COONa·3H2Referring to fig. 6, in order to ensure the usability of the heat dissipation box, a corrosion-resistant material may be coated on a position where the skeleton contacts the heat dissipation box to form the corrosion-resistant layer 34, or a corrosion-resistant material may be coated on an inner wall of the heat dissipation box to form the corrosion-resistant layer, or both the inner wall of the heat dissipation box and the skeleton may be coated with a corrosion-resistant material. The corrosion resistant material may be selected from nickel or other materials.
In some embodiments, referring to fig. 4, the heat transfer unit includes a temperature-uniforming plate 21, the heat-dissipating box 31 and the heat source 1 are both disposed on the temperature-uniforming plate 21, and the heat-dissipating box 31 and the heat source 1 are disposed on the same side of the temperature-uniforming plate 21, or the heat-dissipating box 31 and the heat source 1 are disposed on opposite sides of the temperature-uniforming plate 21. The specific working principle is as follows: the heat generated by the heat source 1 is conducted to the temperature equalizing plate 21, the temperature equalizing plate 21 has a two-dimensional heat conducting surface, and the heat transferred to the heat dissipation box 31 can absorb the heat through the phase change process of the hydrated salt phase change material, so that the heat dissipation effect on the heat source 1 is achieved.
If the heat dissipation box 31 and the heat source 1 are disposed on the same side of the temperature equalization plate 21, the thickness of the heat dissipation device can be correspondingly reduced, and the light and thin design requirements of the terminal electronic product can be met.
When the heat emitted by the heat source 1 is large, the heat source 1 may also be provided with a heat source temperature equalizing sheet, that is, the heat emitted by the heat source 1 is firstly diffused by the heat source temperature equalizing sheet and then diffused to the hydrated salt phase-change material in the heat dissipation box 31 by the temperature equalizing plate 21. This can improve the heat dissipation effect.
In other embodiments, referring to fig. 9, 10 and 11, the heat transfer unit includes a first heat pipe 22, the heat dissipation device further includes a uniform temperature metal plate 7 and a second heat pipe 8, and a heat source uniform temperature sheet 9 connected to the heat source 1, the heat source 1 and the heat dissipation box 31 are disposed on the same side of the uniform temperature metal plate 7, the heat source uniform temperature sheet 9 is disposed in the uniform temperature metal plate 7, the heat source uniform temperature sheet 9 is connected to the uniform temperature metal plate 7 through the second heat pipe 8, and the heat source uniform temperature sheet 9 is further connected to the heat dissipation box 31 through the first heat pipe 22. The specific working principle is as follows: the heat generated by the heating source 1 is diffused to the heat source temperature equalizing sheet 9, the heat on the heat source temperature equalizing sheet 9 is conducted in two paths, one path is conducted to the temperature equalizing metal plate 7 through the second heat pipe 8 and is dissipated through the temperature equalizing metal plate 7, the other path is conducted to the heat dissipating box 31 through the first heat pipe 22 and is absorbed through the phase change process of the hydrated salt phase change material in the heat dissipating box 31, and the heat dissipating effect is achieved on the heating source 1.
With the structure as shown in fig. 9, 10 and 11, the technical effects achieved are as follows: the heat source 1 and the heat dissipation box 31 are arranged on the same side of the uniform-temperature metal plate 7, and at least part of the heat source uniform-temperature sheet 9 is embedded in the uniform-temperature metal plate 7 or connected with the uniform-temperature metal plate 7 through welding, so that the thickness of the whole heat dissipation device can be reduced, the light and thin design requirement is met, and meanwhile, due to the design of the uniform-temperature metal plate and the second heat pipe, the uniform-temperature effect of the heat dissipation device can be increased, and the cooling speed is increased. For a heat source 1 with large calorific value, the heat dissipation device can be diffused through a heat source temperature equalizing sheet 9 which is tightly contacted with the heat source 1, and heat dissipation silicone grease can be filled between the heat source temperature equalizing sheet 9 and the heat source 1; for the heating source 1 with small heating value, the heat sink can also be in direct contact with the heating source 1 through the temperature equalizing metal plate 7. If the heat generation amount of the heat generation source 1 is more than 8W, the heat dissipation device shown in fig. 9, 10, and 11 can be used, and if the heat generation amount of the heat generation source 1 is less than 5W, the heat dissipation device shown in fig. 4 can be used.
On the other hand, an embodiment of the present application further provides a terminal electronic device, where the terminal electronic device includes: the heat dissipation device is provided by the embodiment, the processor and the heat dissipation device are both arranged in the casing, and the heat dissipation device is used for dissipating heat of the processor.
The heat dissipated by the processor is the main heat source of the terminal electronic equipment, so that the temperature of the whole terminal electronic equipment can be effectively reduced by dissipating the heat of the processor through the heat dissipation device.
Because the heat dissipation device adopts the heat dissipation device of the embodiment, the heat storage medium in the heat dissipation device is made of the hydrous salt phase-change material, and the refrigeration unit is also arranged to refrigerate the hydrous salt phase-change material. Therefore, the heat dissipation effect of the terminal electronic equipment can be improved, due to the arrangement of the refrigeration unit, the supercooling phenomenon of the hydrated salt phase change material can be inhibited, so that the hydrated salt phase change material is solidified, preparation is made for next melting heat storage, and further circulation heat storage and heat release of the hydrated salt phase change material at normal temperature are realized, so that the terminal electronic equipment provided by the embodiment of the application has a high enthalpy value, and can also repeatedly and efficiently dissipate heat of a processor at normal temperature.
The terminal electronic device provided by the embodiment of the application can be a mobile phone, a tablet computer, a notebook computer, a vehicle-mounted computer or the like.
In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (21)
1. The utility model provides a heat abstractor, heat abstractor is used for dispelling the heat to the source that generates heat of terminal electronic equipment, its characterized in that includes:
the system comprises a hydrated salt phase-change material and a refrigeration unit which is in contact with the hydrated salt phase-change material and is used for refrigerating the hydrated salt phase-change material;
a heat transfer unit for transferring heat of the heat generation source to the hydrated salt phase-change material;
the refrigeration unit comprises a cold end substrate and a hot end substrate which are arranged oppositely, a heat insulation structure is arranged on the cold end substrate and used for preventing external heat from diffusing to the cold end substrate, a heat transfer structure is arranged on the cold end substrate and used for transferring cold on the cold end substrate to the hydrated salt phase change material.
2. The heat dissipation device of claim 1, wherein a plurality of groups of semiconductor thermocouple pairs are arranged in parallel between the cold-side substrate and the hot-side substrate, two ends of each semiconductor thermocouple pair are disposed on the corresponding cold-side substrate and the corresponding hot-side substrate through conductive electrodes, and the cold-side substrate and the hot-side substrate are both in contact with the hydrous salt phase change material.
3. The heat dissipating device of claim 2, wherein the heat transfer unit comprises an inlet for introducing heat from the heat generating source and an outlet for conducting the introduced heat to the hydrous salt phase change material, the hot side substrate being proximate to the outlet, and the cold side substrate being distal to the outlet.
4. The heat sink of claim 2, wherein the hot side substrate has a heat sink structure disposed thereon, the heat sink structure configured to spread heat away from the hot side substrate.
5. The heat sink of claim 3, wherein a heat sink structure is disposed on the hot side substrate for spreading heat from the hot side substrate.
6. The heat sink of claim 4, wherein the heat dissipation structure comprises a metal fin disposed on a surface of the hot side substrate, and wherein a surface area of the metal fin is greater than a surface area of the hot side substrate.
7. The heat sink of claim 1 wherein the heat transfer structure comprises a metal heat transfer element having one end connected to the cold end base plate and another end extending through the thermal insulation structure into the hydrated salt phase change material.
8. The heat dissipating device of claim 1, wherein the heat transfer structure comprises heat transfer holes opened on the heat insulating structure, the heat transfer holes being filled with the hydrated salt phase change material.
9. The heat dissipating device according to any one of claims 1 to 8, further comprising a heat dissipating box disposed on one side of the heat transfer unit and a skeleton disposed inside the heat dissipating box, wherein the hydrated salt phase change material is filled in the skeleton, the refrigerating unit is mounted on the skeleton filled with the hydrated salt phase change material, one side of the skeleton close to the heat transfer unit is connected to the heat dissipating box through a first heat conducting structure, and the heat dissipating box and the skeleton are made of heat conducting materials.
10. The heat dissipation device of claim 9, wherein the first thermally conductive structure comprises a solder layer.
11. The heat dissipating device of claim 10, wherein a second heat conducting structure is disposed between the heat dissipating cartridge and the heat transfer unit.
12. The heat dissipating device of claim 11, wherein said second thermally conductive structure comprises a layer of thermally conductive silicone.
13. The heat dissipation device of claim 9, wherein the heat transfer unit comprises a temperature-uniforming plate, the heat dissipation box and the heat source are both disposed on the temperature-uniforming plate, and the heat dissipation box and the heat source are disposed on a same side of the temperature-uniforming plate, or the heat dissipation box and the heat source are disposed on opposite sides of the temperature-uniforming plate.
14. The heat dissipation device of claim 9, wherein the heat transfer unit comprises a first heat pipe, the heat dissipation device further comprises a temperature-equalizing metal plate, a second heat pipe, and a heat-source temperature-equalizing sheet connected to the heat-generating source, the heat-generating source and the heat dissipation box are disposed on the same side of the temperature-equalizing metal plate, the heat-source temperature-equalizing sheet is disposed on the temperature-equalizing metal plate, the heat-source temperature-equalizing sheet is connected to the temperature-equalizing metal plate through the second heat pipe, and the heat-source temperature-equalizing sheet is further connected to the heat dissipation box through the first heat pipe.
15. The heat sink of claim 14, wherein at least a portion of the thermal uniforming plate is embedded in the thermal uniforming metal plate.
16. The heat dissipating device of claim 1 or 15, wherein the hydrated salt phase change material is filled with a thermally conductive material.
17. The heat dissipating device of claim 16, wherein the volume fraction of the hydrous salt phase change material is greater than or equal to 90%.
18. The heat dissipating device of claim 1 or 17, further comprising: the temperature detection module is arranged in the hydrated salt phase-change material and is used for detecting the temperature of the hydrated salt phase-change material.
19. The heat sink of claim 18, wherein the hydrated salt phase change material has a phase transition point temperature of 35 ℃ to 65 ℃.
20. The heat sink of claim 1 or 19, wherein the hydrous salt phase change material has a stored energy density greater than 300J/cc.
21. A terminal electronic device, comprising:
a housing;
a processor;
a heat sink, the processor and the heat sink being disposed within the enclosure, the heat sink being configured to dissipate heat from the processor, the heat sink being according to any one of claims 1-20.
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| CN105764298A (en) * | 2014-12-18 | 2016-07-13 | 宏启胜精密电子(秦皇岛)有限公司 | Heat dissipation structure, manufacturing method therefor, and device employing heat dissipation structure |
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| CN206865931U (en) * | 2017-06-23 | 2018-01-09 | 成都智明达电子股份有限公司 | A kind of high-efficiency heat conduction heat storage radiation structure |
| CN107529319A (en) * | 2017-09-01 | 2017-12-29 | 联想(北京)有限公司 | Heat abstractor and electronic equipment |
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