CN104684357A - Novel radiator - Google Patents

Novel radiator Download PDF

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Publication number
CN104684357A
CN104684357A CN201510019944.8A CN201510019944A CN104684357A CN 104684357 A CN104684357 A CN 104684357A CN 201510019944 A CN201510019944 A CN 201510019944A CN 104684357 A CN104684357 A CN 104684357A
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CN
China
Prior art keywords
phase
heat
substrate
change material
fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510019944.8A
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Chinese (zh)
Inventor
龚振兴
鹿博
孙永升
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shandong Chaoyue Numerical Control Electronics Co Ltd
Original Assignee
Shandong Chaoyue Numerical Control Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shandong Chaoyue Numerical Control Electronics Co Ltd filed Critical Shandong Chaoyue Numerical Control Electronics Co Ltd
Priority to CN201510019944.8A priority Critical patent/CN104684357A/en
Publication of CN104684357A publication Critical patent/CN104684357A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a novel radiator which comprises a base plate and radiating fins arranged on the base plate, wherein the insides of the radiating fins and the base plate are hollowed-out and are filled with phase-change materials; each radiating fin is of a heat-pipe steam cavity structure. By virtue of a mode of phase-change heat transfer, heat energy generated by a heating element is absorbed through the phase-change latent heat of an object; therefore, the radiator designed by the patent can resist instantaneous high heat flow density impact; by virtue of the heat-pipe steam cavity radiating fins, the temperature uniformity on the surface of each radiating fin can be improved and the heat transfer effect can be enhanced.

Description

A kind of new radiator
Technical field
The present invention relates to Cooling Technology of Electronic Device field, be specifically related to a kind of new radiator.
Background technology
The failure rate of electronic component is with the rising exponentially relationship change of component temperature, and the temperature of components and parts often raises 10 DEG C, and its reliability will reduce by half.In order to ensure the normal operation of equipment, the temperature making heater element is needed to maintain in certain scope.
The radiating mode of common radiator is the heat conduction of heater element generation to substrate and fin, then in the mode of heat convection and radiation by heat loss to atmospheric environment, produce without phase transformation in this heat transfer process, heat all transmits in the mode of sensible heat, but the heat of latent heat of phase change transmission is about several times or the decades of times of sensible heat.Along with the continuous increase of elements heat density, phase-change heat transfer is by extensive use and electronic equipment dissipating heat.
Summary of the invention
The technical problem to be solved in the present invention is: during device start, the transient heat flow density that high-power heater element produces is very large, common radiator thermal shock resistance is poor, often cause device start fault, the problem that patent of the present invention solves is, can resist instantaneous high heat flux and impact, simultaneously, unique heat radiating fin structure form can improve its surface temperature uniformity, thus improves the heat exchange property of radiator.
The technical solution adopted in the present invention is:
A kind of new radiator, its structure comprises substrate and is arranged at the fin on substrate, fin and substrate inner hollow, and fills phase-change material, and fin adopts heat pipe type steam chamber configurations.
Phase-change material (PCM-Phase Change Material) refers to and varies with temperature and change the material that physical property also can provide latent heat.The process changing physical property is called phase transition process, and at this moment phase-change material will absorb or discharge a large amount of latent heat.
Phase-change material has the ability changing its physical state in certain temperature range.For solid-liquid phase change, when being heated to fusion temperature, just produce from solid-state to the phase transformation of liquid state, in the process of fusing, phase-change material absorbs and stores a large amount of latent heat; When phase-change material cools, the heat of storage will be dispersed in environment and go in certain temperature range, carries out from liquid state to solid-state reverse transformation.In these two kinds of phase transition process, energy that is stored or release is called latent heat of phase change.When physical state changes, the temperature of material self almost remains unchanged before phase transformation completes, and forms a wide temperature platform, although temperature-resistant, absorb or the latent heat of release quite large.
Described phase-change material is inorganic hydrous salt phase transition material, organic phase change material or composite phase-change material.
The classification phase-change material of phase-change material mainly comprises inorganic PCM, organic PCM and compound PCM tri-class.Wherein, mineral-type PCM mainly contains crystalline hydrate salt, molten salts, metal or alloy class etc.; Organic PCM mainly comprises paraffin, acetic acid and other organic substances; Arising at the historic moment of composite phase-change heat-storage material, it effectively can overcome the shortcoming of single inorganic matter or the existence of organic substance phase-change heat-storage material, can improve again the effect of phase-change material and expand its range of application.
A kind of new radiator manufacture method, first, carries out Nickel Plating Treatment by substrate and heat pipe type steam cavity radiating sheet; Secondly, tin cream is evenly brushed in the groove of substrate; Then, the fixture of design welding, fixes the relative position of substrate and fin; Finally, by reflow ovens, radiator is welded.
Base plate bottom and heater element top are close to during use, the length direction of fin is consistent with air-flow direction.
Beneficial effect of the present invention is: the present invention adopts the mode of phase-change heat transfer, the heat of heater element generation is absorbed by object latent heat of phase change, therefore, the radiator of this Patent design can be resisted instantaneous high heat flux and impact, heat pipe type steam cavity radiating sheet can improve fin surface temperature homogeneity, strengthens heat transfer effect.
Accompanying drawing explanation
Fig. 1 is the three-dimensional structure diagram of radiator of the present invention;
Description of reference numerals: 1, substrate, 2, heat pipe steam cavity radiating sheet.
Embodiment
With reference to the accompanying drawings, by embodiment, the present invention is further described:
Embodiment 1:
As shown in Figure 1, a kind of new radiator, the fin 2 that its structure comprises substrate 1 and is arranged on substrate, fin 2 and substrate 1 inner hollow, and fill phase-change material, fin 2 adopts heat pipe type steam chamber configurations.
Phase-change material (PCM-Phase Change Material) refers to and varies with temperature and change the material that physical property also can provide latent heat.The process changing physical property is called phase transition process, and at this moment phase-change material will absorb or discharge a large amount of latent heat.
Phase-change material has the ability changing its physical state in certain temperature range.For solid-liquid phase change, when being heated to fusion temperature, just produce from solid-state to the phase transformation of liquid state, in the process of fusing, phase-change material absorbs and stores a large amount of latent heat; When phase-change material cools, the heat of storage will be dispersed in environment and go in certain temperature range, carries out from liquid state to solid-state reverse transformation.In these two kinds of phase transition process, energy that is stored or release is called latent heat of phase change.When physical state changes, the temperature of material self almost remains unchanged before phase transformation completes, and forms a wide temperature platform, although temperature-resistant, absorb or the latent heat of release quite large.
Embodiment 2:
On the basis of embodiment 1, phase-change material described in the present embodiment is inorganic hydrous salt phase transition material, organic phase change material or composite phase-change material.
The classification phase-change material of phase-change material mainly comprises inorganic PCM, organic PCM and compound PCM tri-class.Wherein, mineral-type PCM mainly contains crystalline hydrate salt, molten salts, metal or alloy class etc.; Organic PCM mainly comprises paraffin, acetic acid and other organic substances; Arising at the historic moment of composite phase-change heat-storage material, it effectively can overcome the shortcoming of single inorganic matter or the existence of organic substance phase-change heat-storage material, can improve again the effect of phase-change material and expand its range of application.
Wherein, inorganic hydrated salt PCM can select: Zn (NO3) 26H20, fusing point 36.1 ° of C; Na2S2O35H20, fusing point 48.5 ° of C; Na2HPO412H20, fusing point 35.0 ° of C; CaCl26H20, fusing point 29.7 ° of C; Na2SO410H20, fusing point 32.4 ° of C;
Organic PCM can select: stearic acid, phase transition temperature 54.0-56.0 ° of C; Palmitic acid, phase transition temperature 61.0 ° of C; Myristic acid, phase transition temperature 51.5 ° of C; Paraffin wax, phase transition temperature 56.0-58.0 ° of C; Laurate, phase transition temperature 41.0-43.0 ° of C;
Compound PCM can select: the tetradecane, C14H30 fusing point 5.5 ° of C; Hexadecane, C16H34 fusing point 16.7 ° of C; Octadecane, C18H38 fusing point 28.0 ° of C; Eicosane, C20H42 fusing point 36.7 ° of C.
Embodiment 3:
A kind of new radiator manufacture method, first, carries out Nickel Plating Treatment by substrate 1 and heat pipe type steam cavity radiating sheet 2; Secondly, tin cream is evenly brushed in the groove of substrate 1; Then, the fixture of design welding, fixes the relative position of substrate 1 and fin 2; Finally, by reflow ovens, radiator is welded.
Base plate bottom and heater element top are close to during use, the length direction of fin is consistent with air-flow direction.
Above execution mode is only for illustration of the present invention; and be not limitation of the present invention; the those of ordinary skill of relevant technical field; without departing from the spirit and scope of the present invention; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.

Claims (3)

1. a new radiator, its structure comprises substrate and is arranged at the fin on substrate, it is characterized in that: fin and substrate inner hollow, and fills phase-change material, and fin adopts heat pipe type steam chamber configurations.
2. a kind of new radiator according to claim 1, is characterized in that: described phase-change material is inorganic hydrous salt phase transition material, organic phase change material or composite phase-change material.
3. a new radiator manufacture method, is characterized in that: first, and substrate and heat pipe type steam cavity radiating sheet are carried out Nickel Plating Treatment; Secondly, tin cream is evenly brushed in the groove of substrate; Then, the fixture of design welding, fixes the relative position of substrate and fin; Finally, by reflow ovens, radiator is welded.
CN201510019944.8A 2015-01-15 2015-01-15 Novel radiator Pending CN104684357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510019944.8A CN104684357A (en) 2015-01-15 2015-01-15 Novel radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510019944.8A CN104684357A (en) 2015-01-15 2015-01-15 Novel radiator

Publications (1)

Publication Number Publication Date
CN104684357A true CN104684357A (en) 2015-06-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510019944.8A Pending CN104684357A (en) 2015-01-15 2015-01-15 Novel radiator

Country Status (1)

Country Link
CN (1) CN104684357A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108200749A (en) * 2018-02-06 2018-06-22 联想(北京)有限公司 A kind of radiator and electronic equipment
EP3650340A1 (en) * 2018-11-12 2020-05-13 Ratier-Figeac SAS Rotor brake overheat management device
CN111174610A (en) * 2020-01-06 2020-05-19 广州视源电子科技股份有限公司 Radiator and preparation method thereof
CN113157072A (en) * 2016-12-29 2021-07-23 华为技术有限公司 Heat dissipation device and terminal equipment thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2510996Y (en) * 2001-10-24 2002-09-11 华孚科技股份有限公司 High-speed heat-conducting device with liquid-gas change-over
JP2007115917A (en) * 2005-10-20 2007-05-10 Fuji Electric Holdings Co Ltd Thermal dissipation plate
US20120206880A1 (en) * 2011-02-14 2012-08-16 Hamilton Sundstrand Corporation Thermal spreader with phase change thermal capacitor for electrical cooling
CN102820417A (en) * 2012-07-25 2012-12-12 杭州赛佳科技有限公司 Power LED (light emitting diode) heat conducting base
CN203523220U (en) * 2013-09-04 2014-04-02 中山佳一电子技术有限公司 Hollow heat pipe radiator

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2510996Y (en) * 2001-10-24 2002-09-11 华孚科技股份有限公司 High-speed heat-conducting device with liquid-gas change-over
JP2007115917A (en) * 2005-10-20 2007-05-10 Fuji Electric Holdings Co Ltd Thermal dissipation plate
US20120206880A1 (en) * 2011-02-14 2012-08-16 Hamilton Sundstrand Corporation Thermal spreader with phase change thermal capacitor for electrical cooling
CN102820417A (en) * 2012-07-25 2012-12-12 杭州赛佳科技有限公司 Power LED (light emitting diode) heat conducting base
CN203523220U (en) * 2013-09-04 2014-04-02 中山佳一电子技术有限公司 Hollow heat pipe radiator

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113157072A (en) * 2016-12-29 2021-07-23 华为技术有限公司 Heat dissipation device and terminal equipment thereof
CN108200749A (en) * 2018-02-06 2018-06-22 联想(北京)有限公司 A kind of radiator and electronic equipment
EP3650340A1 (en) * 2018-11-12 2020-05-13 Ratier-Figeac SAS Rotor brake overheat management device
CN111174610A (en) * 2020-01-06 2020-05-19 广州视源电子科技股份有限公司 Radiator and preparation method thereof
CN111174610B (en) * 2020-01-06 2021-11-19 广州视源电子科技股份有限公司 Radiator and preparation method thereof

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Application publication date: 20150603

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