CN107529319A - Heat abstractor and electronic equipment - Google Patents
Heat abstractor and electronic equipment Download PDFInfo
- Publication number
- CN107529319A CN107529319A CN201710779822.8A CN201710779822A CN107529319A CN 107529319 A CN107529319 A CN 107529319A CN 201710779822 A CN201710779822 A CN 201710779822A CN 107529319 A CN107529319 A CN 107529319A
- Authority
- CN
- China
- Prior art keywords
- heat
- heater element
- electronic equipment
- heat abstractor
- link
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of heat abstractor and electronic equipment, the heat abstractor include：Radiator fan, heat conducting pipe and graphite radiating plate；The graphite radiating plate is connected with the heater element of the electronic equipment, to spread heat caused by the heater element；The heat conducting pipe is connected with the heater element, and the heat of the heater element is conducted to the radiator fan.The radiating efficiency of heater element can be greatly improved in the heat abstractor and electronic equipment of the embodiment of the present invention, and installing space needed for heat abstractor does not have a greater change compared with prior art, graphite radiating plate can directly be spread to heat caused by heater element, the occurrence of so as to prevent electronic equipment localized hyperthermia, it is combined simultaneously with heat conducting pipe, so as to significant increase radiating efficiency.
Description
Technical field
The present invention relates to electronic device field, more particularly to a kind of heat abstractor and electronic equipment of energy high efficiency and heat radiation.
Background technology
With the continuous lifting of electronic equipment performance, power consumption, heat caused by its electronic component is also increasing therewith,
Electronic equipment of the prior art uses air-cooled radiating mostly, i.e., by setting radiator fan in electronic equipment internal, passes through
The convection current of air is radiated to heater element, but the radiating efficiency of this mode is by the thermal conductivity of air and limiting for specific heat capacity
System, so as to limit its capacity of heat transmission, causes the total power consumption of product can not be too high, can only select low power chipset, so as to
It has impact on the performance of product；As user is to the high performance demands of electronic product so that electronic product should possess higher radiating
Performance, therefore, prior art are typically to increase the size and quantity of radiator fan, to increase cross-ventilation, still, frivolous
In notebook computer, due to inherent space constraints, therefore, increase cross-ventilated mode lifted the thermal efficiency be it is infeasible, because
This, a kind of radiating mode of high-efficiency compact turns into prior art technical problem urgently to be resolved hurrily.
The content of the invention
In view of the above-mentioned problems in the prior art, the embodiment of the present invention provides a kind of radiating of excellent radiation performance
Device and electronic equipment.
To solve the above problems, technical scheme provided in an embodiment of the present invention is：
A kind of heat abstractor, include applied to heat abstractor described in electronic equipment：Radiator fan, heat conducting pipe and graphite dissipate
Hot plate；
The graphite radiating plate is connected with the heater element of the electronic equipment, hot caused by the heater element to spread
Amount；
The heat conducting pipe is connected with the heater element, and the heat of the heater element is conducted to the radiator fan
Place.
Preferably, the heat abstractor also includes radiating fin, the radiating fin is arranged on the radiator fan
At air outlet, one end of the heat conducting pipe is connected with the radiating fin.
Preferably, the heat abstractor includes two radiator fans, the middle part of the heat conducting pipe and the heating
Element is connected, and its both ends is connected with the radiating fin at the air outlet of two radiator fans respectively.
Preferably, the heat abstractor also includes link, the link is fixed on the circuit of the electronic equipment
On plate, and it is connected with the heater element, the heat conducting pipe and the graphite radiating plate pass through the link and the hair
Thermal element connects.
Preferably, the link is rectangular, two edges of a wherein side for the link are outward extended with
Connecting portion, connecting portion is outward extended with the middle part of another side relative with the side, the link passes through the connecting portion
It is connected with the circuit board.
Preferably, the material of the link is copper.
Preferably, the heater element is arranged on the circuit board, the link is fixed by the connecting portion
On the circuit board, and the top of the heater element is arranged at, the heat conducting pipe is arranged on the top of the link, institute
State the top that graphite radiating plate is arranged on the heat conducting pipe.
Preferably, the graphite radiating plate is attached to the side of the circuit board of the electronic equipment.
A kind of electronic equipment, including above-mentioned heat abstractor described in any one.
Preferably, a side of circuit board of the heater element along the electronic equipment is set, and the heat conducting pipe
Middle part bend to the board side and be connected with the heater element.
Compared with prior art, the beneficial effect of the embodiment of the present invention is：
The radiating efficiency of heater element can be greatly improved in the heat abstractor and electronic equipment of the embodiment of the present invention, and dissipates
Installing space needed for thermal does not have a greater change compared with prior art, and graphite radiating plate can be to produced by heater element
Heat directly spread, the occurrence of so as to prevent electronic equipment localized hyperthermia, while be combined with heat conducting pipe,
So as to significant increase radiating efficiency.
Brief description of the drawings
Fig. 1 is the configuration schematic diagram of the heat abstractor of the embodiment of the present invention；
Fig. 2 is the structural representation of the heat abstractor installation of the embodiment of the present invention on circuit boards.
Reference：
1- heat conducting pipes；2- graphite radiating plates；21- through holes；3- radiator fans；4- radiating fins；5- links；51- connections
Portion；511- connecting holes；6- circuit boards.
Embodiment
To make those skilled in the art be better understood from technical scheme, below in conjunction with the accompanying drawings and specific embodiment party
Formula elaborates to the present invention.
As shown in Figure 1 to Figure 2, a kind of heat abstractor provided in an embodiment of the present invention, applied in electronic equipment, it is wrapped
Include：Radiator fan 3, heat conducting pipe 1 and graphite radiating plate 2；Graphite radiating plate 2 is connected with the heater element of electronic equipment, with diffusion
Heat caused by heater element；Heat conducting pipe 1 is connected with heater element, and the heat of heater element is conducted to radiator fan 3.
Graphite radiating plate 2 is combined by the heat abstractor of the present invention with heat pipe, using graphite radiating plate 2 to heater element
Caused heat is directly spread, and equivalent to the area of dissipation for adding heater element, will be generated heat in combination with heat conducting pipe 1
At heat transfer caused by element to radiator fan 3, the diffusion of heat is further realized.
Specifically, in embodiment provided by the invention, heat abstractor also includes radiating fin 4, and radiating fin 4 is arranged on scattered
At the air outlet of Hot-air fan 3, one end of heat conducting pipe 1 is connected with radiating fin 4, by heat transfer caused by heater element to dissipate
At hot fin 4, because radiating fin 4 has larger area of dissipation, therefore airflow passes radiating fin caused by radiator fan 3
When 4, so as to realize the efficient diffusion of heat.Wherein, the material of radiating fin 4 can be the radiating heat transfer efficiency such as copper, aluminium
Higher material, and its shape can also adjust accordingly according to the actual requirements, and the embodiment of the present invention is not specifically limited herein.
Further, as shown in figure 1, in order to improve radiating effect, heat abstractor includes two radiation airs in the present embodiment
Fan 3, the middle part of heat conducting pipe 1 is connected with heater element, its both ends respectively with the radiating fin at the air outlet of two radiator fans 3
4 connections.Heat caused by heater element is transferred to the radiating fin 4 at the both ends of heat conducting pipe 1 by the middle part of heat conducting pipe 1, and both ends dissipate
Air-flow caused by Hot-air fan 3 finally takes away heat, realizes the radiating to heater element via radiating fin 4.In addition, at other
In embodiment, heat conducting pipe 1 is it can also be provided that multiple；For example, radiated when electronic equipment needs to realize two heating elements, together
When, two heater elements can be set two heat conducting pipes 1 and divide when being not convenient to use a heat transfer of heat conducting pipe 1 in the arrangement of position
It is other that two heater elements are conducted heat, meanwhile, radiator fan 3 can set one or more according to actual conditions.
Further, for the ease of heat abstractor is fixed in electronic equipment, and also to improve to heater element
Heat transfer, in embodiment provided by the invention, heat abstractor also includes link 5, and link 5 is fixed on the electricity of electronic equipment
On road plate 6, and it is connected with heater element, heat conducting pipe 1 and graphite radiating plate 2 are connected by link 5 with heater element.Specifically
, as shown in Fig. 2 link 5 is rectangular, and two edges of a wherein side for link 5 are outward extended with connecting portion 51,
Connecting portion 51 is outward extended with the middle part of another side relative with the side, link 5 is connected by connecting portion 51 and circuit board 6
Connect.Heater element is arranged on circuit board 6, and link 5 is fixed on circuit board 6 by connecting portion 51, and is arranged at heating member
The top of part, heat conducting pipe 1 are arranged on the top of link 5, and graphite radiating plate 2 is arranged on the top of heat conducting pipe 1.In graphite radiating
Under the collective effect of plate 2 and heat conducting pipe 1, heat caused by heater element efficiently can be transmitted and spread, additionally, it is contemplated that
To bonding strength and heat transfer efficiency, the material of link 5 is copper in the embodiment of the present invention；Graphite radiating plate 2 is a thin plate simultaneously,
It is almost identical with the form and dimension of circuit board 6, and the side of the circuit board 6 of electronic equipment is attached to, so as to greatest extent
Improve and heat caused by heater element is conducted and spread, electronic equipment local temperature is higher to ask to prevent
Topic.
In addition, the embodiment of the present invention additionally provides a kind of electronic equipment, it includes above-mentioned heat abstractor；The electronic equipment
For example, notebook computer when, because notebook computer tends to lightening design, therefore, its inner space is limited, in order to adapt to
The integral layout of notebook computer, and heat abstractor is further reduced to the occupancy in electronic equipment internal space, heater element edge
One side of the circuit board 6 of electronic equipment is set, and the middle part of heat conducting pipe 1 is rolled over to the lateral bending of circuit board 6 and is connected with heater element.
In addition, for the ease of installing, in embodiment provided by the invention, connecting hole is respectively equipped with multiple connecting portions 51 of link 5
511, screwed hole is provided with each 511 one-to-one position of connecting hole on circuit board 6, also, it is on graphite radiating plate 2 and every
The corresponding position of individual installation site (connecting hole 511) is provided with through hole 21, in order to which staff screws (pine) bolt, wherein,
The quantity of connecting portion 51 and position set situation about being not limited in shown by the present embodiment, and link 5 is gone back with circuit board 6
Other connected modes can be used, while in other embodiments, shape, position and the quantity of graphite radiating plate 2 can be according to not
Adjusted accordingly with situation, meanwhile, the position and quantity of heat conducting pipe 1 and radiator fan 3 can also do corresponding tune according to the actual requirements
Whole, the embodiment of the present invention is not specifically limited herein.
Above example is only the exemplary embodiment of the present invention, is not used in the limitation present invention, protection scope of the present invention
It is defined by the claims.Those skilled in the art can make respectively in the essence and protection domain of the present invention to the present invention
Kind modification or equivalent substitution, this modification or equivalent substitution also should be regarded as being within the scope of the present invention.
Claims (10)
1. a kind of heat abstractor, applied in electronic equipment, it is characterised in that the heat abstractor includes：Radiator fan, heat conduction
Pipe and graphite radiating plate；
The graphite radiating plate is connected with the heater element of the electronic equipment, to spread heat caused by the heater element；
The heat conducting pipe is connected with the heater element, and the heat of the heater element is conducted to the radiator fan.
2. heat abstractor according to claim 1, it is characterised in that the heat abstractor also includes radiating fin, described
Radiating fin is arranged at the air outlet of the radiator fan, and one end of the heat conducting pipe is connected with the radiating fin.
3. heat abstractor according to claim 2, it is characterised in that the heat abstractor includes two radiation airs
Fan, the middle part of the heat conducting pipe is connected with the heater element, its both ends respectively with the air outlet of two radiator fans
Radiating fin connection.
4. heat abstractor according to claim 1, it is characterised in that the heat abstractor also includes link, the company
Connect frame to be fixed on the circuit board of the electronic equipment, and be connected with the heater element, the heat conducting pipe and the graphite dissipate
Hot plate is connected by the link with the heater element.
5. heat abstractor according to claim 4, it is characterised in that the link is rectangular, the link its
In two edges of a side be outward extended with connecting portion, be outward extended with connection in the middle part of another side relative with the side
Portion, the link are connected by the connecting portion with the circuit board.
6. heat abstractor according to claim 4, it is characterised in that the material of the link is copper.
7. heat abstractor according to claim 4, it is characterised in that the heater element is arranged on the circuit board,
The link is fixed on the circuit board by the connecting portion, and is arranged at the top of the heater element, described to lead
Heat pipe is arranged on the top of the link, and the graphite radiating plate is arranged on the top of the heat conducting pipe.
8. heat abstractor according to claim 1, it is characterised in that the graphite radiating plate is attached to the electronic equipment
Circuit board side.
9. a kind of electronic equipment, it is characterised in that including the heat abstractor described in any one in claim 1 to 8.
10. electronic equipment according to claim 9, it is characterised in that electricity of the heater element along the electronic equipment
One side of road plate is set, and the middle part of the heat conducting pipe bends to the board side and is connected with the heater element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710779822.8A CN107529319A (en) | 2017-09-01 | 2017-09-01 | Heat abstractor and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710779822.8A CN107529319A (en) | 2017-09-01 | 2017-09-01 | Heat abstractor and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107529319A true CN107529319A (en) | 2017-12-29 |
Family
ID=60683247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710779822.8A Pending CN107529319A (en) | 2017-09-01 | 2017-09-01 | Heat abstractor and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107529319A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110494016A (en) * | 2019-08-06 | 2019-11-22 | 华为技术有限公司 | A kind of radiator and terminal electronic device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1979821A (en) * | 2005-12-01 | 2007-06-13 | 富准精密工业(深圳)有限公司 | Radiating module |
| CN202931733U (en) * | 2012-11-15 | 2013-05-08 | 海能达通信股份有限公司 | Portable electronic device |
| CN103687428A (en) * | 2012-09-17 | 2014-03-26 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| CN104768353A (en) * | 2014-01-04 | 2015-07-08 | 深圳富泰宏精密工业有限公司 | Heat radiating structure and portable electronic device with same |
| US20150323262A1 (en) * | 2014-05-07 | 2015-11-12 | Samsung Electronics Co., Ltd. | Heat dissipating apparatus and electronic device having the same |
| CN105723821A (en) * | 2013-11-14 | 2016-06-29 | 株式会社藤仓 | Cooling structure for portable electronic device |
| US9405335B1 (en) * | 2014-02-21 | 2016-08-02 | Google Inc. | Heat pipe cooling arrangement |
| CN106774755A (en) * | 2017-02-16 | 2017-05-31 | 联想(北京)有限公司 | A kind of heat abstractor |
-
2017
- 2017-09-01 CN CN201710779822.8A patent/CN107529319A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1979821A (en) * | 2005-12-01 | 2007-06-13 | 富准精密工业(深圳)有限公司 | Radiating module |
| CN103687428A (en) * | 2012-09-17 | 2014-03-26 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| CN202931733U (en) * | 2012-11-15 | 2013-05-08 | 海能达通信股份有限公司 | Portable electronic device |
| CN105723821A (en) * | 2013-11-14 | 2016-06-29 | 株式会社藤仓 | Cooling structure for portable electronic device |
| CN104768353A (en) * | 2014-01-04 | 2015-07-08 | 深圳富泰宏精密工业有限公司 | Heat radiating structure and portable electronic device with same |
| US9405335B1 (en) * | 2014-02-21 | 2016-08-02 | Google Inc. | Heat pipe cooling arrangement |
| US20150323262A1 (en) * | 2014-05-07 | 2015-11-12 | Samsung Electronics Co., Ltd. | Heat dissipating apparatus and electronic device having the same |
| CN106774755A (en) * | 2017-02-16 | 2017-05-31 | 联想(北京)有限公司 | A kind of heat abstractor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110494016A (en) * | 2019-08-06 | 2019-11-22 | 华为技术有限公司 | A kind of radiator and terminal electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171229 |
|
| RJ01 | Rejection of invention patent application after publication |